STD2NC45T4 [ETC]

N-CHANNEL 450V 4.1OHM 1.5A DPAK/IPAK/TO-92 SUPERMESH POWER MOSFET ; N沟道450V 1.5A 4.1OHM DPAK / IPAK / TO- 92超网功率MOSFET\n
STD2NC45T4
型号: STD2NC45T4
厂家: ETC    ETC
描述:

N-CHANNEL 450V 4.1OHM 1.5A DPAK/IPAK/TO-92 SUPERMESH POWER MOSFET
N沟道450V 1.5A 4.1OHM DPAK / IPAK / TO- 92超网功率MOSFET\n

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STD2NC45-1  
STQ1NC45  
N-CHANNEL 450V - 4.1- 1.5 A IPAK / TO-92  
SuperMESH™Power MOSFET  
TYPE  
V
R
I
D
Pw  
DSS  
DS(on)  
STD2NC45-1  
STQ1NC45  
450 V  
450 V  
< 4.5 Ω  
< 4.5 Ω  
1.5 A  
0.5 A  
30 W  
3.1 W  
3
TYPICAL R (on) = 4.1 Ω  
DS  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
GATE CHARGE MINIMIZED  
NEW HIGH VOLTAGE BENCHMARK  
2
1
IPAK  
TO-92  
DESCRIPTION  
The SuperMESH™ series is obtained through an  
extreme optimization of ST’s well established strip-  
based PowerMESH™ layout. In addition to pushing  
on-resistance significantly down, special care is tak-  
en to ensure a very good dv/dt capability for the  
most demanding applications. Such series comple-  
ments ST full range of high voltage MOSFETs in-  
cluding revolutionary MDmesh™ products.  
TO-92 (Ammopack)  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
SWITCH MODE LOW POWER SUPPLIES  
(SMPS)  
LOW POWER, LOW COST CFL (COMPACT  
FLUORESCENT LAMPS)  
LOW POWER BATTERY CHARGERS  
ORDERING INFORMATION  
SALES TYPE  
MARKING  
D2NC45  
Q1NC45  
Q1NC45  
PACKAGE  
PACKAGING  
TUBE  
STD2NC45-1  
STQ1NC45  
IPAK  
TO-92  
TO-92  
BULK  
STQ1NC45-AP  
AMMOPAK  
June 2003  
1/11  
STD2NC45-1, STQ1NC45  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
STD2NC45-1  
STQ1NC45  
V
Drain-source Voltage (V = 0)  
450  
450  
± 30  
V
V
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuos) at T = 25°C  
1.5  
0.95  
6
0.5  
0.315  
2
A
D
C
I
Drain Current (continuos) at T = 100°C  
A
D
C
I
( )  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
30  
3.1  
W
C
Derating Factor  
0.24  
0.025  
W/°C  
V/ns  
dv/dt (1)  
Peak Diode Recovery voltage slope  
3
T
T
stg  
Operating Junction Temperature  
Storage Temperature  
-65 to 150  
-65 to 150  
°C  
°C  
j
( ) Pulse width limited by safe operating area  
(1) I 0.5A, di/dt 100A/µs, V V  
, T T  
j JMAX.  
SD  
DD  
(BR)DSS  
THERMAL DATA  
IPAK  
4.1  
TO-92  
Rthj-case  
Rthj-amb  
Rthj-lead  
Thermal Resistance Junction-case Max  
Thermal Resistance Junction-ambient Max  
Thermal Resistance Junction-lead Max  
°C/W  
°C/W  
°C/W  
°C  
100  
120  
40  
T
Maximum Lead Temperature For Soldering  
Purpose  
275  
260  
l
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
IPAK  
TO-92  
I
Avalanche Current, Repetitive or Not-Repetitive  
1.5  
25  
A
AR  
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
mJ  
AS  
(starting T = 25 °C, I = I , V = 50 V)  
j
D
AR  
DD  
2/11  
STD2NC45-1, STQ1NC45  
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OTHERWISE SPECIFIED)  
ON/OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
= 250 µA, V = 0  
450  
V
(BR)DSS  
D
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
= Max Rating  
DS  
1
50  
µA  
µA  
DSS  
Drain Current (V = 0)  
= Max Rating, T = 125 °C  
GS  
DS  
C
I
Gate-body Leakage  
V
= ± 30V  
±100  
nA  
GSS  
GS  
Current (V = 0)  
DS  
V
V
V
= V , I = 250µA  
Gate Threshold Voltage  
2.3  
3
3.7  
4.5  
V
GS(th)  
DS  
GS  
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 0.5 A  
4.1  
DS(on)  
D
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
g
(1)  
Forward Transconductance  
V
> I  
x R  
DS(on)max,  
1.1  
