HC05E1GRS [ETC]

68HC05E1General Release Specification ; 68HC05E1General版本规格\n
HC05E1GRS
型号: HC05E1GRS
厂家: ETC    ETC
描述:

68HC05E1General Release Specification
68HC05E1General版本规格\n

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中文:  中文翻译
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Freescale Semiconductor, Inc.  
HC05E1GRS/D  
REV. 2.0  
68HC05E1  
Ge ne ra l Re le a se Sp e c ific a tion  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ge ne ra l Re le a se Sp e c ific a tion  
Motorola reserves the right to make changes without further notice to  
any products herein to improve reliability, function or design. Motorola  
does not assume any liability arising out of the application or use of any  
product or circuit described herein; neither does it convey any license  
under its patent rights nor the rights of others. Motorola products are not  
designed, intended, or authorized for use as components in systems  
intended for surgical implant into the body, or other applications intended  
to support or sustain life, or for any other application in which the failure  
of the Motorola product could create a situation where personal injury or  
death may occur. Should Buyer purchase or use Motorola products for  
any such unintended or unauthorized application, Buyer shall indemnify  
and hold Motorola and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such  
unintended or unauthorized use, even if such claim alleges that Motorola  
was negligent regarding the design or manufacture of the part.  
General Release Specification  
MC68HC05E1 Rev. 2.0  
MOTOROLA  
2
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Ta b le of Conte nts  
Section 1. General Description  
1.1  
1.2  
1.3  
1.4  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
1.5  
1.5.1  
1.5.2  
1.5.3  
1.5.3.1  
1.5.3.2  
1.5.3.3  
1.5.4  
1.5.5  
1.5.6  
1.5.7  
1.5.8  
1.5.9  
V
and V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
DD SS  
IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . . .16  
OSC1, OSC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
Ceramic Resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
PA0-PA7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
PB0-PB7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
PC0-PC3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
XFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
DDSYN  
Section 2. Operating Modes  
2.1  
2.2  
2.3  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Single-Chip Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
2.4  
2.4.1  
2.4.2  
Self-Check Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
Timer Test Subroutine . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
ROM Checksum Subroutine. . . . . . . . . . . . . . . . . . . . . . . . .24  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
Table of Contents  
3
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ta b le of Conte nts  
2.4.3  
Additional Self-Check Routines . . . . . . . . . . . . . . . . . . . . . .25  
Self-Check PLL Disabled . . . . . . . . . . . . . . . . . . . . . . . . .26  
Jump to RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
Load RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
2.4.3.1  
2.4.3.2  
2.4.3.3  
Section 3. CPU Core  
3.1  
3.2  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
3.3  
3.3.1  
3.3.2  
3.3.3  
3.3.3.1  
3.3.3.2  
3.3.3.3  
3.3.3.4  
3.3.3.5  
3.3.4  
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
Index Register (X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Condition Code Register (CCR). . . . . . . . . . . . . . . . . . . . . .29  
Half Carry (H). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Interrupt (I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Negative (N). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Zero (Z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Carry/Borrow (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
3.3.5  
3.4  
Instruction Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . .32  
Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .33  
Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34  
Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . .35  
Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36  
3.4.1  
3.4.2  
3.4.3  
3.4.4  
3.4.5  
3.5  
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Immediate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Re;atove. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Indexed, 8-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Indexed, 16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
Bit Set/Clear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
3.5.1  
3.5.2  
3.5.3  
3.5.4  
3.5.5  
3.5.6  
3.5.7  
3.5.8  
General Release Specification  
4
MC68HC05E1 — Revision 2.0  
Table of Contents  
MOTOROLA  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Table of Contents  
3.5.9  
Bit Test and Branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
3.5.10 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
3.6  
Resets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
Computer Operating Properly (COP) Reset. . . . . . . . . . . . .40  
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41  
3.6.1  
3.6.2  
3.6.3  
3.6.4  
3.7  
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41  
Hardware Controlled Interrupt Sequence. . . . . . . . . . . . . . .42  
Software Interrupt (SWI). . . . . . . . . . . . . . . . . . . . . . . . . . . .44  
External Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
Custom Peirodic Interrupt (CPI) . . . . . . . . . . . . . . . . . . . . . .45  
3.7.1  
3.7.2  
3.7.3  
3.7.4  
3.7.5  
3.8  
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
WAIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
Data-Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47  
3.8.1  
3.8.2  
3.8.3  
Section 4. Input/Output Ports  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49  
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49  
Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50  
Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50  
Input/Output Programmingf . . . . . . . . . . . . . . . . . . . . . . . . . . .50  
Section 5. Memory  
5.1  
5.2  
5.3  
5.4  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
Table of Contents  
5
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ta b le of Conte nts  
Section 6. Timer, Phase-Locked Loop,  
and Custom Periodic Interrupt  
6.1  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57  
6.2  
6.3  
6.3.1  
6.3.2  
Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58  
Timer Control and Status Register (TCSR) $08. . . . . . . . . .60  
Computer Operating Properly (COP)  
Watchdog Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62  
Timer Control Register (TCR) $09 . . . . . . . . . . . . . . . . . . . .63  
6.3.3  
6.4  
Phase-Locked Loop Synthesizer . . . . . . . . . . . . . . . . . . . . . . .64  
Phase-Locked Loop Control Register (PLLCR) $07 . . . . . .66  
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . .68  
Noise Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69  
6.4.1  
6.4.2  
6.4.3  
6.5  
6.5.1  
Custom Periodic Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . .69  
Custom Periodic Interrupt Control  
and Status Register (CPICSR) $12. . . . . . . . . . . . . . . . .70  
6.6  
6.7  
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . . . .70  
Operation During WAIT Mode . . . . . . . . . . . . . . . . . . . . . . . . .71  
Section 7. Electrical Specifications  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
7.8  
7.9  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73  
Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74  
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75  
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75  
5.0-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .76  
3.3-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .77  
5.0-Volt Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78  
3.3-Volt Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78  
General Release Specification  
6
MC68HC05E1 — Revision 2.0  
Table of Contents  
MOTOROLA  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Table of Contents  
Section 8. Mechanical Specifications  
8.1  
8.2  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81  
Mechnical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81  
8.3  
8.3.1  
8.3.2  
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82  
P Suffix, Plastic DIP, Case # 710-02 . . . . . . . . . . . . . . . . . .82  
DW Suffix, SOIC, Case # 751F-02. . . . . . . . . . . . . . . . . . . .83  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
Table of Contents  
7
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ta b le of Conte nts  
General Release Specification  
8
MC68HC05E1 — Revision 2.0  
MOTOROLA  
Table of Contents  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
List of Fig ure s  
Figure  
Title  
Page  
1-1  
1-2  
Block Diagram of the MC68HC05E1 . . . . . . . . . . . . . . . . . .15  
Oscillator Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
2-1  
2-2  
Single-Chip Mode Pinout of the MC68HC05E1 . . . . . . . . . .22  
Self-Check Circuit Schematic Diagram . . . . . . . . . . . . . . . .23  
2-3  
Self-Check Mode Flowchart . . . . . . . . . . . . . . . . . . . . . . . . .25  
3-1  
3-2  
3-3  
Interrupt Processing Flowchart. . . . . . . . . . . . . . . . . . . . . . .43  
STOP/WAIT Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . .44  
Port I/O Circuitry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47  
4-1  
Port I/O Circuitry. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51  
5-1  
5-2  
The 8 Kbyte Memory Map of the MC68HC05E1 . . . . . . . . .54  
Input/Output (I/O) Registers . . . . . . . . . . . . . . . . . . . . . . . . .55  
6-1  
6-2  
Timer Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59  
Timer Control and Status Register (TCSR) . . . . . . . . . . . . .60  
6-3  
6-4  
Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . . . .63  
PLL Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64  
6-5  
6-6  
Phase-Locked Loop Control Register . . . . . . . . . . . . . . . . .66  
Custom Periodic Interrupt Control  
and Status Register (CPICSR) . . . . . . . . . . . . . . . . . . . .70  
7-1  
7-2  
7-3  
External Interrupt Mode Diagram . . . . . . . . . . . . . . . . . . . . .79  
Stop Recovery Timing Diagram . . . . . . . . . . . . . . . . . . . . . .79  
Power-On Reset and RESET. . . . . . . . . . . . . . . . . . . . . . . .80  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
List of Figures  
9
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
List of Fig ure s  
General Release Specification  
10  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
List of Figures  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
List of Ta b le s  
Table  
Title  
Page  
2-1  
2-2  
Operating Mode Conditions . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Self-Check Results. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
3-1  
4-1  
Vector Address for Interrupts and Reset . . . . . . . . . . . . . . . .42  
I/O Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51  
6-1  
6-2  
6-3  
6-4  
RTI Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61  
COP Reset Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63  
Loop Filter Bandwidth Control . . . . . . . . . . . . . . . . . . . . . . . .67  
PS1 and PS0 Speed Selects with 32.768 kHz Crystal. . . . . .68  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
List of Tables  
11  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
List of Ta b le s  
General Release Specification  
12  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
List of Tables  
For More Information On This Product,  
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Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 1. Ge ne ra l De sc rip tion  
1.1 Conte nts  
1.2  
1.3  
1.4  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
1.5  
1.5.1  
1.5.2  
1.5.3  
1.5.3.1  
1.5.3.2  
1.5.3.3  
1.5.4  
1.5.5  
1.5.6  
1.5.7  
1.5.8  
1.5.9  
V
and V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
DD SS  
IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . . .16  
OSC1, OSC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
Ceramic Resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
PA0-PA7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
PB0-PB7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
PC0-PC3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
XFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
DDSYN  
1.2 Introd uc tion  
The MC68HC05E1 is a low-cost introduction to the M68HC05 Family of  
microcontrollers (MCUs). The HC05 CPU core has been enhanced with  
a 15-stage multi-functional timer and programmable phase-locked loop.  
The MCU is available in a 28-pin package, and has two 8-bit I/O ports  
and one 4-bit I/O port. The 8 Kbyte memory map includes 368 bytes of  
RAM and 4096 bytes of user ROM.  
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1.3 Fe a ture s  
Features of the MC68HC05E1 include:  
• Low cost  
• HC05 Core  
• 28-pin package  
• On-Chip Oscillator (Crystal or Ceramic Resonator)  
• Phase-Locked Loop (PLL) Synthesizer with Programmable Speed  
• 4112 Bytes of User ROM (including 16 Bytes of User Vectors)  
• 368 Bytes of On-Chip RAM  
• 15-Stage Multi-functional Timer with Programmable Input  
• Real Time Interrupt Circuit  
• COP Watchdog Timer Mask Option  
• Custom Periodic Interrupt Circuit  
• 20 Bidirectional I/O Lines  
• Single-Chip Mode  
• Self-Check Mode  
• Power Saving STOP and WAIT Modes  
• Edge-Sensitive or Edge- and Level-Sensitive Interrupt Trigger  
Mask Option  
• STOP Instruction Disable Mask Option  
• Illegal Address Reset  
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General Description  
Features  
CUSTOM  
OSC2  
OSC1  
OSCILLATOR  
PERIODIC  
INTERRUPT  
OSCOUT  
V
V
V
PLL  
SYNTH.  
DDSYN  
CLOCK  
÷ 2  
DD  
SS  
SELECT  
XFC  
TPLL  
COP  
SYSTEM  
TIMER  
SYSTEM  
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
RESET  
IRQ  
CPU  
CONTROL  
ALU  
M68HC05 CPU  
CPU REGISTERS  
ACCUMULATOR  
INDEX REGISTER  
STACK POINTER  
PB0  
PB1  
PB2  
PB3  
PB4  
PB5  
PB6  
PB7  
PROGRAM COUNTER  
CONDITION CODE REG.  
