SP3232EBCY-LTR [EXAR]
True 3.0V to 5.5V RS-232 Transceivers;
| 型号： | SP3232EBCY-LTR |
| 厂家： | 
EXAR CORPORATION |
| 描述： | True 3.0V to 5.5V RS-232 Transceivers |
| 文件： | 总22页 (文件大小：977K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SP3222EB/SP3232EB
True +3.0V to +5.5V RS-232 Transceivers
FEATURES
■ Meets true EIA/TIAꢀ232ꢀF Standards
from a +3.0V to +5.5V power supply
■ 250kbps Transmission Rate Under Load
■ 1ꢁA Low Power Shutdown with
Receivers active (SP3222EB)
■ Interoperable with RSꢀ232 down to a
+2.7V power source
V
CC
1
2
3
4
5
6
16
15
14
13
12
11
C1+
V+
GND
C1-
T1OUT
SP3232EB
C2+
C2-
V-
R1IN
■ Enhanced ESD Specifications:
+15kV Human Body Model
R1OUT
T1IN
+15kV IEC61000ꢀ4ꢀ2 Air Discharge
+8kV IEC61000ꢀ4ꢀ2 Contact Discharge
7
8
10
9
T2OUT
R2IN
T2IN
R2OUT
Now Available in Lead Free Packaging
DESCRIPTION
The SP3222EB/SP3232EB series is an RSꢀ232 transceiver solution intended for portable or
handꢀheld applications such as notebook or laptop computers. The SP3222EB/SP3232EB
series has a highꢀefficiency, chargeꢀpump power supply that requires only 0.1ꢁF capacitors
in 3.3V operation. This charge pump allows the SP3222EB/SP3232EB series to deliver true
RSꢀ232performancefromasinglepowersupplyrangingfrom+3.0Vto+5.5V.TheSP3222EB/
SP3232EB are 2ꢀdriver/2ꢀreceiver devices. The ESD tolerance of the SP3222EB/SP3232EB
devices is over +/ꢀ15kV for both Human Body Model and IEC61000ꢀ4ꢀ2 Air discharge test
methods. The SP3222EB device has a lowꢀpower shutdown mode where the devices' driver
outputs and charge pumps are disabled. During shutdown, the supply current falls to less
than 1ꢁA.
SELECTION TABLE
Device
Power
RSꢀ232
RSꢀ232
External
Shutdown
TTL
# of
Supplies
Drivers Receivers Components
3ꢀState
Pins
SP3222EB
SP3232EB
+3.0V to
+5.5V
2
2
2
2
4 Capacitors
4 Capacitors
Yes
Yes
18, 20
+3.0V to
+5.5V
No
No
16
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
V .......................................................ꢀ0.3V to +6.0V
V+CC(NOTE 1).......................................ꢀ0.3V to +7.0V
Vꢀ (NOTE 1)........................................+0.3V to ꢀ7.0V
V+ + |Vꢀ| (NOTE 1)...........................................+13V
ICC (DC VCC or GND current).........................+100mA
Power Dissipation per package
20ꢀpin SSOP (derate 9.25mW/oC above +70oC)..............750mW
18ꢀpin SOIC (derate 15.7mW/oC above +70oC)..............1260mW
20ꢀpin TSSOP (derate 11.1mW/oC above +70oC).............890mW
16ꢀpin SSOP (derate 9.69mW/oC above +70oC)...............775mW
16ꢀpin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW
16ꢀpin TSSOP (derate 10.5mW/oC above +70oC)..............850mW
16ꢀpin nSOIC (derate 13.57mW/oC above +70oC)...........1086mW
Input Voltages
TxIN, EN..............................................ꢀ0.3V to +6.0V
RxIN...................................................................+15V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, .......................................ꢀ0.3V to (VCC +0.3V)
Short-Circuit Duration
Maximum Junction Temperature .......................................+125°C
Thermal Resistance ΘJA ..............................................100.4°C/W
Thermal Resistance ΘJC ................................................19.0°C/W
TxOUT....................................................Continuous
Storage Temperature......................ꢀ65°C to +150°C
NOTE 1: V+ and Vꢀ can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
NOTE 2: Driver Input hysteresis is typically 250mV.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
C1 ꢀ C4 = 0.1ꢁF.
