SGP20N60RUFTU [FAIRCHILD]

Insulated Gate Bipolar Transistor, 32A I(C), 600V V(BR)CES, N-Channel, TO-220AB, TO-220, 3 PIN;
SGP20N60RUFTU
型号: SGP20N60RUFTU
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Insulated Gate Bipolar Transistor, 32A I(C), 600V V(BR)CES, N-Channel, TO-220AB, TO-220, 3 PIN

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IGBT  
SGP20N60RUF  
Short Circuit Rated IGBT  
General Description  
Features  
Fairchild's RUF series of Insulated Gate Bipolar Transistors  
(IGBTs) provide low conduction and switching losses as  
well as short circuit ruggedness. The RUF series is  
Short circuit rated 10us @ T = 100°C, V = 15V  
C
GE  
High speed switching  
Low saturation voltage : V  
High input impedance  
= 2.2 V @ I = 20A  
CE(sat)  
C
designed for  
applications such as motor control,  
uninterrupted power supplies (UPS) and general inverters  
where short circuit ruggedness is a required feature.  
Applications  
AC & DC motor controls, general purpose inverters, robotics, and servo controls.  
C
E
G
TO-220  
G C E  
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Description  
SGP20N60RUF  
Units  
V
V
V
Collector-Emitter Voltage  
600  
CES  
GES  
Gate-Emitter Voltage  
± 20  
V
Collector Current  
@ T  
=
25°C  
32  
A
C
I
I
C
Collector Current  
@ T = 100°C  
20  
A
C
Pulsed Collector Current  
60  
10  
A
CM (1)  
T
Short Circuit Withstand Time  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
Purposes, 1/8” from Case for 5 Seconds  
@ T = 100°C  
us  
W
W
°C  
°C  
SC  
C
P
@ T  
=
25°C  
195  
D
C
@ T = 100°C  
75  
C
T
-55 to +150  
-55 to +150  
J
T
stg  
T
300  
°C  
L
Notes :  
(1) Repetitive rating : Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
--  
Max.  
Units  
°C/W  
°C/W  
R
R
Thermal Resistance, Junction-to-Case  
0.64  
62.5  
θJC  
θJA  
Thermal Resistance, Junction-to-Ambient  
--  
©2002 Fairchild Semiconductor Corporation  
SGP20N60RUF Rev. A1  
Electrical Characteristics of the IGBT  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BV  
Collector-Emitter Breakdown Voltage  
Temperature Coefficient of Breakdown  
Voltage  
V
V
= 0V, I = 250uA  
600  
--  
--  
--  
--  
V
CES  
GE  
C
B  
/
VCES  
J
= 0V, I = 1mA  
0.6  
V/°C  
GE  
C
T  
I
I
Collector Cut-Off Current  
G-E Leakage Current  
V
V
= V  
= V  
, V = 0V  
--  
--  
--  
--  
250  
uA  
nA  
CES  
GES  
CE  
CES  
GE  
, V = 0V  
± 100  
GE  
GES  
CE  
On Characteristics  
V
G-E Threshold Voltage  
I
I
I
= 20mA, V = V  
GE  
5.0  
--  
6.0  
2.2  
2.5  
8.5  
2.8  
--  
V
V
V
GE(th)  
C
C
C
CE  
= 20A,  
= 32A,  
V
V
= 15V  
= 15V  
Collector to Emitter  
Saturation Voltage  
GE  
GE  
V
CE(sat)  
--  
Dynamic Characteristics  
C
C
C
Input Capacitance  
--  
--  
--  
1323  
254  
47  
--  
--  
--  
pF  
pF  
pF  
ies  
V
= 30V V = 0V,  
, GE  
CE  
Output Capacitance  
oes  
res  
f = 1MHz  
Reverse Transfer Capacitance  
Switching Characteristics  
t
t
t
t
Turn-On Delay Time  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
--  
30  
49  
