FOD817B.W [FAIRCHILD]
Transistor Output Optocoupler, 1-Element, 5000V Isolation, DIP-4;
| 型号： | FOD817B.W |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Transistor Output Optocoupler, 1-Element, 5000V Isolation, DIP-4 输出元件 光电 |
| 文件： | 总12页 (文件大小：584K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
May 2006
FOD814 Series, FOD617 Series, FOD817 Series
4-Pin High Operating Temperature
Phototransistor Optocouplers
tm
Features
Description
■ AC input response (FOD814 only)
■ Applicable to Pb-free IR reflow soldering
■ Compact 4-pin package
The FOD814 consists of two gallium arsenide infrared
emitting diodes, connected in inverse parallel, driving a
silicon phototransistor output in a 4-pin dual in-line
package. The FOD617/817 Series consists of a gallium
■ Current transfer ratio in selected groups:
arsenide infrared emitting diode driving
phototransistor in a 4-pin dual in-line package.
a
silicon
FOD617A:40–80%
FOD617B: 63–125%
FOD617C:100–200%
FOD617D:160–320%
FOD814: 20–300%
FOD814A:50–150%
FOD817: 50–600%
FOD817A:80–160%
FOD817B: 130–260%
FOD817C:200–400%
FOD817D:300–600%
■ C-UL, UL and VDE approved
■ High input-output isolation voltage of 5000Vrms
■ Minimum BV
of 70V guaranteed
CEO
■ Higher operating temperatures (versus H11AXXX
counterparts)
Applications
FOD814 Series
■ AC line monitor
■ Unknown polarity DC sensor
■ Telephone line interface
FOD617 and FOD817 Series
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
Functional Block Diagram
ANODE, CATHODE 1
4 COLLECTOR
3 EMITTER
1
2
4
COLLECTOR
ANODE
4
CATHODE, ANODE 2
CATHODE
3 EMITTER
FOD814
FOD617/817
1
©2006 Fairchild Semiconductor Corporation
FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
1
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Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Value
FOD814 FOD617/817
Units
Symbol
Parameter
TOTAL DEVICE
T
Storage Temperature
-55 to +150
-55 to +105 -55 to +110
°C
°C
STG
T
Operating Temperature
Lead Solder Temperature
Total Power Dissipation
OPR
T
260 for 10 sec
200
°C
SOL
P
mW
TOT
EMITTER
I
Continuous Forward Current
Reverse Voltage
50
–
50
6
mA
F
V
P
R
Power Dissipation
70
mW
D
Derate above 100°C
1.7
mW/°C
DETECTOR
V
V
Collector-Emitter Voltage
Emitter-Collector Voltage
70
V
V
CEO
ECO
6
6 (FOD817)
7 (FOD617)
I
Continuous Collector Current
50
mA
C
P
Collector Power Dissipation
Derate above 90°C
150
2.9
mW
C
mW/°C
2
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Electrical Characteristics (T = 25°C Unless otherwise specified.)
A
Individual Component Characteristics
Symbol Parameter
EMITTER
Device
Test Conditions Min. Typ.* Max. Unit
V
Forward Voltage
FOD814
FOD617
FOD817
FOD617
FOD817
FOD814
FOD617
FOD817
I = 20mA
–
–
–
–
–
–
–
–
1.2
1.35
1.2
0.001
–
1.4
1.65
1.4
10
V
F
F
I = 60mA
F
I = 20mA
F
I
Reverse Leakage Current
Terminal Capacitance
V = 6.0V
µA
pF
R
R
V = 4.0V
10
R
C
V = 0, f = 1kHz
V = 0, f = 1kHz
V = 0, f = 1kHz
50
250
250
250
t
30
30
DETECTOR
I
Collector Dark Current
FOD814
FOD617C/D
FOD617A/B
FOD817
V
V
V
V
= 20V, I = 0
–
–
–
1
1
–
–
–
–
–
–
–
100
100
50
100
–
nA
CEO
CE
CE
CE
CE
F
= 10V, I = 0
F
= 10V, I = 0
–
F
= 20V, I = 0
–
F
BV
BV
Collector-Emitter Breakdown
Voltage
FOD814
I = 0.1mA, I = 0
70
70
70
6
V
V
CEO
C
F
FOD617
I = 100µA, I = 0
–
C
F
FOD817
I = 0.1mA, I = 0
–
C
F
Emitter-Collector Breakdown
Voltage
FOD814
I = 10µA, I = 0
–
ECO
E
F
FOD617
I = 10µA, I = 0
7
–
E
F
FOD817
I = 10µA, I = 0
6
–
E
F
Transfer Characteristics (T = 25°C Unless otherwise specified.)