,
PARAMETER
MIN.
TYP.
MAX. UNITS CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
1.0
10
mA
ꢁA
no load, VCC = 3.3V,
AMB = 25oC, TxIN = GND or VCC
T
Shutdown Supply Current
SHDN = GND, VCC = 3.3V,
TAMB = 25oC, TxIN = Vcc or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
GND
0.8
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
Input Logic Threshold HIGH
Input Leakage Current
2.0
2.4
Vcc
Vcc
+1.0
V
Vcc = 3.3V, Note 2
Vcc = 5.0V, Note 2
TxIN, EN, SHDN,
V
+0.01
+0.05
ꢁA
T
AMB = +25oC, VIN = 0V to VCC
Output Leakage Current
Output Voltage LOW
Output Voltage HIGH
DRIVER OUTPUTS
Output Voltage Swing
+10
0.4
ꢁA
V
Receivers disabled, VOUT = 0V to VCC
IOUT = 1.6mA
V
CC ꢀ0.6 VCC ꢀ0.1
V
IOUT = ꢀ1.0mA
+5.0
+5.4
V
All driver outputs loaded with 3kꢂ to
GND, TAMB = +25oC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
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ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
,
C1 ꢀ C4 = 0.1ꢁF. Typical values apply at VCC = +3.3V or +5.0V and TAMB = 25°C.
PARAMETER
MIN.
TYP. MAX. UNITS CONDITIONS
DRIVER OUTPUTS (continued)
Output Resistance
300
ꢂ
mA
ꢁA
VCC = V+ = Vꢀ = 0V, VOUT=+2V
VOUT = 0V
Output ShortꢀCircuit Current
Output Leakage Current
+35
+60
+25
VCC = 0V or 3.0V to 5.5V, VOUT
+12V, Drivers disabled
=
RECEIVER INPUTS
Input Voltage Range
Input Threshold LOW
Input Threshold LOW
Input Threshold HIGH
Input Threshold HIGH
Input Hysteresis
ꢀ15
0.6
0.8
15
V
V
1.2
1.5
1.5
1.8
0.3
5
Vcc = 3.3V
Vcc = 5.0V
Vcc = 3.3V
Vcc = 5.0V
V
2.4
2.4
V
V
V
Input Resistance
3
7
kꢂ
TIMING CHARACTERISTICS
Maximum Data Rate
250
kbps
RL = 3kꢂ, CL = 1000pF, one
driver active
Receiver Propagation Delay, tPHL
Receiver Propagation Delay, tPLH
0.15
0.15
ꢁs
ꢁs
Receiver input to Receiver
output, CL = 150pF
Receiver input to Receiver
output, CL = 150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
100
ns
ns
ns
| tPHL ꢀ tPLH |, TAMB = 25°C
Receiver Skew
50
ns
| tPHL ꢀ tPLH |
TransitionꢀRegion Slew Rate
30
V/ꢁs
Vcc = 3.3V, RL = 3kꢂ,
CL = 1000pF, TAMB = 25°C,
measurements taken from ꢀ3.0V
to +3.0V or +3.0V to ꢀ3.0V
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 1000kbps data rate, all
drivers loaded with 3kꢂ, 0.1ꢁF charge pump capacitors, and TAMB = +25°C.