--  
--  
ns  
ns  
ns  
ns  
uJ  
uJ  
uJ  
ns  
ns  
ns  
ns  
uJ  
uJ  
uJ  
d(on)  
Rise Time  
r
Turn-Off Delay Time  
Fall Time  
48  
70  
200  
--  
V
R
= 300 V, I = 20A,  
C
d(off)  
f
CC  
= 10, V = 15V,  
152  
524  
473  
997  
30  
G
GE  
Inductive Load, T = 25°C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
C
on  
off  
--  
1400  
--  
ts  
t
t
t
t
d(on)  
r
51  
--  
Turn-Off Delay Time  
Fall Time  
52  
75  
400  
--  
V
= 300 V, I = 20A,  
C
d(off)  
f
CC  
R
= 10, V = 15V,  
311  
568  
1031  
1599  
G
GE  
Inductive Load, T = 125°C  
E
E
E
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
C
on  
off  
ts  
--  
2240  
V
= 300 V, V = 15V  
GE  
C
CC  
T
Short Circuit Withstand Time  
10  
--  
--  
us  
sc  
@ T = 100°C  
Q
Total Gate Charge  
--  
--  
--  
--  
55  
10  
25  
7.5  
80  
15  
40  
--  
nC  
nC  
nC  
nH  
g
V
V
= 300 V, I = 20A,  
= 15V  
CE  
GE  
C
Q
Q
Gate-Emitter Charge  
Gate-Collector Charge  
Internal Emitter Inductance  
ge  
gc  
L
Measured 5mm from PKG  
e
©2002 Fairchild Semiconductor Corporation  
SGP20N60RUF Rev. A1  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
Common Emitter  
TC = 25  
20V  
15V  
Common Emitter  
VGE = 15V  
TC  
= 25━  
12V  
TC = 125------  
VGE = 10V  
0
2
4
6
8
1
10  
Collector - Emitter Voltage, VCE [V]  
Collector - Emitter Voltage, VCE [V]  
Fig 2. Typical Saturation Voltage Characteristics  
Fig 1. Typical Output Characteristics  
5
28  
VCC = 300V  
Common Emitter  
Load Current : peak of square wave  
24  
V
GE = 15V  
4
3
2
1
0
40A  
30A  
20  
16  
12  
8
20A  
IC = 10A  
Duty cycle : 50%  
4
0
T
C = 100  
Power Dissipation = 32W  
-50  
0
50  
100  
150  
0.1  
1
10  
100  
1000  
Case Temperature, TC  
[
]
Frequency [KHz]  
Fig 3. Saturation Voltage vs. Case  
Fig 4. Load Current vs. Frequency  
Temperature at Variant Current Level  
20  
16  
12  
8
20  
Common Emitter  
Common Emitter  
T
C = 25  
TC = 125  
16  
12  
8
40A  
40A  
20A  
4
4
20A  
IC = 10A  
IC = 10A  
8
0
0
0
4
12  
16  
20  
0
4
8
12  
16  
20  
Gate - Emitter Voltage, VGE [V]  
Gate - Emitter Voltage, VGE [V]  
Fig 5. Saturation Voltage vs. V  
Fig 6. Saturation Voltage vs. V  
GE  
GE  
©2002 Fairchild Semiconductor Corporation  
SGP20N60RUF Rev. A1  
2400  
2000  
1600  
1200  
800  
400  
0
Common Emitter  
GE = 0V, f = 1MHz  
TC = 25℃  
Common Emitter  
V
±
15V  
VCC = 300V, VGE  
IC = 20A  
=
━  
= 25  
TC  
Ton  
Tr  
Cies  
TC = 125 ------  
100  
Coes  
Cres  
10  
1
10  
Collector - Emitter Voltage, VCE [V]  
1
10  
Gate Resistance, RG []  
100  
Fig 7. Capacitance Characteristics  
Fig 8. Turn-On Characteristics vs.  
Gate Resistance  
Common Emitter  
±
15V  
VCC = 300V, VGE  
C = 20A  
=
I
━  
= 25  
TC  
TC = 125 ------  
1000  
Eoff  
1000  
Eon  
Eoff  
Toff  
Tf  
Toff  
Common Emitter  
±
15V  
V
CC = 300V, VGE  
=
Tf  
I
C = 20A  
━  
= 25  
TC  
C = 125 ------  
100  
T
100  
1
10  
Gate Resistance, RG []  
100  
1
10  
Gate Resistance, RG []  
100  
Fig 9. Turn-Off Characteristics vs.  
