H11F23SD [FAIRCHILD]

FET Output Optocoupler, 1-Element, 5300V Isolation, LEAD FREE, DIP-6;
H11F23SD
型号: H11F23SD
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

FET Output Optocoupler, 1-Element, 5300V Isolation, LEAD FREE, DIP-6

输出元件 光电
文件: 总10页 (文件大小:553K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
PACKAGE  
SCHEMATIC  
OUTPUT  
TERM.  
1
2
ANODE  
6
5
6
6
CATHODE  
1
1
1
OUTPUT  
TERM.  
4
3
6
DESCRIPTION  
The H11F series consists of a Gallium-Aluminum-Arsenide IRED emitting diode coupled to a symmetrical bilateral silicon photo-  
detector. The detector is electrically isolated from the input and performs like an ideal isolated FET designed for distortion-free  
control of low level AC and DC analog signals. The H11F series devices are mounted in dual in-line packages.  
FEATURES  
As a remote variable resistor  
100to 300 MΩ  
99.9% linearity  
15 pF shunt capacitance  
100 GI/O isolation resistance  
As an analog switch  
Extremely low offset voltage  
60 V signal capability  
No charge injection or latch-up  
pk-pk  
t
, t 15 µS  
on off  
UL recognized (File #E90700)  
VDE recognized (File #E94766)  
– Ordering option ‘300’ (e.g. H11F1.300)  
APPLICATIONS  
As a variable resistor –  
Isolated variable attenuator  
Automatic gain control  
Active filter fine tuning/band switching  
As an analog switch –  
Isolated sample and hold circuit  
Multiplexed, optically isolated A/D conversion  
© 2003 Fairchild Semiconductor Corporation  
Page 1 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
Absolute Maximum Ratings (T = 25°C unless otherwise specified)  
A
Parameter  
Symbol  
Device  
Value  
Units  
TOTAL DEVICE  
Storage Temperature  
Operating Temperature  
Lead Solder Temperature  
EMITTER  
T
All  
All  
All  
-55 to +150  
-55 to +100  
°C  
°C  
°C  
STG  
T
OPR  
T
260 for 10 sec  
SOL  
Continuous Forward Current  
Reverse Voltage  
I
All  
All  
All  
60  
5
mA  
V
F
V
R
Forward Current - Peak (10 µs pulse, 1% duty cycle)  
LED Power Dissipation 25°C Ambient  
Derate Linearly From 25°C  
I
1
A
F(pk)  
100  
1.33  
mW  
mW/°C  
P
All  
D
DETECTOR  
Detector Power Dissipation @ 25°C  
Derate linearly from 25°C  
300  
4.0  
30  
mW  
mW/°C  
V
P
All  
D
H11F1, H11F2  
H11F3  
Breakdown Voltage (either polarity)  
BV  
4-6  
15  
V
Continuous Detector Current (either polarity)  
I
All  
100  
mA  
4-6  
ELECTRICAL CHARACTERISTICS (T = 25°C Unless otherwise specified.)  
A
INDIVIDUAL COMPONENT CHARACTERISTICS  
Parameter  
Test Conditions  
Symbol  
Device  
Min  
Typ*  
Max Unit  
EMITTER  
Input Forward Voltage  
Reverse Leakage Current  
Capacitance  
I = 16 mA  
V
All  
All  
All  
1.3  
50  
1.75  
10  
V
F
F
V = 5 V  
I
µA  
pF  
R
R
V = 0 V, f = 1.0 MHz  
C
J
OUTPUT DETECTOR  
H11F1, H11F2  
30  
15  
Breakdown Voltage  
Either Polarity  
I
= 10µA, I = 0  
BV  
4-6  
V
4-6  
F
H11F3  
All  
V
= 15 V, I = 0  
50  
50  
nA  
µA  
4-6  
F
Off-State Dark Current  
I
4-6  
V
= 15 V, I = 0, T = 100°C  
All  
4-6  
F
A
Off-State Resistance  
Capacitance  
V
= 15 V, I = 0  
R
C
All  
300  
MΩ  
pF  
4-6  
F
4-6  
V
= 15 V, I = 0, f = 1MHz  
All  
15  
4-6  
F
4-6  
© 2003 Fairchild Semiconductor Corporation  
Page 2 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
ISOLATION CHARACTERISTICS  
Parameter  
Test Conditions  
f = 60Hz, t = 1 min.  