30
25
20
15
10
5
6
4
- Slew
+ Slew
TxOUT+
2
T1 at 250Kbps
0
T2 at 15.6Kbps
All TX loaded 3K // CLoad
T1 at 250Kbps
-2
-4
-6
T2 at 15.6Kbps
TxOUT-
All TX loaded 3K // CLoad
0
0
500 1000
2000 3000 4000 5000
0
1000
2000
3000
4000
5000
Load Capacitance (pF)
Load Capacitance (pF)
Figure 1. Transmitter Output Voltage vs Load
Capacitance
Figure 2. Slew Rate vs Load Capacitance
16
14
12
10
8
35
T1 at Full Data Rate
30
25
20
15
10
5
250Kbps
T2 at 1/16 Data Rate
All TX loaded 3K // CLoad
125Kbps
6
1 Transmitter at 250Kbps
20Kbps
1 Transmitter at 15.6Kbps
4
All transmitters loaded with 3K // 1000pf
2
0
2.7
3
3.5
4
4.5
5
0
0
1000
2000
3000
4000
5000
Supply Voltage (V)
Load Capacitance (pF)
Figure 3. Supply Current VS. Load Capacitance
when Transmitting Data
Figure 4. Supply Current VS. Supply Voltage
6
TxOUT+
4
2
T1 at 250Kbps
T2 at 15.6Kbps
0
All TX loaded 3K // 1000 pF
-2
-4
-6
TxOUT-
2.7
3
3.5
4
4.5
5
Supply Voltage (V)
Figure 5. Transmitter Output Voltage vs Supply
Voltage
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
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PIN FUNCTION
PIN NUMBER
SP3222EB
SP3232EB
NAME
EN
FUNCTION
SOIC
SSOP
TSSOP
Receiver Enable. Apply Logic LOW for normal operation.
Apply logic HIGH to disable the receiver outputs (highꢀZ state)
1
1
ꢀ
C1+
V+
Positive terminal of the voltage doubler chargeꢀpump capacitor
+5.5V output generated by the charge pump
Negative terminal of the voltage doubler chargeꢀpump capacitor
Positive terminal of the inverting chargeꢀpump capacitor
Negative terminal of the inverting chargeꢀpump capacitor
ꢀ5.5V output generated by the charge pump
RSꢀ232 driver output.
2
3
2
3
1
2
C1ꢀ
4
4
3
C2+
C2ꢀ
5
5
4
6
6
5
Vꢀ
7
7
6
T1OUT
T2OUT
R1IN
R2IN
15
8
17
8
14
7
RSꢀ232 driver output.
RSꢀ232 receiver input
14
9
16
9
13
8
RSꢀ232 receiver input
R1OUT TTL/CMOS receiver output
R2OUT TTL/CMOS receiver output
13
10
12
11
16
17
15
10
13
12
18
19
12
9
T1IN
T2IN
GND
VCC
TTL/CMOS driver input
TTL/CMOS driver input
Ground.
11
10
15
16
+3.0V to +5.5V supply voltage
Shutdown Control Input. Drive HIGH for normal device operation.
Drive LOW to shutdown the drivers (highꢀZ output) and the onꢀ
board power supply
SHDN
N.C.
18
ꢀ
20
ꢀ
ꢀ
No Connect
11, 14
Table 1. Device Pin Description
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
5
PINOUT
EN
1
2
3
4
5
6
20
19
18
17
16
15
SHDN
EN
18
17
16
15
14
13
1
2
3
4
5
6
SHDN
V
CC
C1+
V+
V
CC
C1+
V+
GND
GND
C1-
T1OUT
R1IN
C1-
T1OUT
R1IN
SP3222EB
C2+
C2-
V-
SP3222EB
C2+
C2-
V-
R1OUT
R1OUT
7
14
13
N.C.
T1IN
7
12
T1IN
T2OUT 8
11
10
R2IN
T2OUT 8
R2IN
9
12 T2IN
N.C.
