FPF1014 [FAIRCHILD]
IntelliMAX 1V Rated Advanced Load Management Products; 的IntelliMAX 1V额定先进的负载管理产品
| 型号： | FPF1014 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | IntelliMAX 1V Rated Advanced Load Management Products |
| 文件： | 总10页 (文件大小：524K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
December 2008
FPF1013/4
tm
IntelliMAXTM 1V Rated Advanced Load Management Products
Features
General Description
0.8V to 1.8V Input Voltage Range
Typical RDS(ON) = 17mΩ @ VON - VIN = 2.0V
Output Discharge Function
The FPF1013/4 series is an IntelliMAX advanced slew rate
loadswitch offering a very low operating voltage. These devices
consist of a 17mΩ N-channel MOSFET that supports an input
voltage up to 2.0V. These slew rate devices control the switch
turn-on and prevent excessive in-rush current from the supply
rails. The input voltage range operates from 0.8V to 1.8V to
fulfill today's lowest Ultraportable Device's supply requirements.
Switch control is via a logic input (ON) capable of interfacing
directly with low voltage control signals.
Internal Pull-down at ON Pin
Accurate Slew Rate Controlled Turn-on time
Low < 1µA Quiescent Current
ESD Protected, above 8000V HBM, 2000V CDM
RoHS Compliant
The FPF1014 has an On-Chip pull down allowing for quick and
controlled output discharge when switch is turned off. The
FPF1013/4 series is available in a space-saving 1X1.5 CSP-6L
package.
Free from Halogenated Compounds and Antimony Oxides
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Notebook Computer
Pin 1
VIN
VOUT
VIN
VOUT
ON
GND
TOP
BOTTOM
Typical Application Circuit
TO LOAD
VOUT
VIN
ON
FPF1013/4
OFF ON
-
GND
Ordering Information
Part
Switch
Turn-on Time
Output Discharge
ON Pin Activity
Active HI
Package
CSP1X1.5
CSP1X1.5
FPF1013
FPF1014
17mΩ, NMOS
17mΩ, NMOS
43µs
43µs
N/A
60Ω
Active HI
©2008 Fairchild Semiconductor Corporation
FPF1013/4 Rev. B1
1
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Functional Block Diagram
VIN
CONTROL
LOGIC
ON
Turn-on Slew Rate
Controlled Driver
VOUT
ESD protection
Output Discharge
(Optional for FPF1014)
FPF1013/4
GND
Pin Configuration
A1
B1
C1
A2
B2
C2
1.0 x 1.5 CSP Bottom View
Pin Description
Pin
A2, B2
C2
Name
Function
VIN
ON
Supply Input: Input to the power switch and the supply voltage for the IC
ON Control Input
A1, B1
C1
VOUT
GND
Switch Output: Output of the power switch
Ground
Absolute Maximum Ratings
Parameter
Min
-0.3
-0.3
Max
2
Unit
V
VIN, VOUT to GND
VON to GND
4.2
1.5
1.2
85
V
Maximum Continuous Switch Current
Power Dissipation @ TA = 25°C (Note 1)
Operating Temperature Range
Storage Temperature
A
W
-40
-65
°C
°C
°C/W
V
150
85
Thermal Resistance, Junction to Ambient
HBM
CDM
8000
2000
Electrostatic Discharge Protection
V
Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board
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FPF1013/4 Rev. B1
Recommended Operating Range
Parameter
Min
0.8
Max
1.8
Unit
V
VIN
Ambient Operating Temperature, TA
-40
85
°C
Electrical Characteristics
VIN = 0.8 to 1.8V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN =1.8V and TA = 25°C.
