MMG3010NT1 [FREESCALE]

Heterojunction Bipolar Transistor (InGaP HBT); 异质结双极晶体管( InGaP HBT的)
MMG3010NT1
型号: MMG3010NT1
厂家: Freescale    Freescale
描述:

Heterojunction Bipolar Transistor (InGaP HBT)
异质结双极晶体管( InGaP HBT的)

晶体 晶体管 射频 微波
文件: 总12页 (文件大小:216K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Document Number: MMG3010NT1  
Rev. 1, 8/2005  
Freescale Semiconductor  
Technical Data  
Heterojunction Bipolar Transistor  
(InGaP HBT)  
Broadband High Linearity Amplifier  
MMG3010NT1  
The MMG3010NT1 is a General Purpose Amplifier that is internally  
input and output matched. It is designed for a broad range of Class A,  
small-signal, high linearity, general purpose applications. It is suitable  
for applications with frequencies from 0 to 6000 MHz such as Cellular,  
PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general  
small-signal RF.  
0-6000 MHz, 15 dB  
17 dBm  
Features  
InGaP HBT  
Frequency: 0 to 6000 MHz  
P1dB: 17 dBm @ 900 MHz  
Small-Signal Gain: 15 dB @ 900 MHz  
Third Order Output Intercept Point: 31 dBm @ 900 MHz  
Single 5 Volt Supply  
1
2
Internally Matched to 50 Ohms  
Low Cost SOT-89 Surface Mount Package  
Pb-Free and RoHS Compliant  
3
CASE 1514-01, STYLE 1  
SOT-89  
In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.  
PLASTIC  
Table 1. Typical Performance (1)  
Table 2. Maximum Ratings  
Rating  
Symbol  
Value  
Unit  
V
Characteristic  
Symbol 900 2140 3500 Unit  
MHz MHz  
MHz  
(2)  
Supply Voltage  
V
7
300  
CC  
CC  
Small-Signal Gain  
(S21)  
G
15  
-15  
-25  
17  
14  
-17  
-25  
16.5  
30  
12  
dB  
dB  
dB  
p
(2)  
Supply Current  
RF Input Power  
I
mA  
dBm  
°C  
P
in  
10  
Input Return Loss  
(S11)  
IRL  
ORL  
P1db  
IP3  
-22  
-15  
Storage Temperature Range  
T
stg  
-65 to +150  
150  
(3)  
Junction Temperature  
T
J
°C  
Output Return Loss  
(S22)  
2. Continuous voltage and current applied to device.  
3. For reliable operation, the junction temperature should not  
Power Output @1dB  
Compression  
15.5 dBm  
exceed 150°C.  
Third Order Output  
Intercept Point  
31  
28  
dBm  
1. V = 5 Vdc, T = 25°C, 50 ohm system  
CC  
C
Table 3. Thermal Characteristics (V = 5 Vdc, I = 54 mA, T = 25°C)  
CC  
CC  
C
(4)  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
θ
JC  
83  
°C/W  
4. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes - AN1955.  
Freescale Semiconductor, Inc., 2005. All rights reserved.  