T2IN
10
R2OUT
11
9
R2OUT
nSOIC
SSOP/TSSOP
Figure 6. Pinout Configurations for the SP3222EB
V
CC
16
15
14
13
12
11
1
2
3
4
5
6
C1+
V+
GND
C1-
T1OUT
SP3232EB
C2+
C2-
V-
R1IN
R1OUT
T1IN
7
8
10
9
T2OUT
R2IN
T2IN
R2OUT
Figure 7. Pinout Configuration for the SP3232EB
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
6
TYPICAL OPERATING CIRCUITS
VCC
VCC
+
+
+
+
19
17
0.1µF
0.1µF
C5
C1
0.1µF
C5
C1
VCC
VCC
2
3
2
3
C1+
C1+
V+
V-
V+
V-
+
+
+
+
0.1µF
0.1µF
*C3
C4
0.1µF
0.1µF
0.1µF
0.1µF
*C3
C4
4
5
C1-
4
5
C1-
7
C2+
SP3222EB
7
C2+
SP3222EB
nSOIC
+
+
SSOP
TSSOP
C2
0.1µF
C2
6
C2-
6
C2-
T1OUT
T2OUT
17
8
T1OUT
T2OUT
13 T1IN
15
8
12 T1IN
LOGIC
INPUTS
RS-232
OUTPUTS
LOGIC
INPUTS
RS-232
OUTPUTS
12
T2IN
11
T2IN
16
15
10
R1IN
R1OUT
R2OUT
14
13
10
R1IN
R1OUT
R2OUT
5kΩ
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
9
R2IN
9
5kΩ
5kΩ
1 EN
1 EN
20
18
SHDN
SHDN
GND
18
GND
16
*can be returned to
either VCC or GND
*can be returned to
either VCC or GND
Figure 8. SP3222EB Typical Operating Circuits
VCC
+
16
0.1µF
0.1µF
C5
C1
VCC
2
6
1
C1+
V+
V-
+
+
+
+
*C3
C4
0.1µF
0.1µF
3
4
C1-
C2+
SP3232EB
0.1µF
C2
5
C2-
T1OUT
T2OUT
14
7
11 T1IN
LOGIC
INPUTS
RS-232
OUTPUTS
10
T2IN
12
9
R1IN 13
R1OUT
R2OUT
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
8
5kΩ
GND
15
*can be returned to
either VCC or GND
Figure 9. SP3232EB Typical Operating Circuit
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
7
DESCRIPTION
The SP3222EB/SP3232EB transceivers
meet the EIA/TIAꢀ232 and ITUꢀT V.28/V.24
communication protocols and can be impleꢀ
mented in batteryꢀpowered, portable, or
handꢀheld applications such as notebook
or palmtop computers. The SP3222EB/
SP3232EB devices feature Exar's propriꢀ
etary onꢀboard charge pump circuitry that
generates ±5.5V for RSꢀ232 voltage levels
from a single +3.0V to +5.5V power supply.
This series is ideal for +3.3Vꢀonly systems,
mixed+3.3Vto+5.5Vsystems,or+5.0Vꢀonly
systems that require true RSꢀ232 perforꢀ
mance.TheSP3222EB/SP3232EB devices
can operate at a data rate of 250kbps when
fully loaded.
The drivers can guarantee a data rate of
250kbps fully loaded with 3kꢂ in parallel
with 1000pF, ensuring compatability with
PCꢀtoꢀPC communication software.
Theslewrateofthedriverisinternallylimited
to a maximum of 30V/ꢁs in order to meet the
EIA standards (EIA RSꢀ232D 2.1.7, Paraꢀ
graph 5). The transition of the loaded output
fromHIGHtoLOWalsomeetthemonotonicꢀ
ity requirements of the standard.
Figure 10 shows a loopback test circuit
used to test the RSꢀ232 Drivers. Figure
11 shows the test results of the loopback
circuit with all drivers active at 120kbps
with RSꢀ232 loads in parallel with a
1000pF capacitor. Figure 12 shows the
test results where one driver was active
at 250kbps and all drivers loaded with an
RSꢀ232 receiver in parallel with 1000pF
capacitors. A solid RSꢀ232 data transmisꢀ
sion rate of 250kbps provides compatibility
with many designs in personal computer
peripherals and LAN applications.