SRAM — 368 BYTES  
ROM — 4112 BYTES  
PC0  
PC1  
PC2  
PC3  
SELF-CHECK ROM — 240 BYTES  
Figure 1-1. Block Diagram of the MC68HC05E1  
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Ge ne ra l De sc rip tion  
1.4 Ma sk Op tions  
There are four mask options on the MC68HC05E1: STOP instruction  
(enable/disable), IRQ (Edge-sensitive only or Edge- and level-sensitive),  
COP Watchdog Timer (enable/disable), and CPI Rate (1 second, 0.5  
second, or 0.25 second).  
NOTE: A line over a signal name indicates an active low signal. For example,  
RESET is active low.  
1.5 Func tiona l Pin De sc rip tion  
1.5.1 V a nd V  
DD  
SS  
Power is supplied to the microcontroller using these two pins. V is the  
DD  
positive supply and V is ground.  
SS  
1.5.2 IRQ (Ma ska b le Inte rrup t Re q ue st)  
This pin has a programmable option that provides two different choices  
of interrupt triggering sensitivity. The options are:  
1. negative edge-sensitive triggering only, or  
2. both negative edge-sensitive and level-sensitive triggering.  
The MCU completes the current instruction before it responds to the  
interrupt request. When IRQ goes low for at least one t , a logic one  
ILIH  
is latched internally to signify an interrupt has been requested. When the  
MCU completes its current instruction, the interrupt latch is tested. If the  
interrupt latch contains a logic one, and the interrupt mask bit (I bit) in the  
condition code register is clear, the MCU then begins the interrupt  
sequence.  
If the option is selected to include level-sensitive triggering, the IRQ input  
requires an external resistor to V for “wire-OR” operation.  
DD  
The IRQ pin contains an internal Schmitt trigger as part of its input to  
improve noise immunity. Refer to 3.7 Interrupts for more detail.  
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NOTE: The voltage on this pin affects the mode of operation. See  
Section 2. Operating Modes.  
1.5.3 OSC1, OSC2  
These pins provide control input for an on-chip clock oscillator circuit  
which can optionally drive a Phase-Locked Loop clock. A crystal, a  
ceramic resonator, or an external signal connects to these pins providing  
a system clock. The oscillator frequency is two times the internal bus  
rate if the PLL is not used.  
1.5.3.1 Crysta l  
Figure 1-2 shows the recommended circuit for using a crystal. The  
crystal and components should be mounted as close as possible to the  
input pins to minimize output distortion and start-up stabilization time.  
1.5.3.2 Ce ra m ic Re so na to r  
A ceramic resonator may be used in place of the crystal in cost-sensitive  
applications. Figure 1-2 shows the recommended circuit for using a  
ceramic resonator. The manufacturer of the particular ceramic resonator  
being considered should be consulted for specific information.  
1.5.3.3 Exte rna l Clo c k  
An external clock should be applied to the OSC1 input with the OSC2 pin  
not connected. See Figure 1-2. This setup can be used if the user does  
not wish to run the CPU with a 32.768 KHz crystal or the PLL frequencies  
are not suitable for the application.  
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Ge ne ra l De sc rip tion  
MCU  
MCU  
OSC1 OSC2  
OSC1  
OSC2  
330 kΩ  
20 MΩ  
Unconnected  
<
External Clock  
32.768 kHz  
10 PF  
33 pF  
(a) Crystal/Ceramic Resonator  
Oscillator Connections  
(b) External Clock Source  
Connections  
Figure 1-2. Oscillator Connections  
1.5.4 RESET  
This active low pin is used to reset the MCU to a known start-up state by  
pulling RESET low. The RESET pin contains an internal Schmitt trigger  
as part of its input to improve noise immunity. See 3.6 Resets.  
1.5.5 PA0-PA7  
These eight I/O lines comprise port A. The state of any pin is software  
programmable and all port A lines are configured as input during  
power-on or reset. See 4.6 Input/Output Programmingf.  
1.5.6 PB0-PB7  
These eight I/O lines comprise port B. The state of any pin is software  
programmable and all port B lines are configured as input during  
power-on or reset. See 4.6 Input/Output Programmingf.  
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1.5.7 PC0-PC3  
These four I/O lines comprise port C. The state of any pin is software  
programmable and all port C lines are configured as input during  
power-on or reset. See 4.6 Input/Output Programmingf.  
1.5.8 XFC  
This pin provides a means for connecting an external filter capacitor to  
the synthesizer phase-locked loop filter. See 6.4 Phase-Locked Loop  
Synthesizer for additional information concerning this capacitor.  
1.5.9 V  
DDSYN  
This pin provides a separate power connection to the PLL synthesizer  
which should be at the same potential as V .  
DD  
NOTE: Any unused inputs and I/O ports should be tied to an appropriate logic  
level (either V or V ). Although the I/O ports of the MC68HC05E1 do  
DD  
SS  
not require termination, it is recommended to reduce the possibility of  
static damage.  
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Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 2. Op e ra ting Mod e s  
2.1 Conte nts  
2.2  
2.3  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Single-Chip Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
2.4  
Self-Check Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
Timer Test Subroutine . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
ROM Checksum Subroutine. . . . . . . . . . . . . . . . . . . . . . . . .24  
Additional Self-Check Routines . . . . . . . . . . . . . . . . . . . . . .25  
2.4.1  
2.4.2  
2.4.3  
2.4.3.1  
2.4.3.2  
2.4.3.3  
Self-Check PLL Disabled . . . . . . . . . . . . . . . . . . . . . . . . .26  
Jump to RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
Load RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
2.2 Introd uc tion  
The MCU has 3 modes of operation: Single-chip mode, Self-Check  
Mode, and Test Mode. Table 2-1 shows the conditions required to go  
into each mode.  
Table 2-1. Operating Mode Conditions  
RESET  
IRQ  
PB1  
Mode  
V
–V  
V
–V  
DD  
Single Chip  
Self Check  
Factory Test  
SS  
DD  
SS  
V
V
V
DD  
TST  
TST  
V
SS  
VTST = 2 x VDD  
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Op e ra ting Mod e s  
2.3 Sing le -Chip Mod e  
In single-chip mode, the address and data buses are not available  
externally, but there are two 8-bit I/O ports and one 4-bit I/O port. This  
mode allows the MCU to function as a self-contained microcontroller,  
with maximum use of the pins for on-chip peripheral functions. All  
address and data activity occurs within the MCU. Single-Chip Mode is  
entered on the rising edge of RESET if the IRQ pin is within normal  
operating range.  
IRQ  
RESET  
OSC1  
OSC2  
PB7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
XFC  
2
V
DDSYN  
3
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
PC0  
PC1  
PC2  
PC3  
4
5
PB6  
6
PB5  
7
PB4  
8
PB3  
9
PB2  
10  
11  
12  
13  
14  
PB1  
PB0  
V
DD  
V
SS  
Figure 2-1. Single-Chip Mode Pinout of the MC68HC05E1  
2.4 Se lf-Che c k Mod e  
The Self-Check Mode provides an internal check to determine if the  
device is functional. See Figure 2-2.  
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Self-Check Mode  
V
TST  
V
= 2 X V  
TST  
DD  
4.7 kΩ  
V
DD  
2N3904  
V
DDSYN  
10 KΩ  
0.1 µf  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
IRQ  
XFC  
1 µf  
2
RESET  
OSC1  
OSC2  
PB7  
V
DDSYN  
3
4
PA0  
32.768 kHz  
10 pf  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
PC0  
PC1  
PC2  
PC3  
5
330 kΩ  
6
PB6  
20 MΩ  
10 pf  
10 kΩ  
7
PB5  
8
PB4  
9
PB3  
10  
11  
12  
13  
14  
PB2  
PB1  
V
DD  
10 kΩ  
PB0  
1 kΩ  
V
V
DD  
SS  
0.1 µf  
Figure 2-2. Self-Check Circuit Schematic Diagram  
The Self-Check Mode is entered on the rising edge of RESET if the IRQ  
pin is at V , and the PB1 pin is at logic one. RESET must be held low  
TST  
for 4064 cycles after POR, or for a time t for any other reset. After  
RL  
reset, the PLL is turned on (f = 1.049 MHz) and the following tests are  
op  
performed automatically:  
1. I/O – Functionally exercises ports A, B, and C  
2. RAM – Counter test for each page zero RAM byte  
3. Timer/CPI – Tracks counter register and checks TOF and RTIF  
flags  
4. ROM – Exclusive OR with odd ones parity result  
5. Interrupts –Tests external interrupts, RTI and CPI  
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Op e ra ting Mod e s  
Self-check results (using the LEDs as monitors) are shown in Table 2-2.  
The Self-Check program resides at ROM location $1F00 to $1FEF. The  
following subroutines are available to user programs and do not require  
any external hardware.  
2.4.1 Tim e r Te st Sub routine  
This subroutine returns with the Z bit cleared if any error is detected;  
otherwise, the Z bit is set.  
This subroutine is called at location $1F9B. Because the timer is free  
running and has only a divide-by-four prescaler, each timer count cannot  
be tested. The test sets RTIE and CPIE and reads the timer once every  
3 counts (12 cycles) to check for correct counting. The test tracks the  
counter until the timer wraps around, setting the TOF bit in the Timer  
Control and Status register. The routine then waits for RTIF=1 and CPIF  
= 1 before returning with the RTI and the CPI pending. RAM location  
$0095 is overwritten. Upon return to the user’s program, A=0 if the test  
passed.  
2.4.2 ROM Che c ksum Sub routine  
This subroutine returns with the Z bit cleared if any error is detected;  
otherwise, the Z bit is set.  
This subroutine is called at location $1FD1. A short routine is set up and  
executed in RAM to compute a checksum of the entire ROM pattern. The  
checksum byte is computed by Motorola and is located in the Self-Check  
ROM. Upon return to the user’s program, X=0. If the test passed, A=0.  
RAM locations $0090 through $0093 are overwritten.  
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Self-Check Mode  
Table 2-2. Self-Check Results  
PA3  
PA2  
PA1  
PA0  
Remarks  
1
1
1
1
1
0
0
0
1
1
0
1
1
0
0
1
0
1
0
1
Bad I/O  
Bad RAM  
Bad Timer  
Bad ROM  
Bad Interrupts or IRQ request  
Good Device  
Flashing  
All Others  
Bad Device  
0 indicates LED is on; 1 indicates LED is off.  
2.4.3 Ad d itiona l Se lf-Che c k Routine s  
The Self-Check ROM contains additional programs to facilitate testing  
and characterization of the device. Figure 2-3 shows the program flow  
in the Self-Check ROM. These programs are used in Self-Check Mode  
(PB1=1). On power-up, the device goes into Self-Check Mode on the  
rising edge of RESET if the IRQ pin is at V  
, and the PB1 pin is at logic  
TST  
one. The values of PB0:PB3 after power-up determine which routine is  
executed from the Self-Check ROM. Only the Self-Check routine is  
intended for customer use.  
POWER-UP  
TST  
PB1=1  
NO  
NO  
IRQ = V  
PB2=1?  
YES  
PB0=1?  
YES  
SELF-CHECK  
PB3=1?  
LOAD RAM  
& EXECUTE  
JUMP TO RAM  
YES  
NO  
PLL  
ENABLED  
PLL  
DISABLED  
Figure 2-3. Self-Check Mode Flowchart  
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2.4.3.1 Se lf-Che c k PLL Disa b le d  
If PB2=1 and PB3=0, the self-check routine is run without turning on the  
PLL. This allows the self-check program to run at any frequency, as  
determined by the value of the crystal oscillator in the self-check circuit.  