Symbol  
Min  
Typ*  
Max  
Units  
Input-Output Isolation Voltage  
Isolation Resistance  
V
5300  
Vac (rms)  
ISO  
11  
V
= 500 VDC  
R
C
10  
I-O  
ISO  
ISO  
Isolation Capacitance  
V
= 0, f = 1.0 MHz  
2
pF  
I-O  
TRANSFER CHARACTERISTICS (T = 25°C Unless otherwise specified.)  
A
DC Characteristics  
Test Conditions  
Symbol  
Device  
Min  
Typ*  
Max  
Units  
H11F1  
H11F2  
H11F3  
H11F1  
H11F2  
H11F3  
200  
330  
470  
200  
330  
470  
On-State Resistance  
I = 16 mA, I = 100 µA  
R
F
4-6  
4-6  
On-State Resistance  
I = 16 mA, I = 100 µA  
R
F
6-4  
6-4  
Resistance, non-linearity  
and assymetry  
I = 16mA, I = 25 µA RMS,  
F 4-6  
All  
0.1  
%
f = 1kHz  
AC Characteristics  
Test Conditions  
Symbol  
Device  
Min  
Typ*  
Max  
Units  
Turn-On Time  
Turn-Off Time  
R
R
= 50, I = 16mA, V = 5V  
t
All  
All  
25  
25  
µS  
µS  
L
F
4-6  
on  
= 50, I = 16mA, V = 5V  
t
L
F
4-6  
off  
© 2003 Fairchild Semiconductor Corporation  
Page 3 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
Figure 1. Resistance vs. Input Current  
Figure 2. Output Characteristics  
800  
I
F
= 18mA  
= 14mA  
= 10mA  
I
600  
400  
200  
0
F
I
10  
F
I
= 6mA  
F
I
= 2mA  
F
I
= 2mA  
F
I
I
I
= 6mA  
F
F
F
-200  
-400  
-600  
-800  
1
= 10mA  
= 14mA  
I
= 18mA  
F
Normalized to:  
I
I
= 16 mA  
F
= 5 µA RMS  
46  
0.1  
-0.2  
-0.1  
0.0  
0.1  
0.2  
1
10  
100  
V
- OUTPUT VOLTAGE (V)  
46  
I
- INPUT CURRENT - mA  
F
Figure 3. LED Forward Voltage vs. Forward Current  
Figure 4. Off-state Current vs. Ambient Temperature  
10000  
2.0  
1.8  
1.6  
1.4  
1.2  
NORMALIZED TO:  
= 15V  
V
46  
= 0mA  
I
F
T
A
= 25°C  
1000  
100  
10  
T
= -55°C  
= 25°C  
A
T
A
1.0  
0.8  
T
A
= 100°C  
1
0.1  
1
10  
100  
0
20  
40  
60  
80  
100  
T
- AMBIENT TEMPERATURE (°C)  
A
I
- LED FORWARD CURRENT - mA  
F
Figure 5. Resistance vs. Temperature  
Figure 6. Region of Linear Resistance  
100  
80  
100  
80  
3
2
NORMALIZED TO  
IF = 16mA  
I4-6 = 25µA RMS  
TA = 25˚C  
MAXIMUM  
RMS  
VOLTAGE  
60  
40  
60  
40  
20  
20  
Observed  
Range  
10  
8
10  
8
1
6
6
MAXIMUM  
RMS  
CURRENT  
0.8  
4
4
0.6  
2
1
2
0.4  
-50  
100  
1000  
10K  
100K  
-25  
0
25  
50  
75  
100  
T
A
- AMBIENT TEMPERATURE - °C  
r(on) RESISTANCE - Ω  
© 2003 Fairchild Semiconductor Corporation  
Page 4 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
Figure 7. Resistive non-linearity vs. D.C. Bias  
5
4
3
2
I
= 10 µA RMS  
4-6  
r(on) = 200 Ω  
1
0
1
50  
100  
150  
200  
250  
300  
350  
V
4-6  
- D.C. BIAS VOLTAGE - mA  
© 2003 Fairchild Semiconductor Corporation  
Page 5 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
TYPICAL APPLICATIONS  
AS A VARIABLE RESISTOR  
AS AN ANALOG SIGNAL SWITCH  