The SP3222EB and SP3232EB are 2ꢀ
driver/2ꢀ receiver devices ideal for portable
or handꢀheld applications. The SP3222EB
featuresa1ꢁA shutdownmodethatreduces
power consumption and extends battery life
in portable systems. Its receivers remain
active in shutdown mode, allowing external
devices such as modems to be monitored
using only 1ꢁA supply current.
The SP3222EB driver's output stages are
turned off (triꢀstate) when the device is in
shutdown mode. When the power is off, the
SP3222EB device permits the outputs to be
driven up to +/ꢀ12V. The driver's inputs do
nothavepullꢀupresistors. Designersshould
connect unused inputs to Vcc or GND.
THEORY OF OPERATION
The SP3222EB/SP3232EB series is made
up of three basic circuit blocks:
1. Drivers
2. Receivers
3. The Exar proprietary charge pump
In the shutdown mode, the supply current
falls to less than 1ꢁA, where SHDN = LOW.
When the SP3222EB device is shut down,
the device's driver outputs are disabled (triꢀ
stated) and the charge pumps are turned off
with V+ pulled down to Vcc and Vꢀ pulled to
GND. The time required to exit shutdown is
typically 100ꢁs. Connect SHDN to Vcc if the
shutdown mode is not used.
Drivers
The drivers are inverting level transmitters
that convert TTL or CMOS logic levels to
+5.0V EIA/TIAꢀ232 levels with an inverted
sense relative to the input logic levels.
Typically, the RSꢀ232 output voltage swing
is +5.4V with no load and +5V minimum fully
loaded. The driver outputs are protected
against infinite shortꢀcircuits to ground withꢀ
out degradation in reliability. Driver outputs
will meet EIA/TIAꢀ562 levels of +/ꢀ3.7V with
supply voltages as low as 2.7V.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
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DESCRIPTION
Receivers
VCC
The Receivers convert EIA/TIAꢀ232 levels
to TTL or CMOS logic output levels. The
SP3222EB receivers have an inverting
triꢀstate output. These receiver outputs
(RxOUT) are triꢀstated when the enable
control EN = HIGH. In the shutdown mode,
the receivers can be active or inactive. EN
hasnoeffectonTxOUT.Thetruthtablelogic
oftheSP3222EBdriverandreceiveroutputs
can be found in Table 2.
+
+
0.1µF
0.1µF
C5
C1
VCC
C1+
V+
V-
+
+
C3
C4
0.1µF
0.1µF
C1-
SP3222EB
SP3232EB
C2+
+
C2
0.1µF
C2-
TxOUT
TxIN
LOGIC
INPUTS
RxIN
RxOUT
EN*
LOGIC
OUTPUTS
5kΩ
*SHDN
SHDN
EN
TxOUT
RxOUT
VCC
0
0
1
1
0
1
0
1
Triꢀstate
Triꢀstate
Active
Active
Triꢀstate
Active
GND
1000pF
* SP3222EB only
Active
Triꢀstate
Figure 10. SP3222EB/SP3232EB Driver Loopback
Test Circuit
Table 2. SP3222EB Truth Table Logic for Shutdown
and Enable Control
Since receiver input is usually from a transꢀ
mission line where long cable lengths and
system interference can degrade the signal,
the inputs have a typical hysteresis margin
of 300mV. This ensures that the receiver
is virtually immune to noisy transmission
lines. Should an input be left unconnected,
an internal 5kꢂ pulldown resistor to ground
will commit the output of the receiver to a
HIGH state.