2.4.3.2 Jum p to RAM  
This routine is executed if PB2=0, PB1=1, and PB0=0.  
This routine jumps to the starting address of the RAM. This is used after  
a program has been placed in the RAM. This feature is useful for  
production testing where single-chip timing or port functionality is  
needed.  
2.4.3.3 Lo a d RAM  
This routine is entered if PB2=0, PB1=1, and PB0=1.  
The ldram routine does a parallel download of a program into port A  
using IRQ (data ready) and PC0 (data acknowledge) to synchronize the  
download with the host system. When IRQ (data ready) goes low, PC0  
(data acknowledge) is deasserted and a byte of data is loaded from port  
A to RAM starting at location $100. After the byte is stored in RAM, PC0  
is asserted as an active low data acknowledge signal to the host. The  
first byte downloaded must contain the total number of bytes to be  
downloaded (program length +1). When the download is complete, the  
program in RAM is executed.  
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Se c tion 3. CPU Core  
3.1 Conte nts  
3.2  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
3.3  
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28  
Index Register (X) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Condition Code Register (CCR). . . . . . . . . . . . . . . . . . . . . .29  
3.3.1  
3.3.2  
3.3.3  
3.3.3.1  
3.3.3.2  
3.3.3.3  
3.3.3.4  
3.3.3.5  
3.3.4  
Half Carry (H). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Interrupt (I) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Negative (N). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Zero (Z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Carry/Borrow (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
3.3.5  
Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
3.4  
Instruction Set. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . .32  
Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .33  
Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34  
Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . .35  
Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36  
3.4.1  
3.4.2  
3.4.3  
3.4.4  
3.4.5  
3.5  
Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Immediate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Re;atove. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Indexed, 8-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38  
Indexed, 16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
Bit Set/Clear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
Bit Test and Branch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39  
3.5.1  
3.5.2  
3.5.3  
3.5.4  
3.5.5  
3.5.6  
3.5.7  
3.5.8  
3.5.9  
3.5.10 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
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3.6  
Resets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40  
Computer Operating Properly (COP) Reset. . . . . . . . . . . . .40  
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41  
3.6.1  
3.6.2  
3.6.3  
3.6.4  
3.7  
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41  
Hardware Controlled Interrupt Sequence. . . . . . . . . . . . . . .42  
Software Interrupt (SWI). . . . . . . . . . . . . . . . . . . . . . . . . . . .44  
External Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
Custom Peirodic Interrupt (CPI) . . . . . . . . . . . . . . . . . . . . . .45  
3.7.1  
3.7.2  
3.7.3  
3.7.4  
3.7.5  
3.8  
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
WAIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46  
Data-Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47  
3.8.1  
3.8.2  
3.8.3  
3.2 Introd uc tion  
This section describes the CPU core.  
3.3 Re g iste rs  
The MCU contains the registers described in the following paragraphs.  
3.3.1 Ac c um ula tor (A)  
The accumulator is a general purpose 8-bit register used to hold  
operands and results of arithmetic calculations or data manipulations.  
7
0
A
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3.3.2 Ind e x Re g iste r (X)  
The index register is an 8-bit register used for the indexed addressing  
value to create an effective address. The index register may also be  
used as a temporary storage area.  
7
0
X
3.3.3 Cond ition Cod e Re g iste r (CCR)  
The CCR is a 5-bit register in which the H, N, Z, and C bits are used to  
indicate the results of the instruction just executed, and the I bit is used  
to enable interrupts. These bits can be individually tested by a program,  
and specific actions can be taken as a result of their state. Each bit is  
explained in the following paragraphs.  
CCR  
H
I
N
Z
C
3.3.3.1 Ha lf Ca rry (H)  
3.3.3.2 Inte rrup t (I)  
This bit is set during ADD and ADC operations to indicate that a carry  
occurred between bits 3 and 4.  
When this bit is set, the timer and external interrupt is masked (disabled).  
If an interrupt occurs while this bit is set, the interrupt is latched and  
processed as soon as the I bit is cleared.  
3.3.3.3 Ne g a tive (N)  
When set, this bit indicates that the result of the last arithmetic, logical,  
or data manipulation was negative.  
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3.3.3.4 Ze ro (Z)  
When set, this bit indicates that the result of the last arithmetic, logical,  
or data manipulation was zero.  
3.3.3.5 Ca rry/ Bo rro w (C)  
When set, this bit indicates that a carry or borrow out of the arithmetic  
logical unit (ALU) occurred during the last arithmetic operation. This bit  
is also affected during bit test and branch instructions and during shifts  
and rotates.  
3.3.4 Sta c k Pointe r (SP)  
The stack pointer contains the address of the next free location on the  
stack. During an MCU reset or the reset stack pointer (RSP) instruction,  
the stack pointer is set to location $00FF. The stack pointer is then  
decremented as data is pushed onto the stack and incremented as data  
is pulled from the stack.  
When accessing memory, the seven most significant bits are  
permanently set to 0000011. These seven bits are appended to the six  
least significant register bits to produce and address within the range of  
$00FF to $00C0. Subroutines and interrupts may use up to 64 (decimal)  
locations. If 64 locations are exceeded, the stack pointer wraps around  
and loses the previously stored information. A subroutine call occupies  
two locations on the stack; an interrupt uses five locations.  
12  
0
7
1
0
0
0
0
0
1
SP  
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3.3.5 Prog ra m Counte r (PC)  
The program counter is a 13-bit register that contains the address of the  
next byte to be fetched.  
NOTE: The HC05 CPU core is capable of addressing 16-bit locations. For this  
implementation, however, the addressing registers are limited to an 8K  
byte memory map.  
12  
0
PC  
3.4 Instruc tion Se t  
The MCU has a set of 62 basic instructions. They can be divided into five  
different types: register/memory, read-modify-write, branch, bit  
manipulation, and control. The following paragraphs briefly explain each  
type. For more information on the instruction set, refer to the M6805  
Family User’s Manual (M6805UM/AD2) or the MC68HC05C4 Data  
Sheet (MC68HC05C4/D).  
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3.4.1 Re g iste r/ Me m ory Instruc tions  
Most of these instructions use two operands. One operand is either the  
accumulator or the index register. The other operand is obtained from  
memory using one of the addressing modes. The jump unconditional  
(JMP) and jump to subroutine (JSR) instructions have no register  
operand. Refer to the following instruction list.  
Function  
Load A from Memory  
Mnemonic  
LDA  
Load X from Memory  
LDX  
Store A in Memory  
STA  
Store X in Memory  
STX  
Add Memory to A  
ADD  
ADC  
SUB  
SBC  
AND  
ORA  
EOR  
CMP  
CPX  
BIT  
Add Memory and Carry to A  
Subtract Memory  
Subtract Memory from A with Borrow  
AND Memory to A  
OR Memory with A  
Exclusive OR Memory with A  
Arithmetic compare A with Memory  
Arithmetic Compare X with Memory  
Bit Test Memory with A (Logical Compare)  
Jump Unconditional  
JMP  
JSR  
Jump to Subroutine  
Multiply  
MUL  
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3.4.2 Re a d -Mod ify-Write Instruc tions  
These instructions read a memory location or a register, modify or test  
its contents, and write the modified value back to memory or to the  
register. The test for negative or zero (TST) instruction is an exception  
to the read-modify-write sequence since it does not modify the value. Do  
not use these read-modify-write instructions on write-only locations.  
Refer to the following list of instructions.  
Function  
Mnemonic  
INC  
Increment  
Decrement  
Clear  
DEC  
CLR  
Complement  
COM  
NEG  
ROL  
Negate (Twos Complement)  
Rotate Left Thru Carry  
Rotate Right Thru Carry  
Logical Shift Left  
ROR  
LSL  
Logical Shift Right  
LSR  
Arithmetic Shift Right  
Test for Negative or Zero  
ASR  
TST  
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3.4.3 Bra nc h Instruc tions  
This set of instruction branches if a particular condition is met; otherwise,  
no operation is performed. Branch instructions are two-byte instructions.  
Refer to the following list for branch instructions.  
Function  
Mnemonic  
BRA  
BRN  
BHI  
Branch Always  
Branch Never  
Branch if Higher  
Branch if Lower or Same  
Branch if Carry Clear  
Branch if Higher or Same  
Branch if Carry Set  
BLS  
BCC  
BHS  
BCS  
BLO  
BNE  
BEQ  
BHCC  
BHCS  
BPL  
Branch if Lower  
Branch if Not Equal  
Branch if Equal  
Branch if Half Carry Clear  
Branch if Half Carry Set  
Branch if Plus  
Branch if Minus  
BMI  
Branch if Interrupt Mask Bit is Clear  
Branch if Interrupt Mask Bit is Set  
Branch if Interrupt Line is Low  
Branch if Interrupt Line is High  
Branch to Subroutine  
BMC  
BMS  
BIL  
BIH  
BSR  
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3.4.4 Bit Ma nip ula tion Instruc tions  
The MCU is capable of setting or clearing any writable bit which resides  
in the first 256 bytes of the memory space where all port registers, port  
DDRs, timer, timer control, and on-chip RAM reside. An additional  
feature allows the software to test and branch on the state of any bit  
within these 256 locations. The bit set, bit clear and bit test, and branch  
functions are all implemented with a single instruction. For test and  
branch instructions, the value of the bit tested is also placed in the carry  
bit of the condition code register. These instructions are also  
read-modify-write instructions. Do not bit manipulate write-only  
locations. Refer to the following list for bit manipulation instructions.  
Function  
Branch if Bit n is Set  
Mnemonic  
BRSET n (n = 0. . .7)  
BRCLR n (n = 0. . .7)  
BSET n (n = 0. . .7)  
BCLR n (n = 0. . .7)  
Branch if bit n is Clear  
Set Bit n  
Clear Bit n  
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3.4.5 Control Instruc tions  
These instructions are register reference instructions and are used to  
control processor operation during program execution. Refer to the  
following list for control instructions.  
Function  
Mnemonic  
TAX  
Transfer A to X  
Transfer X to A  
Set Carry Bit  
TXA  
SEC  
CLC  
Clear Carry Bit  
Set Interrupt Mask Bit  
Clear Interrupt Mask Bit  
Software Interrupt  
Return from Subroutine  
Return from Interrupt  
Reset Stack Pointer  
No-Operation  
SEI  
CLI  
SWI  
RTS  
RTI  
RSP  
NOP  
STOP  
WAIT  
Stop  
Wait  
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3.5 Ad d re ssing Mod e s  
The MCU uses ten different addressing modes to provide the  
programmer with an opportunity to optimize the code for all situations.  
The various indexed addressing modes make it possible to locate data  
tables, code conversion tables, and scaling tables anywhere in the  
memory space. Short indexed accesses are single byte instructions; the  
longest instructions (three bytes) permit accessing tables throughout  
memory. Short and long absolute addressing is also included. One- or  
two-byte direct addressing instructions access all data bytes in most  
applications. Extended addressing permits jump instructions to reach all  
memory.  
The term “effective address” (EA) is used in describing the various  
addressing modes. Effective address is defined as the address from  
which the argument for an instruction is fetched or stored.  
3.5.1 Im m e d ia te  
In the immediate addressing mode, the operand is contained in the byte  
immediately following the opcode. The immediate addressing mode is  
used to access constants that do not change during program execution  
(e.g., a constant used to initialize a loop counter).  
