AOI4146 [FREESCALE]

30V N-Channel MOSFET; 30V N沟道MOSFET
AOI4146
型号: AOI4146
厂家: Freescale    Freescale
描述:

30V N-Channel MOSFET
30V N沟道MOSFET

文件: 总7页 (文件大小:487K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOD4146/AOI4146  
30V N-Channel MOSFET  
General Description  
The AOD4146/AOI4146 is fabricated with SDMOSTM  
trench technology that combines excellent RDS(ON) with low  
controlled switching behavior. This universal technology is  
gate charge.The result is outstanding efficiency with  
applications.  
well suited for PWM, load switching and general purpose  
Features  
VDS  
30V  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
RDS(ON) (at VGS = 4.5V)  
55A  
< 5.6m  
< 9.5mΩ  
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
VDS  
30  
V
Gate-Source Voltage  
VGS  
±20  
55  
V
A
TC=25°C  
Continuous Drain  
Current G  
ID  
TC=100°C  
43  
Pulsed Drain Current C  
IDM  
190  
15  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Avalanche energy L=0.05mH C  
IDSM  
A
12  
IAS, IAR  
50  
A
EAS, EAR  
63  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
62  
PD  
W
31  
TA=25°C  
2.5  
PDSM  
W
°C  
Power Dissipation A  
1.6  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 175  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
15  
41  
2
Max  
20  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
Steady-State  
Steady-State  
50  
RθJC  
2.4  
1/7  
www.freescale.net.cn  
AOD4146/AOI4146  
30V N-Channel MOSFET  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
30  
V
VDS=30V, VGS=0V  
100  
µA  
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
500  
V
DS=0V, VGS= ±20V  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
100  
3
nA  
V
VGS(th)  
ID(ON)  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
1.6  
2.1  
190  
A
4.7  
7.4  
7.9  
50  
5.6  
8.9  
9.5  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
VGS=4.5V, ID=10A  
mΩ  
S
VDS=5V, ID=20A  
IS=1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
0.7  
1
V
Maximum Body-Diode Continuous Current  
55  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1630 2037 2440  
pF  
pF  
pF  
VGS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
260  
130  
0.5  
375  
220  
1.1  
490  
300  
1.7  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
Qg(4.5V) Total Gate Charge  
28  
13  
35  
16  
8.6  
4.6  
8.8  
26  
23  
6
42  
20  
10  
6.4  
nC  
nC  
nC  
nC  
ns  
VGS=10V, VDS=15V, ID=20A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
6.8  
2.8  
VGS=10V, VDS=15V, RL=0.75,  
RGEN=3Ω  
ns  
tD(off)  
tf  
ns  
ns  
trr  
IF=20A, dI/dt=500A/µs  
IF=20A, dI/dt=500A/µs  
8
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
10  
15  
12  
18  
ns  
Qrr  
12  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep  
initial TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.  
G. The maximum current rating is limited by bond-wires.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
2/7  
www.freescale.net.cn  
AOD4146/AOI4146  
30V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
100  
80  
60  
40  
20  
0
5V  
10V  
VDS=5V  
4.5V  
6V  
7V  
4V  
125°C  
VGS=3.5V  
25°C  
0
1
2
3
4
5
6
0
1
2
3
4
5
VGS(Volts)  
VDS (Volts)  
Fig 1: On-Region Characteristics (Note E)  
Figure 2: Transfer Characteristics (Note E)  
15  
12  
9
2
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=20A  
VGS=4.5V  
6
VGS=4.5V  
VGS=10V  
3
ID=20A  
0.8  
0
0
25  
50  
75  
100 125 150 175 200  
0
5
10  
15  
ID (A)  
20  
25  
30  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
20  
16  
12  
8
1.0E+02  
1.0E+01  
ID=20A  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
4
25°C  
0
0.0  
0.2  
0.4  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
3/7  
www.freescale.net.cn  
AOD4146/AOI4146  
30V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
3000  
2500  
2000  
1500  
1000  
500  
VDS=15V  
ID=20A  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
0
5
10  
15  
20  
25  
30  
35  
40  
0
5
10  
VDS (Volts)  
15  
20  
25  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
200  
160  
120  
80  
1000.0  
100.0  
10.0  
1.0  
TJ(Max)=175°C  
TC=25°C  
10µs  
RDS(ON)  
100µs  
1ms  
10ms  
DC  
TJ(Max)=175°C  
TC=25°C  
0.1  
40  
0.0  
0
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
VDS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
RθJC=2.4°C/W  
PD  
0.1  
0.01  
Ton  
T
Single Pulse  
0.0001  
0.00001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
4/7  
www.freescale.net.cn  
AOD4146/AOI4146  
30V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
TA=25°C  
TA=100°C  
TA=150°C  
TA=125°C  
10  
0.000001  
0
25  
50  
75  
TCASE (°C)  
Figure 13: Power De-rating (Note F)  
100  
125  
150  
175  
0.00001  
0.0001  
0.001  
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche  
capability (Note C)  
100000  
10000  
1000  
100  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
10  
1
0.00001  
0.001  
0.1  
10  
1000  
0
25  
50  
75  
TCASE (°C)  
100  
125  
150  
175  
Pulse Width (s)  
Figure 14: Current De-rating (Note F)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJA=50°C/W  
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
0.1  
1
10  
100  
1000  
5/7  
www.freescale.net.cn  
AOD4146/AOI4146  
30V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
25  
20  
15  
10  
5
12  
10  
8
16  
3
di/dt=800A/µs  
14  
di/dt=800A/µs  
2.5  
2
12  
125ºC  
125ºC  
10  
8
Qrr  
trr  
6
25ºC  
1.5  
1
25ºC  
6
125ºC  
25ºC  
4
125ºC  
25ºC  
Irm  
S
4
2
0.5  
0
2
0
0
0
0
5
10  
15  
IS (A)  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
IS (A)  
Figure 17: Diode Reverse Recovery Charge and Peak  
Current vs. Conduction Current  
Figure 18: Diode Reverse Recovery Time and  
Softness Factor vs. Conduction Current  
20  
15  
10  
5
10  
15  
12  
9
2.5  
2
Is=20A  
Is=20A  
8
125ºC  
125ºC  
trr  
25ºC  
6
4
2
0
1.5  
1
25ºC  
125º  
Qrr  
6
125ºC  
25ºC  
S
3
25ºC  
0.5  
0
Irm  
0
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
di/dt (A/µs)  
di/dt (A/µs)  
Figure 19: Diode Reverse Recovery Charge and Peak  
Current vs. di/dt  
Figure 20: Diode Reverse Recovery Time and  
Softness Factor vs. di/dt  
6/7  
www.freescale.net.cn  
AOD4146/AOI4146  
30V N-Channel MOSFET  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
7/7  
www.freescale.net.cn  

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