A
Symbol DC Characteristic
Device
Test Conditions
Min.
20
50
40
63
100
160
13
22
34
56
50
80
130
200
300
–
Typ.* Max. Unit
(1)
CTR
Current Transfer
Ratio
FOD814 I = 1mA, V = 5V
–
–
300
150
80
%
F
CE
FOD814A
FOD617A I = 10mA, V = 5V
(1)
–
F
CE
FOD617B
FOD617C
FOD617D
–
125
200
320
–
–
–
(1)
FOD617A I = 1mA, V = 5V
–
F
CE
FOD617B
FOD617C
FOD617D
–
–
–
–
–
–
(1)
FOD817 I = 5mA, V = 5V
–
600
160
260
400
600
0.2
0.4
0.2
F
CE
FOD817A
FOD817B
FOD817C
FOD817D
–
–
–
–
V
Collector-Emitter
Saturation Voltage
FOD814 I = 20mA, I = 1mA
0.1
–
V
CE (sat)
F
C
FOD617 I = 10mA, I = 2.5mA
–
F
C
FOD817 I = 20mA, I = 1mA
–
0.1
F
C
*Typical values at T = 25°C
A
3
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Transfer Characteristics (Continued) (T = 25°C Unless otherwise specified.)
A
Symbol AC Characteristic
Device
Test Conditions
Min. Typ.* Max. Unit
f
Cut-Off Frequency
FOD814
V
-3dB
= 5V, I = 2mA, R = 100Ω,
15
80
–
kHz
C
CE
C
L
(2)
t
Response Time (Rise)
FOD814
FOD617
FOD817
FOD814
FOD617
FOD817
V
= 2 V, I = 2mA, R = 100Ω
–
4
18
µs
r
CE
C
L
t
Response Time (Fall)
–
3
18
µs
f
Isolation Characteristics
Symbol Characteristic
Device Test Conditions
Min.
5000
Typ.*
Max.
Units
V
R
C
Input-Output Isolation
Voltage
FOD814 f = 60Hz, t = 1 min,
Vac(rms)
ISO
ISO
ISO
(3)
I
≤ 2µA
I-O
FOD617
FOD817
FOD814
FOD617
FOD817
FOD814
FOD617
FOD817
10
11
Isolation Resistance
Isolation Capacitance
V
= 500VDC
5x10
1x10
—
Ω
I-O
V
= 0, f = 1 MHz
0.6
1.0
pf
I-O
*Typical values at T = 25°C
A
Notes:
1. Current Transfer Ratio (CTR) = I /I x 100%.
C F
2. For test circuit setup and waveforms, refer to page 4.
3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.
4
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Typical Electrical/Optical Characteristics (T = 25°C Unless otherwise specified.)
A
Fig. 1 Collector Power Dissipation
vs. Ambient Temperature (FOD814)
Fig. 2 Collector Power Dissipation
vs. Ambient Temperature (FOD617/817)
200
150
100
50
200
150
100
50
0
-55
0
-55
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
AMBIENT TEMPERATURE T (°C)
AMBIENT TEMPERATURE T (°C)
A
A
Fig. 3 Collector-Emitter Saturation Voltage
vs. Forward Current
Fig. 4 Forward Current vs. Forward Voltage
(FOD814)
6
100
10
1
Ic = 0.5mA
Ta = 25°C
1m A
3m A
5m A
T
A
= 105oC
75oC
50oC
5
4
7m A
25oC
0oC
3
2
1
0
-30oC
-55oC
0.1
0.5
1.0
1.5
2.0
0
2.5
5.0
7.5 10.0 12.5 15.0
FORWARD CURRENT I (mA)
FORWARD VOLTAGE V (V)
F
F
Fig. 6 Current Transfer Ratio
vs. Forward Current
Fig. 5 Forward Current vs. Forward Voltage
(FOD617/817)
100
10
1
140
120
100
V
= 5V
Ta= 25°C
T
A
= 110oC
75oC
50oC
FOD617/817
80
60
40
20
0
25oC
0oC
-30oC
FOD814
-55oC
0.1
0.5
1.0
1.5
2.0
0.1 0.2 0.5
1
2
5
10 20 50 100
FORWARD VOLTAGE V (V)
FORWARD CURRENT I (mA)
F
F
5
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Typical Electrical/Optical Characteristics (Continued) (T = 25°C Unless otherwise specified.)