3.5.2 Dire c t  
In the direct addressing mode, the effective address of the argument is  
contained in a single byte following the opcode byte. Direct addressing  
allows the user to directly address the lowest 256 bytes in memory with  
a single two-byte instruction.  
3.5.3 Exte nd e d  
In the extended addressing mode, the effective address of the argument  
is contained in the two bytes following the opcode byte. Instructions with  
extended addressing mode are capable of referencing arguments  
anywhere in memory with a single three-byte instruction. When using the  
Motorola assembler, the user need not specify whether an instruction  
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uses direct or extended addressing. The assembler automatically  
selects the shortest form of the instruction.  
3.5.4 Re ;a tove  
The relative addressing mode is only used in branch instructions. In  
relative addressing, the contents of the 8-bit signed offset byte (which is  
the last byte of the instruction) is added to the PC if, and only if, the  
branch conditions are true. Otherwise, control proceeds to the next  
instruction. The span of relative addressing is from -128 to +127 from the  
address of the next opcode. The programmer need not calculate the  
offset when using the Motorola assembler, since it calculates the proper  
offset and checks to see that it is within the span of the branch.  
3.5.5 Ind e xe d , No Offse t  
In the indexed, no offset addressing mode, the effective address of the  
argument is contained in the 8-bit index register. This addressing mode  
can access the first 256 memory locations. These instructions are only  
one byte long. This mode is often used to move a pointer through a table  
or to hold the address of a frequently referenced RAM or I/O location.  
3.5.6 Ind e xe d , 8-Bit Offse t  
In the indexed, 8-bit offset addressing mode, the effective address is the  
sum of the contents of the unsigned 8-bit index register and the unsigned  
byte following the opcode. The addressing mode is useful for selecting  
the Kth element in an n element table. With this two-byte instruction, K  
would typically be in X with the address of the beginning of the table in  
the instruction. As such, tables may begin anywhere within the first 256  
addressable locations and could extend as far as location 510. $1FE is  
the last location which can be accessed in this way.  
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3.5.7 Ind e xe d , 16-Bit Offse t  
In the indexed, 16-bit offset addressing mode, the effective address is  
the sum of the contents of the unsigned 8-bit index register and the two  
unsigned bytes following the opcode. This address mode can be used in  
a manner similar to indexed, 8-bit offset except that this three-byte  
instruction allows tables to be anywhere in memory. As with direct and  
extended addressing, the Motorola assembler determines the shortest  
form of indexed addressing.  
3.5.8 Bit Se t/ Cle a r  
In the bit set/clear addressing mode, the bit to be set or cleared is part  
of the opcode, and the byte following the opcode specifies the direct  
address of the byte in which the specified bit is to be set or cleared. Any  
read/write bit in the first 256 locations of memory, including I/O, can be  
selectively set or cleared with a single two-byte instruction.  
3.5.9 Bit Te st a nd Bra nc h  
The bit test and branch addressing mode is a combination of direct  
addressing and relative addressing. The bit that is to be tested and its  
condition (set or clear), is included in the opcode. The address of the  
byte to be tested is in the single byte immediately following the opcode  
byte. The signed relative 8-bit offset in the third byte is added to the PC  
if the specified bit is set or cleared in the specified memory location. This  
single three-byte instruction allows the program to branch based on the  
condition of any readable bit in the first 256 locations of memory. The  
span of branching is from -128 to +127 from the address of the next  
opcode. The state of the tested bit is also transferred to the carry bit of  
the condition code register.  
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3.5.10 Inhe re nt  
In the inherent addressing mode, all the information necessary to  
execute the instruction is contained in the opcode. Operations specifying  
only the index register and/or accumulator as well as the control  
instructions with no other arguments are included in this mode. These  
instructions are one byte long.  
3.6 Re se ts  
The MCU can be reset three ways: by the initial power-on reset function,  
by an active low input to the RESET pin, by a COP watchdog-timer reset,  
and by the ILADR bit being set in the test register.  
3.6.1 Powe r-On Re se t (POR)  
An internal reset is generated on power-up to allow the internal clock  
generator to stabilize. The power-on reset is strictly for power turn-on  
conditions and should not be used to detect a drop in the power supply  
voltage. There is a 4064 internal processor clock cycle (t ) oscillator  
cyc  
stabilization delay after the oscillator becomes active. If the RESET pin  
is low at the end of this 4064 cycle delay, the MCU will remain in the  
reset condition until RESET goes high.  
3.6.2 RESET Pin  
The MCU is reset when a logic zero is applied to the RESET input for a  
period of one and one-half machine cycles (t ). RESET is an input-only  
cyc  
pin and will not indicate when an internal reset has occurred.  
3.6.3 Com p ute r Op e ra ting Prop e rly (COP) Re se t  
The MCU contains a watchdog timer that automatically times out if not  
reset (cleared) within a specific time by a program reset sequence. If the  
COP watchdog timer is allowed to timeout, an internal reset is generated  
to reset the MCU. Because the internal reset signal is used, the MCU  
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comes out of a COP reset in the same operating mode it was in when  
the COP time-out was generated.  
The COP reset function is enabled or disabled by a mask option.  
Refer to 6.3.2 Computer Operating Properly (COP) Watchdog Reset,  
for more information on the COP Watchdog timer.  
3.6.4 Ille g a l Ad d re ss Re se t  
When an opcode fetch occurs from an address which is not implemented  
in the RAM ($0090–$01FF) or ROM ($0F00–$1FFF), the part is  
automatically reset.  
3.7 Inte rrup ts  
The MCU can be interrupted four different ways: the three maskable  
hardware interrupts (IRQ, timer, and CPI) and the nonmaskable  
software interrupt instruction (SWI).  
Interrupts cause the processor to save register contents on the stack  
and to set the interrupt mask (I bit) to prevent additional interrupts. The  
RTI instruction causes the register contents to be recovered from the  
stack and normal processing to resume.  
Unlike RESET, hardware interrupts do not cause the current instruction  
execution to be halted, but are considered pending until the current  
instruction is complete.  
NOTE: The current instruction is the one already fetched and being operated on.  
When the current instruction is complete, the processor checks all  
pending hardware interrupts. If interrupts are not masked (CCR I bit  
clear) and the corresponding interrupt enable bit is set, the processor  
proceeds with interrupt processing; otherwise, the next instruction is  
fetched and executed.  
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If both an external interrupt and a timer interrupt are pending at the end  
of an instruction execution, the external interrupt is serviced first. The  
SWI is executed the same as any other instruction, regardless of the I-bit  
state.  
Table 3-1. Vector Address for Interrupts and Reset  
Flag  
Name  
CPU  
Interrupt  
Register  
Interrupts  
Vector Address  
N/A  
N/A  
N/A  
N/A  
Reset  
RESET  
SWI  
$1FFE–$1FFF  
$1FFC–$1FFD  
$1FFA–$1FFB  
$1FF8–$1FF9  
$1FF8–$1FF9  
$1FF6–$1FF7  
Software  
N/A  
N/A  
External Interrupt  
Timer Overflow  
RQ  
TCSR  
TOF  
RTIF  
CPIF  
TIMER  
IMER  
CPI  
Real Time Interrupt  
Custom Periodic Interrupt  
CPICSR  
3.7.1 Ha rd wa re Controlle d Inte rrup t Se q ue nc e  
The following three functions (RESET, STOP, and WAIT) are not in the  
strictest sense an interrupt; however, they are acted upon in a similar  
manner. See Figure 3-1 and Figure 3-2. A discussion is provided below.  
1. RESET - A low input on the RESET input pin causes the program  
to vector to its starting address which is specified by the contents  
of memory locations $1FFE and $1FFF. The I bit in the condition  
code register is also set. Much of the MCU is configured to a  
known state during this type of reset as previously described in  
3.6 Resets.  
2. STOP - The STOP instruction causes the oscillator to be turned  
off and the processor to “sleep” until an external interrupt (IRQ) or  
reset occurs.  
3. WAIT - The WAIT instruction causes all processor clocks to stop,  
but leaves the timer clock running. This “rest” state of the  
processor can be cleared by reset, an external interrupt (IRQ), or  
Timer interrupt. There are no special wait vectors for these  
individual interrupts.  
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Interrupts  
From  
RESET  
Is  
I Bit  
Set  
Y
N
IRQ  
External  
Interrupt  
Clear IRQ  
Request  
Latch  
Y
Y
Y
N
Timer  
Internal  
Interrupt  
Stack  
PC, X, A, CC  
N
CPI  
Internal  
Interrupt  
Set  
I Bit  
N
Load PC From:  
SWI: $1FFC, $1FFD  
IRQ: $1FFA-$1FFB  
Timer: $1FF8-$1FF9  
CPI: $1FF6, $1FF7  
Fetch Next  
Instruction  
N
SWI  
Instruction  
?
Y
Y
N
RTI  
Instruction  
?
Restore Resisters  
from stack  
CC, A, X, PC  
N
Execute  
Instruction  
Figure 3-1. Interrupt Processing Flowchart  
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WAIT  
STOP  
Oscillator Active  
Timer Clock Active  
Processor Clocks  
Stopped  
Stop Oscillator  
And All Clocks  
Clear I Bit  
N
N
Reset  
Y
Reset  
Y
External  
Interrupt  
(IRQ)  
External  
Interrupt  
(IRQ)  
N
N
Y
Y
Timer  
Internal  
Interrupt  
N
Y
Restart  
Processor Clock  
Turn On Oscillator  
Wait for Time  
Delay to Stabilize  
CPI  
Internal  
Interrupt  
N
Y
1. Fetch  
Vector or  
Reset  
1. Fetch  
Vector or  
Reset  
2. Service  
Interrupt  
a. Stack  
2. Service  
Interrupt  
a. Stack  
b. Set I Bit  
c. Vector to  
Interrupt  
b. Set I Bit  
c. Vector to  
Interrupt  
Routine  
Routine  
Figure 3-2. STOP/WAIT Flowcharts  
3.7.2 Softwa re Inte rrup t (SWI)  
The SWI is an executable instruction and a non-maskable interrupt: it is  
executed regardless of the state of the I bit in the CCR. If the I bit is zero  
(interrupts enabled), SWI executes after interrupts which were pending  
when the SWI was fetched, but before interrupts generated after the SWI  
was fetched. The interrupt service routine address is specified by the  
contents of memory locations $1FFC and $1FFD.  
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Interrupts  
3.7.3 Exte rna l Inte rrup t  
If the interrupt mask bit (I bit) of the CCR is set, all maskable interrupts  
(internal and external) are disabled. Clearing the I bit enables interrupts.  
The interrupt request is latched immediately following the falling edge of  
IRQ. It is then synchronized internally and serviced by the interrupt  
service routine located at the address specified by the contents of  
$1FFA and $1FFB.  
Either a level-sensitive and edge-sensitive trigger, or an  
edge-sensitive-only trigger is available as a mask option.  
NOTE: The internal interrupt latch is cleared in the first part of the interrupt  
service routine; therefore, one external interrupt pulse could be latched  
and serviced as soon as the I bit is cleared.  
3.7.4 Tim e r Inte rrup t  
There are two different timer interrupt flags that cause a timer interrupt  
whenever they are set and enabled. The interrupt flags and enable bits  
are located in the Timer Control and Status Register (TCSR). Either of  
these interrupts will vector to the same interrupt service routine, located  
at the address specified by the contents of memory location $1FF8 and  
$1FF9. See 6.3.1 Timer Control and Status Register (TCSR) $08.  
3.7.5 Custom Pe irod ic Inte rrup t (CPI)  
The CPI flag and enable bits are located in the CPI Control and Status  
Register (CPICSR). A CPI interrupt will vector to the interrupt service  
routine located at the address specified by the contents of memory  
location $1FF6 and $1FF7. See 6.5 Custom Periodic Interrupt.  