Parameter
Symbol
Conditions
Min Typ Max Units
Basic Operation
Operating Voltage
VIN
0.8
1.8
2.8
1.8
4.0
4.0
1
V
V
VON(MIN) VIN = 0.8V
2.8
3.8
ON Input Voltage
VON(MAX) VIN = 1.8V (Note 2)
ICC VIN = 1V, VON = 3.3V, VOUT = Open
IQ VIN = 1V, VON = GND, VOUT = Open
V
Operating Current
Quiescent Current
Off Switch Current
µA
µA
µA
2
ISWOFF VIN = 1.8V, VON = GND, VOUT = GND
2
VIN = 1V, VON = 3V, IOUT =1A, TA = 25C
RON
17
25
27
38
On-Resistance
mΩ
VIN = 1V, VON = 2.3V, IOUT =1A, TA = 25°C
VIN = 1V, VON = 0V, IOUT =1mA, TA = 25°C,
FPF1014
Output Pull Down Resistance
RPD
60
120
0.3
Ω
VIN = 0.8V, RL = 1KΩ
ON Input Logic Low Voltage
ON Input Leakage
VIL
V
VIN = 1.8V, RL = 1KΩ
0.8
1
VON = VIN or GND
-1
µA
Dynamic (VIN = 1.0V, VON = 3.0V, TA = 25°C)
RL = 500Ω, CL = 0.1µF
28
38
43
58
14
76
50
96
VOUT Rise Time
Turn On Time
VOUT Fall Time
Turn Off Time
TR
TON
TF
µs
µs
µs
µs
RL = 3.3Ω, CL = 10µF
RL = 500Ω, CL = 0.1µF
RL = 3.3Ω, CL = 10µF
FPF1014, RL = 500Ω, CL = 0.1µF
FPF1014, RL = 3.3Ω, CL = 10µF
FPF1014, RL = 500Ω, CL = 0.1µF
FPF1014, RL = 3.3Ω, CL = 10µF
TOFF
Note 2: VON(MAX) is limited by the absolute rating.
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FPF1013/4 Rev. B1
Typical Characteristics
0.05
0.04
0.03
0.02
1.20
1.00
0.80
0.60
0.40
0.20
0.00
VON = 0 V
OUT = Open
V
V
IN = 1.8V
VON = 3.3V
VIN = 1V
0.01
0.00
VIN = 0.8V
VON = 0V
-0.01
-0.02
-40
-15
10
35
60
85
0.8
1.0
1.2
1.4
1.6
1.8
TJ, JUNCTION TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 1. Supply Current vs.VIN
Figure 2. Off Quiescent Current vs. Temperature
0.05
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
1.20
1.00
0.80
0.60
0.40
0.20
0.00
VIN = 1.8 V
VON = 3.3 V
OUT = Open
V
V
ON = 0 V
OUT = 0 V
V
V
IN = 0.8V
VIN = 1V
VIN = 1.8V
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Operating Current vs. Temperature
Figure 4. Off Switch Current vs. Temperature
26
45
40
35
30
25
20
15
10
5
24
22
20
18
16
14
12
10
VIN = 1 V
VON = 3 V
OUT = 1A
VON = 3 V
OUT = 1 A
I
I
0
-40
-15
10
35
60
85
1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9
2
2.1 2.2 2.3 2.4 2.5 2.6 2.7
TJ, JUNCTION TEMPERATURE (°C)
VON-VIN VOLTAGE (V)
Figure 5. RON vs. Temperature
Figure 6. RON vs. VON-VIN
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FPF1013/4 Rev. B1
Typical Characteristics
2.0
1.8
1.5
1.3
1.0
0.8
0.5
0.3
0.0
1.600
1.400
1.200
1.000
0.800
0.600
0.400
0.200
0.000
V = 1.8V
IN
V = 1V
IN
V = 0.8V
IN
-40
-15
10
35
60
85
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
TJ, JUNCTION TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
Figure 7. VIL vs. VIN
Figure 8. VIL vs. Temperature
90
80
70
60
50
40
30
20
10
0
140
120
100
80
FPF1014 TFALL
FPF1014 TOFF
FPF1013/4 TRISE
FPF1013/4 TON
60
VIN = 1 V
ON = 2.5 V
CL = 10 µF
VIN = 1 V
ON = 2.5 V
CL = 10 µF
40
V
V
20
RL = 3.3 Ω
RL = 3.3 Ω
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. TRISE/TFALL vs. Temperature
Figure 10. TON/TOFF vs. Temperature
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN = 1 V
ON = 2.6 V
IN = 10 µF
CL = 10 µF
RL = 3.3 Ω
VIN
500mV/DIV
VIN
500mV/DIV
V
C
VIN = 1 V
V
C
ON = 2.6 V
IN = 10 µF
VOUT
500mV/DIV
VOUT
500mV/DIV
CL = 10 µF
RL = 3.3 Ω
100µs/DIV
Figure 11. FPF1013/4 Turn ON Response
100µs/DIV
Figure 12. FPF1014 Turn OFF Response
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FPF1013/4 Rev. B1
Typical Characteristics
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN = 1 V
ON = 2.6 V
IN = 10 µF
CL = 4.7 µF
RL = 1 Ω
VIN
500mV/DIV
VIN
500mV/DIV
V
C
VIN = 1 V
ON = 2.6 V
IN = 10 µF
CL = 4.7 µF
RL = 1 Ω
V
C
VOUT
500mV/DIV
VOUT
500mV/DIV
100µs/DIV
Figure 13. FPF1013/4 Turn ON Response
100µs/DIV
Figure 14. FPF1014 Turn OFF Response
VON
2V/DIV
VIN
500mV/DIV
VIN = 1 V
ON = 2.6 V
RL = 499 Ω
V
VOUT
500mV/DIV
500ns/DIV
Figure 15. FPF1014 Output Pull-down Response
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FPF1013/4 Rev. B1
Description of Operation
Timing Diagram
The FPF1013/4 are low RDS(ON) N-Channel load switches with
controlled turn-on. The core of each device is a 17mΩ (VIN = 1V,
VON = 3V) N-Channel MOSFET and is customized for a low
input operating range of 0.8 to 1.8V. The ON pin controls the
state of the switch.