Figure 11. Loopback Test results at 120kbps
Charge Pump
The charge pump is an Exarꢀpatended
design (U.S. 5,306,954) and uses a unique
approach compared to older lessꢀefficient
designs.Thechargepumpstillrequiresfour
external capacitors, but uses a fourꢀphase
voltage shifting technique to attain symꢀ
metrical 5.5V power supplies. The internal
power supply consists of a regulated dual
charge pump that provides output voltages
of +/ꢀ5.5V regardless of the input voltage
(Vcc) over the +3.0V to +5.5V range.
Figure 12. Loopback Test results at 250kbps
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
9
DESCRIPTION
Inmostcircumstances,decouplingthepower
supply can be achieved adequately using
a 0.1ꢁF bypass capacitor at C5 (refer to
fi g ures 8 and 9)
Phase 4
— V transfer — The fourth phase of
the cDloDck connects the negative terminal
of C2 to GND, and transfers this positive
generated voltage across C2 to C4, the
VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the inꢀ
ternal oscillator is disabled. Simultaneous
with the transfer of the voltage to C4, the
positive side of capacitor C is switched
to V and the negative1 side is conꢀ
nectCeCd to GND, allowing the charge
pump cycle to begin again. The charge
pump cycle will continue as long as the
operational conditions for the internal
oscillator are present.
In applications that are sensitive to powerꢀ
supply noise, decouple Vcc to ground with a
capacitorofthesamevalueaschargeꢀpump
capacitor C1. Physically connect bypass
capcitors as close to the IC as possible.
The charge pump operates in a discontinuꢀ
ous mode using an internal oscillator. If the
output voltages are less than a magnitude
of 5.5V, the charge pump is enabled. If the
outputvoltages exceedamagnitudeof5.5V,
the charge pump is disabled. This oscillator
controls the four phases of the voltage shiftꢀ
ing. A description of each phase follows.
Since both V+ and V– are separately generꢀ
ated from VCC, in a no–load condition V+
and V– will be symmetrical. Older charge
pump approaches that generate V– from
V+ will show a decrease in the magnitude
of V– compared to V+ due to the inherent
inefficiencies in the design.
Phase 1
— VSS charge storage — During this phase
oftheclockcycle,thepositivesideofcapaciꢀ
tors C1 and C2 are initially charged to VCC.
Cl+ is then switched to GND and the charge
in C1– is transferred to C –. Since C2+ is conꢀ
nected to V , the volta2ge potential across
capacitor C2CCis now 2 times VCC.
The clock rate for the charge pump typically
operatesatgreaterthan250kHz. Theexterꢀ
nal capacitors can be as low as 0.1ꢁF with
a 16V breakdown voltage rating.
Phase 2
— V transfer — Phase two of the clock
connSeSctsthenegativeterminalofC to theVSS
storagecapacitorandthepositivet2erminalof
C2 to GND. This transfers a negative generꢀ
ated voltage to C3. This generated voltage is
regulated to a minimum voltage of ꢀ5.5V.
Simultaneous with the transfer of the voltꢀ
age to C3, the positive side of capacitor C1
is switched to VCC and the negative side is
connected to GND.
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –VCC in
the negative terminal of C , which is applied
to the negative side of ca1pacitor C2. Since
C + is at V , the voltage potential across C2
is22 timesCVCCC.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
10
DESCRIPTION
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 13. Charge Pump — Phase 1
V
CC
= +5V
C
4
+
–
V
V
Storage Capacitor
Storage Capacitor
DD
SS
+
–
+
C
1
C
2
–
+
–
C
3
-5.5V
Figure 14. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
GND
1
2
b) C2-
-6V
Ch1 2.00V Ch2 2.00V M 1.00ms Ch1 5.48V
Figure 15. Charge Pump Waveforms
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
+
–
C
1
C
2
–
–
SS
C
–5V
–5V
3
Figure 16. Charge Pump — Phase 3
V
= +5V
CC
+5.5V
C
4
+
–
+
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
C
1
C
2
–
–
V
SS
C
3
Figure 17. Charge Pump — Phase 4
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
11
DESCRIPTION
ESD TOLERANCE
thesystemisrequiredtowithstandanamount
of static electricity when ESD is applied to
points and surfaces of the equipment that
are accessible to personnel during normal
The SP3222EB/SP3232EB series incorꢀ
porates ruggedized ESD cells on all driver
output and receiver input pins. The ESD
structure is improved over our previous
family for more rugged applications and
environments sensitive to electroꢀstatic
discharges and associated transients. The
improved ESD tolerance is at least +15kV
without damage nor latchꢀup.