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3.8 Low-Powe r Mod e s  
3.8.1 STOP  
The STOP instruction places the MCU in its lowest power consumption  
mode. In STOP mode, the internal oscillator is turned off, halting all  
internal processing, including timer (and COP Watchdog timer)  
operation.  
The I bit in the CCR is cleared to enable external interrupts. All other  
registers, including the remaining bits in the TCSR, and memory remain  
unaltered. All input/output lines remain unchanged. The processor can  
be brought out of the STOP mode only by an external interrupt or  
RESET.  
The STOP instruction can be disabled by a mask option. When disabled,  
the STOP instruction is executed as a NOP.  
See 6.6 Operation During STOP Mode.  
3.8.2 WAIT  
The WAIT instruction places the MCU in a low-power consumption  
mode, but the WAIT mode consumes more power than the STOP mode.  
All CPU action is suspended, but the timer remains active. An interrupt  
from the timer can cause the MCU to exit the WAIT mode.  
During the WAIT mode, the I bit in the CCR is cleared to enable  
interrupts. All other registers, memory, and input/output lines remain in  
their previous state. The timer may be enabled to allow a periodic exit  
from the WAIT mode.  
See 6.7 Operation During WAIT Mode.  
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Low-Power Modes  
3.8.3 Da ta -Re te ntion Mod e  
The contents of RAM and CPU registers are retained at supply voltages  
as low as 2.0Vdc. This is called the data-retention mode where the data  
is held, but the device is not guaranteed to operate. RESET must be held  
low during data-retention mode.  
Data Direction  
Register Bit  
Internal  
HC05  
I/O  
Pin  
Latched Output  
Data Bit  
Output  
Connections  
Input  
Register  
Bit  
Input  
I/O  
Figure 3-3. Port I/O Circuitry  
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Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 4. Inp ut/ Outp ut Ports  
4.1 Conte nts  
4.2  
4.3  
4.4  
4.5  
4.6  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49  
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49  
Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50  
Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50  
Input/Output Programmingf . . . . . . . . . . . . . . . . . . . . . . . . . . .50  
4.2 Introd uc tion  
In single-chip mode there will be 20 lines arranged as two 8-bit I/O port  
and one 4-bit I/O port. These ports are programmable as either inputs or  
outputs under software control of the data direction registers.  
To avoid a glitch on the output pins, write data to the I/O Port Data  
Register before writing a one to the corresponding Data Direction  
Register.  
4.3 Port A  
Port A is an 8-bit bidirectional port which does not share any of its pins  
with other subsystems. The port A data register is at $0000 and the data  
direction register (DDR) is at $0004. Reset does not affect the data  
registers, but clears the data direction registers, thereby returning the  
ports to inputs. Writing a one to a DDR bit sets the corresponding port  
bit to output mode.  
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4.4 Port B  
Port B is an 8-bit bidirectional port which does not share any of its pins  
with other subsystems. The address of the port B data register is $0001  
and the data direction register (DDR) is at address $0005. Reset does  
not affect the data registers, but clears the data direction registers,  
thereby returning the ports to inputs. Writing a one to a DDR bit sets the  
corresponding port bit to output mode.  
4.5 Port C  
Port C is a 4-bit bidirectional port which does not share any of its pins  
with other subsystems. The port C data register is at $0002 and the data  
direction register (DDR) is at $0006. Reset does not affect the data  
registers, but clears the data direction registers, thereby returning the  
ports to inputs. Writing a one to a DDR bit sets the corresponding port  
bit to output mode.  
4.6 Inp ut/ Outp ut Prog ra m m ing f  
Ports A, B and C may be programmed as an input or an output under  
software control. The direction of the pins is determined by the state of  
the corresponding bit in the port data direction register (DDR). Each port  
has an associated DDR. Any port A, port B or port C pin is configured as  
an output if its corresponding DDR bit is set to a logic one. A pin is  
configured as an input if its corresponding DDR bit is cleared to a logic  
zero.  
At power-on or reset, all DDRs are cleared, which configures all port A,  
B, and C pins as inputs. The data direction registers are capable of being  
written to or read by the processor. During the programmed output state,  
a read of the data register actually reads the value of the output data  
latch and not the I/O pin. See Table 4-1 and Figure 4-1.  
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Input/Output Programmingf  
Table 4-1. I/O Pin Functions  
R/W* DDR  
I/O Pin Function  
The I/O pin is in input mode. Data is written into the output  
data latch.  
0
0
0
1
1
1
0
1
Data is written into the output data latch and output of the I/O pin.  
The state of the I/O pin is read.  
The I/O pin is in an output jmode. The output data latch is read.  
*R/W is an internal signal.  
Data Direction  
Register Bit  
Internal  
HC05  
I/O  
Pin  
Latched Output  
Data Bit  
Output  
Connections  
Input  
Register  
Bit  
Input  
I/O  
Figure 4-1. Port I/O Circuitry  
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Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 5. Me m ory  
5.1 Conte nts  
5.2  
5.3  
5.4  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
5.2 Introd uc tion  
The MC68HC05E1 has an 8K byte memory map, consisting of user  
ROM, user RAM, Self-Check ROM, Control Registers, and I/O. See  
Figure 5-1 and Figure 5-2.  
5.3 ROM  
4096 bytes of user ROM are located from $0F00 to $1EFF, with 16  
additional bytes of user vectors from $1FF0 to $1FFF. The Self-Check  
ROM and vectors are located from $1F00 to $1FEF.  
5.4 RAM  
The user RAM consists of 368 bytes from location $0090 to $01FF  
including the stack area. The stack begins at address $00FF. The stack  
pointer can access 64 bytes of RAM from $00FF to $00C0. Using the  
stack area for data storage or temporary work locations requires care to  
prevent it from being overwritten due to stacking from an interrupt or  
subroutine call.  
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$0000  
0000  
Port A Data Register  
$00  
$01  
$02  
$03  
$04  
$05  
$06  
$07  
$08  
$09  
$0A  
I/O  
32 Bytes  
Port B Data Register  
Port C Data Register  
$001F  
$0020  
0031  
0032  
Unused  
112 Bytes  
Unused  
$008F  
$0090  
0143  
0144  
Port A Data Direction Register  
Port B Data Direction Register  
Port C Data Direction Register  
PLL Control Register  
Timer Control & Status Register  
Timer Counter Register  
Unused  
RAM  
112 Bytes  
$00BF  
$00C0  
0191  
0192  
Stack  
64 Bytes  
$00FF  
$0100  
0255  
0256  
RAM  
256 Bytes  
$01FF  
$0200  
0511  
0512  
Unused  
3328 Bytes  
$0EFF  
$0F00  
3839  
3840  
Unused  
$11  
$12  
User ROM  
4096 Bytes  
CPI Control & Status Register  
Unused  
$13  
$1EFF  
$1F00  
7935  
7936  
Self-Check ROM  
& Vectors  
240 Bytes  
Unused  
$1E  
$1F  
$1FEF  
$1FF0  
8175  
8176  
Test Register  
User Vectors  
16 Bytes  
$1FFF  
8191  
Unused  
$1FF0  
Unused  
$1FF5  
$1FF6  
$1FF7  
$1FF8  
$1FF9  
$1FFA  
$1FFB  
$1FFC  
$1FFD  
$1FFE  
$1FFF  
CPI Vector (High Byte)  
CPI Vector (Low Byte)  
Timer Vector (High Byte)  
Timer Vector (Low Byte)  
IRQ Vector (High Byte)  
IRQ Vector (Low Byte)  
SWI Vector (High Byte)  
SWI Vector (Low Byte)  
Reset Vector (High Byte)  
Reset Vector (Low Byte)  
Figure 5-1. The 8 Kbyte Memory Map of the MC68HC05E1  
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Memory  
RAM  
DATA  
ADDRESS  
$00 TO $001F  
7
6
5
4
3
2
1
0
$00 PORT A DATA  
$01 PORT B DATA  
$02 PORT C DATA  
$03 UNUSED  
0
0
0
0
$04 PORT A DDR  
$05 PORT B DDR  
$06 PORT C DDR  
$07 PLL CONTROL REG  
$08 TIMER CONTROL & STATUS REG  
$09 TIMER COUNTER REG  
$0A UNUSED  
0
BCS  
RTIF  
AUTO  
TOFE  
BWC  
RTIE  
PLLON VCOTST  
PS1  
RT1  
PS0  
RT0  
TOF  
0
0
CPIF  
CPIE  
$0B UNUSED  
$0C UNUSED  
$0D UNUSED  
$0E UNUSED  
$0F UNUSED  
$10 UNUSED  
$11 UNUSED  
$12 CPI CONTROL &STATUS REG  
$13 UNUSED  
$14 UNUSED  
$15 UNUSED  
$16 UNUSED  
$17 UNUSED  
$18 UNUSED  
$19 UNUSED  
$1A UNUSED  
$1B UNUSED  
$1C UNUSED  
$1D UNUSED  
$1E UNUSED  
$1F UNUSED  
Figure 5-2. Input/Output (I/O) Registers  
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Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 6. Tim e r, Pha se -Loc ke d Loop ,  
a nd Custom Pe riod ic Inte rrup t  
6.1 Conte nts  
6.2  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57  
6.3  
Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58  
Timer Control and Status Register (TCSR) $08. . . . . . . . . .60  
Computer Operating Properly (COP) Watchdog Reset . . . .62  
Timer Control Register (TCR) $09 . . . . . . . . . . . . . . . . . . . .63  
6.3.1  
6.3.2  
6.3.3  
6.4  
Phase-Locked Loop Synthesizer . . . . . . . . . . . . . . . . . . . . . . .64  
Phase-Locked Loop Control Register (PLLCR) $07 . . . . . .66  
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . .68  
Noise Immunity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69  
6.4.1  
6.4.2  
6.4.3  
6.5  
6.5.1  
Custom Periodic Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . .69  
Custom Periodic Interrupt Control  
and Status Register (CPICSR) $12. . . . . . . . . . . . . . . . .70  
6.6  
6.7  
Operation During STOP Mode . . . . . . . . . . . . . . . . . . . . . . . . .70  
Operation During WAIT Mode . . . . . . . . . . . . . . . . . . . . . . . . .71  
6.2 Introd uc tion  
This section describes the timer, phase-locked loop (PLL), and custom  
periodic interrupt (CPI).  
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6.3 Tim e r  
The Timer for this device is a 15-stage multi-functional ripple counter.  
The features include Timer Over Flow, Power-On Reset (POR), Real  
Time Interrupt, and COP Watchdog Timer.  
As seen in Figure 6-1, the Timer is driven by the output of the clock  
select circuit (as determined by the value of BCS in the PLLCR) then a  
fixed divide by four prescaler. This signal drives an 8-bit ripple counter.  
The value of this 8-bit ripple counter can be read by the CPU at any time  
by accessing the Timer Counter Register (TCR) at address $09. A timer  
overflow function is implemented on the last stage of this counter, giving  
a possible interrupt at the rate of f /1024. Two additional stages  
op  
produce the POR function at f /4064. The Timer Counter Bypass  
op  
circuitry (available only in Test Mode) is at this point in the timer chain.  
This circuit is followed by two more stages, with the resulting clock  
(f /16384) driving the Real Time Interrupt circuit. The RTI circuit  
op  
consists of three divider stages with a 1 of 4 selector. The output of the  
RTI circuit is further divided by eight to drive the mask optional COP  
Watchdog Timer circuit. The RTI rate selector bits, and the RTI and TOF  
enable bits and flags are located in the Timer Control and Status  
Register at location $08.  