S
fs  
DS  
D(on)  
I
= 0.5 A  
D
C
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitance  
V
= 25V, f = 1 MHz, V = 0  
pF  
pF  
pF  
iss  
DS  
GS  
160  
27.5  
4.7  
C
oss  
C
rss  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time  
Rise Time  
V
R
= 225 V, I = 0.5 A  
= 4.7V = 10 V  
GS  
6.7  
4
ns  
ns  
d(on)  
DD  
D
t
r
G
(Resistive Load see, Figure 3)  
Q
V
V
= 360V, I = 1.5 A,  
10  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
7
1.3  
3.2  
nC  
nC  
nC  
g
DD  
GS  
D
Q
gs  
gd  
= 10V, R = 4.7Ω  
G
Q
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 360V, I = 1.5 A,  
Off-voltage Rise Time  
Fall Time  
Cross-over Time  
8.5  
12  
18  
ns  
ns  
ns  
r(Voff)  
DD  
D
t
f
= 4.7Ω, V = 10V  
G
GS  
t
c
(Inductive Load see, Figure 5)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
I
1.5  
6.0  
A
A
Source-drain Current  
Source-drain Current (pulsed)  
SD  
(2)  
I
SDM  
V
(1)  
I
I
= 1.5 A, V = 0  
Forward On Voltage  
1.6  
V
SD  
SD  
SD  
GS  
t
= 1.5 A, di/dt = 100A/µs  
= 100V, T = 150°C  
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
225  
530  
4.7  
ns  
µC  
A
Q
V
DD  
rr  
RRM  
j
I
(see test circuit, Figure 5)  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
3/11  
STD2NC45-1, STQ1NC45  
Safe Operating Area For IPAK  
Thermal Impedance For IPAK  
Safe Operating Area For TO-92  
Thermal Impedance For TO-92  
Output Characteristics  
Transfer Characteristics  
4/11  
STD2NC45-1, STQ1NC45  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
Normalized Gate Threshold Voltage vs Temp.  
Normalized On Resistance vs Temperature  
5/11  
STD2NC45-1, STQ1NC45  
Source-drain Diode Forward Characteristics  
Normalized BVDSS vs Temperature  
Max Id Current vs Tc  
Maximum Avalanche Energy vs Temperature  
6/11  
STD2NC45-1, STQ1NC45  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuit For  
Fig. 4: Gate Charge test Circuit  
Resistive Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
7/11  
STD2NC45-1, STQ1NC45  
TO-251 (IPAK) MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
2.4  
MIN.  
0.086  
0.035  
0.027  
0.025  
0.204  
MAX.  
0.094  
0.043  
0.051  
0.031  
0.212  
0.033  
A
A1  
A3  
B
2.2  
0.9  
1.1  
0.7  
1.3  
0.64  
5.2  
0.9  
B2  
B3  
B5  
B6  
C
5.4  
0.85  
0.3  
0.012  
0.95  
0.6  
0.6  
6.2  
6.6  
4.6  
16.3  
9.4  
1.2  
1
0.037  
0.023  
0.023  
0.244  
0.260  
0.181  
0.641  
0.370  
0.047  
0.039  
0.45  
0.48  
6
0.017  
0.019  
0.236  
0.252  
0.173  
0.626  
0.354  
0.031  
C2  
D
E
6.4  
4.4  
15.9  
9
G
H
L
L1  
L2  
0.8  
0.8  
0.031  
H
L
D
L2  
L1  
0068771-E  
8/11  
STD2NC45-1, STQ1NC45  
TO-92 MECHANICAL DATA  
mm.  
inch  
DIM.  
MIN.  
4.32  
0.36  
4.45  
3.30  
2.41  
1.14  
12.70  
2.16  
0.92  
0.41  
TYP  
MAX.  
4.95  
0.51  
4.95  
3.94  
2.67  
1.40  
15.49  
2.41  
1.52  
0.56  
MIN.  
0.170  
0.014  
0.175  
0.130  
0.094  
0.044  
0.50  
TYP.  
MAX.  
0.194  
0.020  
0.194  
0.155  
0.105  
0.055  
0.610  
0.094  
0.060  
0.022  
A
b
D
E
e
e1  
L
R
S1  
W
V
0.085  
0.036  
0.016  
5°  
5°  
9/11  
STD2NC45-1, STQ1NC45  
10/11  
STD2NC45-1, STQ1NC45  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are  
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products  
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is a trademark of STMicroelectronics  
© 2000 STMicroelectronics – Printed in Italy – All Rights Reserved  
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http://www.st.com  
11/11  

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