ISOLATED SAMPLE AND HOLD CIRCUIT  
ISOLATED VARIABLE ATTENUATORS  
500K  
+
VIN  
-
VOUT  
VOUT  
VIN  
VIN  
50Ω  
VIN  
IF  
VOUT  
H11F1  
H11F1  
H11F1  
C
IF  
VOUT  
IF  
LOW FREQUENCY  
t
IF  
HIGH FREQUENCY  
DYNAMIC RANGE 70db  
FOR 0 IF 30mA  
DYNAMIC RANGE 50db  
FOR 0 IF 30mA  
@10KHz  
@1MHz  
Accuracy and range are improved over conventional FET  
switches because the H11F has no charge injection from the  
control signal. The H11F also provides switching of either  
polarity input signal up to 30V magnitude.  
Distortion free attenuation of low level A.C. signals is accom-  
plished by varying the IRED current, I Note the wide dynamic  
F
range and absence of coupling capacitors; D.C. level shifting or  
parasitic feedback to the controlling function.  
AUTOMATIC GAIN CONTROL  
MULTIPLEXED, OPTICALLY-ISOLATED A/D CONVERSION  
CALL V1  
H11F1  
CALL  
Vn  
DATA  
VOUT  
VIN  
ACQUISITION  
V1  
V2  
H74A1  
+
-
MSB  
LSB  
MSB  
LSB  
A/D  
CONVERTER  
PROCESS  
CONTROL  
LOGIC  
Vn  
H74A1  
H11F1  
IF  
SYSTEM  
500K  
H11F1  
AGC  
SIGNAL  
This simple circuit provides over 70db of stable gain control for  
an AGC signal range of from 0 to 30mA. This basic circuit can  
be used to provide programmable fade and attack for electronic  
music.  
The optical isolation, linearity and low offset voltage of the  
H11F allows the remote multiplexing of low level analog signals  
from such transducers as thermocouplers, Hall effect devices,  
strain gauges, etc. to a single A/D converter.  
ACTIVE FILTER FINE TUNING/BAND SWITCHING  
TEST EQUIPMENT - KELVIN CONTACT POLARITY  
IF1  
IF2  
H11F1  
H11F1  
H11F1  
H11F1  
IF  
IF  
A
C
ITEST  
DEVICE  
UNDER  
TEST  
I
F TO  
A1  
A2  
A & B FOR  
POLARITY 1  
A3  
PARAMETER  
SENSING  
BOARD  
C & D FOR  
POLARITY 2  
B
D
IF  
IF  
H11F1  
H11F1  
IF1 ADJUSTS f1, IF2 ADJUSTS f2  
In many test equipment designs the auto polarity function uses  
reed relay contacts to switch the Kelvin Contact polarity. These  
reeds are normally one of the highest maintenance cost items  
due to sticking contacts and mechanical problems. The totally  
solid-State H11F eliminates these troubles while providing  
faster switching.  
The linearity of resistance and the low offset voltage of the  
H11F allows the remote tuning or band-switching of active  
filters without switching glitches or distortion. This schematic  
illustrates the concept, with current to the H11F1 IRED’s  
controlling the filter’s transfer characteristic.  
© 2003 Fairchild Semiconductor Corporation  
Page 6 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
Package Dimensions (Through Hole)  
Package Dimensions (Surface Mount)  
0.350 (8.89)  
0.330 (8.38)  
PIN 1  
ID.  
PIN 1  
ID.  