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Timer  
MC68HC05E1 Internal Bus  
8
8
COP  
Clear  
Internal  
Processor  
Clock  
$09 TCR  
Timer Counter Register (TCR)  
f
op  
2
f
/2  
TCR  
op  
÷4  
10  
f
/2  
op  
7-bit counter  
POR  
TCBP  
RTI Select Circuit  
Overflow  
Detect  
Circuit  
14  
17  
f
/2 TO f /2  
op  
op  
$08 TCSR  
Timer Control & Status Register  
TCSR  
TOF RTIF TOFE RTIE  
RT1 RT0  
COP Watchdog  
Timer (÷8)  
Interrupt Circuit  
To Interrupt  
Logic  
To Reset  
Logic  
Figure 6-1. Timer Block Diagram  
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6.3.1 Tim e r Control a nd Sta tus Re g iste r (TCSR) $08  
The TCSR contains the timer interrupt flag, the timer interrupt enable  
bits, and the real time interrupt rate select bits. Figure 6-2 shows the  
value of each bit in the TCSR when coming out of reset.  
$08  
TOF  
0
RTIF  
0
TOFE  
0
RTIE  
0
0
0
0
0
RT1  
1
RT0  
1
RESET:  
Figure 6-2. Timer Control and Status Register (TCSR)  
TOF — Timer Over Flow  
TOF is a clearable, read-only status bit and is set when the 8-bit ripple  
counter rolls over from $FF to $00. A CPU interrupt request will be  
generated if TOFE is set. Clearing the TOF is done by writing a ’0’ to  
it. Writing a ’1’ to TOF has no effect on the bit’s value. Reset clears  
TOF.  
RTIF — Real Time Interrupt Flag  
The Real Time Interrupt circuit consists of a three stage divider and a  
1 of 4 selector. The clock frequency that drives the RTI circuit is  
13  
f /2 (or f /8192) with three additional divider stages giving a  
op  
op  
maximum interrupt period of 4 seconds at a crystal frequency of  
32.768 kHz. RTIF is a clearable, read-only status bit and is set when  
the output of the chosen (1 of 4 selection) stage goes active. A CPU  
interrupt request will be generated if RTIE is set. Clearing the RTIF is  
done by writing a ’0’ to it. Writing a ’1’ to RTIF has no effect on this bit.  
Reset clears RTIF.  
TOFE — Timer Over Flow Enable  
When this bit is set, a CPU interrupt request is generated when the  
TOF bit is set. Reset clears this bit.  
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Timer  
RTIE — Real Time Interrupt Enable  
When this bit is set, a CPU interrupt request is generated when the  
RTIF bit is set. Reset clears this bit.  
RT1:RT0 — Real Time Interrupt Rate Select  
These two bits select one of four taps from the Real Time Interrupt  
circuit.Table 6-1 shows the available interrupt rates with several f  
op  
values. Reset sets these RT0 and RT1, selecting the lowest periodic  
rate and therefore the maximum time in which to alter these bits if  
necessary. Care should be taken when altering RT0 and RT1 if the  
time-out period is imminent or uncertain. If the selected tap is  
modified during a cycle in which the counter is switching, an RTIF  
could be missed or an additional one could be generated. To avoid  
problems, the COP should be cleared before changing RTI taps.  
Table 6-1. RTI Rates  
RTI RATES AT f FREQUENCY SPECIFIED:  
OP  
RT1:RT0  
f
16.384 kHz 524 kHz 1.049 MHz 2.097 MHz 4.194 MHz  
OP  
14  
15  
16  
17  
00  
01  
10  
11  
1 s  
2 s  
4 s  
8 s  
31.3 ms  
62.5 ms  
125 ms  
250 ms  
15.6 ms  
31.3 ms  
62.5 ms  
125.1 ms  
7.8 ms  
15.6 ms  
31.3 ms  
62.5 ms  
3.9 ms  
7.8 ms  
2
2
2
2
f
op  
f
op  
15.6 ms  
31.3 ms  
f
op  
f
op  
NOTE: In rare instances, clearing any of the timer control and status register  
(TCSR) flag or enable bits could result in vectoring to the reset vector  
rather than the timer interrupt vector if the correct precautions are not  
followed. Do not clear any of the timer flags or enable bits (i.e., TOF,  
TOFE, RTI, and RTIF) with bit manipulation instructions.  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Tim e r, Pha se -Loc ke d Loop , a nd Custom Pe riod ic  
Example:  
CLEARING TIMER OVERFLOW FLAG (TOF) BIT  
SEI  
SEI NOT REQUIRED IF USED WITHIN  
TIMER INTERRUPT ROUTINE.  
LDA  
AND  
OR  
#$73  
$TCSR  
#$40  
MASK RTIF BIT  
STA  
CLI  
$TCSR  
DO NOT USE CLI IF THIS CODE  
SEGMENT IF USED WITHIN TIMER  
INTERRUPT ROUTINE  
CLEARING TIMER OVERFLOW ENABLE (TOFE) BIT  
SEI  
LDA  
AND  
OR  
#$D3  
$TCSR  
#$C0  
MASK RTIF & TOF  
STA  
CLI  
$TCSR  
DO NOT USE CLI IF THIS CODE  
SEGMENT IF USED WITHIN TIMER  
INTERRUPT ROUTINE  
6.3.2 Com p ute r Op e ra ting Prop e rly (COP) Wa tc hd og Re se t  
The COP watchdog timer function is implemented on this device by  
using the output of the RTI circuit and further dividing it by eight. The  
minimum COP reset rates are listed in Table 6-2. If the COP circuit times  
out, an internal reset is generated and the normal reset vector is fetched.  
Preventing a COP time-out is done by writing a ’0’ to bit 0 of address  
$1FF0. When the COP is cleared, only the final divide by eight stage  
(output of the RTI) is cleared.  
This function is a mask option.  
General Release Specification  
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MOTOROLA  
62 Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Timer  
Table 6-2. COP Reset Times  
RTI RATES AT f FREQUENCY SPECIFIED:  
OP  
RT1:RT0  
f
16.384 kHz 524 kHz 1.049 MHz 2.097 MHz 4.194 MHz  
OP  
00  
01  
10  
11  
7 s  
218.8 ms  
437.5 ms  
875.0 ms  
1.75 s  
109.4 ms  
218.8 ms  
437.5 ms  
875.0 ms  
54.7 ms  
109.4 ms  
218.8 ms  
437.5 ms  
27.3 ms  
54.7 ms  
109.4 ms  
218.8 ms  
7 x (RTI Rate)  
7 x (RTI Rate)  
14 s  
28 s  
56 s  
7 x (RTI Rate)  
7 x (RTI Rate)  
6.3.3 Tim e r Control Re g iste r (TCR) $09  
The Timer Counter Register is a read-only register which contains the  
current value of the 8-bit ripple counter at the beginning of the timer  
chain. This counter is clocked at f divided by 4 and can be used for  
op  
various functions including a software input capture. Extended time  
periods can be attained using the TOF function to increment a temporary  
RAM storage location thereby simulating a 16-bit (or more) counter.  
$09  
Figure 6-3. Timer Counter Register  
The power-on cycle clears the entire counter chain and begins clocking  
the counter. After 4064 cycles, the power-on reset circuit is released  
which again clears the counter chain and allows the device to come out  
of reset. At this point, if RESET is not asserted, the timer will start  
counting up from zero and normal device operation will begin. When  
RESET is asserted anytime during operation (other than POR), the  
counter chain will be cleared.  
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MOTOROLA Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Tim e r, Pha se -Loc ke d Loop , a nd Custom Pe riod ic  
6.4 Pha se -Loc ke d Loop Synthe size r  
The phase-locked loop (PLL) consists of a variable bandwidth loop filter,  
a voltage controlled oscillator (VCO), a feedback frequency divider, and  
a digital phase detector. The PLL requires an external loop filter  
capacitor (typically 0.1 uf) connected between XFC and V  
. This  
DDSYN  
capacitor should be located as close to the chip as possible to minimize  
noise. V is the supply source for the PLL and should be bypassed  
DDSYN  
to minimize noise. The V  
possible to the chip.  
bypass cap should be as close as  
DDSYN  
V
DDSYN  
0.1 µF  
0.1 µF  
XFC  
t
PCOMP  
PLLOUT  
REF  
VCO  
and ÷2  
Phase  
Detect  
Clock  
Select  
loop filter  
OSC1  
Crystal  
Oscillator  
To clock  
generation  
circuitry  
BCS  
t
Frequency  
Divider  
FB  
PS1  
PS0  
Figure 6-4. PLL Circuit  
The phase detector compares the frequency and phase of the feedback  
frequency (t ) and the crystal oscillator reference frequency (t ) and  
FB  
REF  
generates the output, PCOMP, as shown in Figure 6-4. The output  
wave-form is then integrated and amplified. The resultant dc voltage is  
applied to the voltage controlled oscillator. The output of the VCO is  
divided by a variable frequency divider of 256, 128, 64, or 32 to provide  
the feedback frequency for the phase detector.  
General Release Specification  
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
Phase-Locked Loop Synthesizer  
To change PLL frequencies, follow the procedure outlined below:  
1. Clear BCS to enable the low frequency bus rate,  
2. Clear PLLON to disable the PLL and select manual high  
bandwidth,  
3. Select the speed using PS1 and PS0,  
4. Set PLLON to enable the PLL,  
5. Wait a time of 90% t  
for the PLL frequency to stabilize and  
PLLS  
select manual low bandwidth, wait another 10% t  
,
PLLS  
6. Set BCS to switch to the high frequency bus rate.  
The user should not switch among the high speeds with the BCS bit set.  
Following the procedure above will prevent possible bursts of high  
frequency operation during the re-configuration of the PLL.  
The PLL loop filter has two bandwidths which are automatically selected  
by the PLL if AUTO=1. Whenever the PLL is first enabled, the wide  
bandwidth mode is used. This enables the PLL frequency to ramp up  
quickly. When the output frequency is near the desired frequency, the  
filter is switched to the narrow bandwidth mode to make the final  
frequency more stable. The use of automatic bandwidth is not  
recommended at this time. Manual bandwidth control can be done by  
clearing AUTO in the PLLCR and setting the appropriate value for BWC.  
MC68HC05E1 — Revision 2.0  
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MOTOROLA Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Tim e r, Pha se -Loc ke d Loop , a nd Custom Pe riod ic  
6.4.1 Pha se -Loc ke d Loop Control Re g iste r (PLLCR) $07  
This read/write register contains the control bits select the PLL  
frequency and enable/disable the synthesizer.  
$07  
0
0
BCS  
0
AUTO  
1
BWC PLLON VCOTST PS1  
PS0  
1
RESET:  
0
1
1
0
Figure 6-5. Phase-Locked Loop Control Register  
BCS — Bus Clock Select  
When this bit is set, the output of the PLL is used to generate the  
internal processor clock. When clear, the internal bus clock is driven  
by the crystal (OSC1÷2). Once BCS has been changed, it may take  
up to 1.5 OSC1 cycles + 1.5 PLLOUT cycles to make the transition.  
During the transition, the clock select output will be held low and all  
CPU and timer activity will cease until the transition is complete.  
Before setting BCS, allow at least a time of t  
Reset clears this bit.  
after PLLON is set.  
PLLS  
AUTO  
When set, this bit selects the automatic bandwidth circuitry in the  
Phase detect block. When clear, manual bandwidth control is  
selected. Reset sets this bit.  
NOTE: The use of automatic bandwidth is not recommended at this time.  