Table 4. Electrical Characteristics (V = 5 Vdc, 900 MHz, T = 25°C, 50 ohm system, in Freescale Application Circuit)  
CC  
C
Characteristic  
Symbol  
Min  
14  
Typ  
15  
Max  
Unit  
dB  
Small-Signal Gain (S21)  
Input Return Loss (S11)  
Output Return Loss (S22)  
G
p
IRL  
ORL  
P1dB  
IP3  
-15  
-25  
17  
dB  
dB  
Power Output @ 1dB Compression  
Third Order Output Intercept Point  
Noise Figure  
dBm  
dBm  
dB  
31  
NF  
4.5  
54  
(1)  
Supply Current  
I
46  
63  
mA  
V
CC  
(1)  
Supply Voltage  
V
CC  
5
1. For reliable operation, the junction temperature should not exceed 150°C.  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
2
Table 5. Functional Pin Description  
2
Pin  
Pin Function  
Number  
1
2
3
RF  
in  
Ground  
RF /DC Supply  
out  
1
2
3
Figure 1. Functional Diagram  
Table 6. ESD Protection Characteristics  
Test Methodology  
Class  
Human Body Model (per JESD 22-A114)  
Machine Model (per EIA/JESD 22-A115)  
Charge Device Model (per JESD 22-C101)  
1A (Minimum)  
A (Minimum)  
IV (Minimum)  
Table 7. Moisture Sensitivity Level  
Test Methodology  
Rating  
Package Peak Temperature  
Unit  
Per JESD 22-A113, IPC/JEDEC J-STD-020  
1
260  
°C  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
3
50 OHM TYPICAL CHARACTERISTICS  
0
20  
15  
10  
5
T = 85°C  
C
25°C  
−10  
S11  
-40°C  
−20  
S22  
−30  
V
I
= 5 Vdc  
= 54 mA  
CC  
V
CC  
= 5 Vdc  
CC  
−40  
0
1
2
3
4
0
1
2
3
4
f, FREQUENCY (GHz)  
f, FREQUENCY (GHz)  
Figure 2. Small-Signal Gain (S21) versus  
Frequency  
Figure 3. Input/Output Return Loss versus  
Frequency  
17  
16  
19  
18  
17  
16  
15  
14  
13  
12  
900 MHz  
15  
14  
13  
2140 MHz  
1960 MHz  
2600 MHz  
3500 MHz  
12  
V
= 5 Vdc  
= 54 mA  
CC  
11  
10  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
I
CC  
0.5  
1
1.5  
2
2.5  
3
3.5  
8
9
10  
11  
12  
13  
14  
15  
16  
P , OUTPUT POWER (dBm)  
out  
f, FREQUENCY (GHz)  
Figure 4. Small-Signal Gain versus Output  
Power  
Figure 5. P1dB versus Frequency  
36  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
33  
30  
27  
24  
21  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
1 MHz Tone Spacing  
4
4.2  
4.4  
4.6  
4.8  
5
5.2  
5.4  
0
1
2
3
4
f, FREQUENCY (GHz)  
V , COLLECTOR VOLTAGE (V)  
CC  
Figure 7. Third Order Output Intercept Point  
versus Frequency  
Figure 6. Collector Current versus Collector  
Voltage  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
4
50 OHM TYPICAL CHARACTERISTICS  
36  
33  
30  
33  
32  
31  
30  
29  
28  
27  
24  
21  
V
= 5 Vdc  
f = 900 MHz  
CC  
27  
f = 900 MHz  
1 MHz Tone Spacing  
26  
1 MHz Tone Spacing  
−40  
−20  
0
20  
40  
60  
80  
100  
4.9  
4.95  
5
5.05  
5.1  
T, TEMPERATURE (_C)  
Figure 9. Third Order Output Intercept Point  
versus Case Temperature  
V
, COLLECTOR VOLTAGE (V)  
CC  
Figure 8. Third Order Output Intercept Point  
versus Collector Voltage  
5
10  
−30  
−40  