Gate Resistance  
Fig 10. Switching Loss vs. Gate Resistance  
1000  
Common Emitter  
±
VGE  
TC  
TC = 125 ------  
=
15V, RG = 10  
━  
25  
=
Ton  
100  
Toff  
Tf  
Tr  
Toff  
Tf  
100  
Common Emitter  
±
25  
VGE  
TC  
=
15V, RG = 10Ω  
━  
=
T
C = 125 ------  
30 35  
Collector Current, IC [A]  
10  
10  
15  
20  
25  
30  
35  
40  
10  
15  
20  
25  
40  
Collector Current, IC [A]  
Fig 11. Turn-On Characteristics vs.  
Collector Current  
Fig 12. Turn-Off Characteristics vs.  
Collector Current  
©2002 Fairchild Semiconductor Corporation  
SGP20N60RUF Rev. A1  
15  
12  
9
Common Emitter  
RL = 15  
TC = 25℃  
Common Emitter  
VGE = ± 15V, R = 10Ω  
G
TC  
= 25━  
Eoff  
Eoff  
TC = 125------  
VCC = 100 V  
300 V  
200 V  
1000  
Eon  
6
3
100  
0
10  
15  
20  
25  
30  
35  
40  
0
10  
20  
30  
40  
50  
60  
Collector Current, IC [A]  
Gate Charge, Qg [ nC ]  
Fig 13. Switching Loss vs. Collector Current  
Fig 14. Gate Charge Characteristics  
100  
100  
IC MAX. (Pulsed)  
50  
100  
IC MAX. (Continuous)  
1
10  
DC Operation  
10  
1
Single Nonrepetitive  
Pulse TC = 25  
Curves must be derated  
linearly with increase  
in temperature  
Safe Operating Area  
VGE = 20V, TC = 100  
10 100  
Collector-Emitter Voltage, VCE [V]  
0.1  
1
0.3  
1
10  
100  
1000  
1
1000  
Collector-Emitter Voltage, VCE [V]  
Fig 15. SOA Characteristics  
Fig 16. Turn-Off SOA Characteristics  
1
0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Pdm  
0.01  
0.01  
1E-3  
t1  
t2  
single pulse  
Duty factor D = t1 / t2  
Peak Tj = Pdm  
×
Zthjc + TC  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
Rectangular Pulse Duration [sec]  
Fig 17. Transient Thermal Impedance of IGBT  
©2002 Fairchild Semiconductor Corporation  
SGP20N60RUF Rev. A1  
Package Dimension  
TO-220  
4.50 ±0.20  
9.90 ±0.20  
(8.70)  
+0.10  
–0.05  
1.30  
ø3.60 ±0.10  
1.27 ±0.10  
1.52 ±0.10  
0.80 ±0.10  
+0.10  
–0.05  
0.50  
2.40 ±0.20  
2.54TYP  
2.54TYP  
[2.54 ±0.20]  
[2.54 ±0.20]  
10.00 ±0.20  
Dimensions in Millimeters  
©2002 Fairchild Semiconductor Corporation  
SGP20N60RUF Rev. A1  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
ACEx™  
FAST®  
FASTr™  
FRFET™  
GlobalOptoisolator™ PACMAN™  
GTO™  
HiSeC™  
I2C™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MICROWIRE™  
OPTOLOGIC™  
OPTOPLANAR™  
SLIENT SWITCHER® UHC™  
SMART START™  
SPM™  
STAR*POWER™  
Stealth™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DenseTrench™  
DOME™  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
UltraFET®  
VCX™  
POP™  
Power247™  
PowerTrench®  
QFET™  
QS™  
QT Optoelectronics™ TinyLogic™  
Quiet Series™ TruTranslation™  
FACT Quiet Series™ MicroPak™  
STAR*POWER is used under license  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY  
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY  
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR  
CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, or (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
©2002 Fairchild Semiconductor Corporation  
Rev. H5  

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