usage. The transceiver IC receives most
of the ESD current when the ESD source is
appliedtotheconnectorpins. Thetestcircuit
for IEC61000ꢀ4ꢀ2 is shown on Figure 19.
TherearetwomethodswithinIEC61000ꢀ4ꢀ2,
the Air Discharge method and the Contact
Discharge method.
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electricallychargedpersonreadytoconnect
a cable onto the rear of the system only to
fi n danunpleasantzapjustbeforetheperson
touches the back panel. The high energy
potential on the person discharges through
anarcingpathtotherearpanelofthesystem
before he or she even touches the system.
This energy, whether discharged directly or
throughair,ispredominantlyafunctionofthe
discharge current rather than the discharge
voltage. Variableswithanairdischargesuch
asapproachspeedoftheobjectcarryingthe
ESD potential to the system and humidity
will tend to change the discharge current.
For example, the rise time of the discharge
current varies with the approach speed.
There are different methods of ESD testing
applied:
a) MILꢀSTDꢀ883, Method 3015.7
b) IEC61000ꢀ4ꢀ2 AirꢀDischarge
c) IEC61000ꢀ4ꢀ2 Direct Contact
The Human Body Model has been the
generally accepted ESD testing method
for semiꢀconductors. This method is also
specified in MILꢀSTDꢀ883, Method 3015.7
forESDtesting.ThepremiseofthisESDtest
is to simulate the human body’s potential to
store electroꢀstatic energy and discharge it
to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 18. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in manuꢀ
facturing areas where the ICs tend to be
handled frequently.
The Contact Discharge Method applies the
ESDcurrentdirectlytotheEUT. Thismethod
was devised to reduce the unpredictability
of the ESD arc. The discharge current rise
time is constant since the energy is directly
transferred without the airꢀgap arc. In situꢀ
ations such as hand held systems, the ESD
charge can be directly discharged to the
The IECꢀ61000ꢀ4ꢀ2, formerly IEC801ꢀ2, is
generallyusedfortestingESDonequipment
and systems. For system manufacturers,
theymustguaranteeacertainamountofESD
protection since the system itself is exposed
totheoutsideenvironmentandhumanpresꢀ
ence. ThepremisewithIEC61000ꢀ4ꢀ2isthat
R
S
R
C
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
Figure 18. ESD Test Circuit for Human Body Model
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
12
DESCRIPTION
Contact-Discharge Model
R
R
R
V
C
S
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
and
add up to 330Ω for IEC1000-4-2.
R
V
R
S
Figure 19. ESD Test Circuit for IEC61000ꢀ4ꢀ2
equipment from a person already holding
the equipment. The current is transferred
on to the keypad or the serial port of the
equipment directly and then travels through
the PCB and finally to the IC.
The higher CS value and lower R value in
the IEC61000ꢀ4ꢀ2 model are moreSstringent
than the Human Body Model. The larger
storage capacitor injects a higher voltage
to the test point when SW2 is switched on.
The lower current limiting resistor increases
the current charge onto the test point.
The circuit models in Figures 18 and 19 repꢀ
resentthetypicalESDtestingcircuitusedfor
allthreemethods. TheCS is initiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor
is charged, the second switch (SW2) is on
while SW1 switches off. The voltage stored
in the capacitor is then applied through R ,
the current limiting resistor, onto the devicSe
under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under
test receives a duration of voltage.