−50  
−60  
−70  
−80  
4
10  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
f = 900 MHz  
1 MHz Tone Spacing  
3
10  
120  
125  
130  
135  
140  
145  
150  
6
−3  
0
3
9
12  
15  
T , JUNCTION TEMPERATURE (°C)  
J
P , OUTPUT POWER (dBm)  
out  
NOTE: The MTTF is calculated with V = 5 Vdc, I = 54 mA  
CC CC  
Figure 10. Third Order Intermodulation versus  
Output Power  
Figure 11. MTTF versus Junction Temperature  
−20  
8
V
CC  
= 5 Vdc, I = 54 mA, f = 2140 MHz  
CC  
Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth  
PAR = 8.5 dB @ 0.01% Probability (CCDF)  
−30  
−40  
6
4
−50  
−60  
−70  
2
0
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
0
1
2
3
4
−3  
0
3
6
9
12  
15  
f, FREQUENCY (GHz)  
P , OUTPUT POWER (dBm)  
out  
Figure 12. Noise Figure versus Frequency  
Figure 13. Single-Carrier W-CDMA Adjacent  
Channel Power Ratio versus Output Power  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
5
50 OHM APPLICATION CIRCUIT: 40-300 MHz  
V
SUPPLY  
R1  
C3  
C4  
Z5  
L1  
RF  
OUTPUT  
RF  
INPUT  
DUT  
V
Z3  
Z4  
Z1  
Z2  
C1  
C2  
CC  
Z1, Z5  
Z2  
Z3  
0.347x 0.058Microstrip  
0.575x 0.058Microstrip  
0.172x 0.058Microstrip  
Z4  
PCB  
0.403x 0.058Microstrip  
Getek Grade ML200C, 0.031, ε = 4.1  
r
Figure 14. 50 Ohm Test Circuit Schematic  
20  
10  
0
S21  
R1  
C4  
C3  
L1  
−10  
−20  
−30  
−40  
S11  
S22  
C2  
C1  
V
= 5 Vdc  
= 54 mA  
CC  
MMG30XX  
Rev 2  
I
CC  
0
100  
200  
300  
400  
500  
f, FREQUENCY (MHz)  
Figure 15. S21, S11 and S22 versus Frequency  
Figure 16. 50 Ohm Test Circuit Component Layout  
Table 8. 50 Ohm Test Circuit Component Designations and Values  
Part  
Description  
0.01 µF Chip Capacitors  
Part Number  
0603A103JAT2A  
0603A102JAT2A  
BK2125HM471  
Manufacturer  
AVX  
C1, C2, C3  
C4  
L1  
R1  
1000 pF Chip Capacitor  
470 nH Chip Inductor  
0 W Chip Resistor  
AVX  
Taiyo Yuden  
Panasonic  
ERJ3GEY0R00V  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
6
50 OHM APPLICATION CIRCUIT: 300-3600 MHz  
V
SUPPLY  
R1  
C3  
C4  
Z5  
L1  
RF  
OUTPUT  
RF  
INPUT  
DUT  
V
Z3  
Z4  
Z1  
Z2  
C1  
C2  
CC  
Z1, Z5  
Z2  
Z3  
0.347x 0.058Microstrip  
0.575x 0.058Microstrip  
0.172x 0.058Microstrip  
Z4  
PCB  
0.403x 0.058Microstrip  
Getek Grade ML200C, 0.031, ε = 4.1  
r
Figure 17. 50 Ohm Test Circuit Schematic  
20  
10  
0
S21  
R1  
C4  
C3  
L1  
−10  
−20  
S11  
S22  
C2  
C1  
−30  
−40  
V
= 5 Vdc  
= 54 mA  
CC  
MMG30XX  
Rev 2  
I
CC  
300  
800  
1300  
1800  
2300  
2800  
3300  
3800  
f, FREQUENCY (MHz)  
Figure 18. S21, S11 and S22 versus Frequency  
Figure 19. 50 Ohm Test Circuit Component Layout  
Table 9. 50 Ohm Test Circuit Component Designations and Values  
Part  
Description  
150 pF Chip Capacitors  
Part Number  
06035A151JAT2A  
0603A103JAT2A  
0603A102JAT2A  
HK160856NJ-T  
ERJ3GEY0R00V  
Manufacturer  
AVX  
C1, C2  
C3  
0.01 µF Chip Capacitor  
1000 pF Chip Capacitor  