A
Fig. 8 Collector Current vs.
Collector-Emitter Voltage (FOD617/817)
Fig. 7 Collector Current
vs. Collector-Emitter Voltage (FOD814)
30
50
Ta= 25°C
II = 30mA
F
Ta = 25°C
IF = 30mA
20mA
25
20
15
10
5
40
30
20
10
0
Pc(MAX.)
20mA
Pc(MAX.)
10mA
10m A
5m A
5mA
1m A
10 20 30 40 50 60 70 80 90 100
0
0
10 20 30 40 50 60 70 80 90
0
COLLECTOR-EMITTER VOLTAGE V (V)
CE
COLLECTOR-EMITTER VOLTAGE V (V)
CE
Fig. 10 Collector-Emitter Saturation Voltage
Fig. 9 Relative Current Transfer Ratio
vs. Ambient Temperature
vs. Ambient Temperature
160
140
120
100
80
0.12
I
I
= 20mA
= 1mA
FOD814
F
I
V
= 1 mA
= 5V
F
C
0.10
0.08
0.06
0.04
0.02
0.00
CE
FOD617/817
I
= 5mA
F
60
V
CE
= 5V
40
20
0
-60 -40 -20
0
20 40 60 80 100 120
-60 -40 -20
0
20 40 60 80 100 120
AMBIENT TEMPERATURE T (°C)
A
AMBIENT TEMPERATURE T (°C)
A
Fig. 11 LED Power Dissipation
vs. Ambient Temperature (FOD814)
Fig. 12 LED Power Dissipation
vs. Ambient Temperature (FOD617/817)
100
100
80
60
40
20
0
80
60
40
20
0
-55 -40 -20
0
20 40 60 80 100 120
-55 -40 -20
0
20 40 60 80 100 120
AMBIENT TEMPERATURE T (°C)
AMBIENT TEMPERATURE T (°C)
A
A
6
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Typical Electrical/Optical Characteristics (Continued) (T = 25°C Unless otherwise specified.)
A
Fig. 13 Response Time
vs. Load Resistance
Fig. 14 Frequency Response
100
50
V
CE= 2V
VCE = 2V
Ic= 2mA
Ta = 25°C
Ic = 2mA
Ta = 25°C
tr
0
-10
-20
20
10
5
tf
td
RL=10k
100
1k
2
1
ts
0.5
0.2
0.1
0.1 0.2 0.5
1
2
5
10
0.2 0.5 15 2
10
100
1000
FREQUENCY f (kHz)
LOAD RESISTANCE R (kΩ)
L
Fig. 15 Collector Dark Current
vs. Ambient Temperature
10000
1000
100
10
V
CE
= 20V
1
0.1
0.01
-60 -40 -20
0
20 40 60 80 100 120
AMBIENT TEMPERATURE T (°C)
A
Test Circuit for Frequency Response
Test Circuit for Response Time
Vcc
Input
Output
Output
Vcc
RL
RL
RD
Output
10%
90%
RD
Input
td
ts
tr
tf
7
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.312 (7.92)
0.288 (7.32)
0.200 (5.10)
0.161 (4.10)
0.200 (5.10)
0.276 (7.00)
0.161 (4.10)
0.236 (6.00)
0.157 (4.00)
0.118 (3.00)
0.157 (4.00)
0.118 (3.00)
0.010 (0.26)
0.051 (1.30)
0.043 (1.10)
0.049 (1.25)
0.030 (0.76)
0.130 (3.30)
0.020 (0.51)
0.091 (2.30)
TYP
0.024 (0.60)
0.004 (0.10)
0.412 (10.46)
0.388 (9.86)
0.010 (0.26)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.300 (7.62)
typ
Lead Coplanarity 0.004 (0.10) MAX
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
Footprint Dimensions
(Surface Mount)
Package Dimensions
(0.4” Lead Spacing)
1.5
0.312 (7.92)
0.288 (7.32)
0.200 (5.10)
0.161 (4.10)
1.3
0.157 (4.00)
0.118 (3.00)
0.276 (7.00)
0.236 (6.00)
0.291 (7.40)
0.252 (6.40)
9
0.130 (3.30)
0.091 (2.30)
0.110 (2.80)
0.011 (1.80)
0.150 (3.80)
0.110 (2.80)
0.010 (0.26)
0.110 (2.79)
0.090 (2.29)
0.024 (0.60)
0.016 (0.40)
2.54
0.42 (10.66)
0.38 (9.66)
Note:
All dimensions are in inches (millimeters).