3
1
0.270 (6.86)  
0.240 (6.10)  
0.270 (6.86)  
0.240 (6.10)  
0.350 (8.89)  
0.330 (8.38)  
6
0.070 (1.78)  
0.045 (1.14)  
0.300 (7.62)  
TYP  
0.070 (1.78)  
0.045 (1.14)  
0.200 (5.08)  
0.135 (3.43)  
0.200 (5.08)  
0.165 (4.18)  
0.016 (0.41)  
0.008 (0.20)  
0.020 (0.51)  
MIN  
0.020 (0.51)  
0.154 (3.90)  
0.100 (2.54)  
0.016 (0.40) MIN  
MIN  
0.022 (0.56)  
0.016 (0.41)  
0.100 (2.54)  
TYP  
0.315 (8.00)  
MIN  
0.016 (0.40)  
0.008 (0.20)  
0.405 (10.30)  
MAX  
0.300 (7.62)  
TYP  
0.022 (0.56)  
0.016 (0.41)  
0° to 15°  
Lead Coplanarity : 0.004 (0.10) MAX  
0.100 (2.54)  
TYP  
Package Dimensions (0.4” Lead Spacing)  
Recommended Pad Layout for  
Surface Mount Leadform  
0.270 (6.86)  
0.240 (6.10)  
0.070 (1.78)  
0.060 (1.52)  
0.350 (8.89)  
0.330 (8.38)  
0.070 (1.78)  
0.045 (1.14)  
0.415 (10.54)  
0.100 (2.54)  
0.295 (7.49)  
0.030 (0.76)  
0.200 (5.08)  
0.135 (3.43)  
0.154 (3.90)  
0.100 (2.54)  
0.016 (0.40)  
0.008 (0.20)  
0.004 (0.10)  
MIN  
0° to 15°  
0.022 (0.56)  
0.016 (0.41)  
0.400 (10.16)  
TYP  
0.100 (2.54) TYP  
NOTE  
All dimensions are in inches (millimeters)  
© 2003 Fairchild Semiconductor Corporation  
Page 7 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
ORDERING INFORMATION  
Option  
Order Entry Identifier  
Description  
S
.S  
.SD  
Surface Mount Lead Bend  
Surface Mount; Tape and Reel  
0.4" Lead Spacing  
SD  
W
.W  
300  
.300  
.300W  
.3S  
VDE 0884  
300W  
3S  
VDE 0884, 0.4" Lead Spacing  
VDE 0884, Surface Mount  
VDE 0884, Surface Mount, Tape and Reel  
3SD  
.3SD  
MARKING INFORMATION  
1
2
H11F1  
6
V XX YY K  
5
3
4
Definitions  
1
2
Fairchild logo  
Device number  
VDE mark (Note: Only appears on parts ordered with VDE  
option – See order entry table)  
3
4
5
6
Two digit year code, e.g., ‘03’  
Two digit work week ranging from ‘01’ to ‘53’  
Assembly package code  
© 2003 Fairchild Semiconductor Corporation  
Page 8 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
Carrier Tape Specifications  
12.0 0.1  
4.85 0.20  
4.0 0.1  
Ø1.55 0.05  
0.30 0.05  
4.0 0.1  
1.75 0.10  
7.5 0.1  
16.0 0.3  
13.2 0.2  
9.55 0.20  
Ø1.6 0.1  
10.30 0.20  
0.1 MAX  
User Direction of Feed  
NOTE  
All dimensions are in inches (millimeters)  
Tape and reel quantity is 1,000 units per reel  
Reflow Profile (Black Package, No Suffix)  
300  
250  
215°C, 10–30 s  
225 C peak  
200  
150  
Time above 183°C, 60–150 sec  
Ramp up = 3C/sec  
100  
50  
0
• Peak reflow temperature: 225°C (package surface temperature)  
• Time of temperature higher than 183°C for 60–150 seconds  
• One time soldering reflow is recommended  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
Time (Minute)  
© 2003 Fairchild Semiconductor Corporation  
Page 9 of 10  
3/19/03  
PHOTO FET OPTOCOUPLERS  
H11F1 H11F2 H11F3  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury of the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
© 2003 Fairchild Semiconductor Corporation  
Page 10 of 10  
3/19/03  

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