56 nH Chip Inductor  
0 W Chip Resistor  
AVX  
C4  
AVX  
L1  
Taiyo Yuden  
Panasonic  
R1  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
7
50 OHM TYPICAL CHARACTERISTICS  
Table 10. Class A Common Emitter S-Parameters at VCC = 5 Vdc, ICC = 54 mA, TC = 255C  
S
11  
S
21  
S
12  
S
22  
f
GHz  
|S  
11  
|
∠ φ  
|S  
21  
|
∠ φ  
|S  
12  
|
∠ φ  
|S |  
22  
∠ φ  
0.1  
0.15  
0.2  
0.18961  
0.18946  
0.18931  
0.18916  
0.18900  
0.18887  
0.18873  
0.18856  
0.18844  
0.18829  
0.18813  
0.18799  
0.18783  
0.18769  
0.18753  
0.18738  
0.18723  
0.18703  
0.18689  
0.18674  
0.18657  
0.18643  
0.18629  
0.18613  
0.18599  
0.18582  
0.18568  
0.18567  
0.18569  
0.18591  
0.18645  
0.18767  
0.18855  
0.19030  
0.19186  
0.19364  
0.19581  
0.19775  
0.20022  
0.20274  
0.20483  
0.20673  
0.21006  
0.21183  
0.21443  
0.21661  
174.356  
172.591  
170.087  
168.286  
166.103  
163.926  
161.691  
159.363  
157.207  
154.948  
152.775  
150.556  
148.43  
6.08599  
6.06991  
6.05558  
6.04027  
6.03125  
6.01832  
6.00664  
5.99750  
5.98612  
5.97231  
5.95537  
5.94078  
5.92660  
5.90891  
5.88998  
5.86905  
5.84578  
5.82588  
5.80670  
5.77963  
5.75495  
5.72982  
5.70191  
5.67762  
5.65132  
5.62394  
5.59479  
5.56625  
5.54822  
5.52432  
5.49674  
5.46526  
5.43646  
5.40925  
5.38177  
5.35341  
5.32341  
5.29221  
5.25998  
5.22900  
5.20224  
5.16895  
5.13639  
5.10466  
5.07001  
5.03818  
176.121  
173.709  
171.476  
169.492  
167.447  
165.299  
163.288  
161.184  
159.055  
157.036  
154.979  
152.921  
150.895  
148.835  
146.803  
144.751  
142.751  
140.772  
138.776  
136.782  
134.777  
132.79  
0.10045  
0.10051  
0.10055  
0.10060  
0.10065  
0.10069  
0.10073  
0.10078  
0.10085  
0.10090  
0.10098  
0.10111  
0.10103  
0.10115  
0.10113  
0.10130  
0.10126  
0.10142  
0.10134  
0.10156  
0.10146  
0.10159  
0.10169  
0.10184  
0.10183  
0.10196  
0.10201  
0.10211  
0.10220  
0.10258  
0.10272  
0.10283  
0.10301  
0.10315  
0.10333  
0.10340  
0.10356  
0.10384  
0.10401  
0.10405  
0.10413  
0.10441  
0.10441  
0.10468  
0.10472  
0.10489  
-1.147  
-1.684  
-2.764  
-3.23  
0.01890  
0.01961  
0.02022  
0.02108  
0.02178  
0.02240  
0.02324  
0.02417  
0.02490  
0.02589  
0.02683  
0.02784  
0.02895  
0.03030  
0.03176  
0.03328  
0.03472  
0.03683  
0.03847  
0.04077  
0.04304  
0.04551  
0.04827  
0.05112  
0.05460  
0.05759  
0.06146  
0.06306  
0.06362  
0.06362  
0.06377  
0.06570  
0.06858  
0.07094  
0.07392  
0.07711  
0.08039  
0.08395  
0.08764  
0.09155  
0.09523  
0.09969  
0.10388  
0.10812  
0.11217  
0.11632  
-117.716  
-119.073  
-121.834  
-123.647  
-125.155  
-127.572  
-129.668  
-131.224  
-133.739  
-135.854  
-137.345  
-139.784  
-141.384  
-143.84  
0.25  
0.3  
-3.883  
-4.61  
0.35  
0.4  
-5.218  
-5.914  
-6.577  
-7.176  
-7.816  
-8.444  
-9.124  
-9.76  
0.45  
0.5  
0.55  
0.6  
0.65  
0.7  
0.75  
0.8  
146.278  