8
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Ordering Information
Option
S
Part Number Example
Description
Surface Mount Lead Bend
Surface Mount; Tape and reel
0.4" Lead Spacing
FOD814S
FOD814SD
FOD814W
SD
W
300
300W
3S
FOD814300
FOD814300W
FOD8143S
FOD8143SD
VDE Approved
VDE Approved, 0.4" Lead Spacing
VDE Approved, Surface Mount
VDE Approved, Surface Mount, Tape & Reel
3SD
Marking Information
4
5
6
V X ZZ Y
814
3
2
1
Definitions
1
2
3
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
5
6
One digit year code
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
9
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Carrier Tape Specifications
P
P
0
2
Ø1.55 0.05
1.75 0.1
F
W
B0
A0
P
1
0.3 0.05
K0
Note:
All dimensions are in millimeters.
Description
Tape wide
Symbol
Dimensions in mm (inches)
W
16 0.3 (.63)
Pitch of sprocket holes
Distance of compartment
P
4
0.1 (.15)
7.5 0.1 (.295)
0.1 (.079)
0
F
P
2
2
Distance of compartment to compartment
Compartment
P
12 0.1 (.472)
10.45 0.1 (.411)
5.30 0.1 (.209)
4.25 0.1 (.167)
1
A0
B0
K0
10
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
Lead Free Recommended IR Reflow Condition
Tp
Tsmax
Tsmin
Ramp-down
25°C
Soldering zon
ts (Preheat)
Time (sec)
Profile Feature
Pb-Sn solder assembly
Lead Free assembly
Preheat condition
(Tsmin-Tsmax / ts)
100°C ~ 150°C
60 ~ 120 sec
150°C ~ 200°C
60 ~120 sec
Melt soldering zone
183°C
217°C
60 ~ 120 sec
30 ~ 90 sec
Peak temperature (Tp)
Ramp-down rate
240 +0/-5°C
260 +0/-5°C
6°C/sec max.
6°C/sec max.
Recommended Wave Soldering condition
Profile Feature
For all solder assembly
Max 260°C for 10 sec
Peak temperature (Tp)
11
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
®
ACEx™
FAST
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
PowerEdge™
PowerSaver™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
®
PowerTrench
®
QFET
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
ScalarPump™
SILENT SWITCHER
SMART START™
SPM™
®
HiSeC™
TinyLogic
2
EcoSPARK™
I C™
MSXPro™
OCX™
TINYOPTO™
TruTranslation™
UHC™
2
E CMOS™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
EnSigna™
FACT™
FACT Quiet Series™
OCXPro™
OPTOLOGIC
®
UniFET™
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OPTOPLANAR™
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UltraFET
Across the board. Around the world.™
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDíS WORLDWIDE TERMS AND CONDITIONS,
SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I19
12
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FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.5
相关型号：
FOD817B300
4-Pin DIP Phototransistor Optocouplers, 4LD,MDIP,.300",WIDE,OPTO, 2000/BOX
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