BWC — Bandwidth Control  
This bit selects high bandwidth control when set, and low bandwidth  
control when clear. The low bandwidth driver is always enabled, so  
this bit determines whether the high bandwidth driver is on or off.  
Bandwidth control is under manual control only when the AUTO bit is  
clear. When the AUTO bit is set, BWC acts as a read-only status bit  
to indicate which mode has been selected by the internal circuit. On  
PLL start-up in automatic mode (AUTO=1), the high bandwidth driver  
is enabled (BWC=1) by internal circuitry until the PLL has locked onto  
General Release Specification  
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MOTOROLA  
66 Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
Phase-Locked Loop Synthesizer  
the specified frequency. The high bandwidth driver is then disabled  
and BWC is cleared by internal circuitry. Reset clears this bit.  
Table 6-3  
Table 6-3. Loop Filter Bandwidth Control  
AUTO  
BWC  
VCOTST  
HIGH BANDWIDTH  
LOW BANDWIDTH  
0
0
0
0
1
0
0
1
1
X
0
1
0
1
1
OFF  
OFF  
ON  
OFF  
ON  
OFF  
ON  
ON  
AUTO  
ON  
PLLON — PLL On  
This bit activates the synthesizer circuit without connecting it to the  
control circuit. This allows the synthesizer to stabilize before it can  
drive the CPU clocks. When this bit is cleared, the PLL is shut off.  
Reset sets this bit.  
NOTE: PLLON should not be cleared while using the PLL to drive the internal  
processor clock, i.e. when BCS is high. If the internal processor clock is  
driven by the PLL, clearing the PLLON bit would cause the internal  
processor clock to stop. Exercise caution when using these bits.  
VCOTST — VCO Test  
This bit is used to isolate the loop filter from the VCO in order to  
facilitate testing. When clear, the low bandwidth mode of the PLL filter  
is disabled. When set, the loop filter operates as indicated by the  
values of AUTO and BWC. This bit is always set when AUTO=1 as  
security when running in automatic mode. Reset sets this bit.  
NOTE: This bit is intended for use by Motorola to test and characterize the PLL.  
The user should always have this bit set to 1.  
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MOTOROLA Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Tim e r, Pha se -Loc ke d Loop , a nd Custom Pe riod ic  
PS1:PS0 — PLL Synthesizer Speed Select  
These two bits select one of four taps from the PLL to drive the CPU  
clocks. These bits are used in conjunction with PLLON and BCS bits  
in the PLL Control Register. These bits should not be written if BCS  
in the PLLCR is at a logic high. Reset clears PS1 and sets PS0,  
choosing a bus clock frequency of 1.049 MHz.  
Table 6-4. PS1 and PS0 Speed Selects  
with 32.768 kHz Crystal  
CPU BUS CLOCK FREQUENCY (f  
)
PA1:PS0  
0 0  
OP  
524 kHz  
1.049 MHz  
Reset Condition  
See Note below  
See Note below  
0 1  
2.097 MHz  
4.194 MHz  
1 0  
1 1  
NOTE: For the standard MC68HC05E1, the 4.194 MHz bus clock frequency  
should never be selected, and the 2.097 MHz bus clock frequency  
should not be selected when running the part below V = 4.5 V. For the  
DD  
high speed MC68HSC05E1, the 4.194 MHz bus clock frequency should  
not be selected when running the part below V = 4.5 V.  
DD  
6.4.2 Op e ra tion During STOP Mod e  
The PLL is switched to low frequency bus rate and is temporarily turned  
off when STOP is executed. Coming out of STOP mode with an external  
IRQ, the PLL is turned on with the same configuration it had before going  
into STOP with the exception of BCS which is reset. Otherwise, the PLL  
control register is in the reset condition.  
General Release Specification  
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MOTOROLA  
68 Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
Custom Periodic Interrupt  
6.4.3 Noise Im m unity  
The MCU should be insulated as much as possible from noise in the  
system. We recommend the following steps be taken to help prevent  
problems due to noise injection.  
1. The application environment should be designed so that the MCU  
is not near signal traces which switch often, such as a clock signal,  
2. The oscillator circuit for the MCU should be placed as close as  
possible to the OSC1 and OSC2 pins on the MCU, and  
3. All power pins should be filtered (to minimize noise on these  
signals) by using bypass capacitors placed as close as possible to  
the MCU.  
See the Application Note Designing for Electromagnetic Compatibility  
(EMC) with HCMOS Microcontrollers, available through the Motorola  
Literature Distribution Center, document number AN1050/D.  
6.5 Custom Pe riod ic Inte rrup t  
The custom periodic interrupt is mask programmable to a 0.25 second,  
0.5 second, or 1 second interrupt. The interrupt is generated from the 32  
kHz OSC1 input by a 15-bit counter. This interrupt is under the control of  
the Custom Periodic Interrupt Control and Status Register located at  
$12.  
MC68HC05E1 — Revision 2.0  
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MOTOROLA Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Tim e r, Pha se -Loc ke d Loop , a nd Custom Pe riod ic  
6.5.1 Custom Pe riod ic Inte rrup t Control a nd Sta tus Re g iste r (CPICSR) $12  
The CPICSR contains the CPI flag and enable bits. Figure 6-6 shows  
the location of these bits and their values after reset.  
$12  
0
0
CPIF  
0
0
0
CPIE  
0
0
0
0
0
0
0
0
0
RESET:  
Figure 6-6. Custom Periodic Interrupt Control  
and Status Register (CPICSR)  
CPIF — Custom Periodic Interrupt Flag  
CPIF is a clearable, read-only status bit and is set when the 15-bit  
counter changes from $7FFF to $0000. A CPU interrupt request will  
be generated if CPIE is set. Clearing the CPIF is done by writing a ’0’  
to it. Writing a ’1’ to CPIF has no effect on the bit’s value. Reset clears  
CPIF.  
CPIE — Custom Periodic Interrupt Enable  
When this bit is cleared, the counter is cleared and CPI interrupts are  
disabled. When this bit is set, the counter starts from $0000 and a  
CPU interrupt request is generated when the CPIF bit is set. Reset  
clears this bit.  
6.6 Op e ra tion During STOP Mod e  
The timer system is cleared and the CPI counter is halted when going  
into STOP mode. When STOP is exited by an external interrupt or an  
external RESET, the internal oscillator will resume, followed by a 4064  
internal processor oscillator stabilization delay. The timer system  
counter is then cleared and operation resumes. The CPI will continue  
counting once the oscillator resumes and does not wait for the oscillator  
to stabilize.  
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Operation During WAIT Mode  
6.7 Op e ra tion During WAIT Mod e  
The CPU clock halts during the WAIT mode, but the timer and CPI  
remain active. If interrupts are enabled, a timer interrupt or custom  
periodic interrupt will cause the processor to exit the WAIT mode.  
MC68HC05E1 — Revision 2.0  
General Release Specification  
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MOTOROLA Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Tim e r, Pha se -Loc ke d Loop , a nd Custom Pe riod ic  
General Release Specification  
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MC68HC05E1 — Revision 2.0  
MOTOROLA  
Timer, Phase-Locked Loop, and Custom Periodic Interrupt  
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Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 7. Ele c tric a l Sp e c ific a tions  
7.1 Conte nts  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
7.8  
7.9  
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73  
Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74  
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75  
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75  
5.0-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .76  
3.3-Volt DC Electrical Characteristics. . . . . . . . . . . . . . . . . . . .77  
5.0-Volt Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78  
3.3-Volt Control Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78  
7.2 Introd uc tion  
This section provides parametric information for the MC68HC05E1.  
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Electrical Specifications  
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Ele c tric a l Sp e c ific a tions  
7.3 Ma xim um Ra ting s  
Maximum ratings are the extreme limits to which the MCU can be  
exposed without permanently damaging it.  
The MCU contains circuitry to protect the inputs against damage from  
high static voltages; however, do not apply voltages higher than those  
shown in the table below. Keep VIN and VOUT within the range  
VSS (VIN or VOUT) VDD. Connect unused inputs to the appropriate  
voltage level, either VSS or VDD  
Rating  
Symbol  
Value  
Unit  
Supply Voltage  
V
–0.3 to + 7.0  
V
DD  
V
V
–0.3 to  
SS  
Input Voltage  
V
V
V
IN  
IN  
+0.3  
DD  
V
–0.3 to  
SS  
Self-Check Mode (IRQ Pin Only)  
Current Drain per Pin  
V
2 x V +0.3  
DD  
I
25  
mA  
Excluding V and V  
DD  
SS  
Storage Temperature Range  
T
–65 to + 150  
°C  
stg  
NOTE: This device is not guaranteed to operate properly at the maximum  
ratings. Refer to 7.6 5.0-Volt DC Electrical Characteristics and  
7.7 3.3-Volt DC Electrical Characteristics for guaranteed operating  
conditions.  
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Electrical Specifications  
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Electrical Specifications  
Operating Range  
7.4 Op e ra ting Ra ng e  
Characteristic  
Symbol  
Value  
T to T  
0 to +70  
–40 to +85  
–40 to +125  
Unit  
Operating Temperature Range  
MC68HC05E1P (Standard)  
MC68HC05E1CP (Extended)  
MC68HC05E1MP (Automotive)  
L
H
T
°C  
A
7.5 The rm a l Cha ra c te ristic s  
Characteristic  
Thermal Resistance  
Symbol  
Value  
Unit  
Plastic DIP  
SOIC  
θ
60  
60  
°C/W  
JA  
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Electrical Specifications  
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Ele c tric a l Sp e c ific a tions  
7.6 5.0-Volt DC Ele c tric a l Cha ra c te ristic s  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Output Voltage  
Load = 10.0 µA  
Load = –10.0 µA  
I
VOL  
VOH  
DD –0.1  
0.1  
V
I
V
Output High Voltage  
(ILoad = –0.8 mA) PA0–PA7, PB0–PB7, PC0–PC3  
VOH  
VOL  
VIH  
VIL  
VDD –0.8  
0.40  
V
V
V
V
Output Low Voltage  
(ILoad = 1.6 mA) PA0–PA7, PB0–PB7, PC0–PC3  
Input High Voltage  
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1  
0.7 x VDD  
VSS  
VDD  
Input Low Voltage  
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1  
0.3 x VDD  
XFC Wide Bandwidth  
Source  
Sink  
IOH  
IOL  
–50  
50  
–100  
100  
µA  
µA  
XFC Narrow Bandwidth  
Source  
Sink  
IOH  
IOL  
–1  
1
–2  
2
Supply Current (see Notes)  
Run  
f
f
osc = 32.768 kHz, fOP =16.384 kHz  
osc = 4.2 MHz, fOP = 2.1 MHz  
Wait  
osc = 32.768 kHz, fOP =16.384 kHz  
100  
3.5  
160  
5.0  
µA  
mA  
IDD  
f
60  
0.8  
100  
1.2  
µA  
mA  
fosc = 4.2 MHz, fOP = 2.1 MHz  
Stop (PLL off)  
25 °C  
2
50  
180  
µA  
µA  
–40 °C to +85 °C (Extended)  
I/O Ports Hi-Z Leakage Current  
PB0–PB7, PC0–PC3, PA0–PA7  
IOZ  
IIN  
10  
1
µA  
µA  
Input Current  
RESET, IRQ, OSC1  
Capacitance  
Ports (As Input or Output)  
RESET, IRQ  
COUT  
CIN  
12  
8
pF  
NOTES:  
1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise noted  
2. All values shown reflect average measurements at midpoint of voltage range at 25 °C.  
3. Wait IDD: Only timer and CPI systems active  
4. Run (Operating) IDD, Wait IDD: Measured using external square wave clock source, all inputs 0.2 V from rail; no dc  
loads, less than 50 pF on all outputs, CL = 20 pF on OSC2.  