144.103  
142.071  
140.126  
138.174  
136.334  
134.574  
132.862  
131.57  
-10.388  
-11.106  
-11.715  
-12.347  
-13.049  
-13.635  
-14.317  
-14.945  
-15.594  
-16.271  
-16.958  
-17.615  
-18.236  
-18.888  
-19.552  
-20.344  
-20.962  
-21.702  
-145.852  
-147.52  
0.85  
0.9  
-148.773  
-150.721  
-153.215  
-155.358  
-159.06  
0.95  
1
1.05  
1.1  
1.15  
1.2  
-162.691  
-166.671  
-170.497  
-174.453  
-178.275  
178.051  
174.258  
170.85  
130.147  
128.841  
127.621  
126.515  
125.418  
124.471  
123.602  
122.392  
120.668  
119.047  
130.817  
128.866  
126.933  
124.986  
123.074  
121.175  
119.257  
117.274  
115.354  
113.429  
1.25  
1.3  
1.35  
1.4  
1.45  
1.5  
1.55  
1.6  
163.521  
160.673  
158.125  
1.65  
1.7  
117.338  
115.719  
114.043  
112.379  
110.938  
109.449  
108.079  
106.526  
105.054  
103.673  
102.263  
100.83  
111.53  
109.673  
107.795  
105.878  
104.011  
102.117  
100.28  
98.422  
96.556  
94.728  
92.885  
91.074  
89.25  
-22.327  
-23.09  
155.716  
153.133  
151.055  
148.881  
147.016  
145.259  
143.574  
141.882  
140.434  
138.992  
137.594  
136.199  
134.891  
133.499  
1.75  
1.8  
-23.804  
-24.547  
-25.192  
-25.884  
-26.62  
1.85  
1.9  
1.95  
2
2.05  
2.1  
-27.296  
-28.065  
-28.819  
-29.517  
-30.238  
-30.97  
2.15  
2.2  
2.25  
2.3  
99.385  
2.35  
98.005  
87.453  
-31.768  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
8
50 OHM TYPICAL CHARACTERISTICS  
Table 10. Class A Common Emitter S-Parameters at VCC = 5 Vdc, ICC = 54 mA, TC = 255C (continued)  
S
11  
S
21  
S
12  
S
22  
f
GHz  
|S  
11  
|
∠ φ  
|S  
21  
|
∠ φ  
|S  
12  
|
∠ φ  
|S |  
22  
∠ φ  
2.4  
2.45  
2.5  
0.21882  
0.22193  
0.22303  
0.22524  
0.22731  
0.22921  
0.23072  
0.23259  
0.23443  
0.23625  
0.23786  
0.23979  
0.24125  
0.24422  
0.24610  
0.24792  
0.25072  
0.25383  
0.25590  
0.25874  
0.26159  
0.26531  
0.26829  
0.27180  
0.27525  
96.635  
95.395  
93.907  
92.5  
5.00516  
4.97224  
4.93831  
4.90747  
4.87540  
4.84438  
4.81170  
4.77720  
4.74514  
4.71210  
4.68334  
4.64992  
4.61988  
4.58846  
4.55812  
4.52495  
4.49699  
4.46681  
4.43561  
4.40430  
4.37458  
4.34458  
4.31385  
4.28470  
4.25389  
85.611  
83.821  
82.052  
80.256  
78.504  
76.72  
0.10502  
0.10521  
0.10527  
0.10541  
0.10567  
0.10587  
0.10582  
0.10600  
0.10623  
0.10637  
0.10648  
0.10664  
0.10700  
0.10702  
0.10736  
0.10733  
0.10748  
0.10765  
0.10784  
0.10813  
0.10814  
0.10821  
0.10846  
0.10856  
0.10871  
-32.469  
-33.265  
-34.008  
-34.706  
-35.467  
-36.255  
-37.021  
-37.804  
-38.579  
-39.349  
-40.152  
-41.004  
-41.819  
-42.586  
-43.392  
-44.248  
-45.078  
-45.892  
-46.753  
-47.687  
-48.565  
-49.382  
-50.314  
-51.229  
-52.108  
0.12050  
0.12557  
0.12957  
0.13384  
0.13842  
0.14269  
0.14690  
0.15188  
0.15645  
0.16075  
0.16529  
0.16969  
0.17439  
0.17909  
0.18404  
0.18914  