90%
VON
10%
The FPF1014 contains a 60Ω(typ) on-chip resistor which is
connected internally from VOUT to GND for quick output
discharge when the switch is turned off.
90%
90%
VOUT
10%
10%
td
tR
td
tF
OFF
ON
OFF
On/Off Control
tON
t
The ON pin is active high and it controls the state of the switch.
Applying a continuous high signal will hold the switch in the ON
state. In order to minimize the switch on resistance, the ON pin
voltage should exceed the input voltage by 2V. This device is
compatible with a GPIO (General Purpose Input/Output) port,
where:
tdON
tR
tON
tdOFF
tF
=
=
=
=
=
=
Delay On Time
VOUT Rise Time
Turn On Time
Delay Off Time
VOUT Fall Time
Turn Off Time
where the logic voltage level can be configured to 4V ≥ VON
≥
VIN+2V and power consumed is less than 1µA in steady state.
tOFF
Application Information
Typical Application
VOUT
VIN
ON
FPF1013/4
CIN
RL
CL
VIN = 0.8-1.8V
OFF ON
GND
Input Capacitor
Board Layout
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on, a capacitor must be
placed between VIN and GND. For minimized voltage drop,
especially when the operating voltage approaches 1V a 10µF
ceramic capacitor should be placed close to the VIN pins. Higher
values of CIN can be used to further reduce the voltage drop
during higher current modes of operation.
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces or large copper planes for all pins
(VIN, VOUT, ON and GND) will help minimize the parasitic
electrical effects along with minimizing the case to ambient
thermal impedance.
Output Capacitor
A 0.1µF capacitor, CL, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductance
from forcing VOUT below GND when the switch turns-off. If the
application has a capacitive load, the FPF1014 can be used to
discharged that load through an on-chip output discharge path.
7
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FPF1013/4 Rev. B1
Improving Thermal Performance
Demo Board Layout
An improper layout could result in higher junction temperature.
This concern applies when continuous operation current is set
to maximum allowed current and switch turns into a large
capacitive load that introduce high inrush current in the
transient. Since FPF1013/4 does not have thermal shutdown
feature a proper layout can essentially reduce power dissipation
of the switch in transient and prevents switch to exceed the
maximum absolute power dissipation of 1.2W.
FPF1013/4 Demo board has the components and circuitry to
demonstrate FPF1013/4 load switches functions. Thermal
performance of the board is improved using a few techniques
recommended in the layout recommendations section of
datasheet.
The VIN, VOUT and GND pins will dissipate most of the heat
generated during a high load current condition. The layout
suggested in Figure 16 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The ON pin trace may be laid-out diagonally from
the device to maximize the area available to the ground pad.
Placing the input and output capacitors as close to the device as
possible also contributes to heat dissipation, particularly during
high load currents.
Figure 17. FPF1013/4 Demo Board Layout
Figure 16: Proper layout of output, input and
ground copper area
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FPF1013/4 Rev. B1
Dimensional Outline and Pad Layout
9
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FPF1013/4 Rev. B1
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®
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™
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MegaBuck™
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MicroFET™
MicroPak™
TINYOPTO™
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Definition of Terms
Datasheet Identification
Product Status
Definition
Datasheet contains the design specifications for product development. Specifications may change
in any manner without notice.
Advance Information
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
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First Production
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changes at any time without notice to improve the design.
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Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I37
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FPF1013/4 Rev. B1
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