30A
15A
0A
For the Human Body Model, the current
limitingresistor(RS)andthesourcecapacitor
(CS) are 1.5kꢂ an 100pF, respectively. For
IECꢀ61000ꢀ4ꢀ2, the current limiting resistor
(R ) and the source capacitor (CS) are 330ꢂ
anS150pF, respectively.
t = 0ns
t = 30ns
t →
Figure 20. ESD Test Waveform for IEC61000ꢀ4ꢀ2
DEVICE PIN
TESTED
HUMAN BODY
MODEL
IEC61000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
+15kV
+15kV
+15kV
+15kV
+8kV
+8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
13
PACKAGE: 20 PIN SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
14
PACKAGE: 16 PIN SSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
15
PACKAGE: 16 PIN WSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
16
PACKAGE: 18 PIN WSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
17
PACKAGE: 16 PIN nSOIC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
18
PACKAGE: 16 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
19
PACKAGE: 20 PIN TSSOP
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
20
ORDERING INFORMATION
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
Package
SP3222EBCAꢀL
SP3222EBCAꢀL/TR
SP3222EBCTꢀL
SP3222EBCTꢀL/TR
SP3222EBCYꢀL
SP3222EBCYꢀL/TR
SP3222EBEAꢀL
SP3222EBEAꢀL/TR
SP3222EBETꢀL
20 Pin SSOP
20 Pin SSOP
18 Pin WSOIC
18 Pin WSOIC
20 Pin TSSOP
20 Pin TSSOP
20 Pin SSOP
20 Pin SSOP
18 Pin WSOIC
18 Pin WSOIC
20 Pin TSSOP
20 Pin TSSOP
SP3222EBETꢀL/TR
SP3222EBEYꢀL
SP3222EBEYꢀL/TR
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
ꢀ40°C to +85°C
Package
SP3232EBCAꢀL
SP3232EBCAꢀL/TR
SP3232EBCNꢀL
SP3232EBCNꢀL/TR
SP3232EBCTꢀL
16 Pin SSOP
16 Pin SSOP
16 Pin NSOIC
16 Pin NSOIC
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
16 Pin SSOP
16 Pin SSOP
16 Pin NSOIC
16 Pin NSOIC
16 Pin WSOIC
16 Pin WSOIC
16 Pin TSSOP
16 Pin TSSOP
SP3232EBCTꢀL/TR
SP3232EBCYꢀL
SP3232EBCYꢀL/TR
SP3232EBEAꢀL
SP3232EBEAꢀL/TR
SP3232EBENꢀL
SP3232EBENꢀL/TR
SP3232EBETꢀL
SP3232EBETꢀL/TR
SP3232EBEYꢀL
SP3232EBEYꢀL/TR
Note: "/TR" is for tape and Reel option. "ꢀL" is for lead free packaging
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
21
REVISION HISTORY
DATE
REVISION DESCRIPTION
11/02/05
09/09/09
ꢀꢀ
Legacy Sipex Datasheet
1.0.0
Convert to Exar Format, Update ordering information and
change revision to 1.0.0.
06/07/11
03/14/13
8/14/14
1.0.1
1.0.2
1.0.3
Remove obsolete devices per PDN 110510ꢀ01 and change
ESD rating to IECꢀ61000ꢀ4ꢀ2.
Correct type error to RX input voltage range and TX transiꢀ
tion region slew rate condition.
Add Max Junction temperature and package thermal inforꢀ
mation.
Notice
EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reliꢀ
ability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are
only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully
checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been
minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 2014 EXAR Corporation
Datasheet August 2014
Send your serial transceiver technical inquiry with technical details to: serialtechsupport@exar.com
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510ꢀ668ꢀ7017 • www.exar.com
SP3222EB/SP3232EB_103_081414
22
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