0.19427  
0.19983  
0.20478  
0.21036  
0.21586  
0.22115  
0.22678  
0.23264  
0.23850  
132.176  
130.946  
129.503  
128.151  
126.605  
125.06  
123.585  
122.036  
120.364  
118.48  
2.55  
2.6  
91.106  
89.599  
88.26  
2.65  
2.7  
74.931  
73.147  
71.382  
69.615  
67.904  
66.078  
64.334  
62.607  
60.863  
59.115  
57.356  
55.612  
53.877  
52.133  
50.384  
48.649  
46.916  
45.167  
43.44  
2.75  
2.8  
86.873  
85.515  
84.122  
82.84  
2.85  
2.9  
116.779  
114.827  
112.861  
111.23  
2.95  
3
81.448  
80.072  
78.711  
77.547  
76.337  
75.174  
73.947  
72.848  
71.738  
70.666  
69.68  
3.05  
3.1  
109.114  
107.101  
105.076  
102.924  
100.877  
98.897  
96.818  
94.763  
92.769  
90.836  
88.858  
3.15  
3.2  
3.25  
3.3  
3.35  
3.4  
3.45  
3.5  
68.707  
67.687  
66.773  
3.55  
3.6  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
9
1.7  
7.62  
0.305 diameter  
2.49  
3.48  
0.58  
5.33  
2.54  
1.27  
1.27  
0.86  
0.64  
3.86  
NOTES:  
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE  
USED IN PCB LAYOUT DESIGN.  
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS  
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.  
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN  
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO  
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL  
AND RF PERFORMANCE.  
Recommended Solder Stencil  
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM  
PITCH.  
Figure 20. Recommended Mounting Configuration  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
10  
PACKAGE DIMENSIONS  
3
4
4.70  
4.40  
A
1.87  
1.79  
M
0.15  
C A B  
0.60  
0.40  
2X R0.15 TYP  
B
1.70  
1.40  
°
2X 4 TYP  
2.70  
2.40  
3
4
4.50  
3.70  
1.30  
0.70  
5
2X  
1
2
3
M
0.20  
C B  
0.48  
0.38  
0.48  
0.38  
M
0.15  
C A B  
M
0.15  
C A B  
0.58  
0.48  
M
0.15  
C A B  
0.46  
0.40  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. ALL DIMENSIONS ARE IN MILLIMETERS.  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS  
OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE  
BURRS SHALL NOT EXCEED 0.5MM PER END. DIMENSION DOES  
NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD  
FLASH OR PROTRUSION SHALL NOT EXCEED 0.5MM PER SIDE.  
4. DIMENSIONS ARE DETERMINED AT THE OUTMOST EXTREMES  
OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING  
ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
°
2X 4 TYP  
E.P.  
2X R0.20  
5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.  
4X  
0.10 C  
1.35  
1.25  
0.65  
0.55  
SEATING PLANE  
C
1.50  
1.50  
1.65  
1.55  
STYLE 1:  
PIN 1. RF INPUT  
2. GROUND  
3. RF OUTPUT  
CASE 1514-01  
ISSUE C  
SOT-89  
PLASTIC  
BOTTOM VIEW  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
11  
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Document Number: MMG3010NT1  
Rev. 1, 8/2005  

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