5. Wait, Stop IDD: All ports configured as inputs, VIL = 0.2 Vdc, VIH = VDD –0.2 Vdc.  
6. Stop IDD is measured with OSC1 = VSS  
.
7. Standard temperature range is 0 °C to 70 °C. Extended temperature range (–40 °C to 85 °C) is available.  
8. Wait IDD is affected linearly by the OSC2 capacitance.  
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Electrical Specifications  
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Electrical Specifications  
3.3-Volt DC Electrical Characteristics  
7.7 3.3-Volt DC Ele c tric a l Cha ra c te ristic s  
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
Output Voltage  
Load = 10.0 µA  
Load = –10.0 µA  
I
VOL  
VOH  
DD –0.1  
0.1  
V
I
V
Output High Voltage  
(ILoad = –0.2 mA) PA0–PA7, PB0–PB7, PC0–PC3  
VOH  
VOL  
VIH  
VIL  
VDD –0.3  
0.30  
V
V
V
V
Output Low Voltage  
(ILoad = 0.4 mA) PA0–PA7, PB0–PB7, PC0–PC3  
Input High Voltage  
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1  
0.7 x VDD  
VSS  
VDD  
Input Low Voltage  
PA0–PA7, PB0–PB7, PD0–PD3, IRQ, RESET, OSC1  
0.3 x VDD  
XFC Wide Bandwidth  
Source  
Sink  
IOH  
IOL  
–25  
25  
–50  
50  
µA  
µA  
XFC Narrow Bandwidth  
Source  
Sink  
IOH  
IOL  
–-0.5  
0.5  
–1  
1
Supply Current (see Notes)  
Run  
f
f
osc = 32.768 kHz, fOP =16.384 kHz  
osc = 2.1 MHz, fOP = 1.0 MHz  
Wait  
osc = 32.768 kHz, fOP =16.384 kHz  
60  
1.5  
90  
2.0  
µA  
mA  
IDD  
f
30  
0.3  
50  
0.3  
µA  
mA  
fosc = 2.1 MHz, fOP = 1.0 MHz  
Stop (PLL off)  
25 °C  
1
30  
120  
µA  
µA  
–40 °C to +85 °C (Extended)  
I/O Ports Hi-Z Leakage Current  
PB0–PB7, PC0–PC3, PA0–PA7  
IOZ  
IIN  
10  
1
µA  
µA  
Input Current  
RESET, IRQ, OSC1  
Capacitance  
Ports (As Input or Output)  
RESET, IRQ  
COUT  
CIN  
12  
8
pF  
NOTES:  
1. VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise noted  
2. All values shown reflect average measurements at midpoint of voltage range at 25 °C.  
3. Wait IDD: Only timer and CPI systems active  
4. Run (Operating) IDD, Wait IDD: Measured using external square wave clock source, all inputs 0.2 V from rail; no dc  
loads, less than 50 pF on all outputs, CL = 20 pF on OSC2.  
5. Wait, Stop IDD: All ports configured as inputs, VIL = 0.2 Vdc, VIH = VDD –0.2 Vdc.  
6. Stop IDD is measured with OSC1 = VSS  
.
7. Standard temperature range is 0 °C to 70 °C. Extended temperature range (–40 °C to 85 °C) is available.  
8. Wait IDD is affected linearly by the OSC2 capacitance.  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
77  
Electrical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ele c tric a l Sp e c ific a tions  
7.8 5.0-Volt Control Tim ing  
Characteristic  
Symbol  
Min  
Max  
Unit  
Frequency of Operation  
Crystal Oscillator Option  
External Clock Option  
f
DC  
32.768  
4.2  
kHz  
MHz  
osc  
Internal Operating Frequency  
Crystal Oscillator (fOSC ÷ 2)  
External Clock (fOSC ÷ 2)  
f
DC  
16.384  
2.1  
kHz  
MHz  
op  
Cycle Time  
t
480  
1.5  
ns  
cyc  
RESET Pulse Width  
t
t
cyc  
RL  
Interrupt Pulse Width Low (Edge-Triggered) (see Figure 7-1)  
Interrupt Pulse Period (see Figure 7-1)  
OSC1 Pulse Width  
t
125  
Note 2  
90  
ns  
ILIH  
t
t
cyc  
ILIL  
t
, t  
ns  
OH OL  
PLL Startup Stabilization Time  
NOTES:  
t
50  
ms  
PLLS  
1. VDD = 5.0 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise note  
2. The minimum period, tILIL, should not be less than the number of cycles it takes to execute the interrupt service routine  
plus 19 tcyc  
.
7.9 3.3-Volt Control Tim ing  
Characteristic  
Symbol  
Min  
Max  
Unit  
Frequency of Operation  
Crystal Oscillator Option  
External Clock Option  
f
DC  
32.768  
2.1  
kHz  
MHz  
osc  
Internal Operating Frequency  
Crystal Oscillator (fOSC ÷ 2)  
External Clock (fOSC ÷ 2)  
f
DC  
16.384  
1.0  
kHz  
MHz  
op  
Cycle Time  
t
1000  
1.5  
ns  
cyc  
RESET Pulse Width  
t
t
cyc  
RL  
Interrupt Pulse Width Low (Edge-Triggered) (see Figure 7-1)  
Interrupt Pulse Period (see Figure 7-1)  
OSC1 Pulse Width  
t
250  
ns  
ILIH  
t
Note 2  
200  
t
cyc  
ILIL  
t
, t  
ns  
OH OL  
PLL Startup Stabilization Time  
NOTES:  
t
100  
ms  
PLLS  
1. VDD = 3.3 Vdc ± 10%, VSS = 0 Vdc, TA = 0 °C to 70 °C, unless otherwise note  
2. The minimum period, tILIL, should not be less than the number of cycles it takes to execute the interrupt service routine  
plus 19 tcyc  
.
General Release Specification  
78  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
Electrical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Electrical Specifications  
3.3-Volt Control Timing  
IRQ  
tILIH  
tILIL  
IRQ1  
tILIH  
.
.
.
NORMALLY USED  
WITH WIRE-ORED  
CONNECTION  
IRQn  
IRQ  
(MCU)  
Figure 7-1. External Interrupt Mode Diagram  
1
OSC1  
t
RL  
RESET  
t
ILIH  
2
IRQ  
4064 t  
cyc  
3
IRQ  
Internal  
Clock  
Internal  
Address  
Bus  
4
1FFE  
1FFE  
1FFE  
1FFE  
1FFF  
NOTES:  
RESET or Interrupt  
Vector Fetch  
1. Represents the internal gating of the OSC1 pin  
2. IRQ pin edge-sensitive mask option.  
3. IRQ pin level and edge-sensitive mask option.  
4. RESET vector address shown for timing example.  
Figure 7-2. Stop Recovery Timing Diagram  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
79  
Electrical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Ele c tric a l Sp e c ific a tions  
General Release Specification  
80  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
Electrical Specifications  
For More Information On This Product,  
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Freescale Semiconductor, Inc.  
Ge ne ra l Re le a se Sp e c ific a tion MC68HC05E1  
Se c tion 8. Me c ha nic a l Sp e c ific a tions  
8.1 Conte nts  
8.2  
Mechnical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81  
8.3  
8.3.1  
8.3.2  
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82  
P Suffix, Plastic DIP, Case # 710-02 . . . . . . . . . . . . . . . . . .82  
DW Suffix, SOIC, Case # 751F-02. . . . . . . . . . . . . . . . . . . .83  
8.2 Me c hnic a l Da ta  
IRQ  
RESET  
OSC1  
OSC2  
PB7  
XFC  
V
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
2
DDSYN  
PA0  
PA1  
PA2  
PA3  
PA4  
PA5  
PA6  
PA7  
PC0  
PC1  
PC2  
PC3  
3
4
5
PB6  
6
PB5  
7
PB4  
8
PB3  
9
PB2  
10  
11  
12  
13  
14  
PB1  
PB0  
V
DD  
V
SS  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
81  
Mechanical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
 
Freescale Semiconductor, Inc.  
Me c ha nic a l Sp e c ific a tions  
8.3 Pa c ka g e Dim e nsions  
8.3.1 P Suffix, Pla stic DIP, Ca se # 710-02  
-A-  
28  
15  
14  
B
1
C
L
-T-  
SEATING  
PLANE  
J 20 PL  
N
H
G
F
D 20 PL  
K
M
M
M
0.25(0.010)  
T B  
M
M
0.25(0.010)  
T
A
MILLIMETERS  
INCHES  
MIN MAX  
DIM  
MIN  
MAX  
A
B
C
D
F
G
H
J
K
L
M
N
36.45  
13.72  
3.94  
37.21  
14.2  
5.08  
0.56  
1.52  
1.435  
0.540  
0.155  
0.014  
0.040  
1.465  
0.560  
0.200  
0.022  
0.060  
NOTES  
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE  
WITHIN 0.25mm (0.010) AT MAXIMUM MATERIAL  
CONDITION, IN RELATION TO SEATING PLANE AND  
EACH OTHER.  
2. DIMENSION "L" TO CENTER OF LEADS WHEN FORMED  
PARALLEL.  
0.36  
1.02  
2.54 BSC  
1.65  
0.20  
2.92  
15.24 BSC  
0°  
0.51  
0.100 BSC  
0.065  
0.008  
0.115  
0.600 BSC  
0°  
0.020  
2.16  
0.38  
3.43  
0.085  
0.015  
0.135  
3. DIMENSION "B" DOES NOT INCLUDE MOLD FLASH.  
15°  
1.02  
15°  
0.040  
General Release Specification  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
82  
Mechanical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Mechanical Specifications  
Package Dimensions  
8.3.2 DW Suffix, SOIC, Ca se # 751F-02  
-A-  
28  
1
15  
14  
M
M
-B- P  
0.25(0.010)  
B
14 PL  
G
R X 45°  
J
C
-T-  
SEATING  
PLANE  
M
K
F
D 20 PL  
NOTES  
1. DIMENSIONS "A" AND "B" ARE DATUMS AND  
"T" IS A DATUM SURFACE.  
2. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
3. CONTROLLING DIM; MILLIMETER.  
4. DIMENSION A AND B DO NOT INCLUDE MLD  
PROTRUSION.  
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
MILLIMETERS  
INCHES  
DIM  
MIN  
MAX  
MIN  
MAX  
6. 751F-01 OBSOLETE, NEW STANDARD  
751F-02.  
A
B
C
D
F
17.80  
7.40  
2.35  
0.35  
0.50  
18.05  
7.60  
2.65  
0.49  
0.90  
0.701  
0.292  
0.093  
0.014  
0.020  
0.710  
0.299  
0.104  
0.019  
0.035  
G
J
1.27 BSC  
0.050BSC  
0.25  
0.10  
0°  
10.05  
0.25  
0.32  
0.25  
7°  
10.55  
0.75  
0010  
0.004  
0°  
0.395  
0.010  
0.012  
0.009  
7°  
0.415  
0.029  
K
M
P
R
MC68HC05E1 — Revision 2.0  
MOTOROLA  
General Release Specification  
83  
Mechanical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
Me c ha nic a l Sp e c ific a tions  
General Release Specification  
84  
MC68HC05E1 — Revision 2.0  
MOTOROLA  
Mechanical Specifications  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
For More Information On This Product,  
Go to: www.freescale.com  
Freescale Semiconductor, Inc.  
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HC05E1GRS/D  
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