MPX5100_10 [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MPX5100_10 |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总17页 (文件大小：350K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MPX5100
Rev 13, 05/2010
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This patented,
single element transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
MPX5100
MPXV5100
Series
0 to 100 kPa (0 to 14.5 psi)
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.7 V Output
Typical Applications
•
•
•
•
Patient Monitoring
Process Control
Pump/Motor Control
Pressure Switching
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Patented Silicon Shear Stress Strain Gauge
• Available in Absolute, Differential and Gauge Configuration
• Durable Epoxy Unibody Element
• Easy-to-Use Chip Carrier Option
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential
Case
No.
Device
Marking
Device Name
None
Dual
Gauge
Absolute
Unibody Package (MPX5100 Series)
MPX5100A
MPX5100AP
MPX5100D
MPX5100DP
MPX5100GP
867
867B
867
•
•
•
•
MPX5100A
MPX5100AP
MPX5100D
MPX5100DP
MPX5100GP
•
•
•
•
867C
867B
•
•
•
Small Outline Package (MPXV5100 Series)
MPXV5100GC6U
MPXV5100GC7U
MPXV5100DP
482A
482C
1351
1369
•
•
•
•
MPXV5100G
MPXV5100G
MPXV5100DP
MPXV5100GP
•
MPXV5100GP
•
•
© Freescale Semiconductor, Inc., 2005-2010. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX5100A/D
CASE 867-08
MPX5100AP/GP
CASE 867B-04
MPX5100DP
CASE 857C-05
SMALL OUTLINE PACKAGES
MPXV5100GC6U
CASE 482A-01
MPXV5100GC7U
CASE 482C-03
MPXV5100DP
CASE 1351-01
MPXV5100GP
CASE 1369-01
MPX5100
Sensors
Freescale Semiconductor
2
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 5 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
kPa
0
15
—
—
100
115
Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G
Absolute: MPX5100A
Supply Voltage(2)
Supply Current
VS
IO
4.75
—
5.0
7.0
5.25
10
VDC
mAdc
VDC
Minimum Pressure Offset(3)
@ VS = 5.0 V
(0 to 85°C)
VOFF
0.088
0.20
0.313
Full Scale Output(4)
@ VS = 5.0 V
Differential and Absolute (0 to 85°C)
Differential and Absolute (0 to 85°C)
VFSO
VFSS
—
4.587
—
4.700
4.500
—
4.813
—
VDC
Full Scale Span(5)
@ VS = 5.0 V
VDC
Accuracy(6)
Sensitivity
—
±2.5
%VFSS
V/P
tR
—
—
45
—
—
mV/kPa
ms
Response Time(7)
1.0
Output Source Current at Full Scale Output
IO+
—
—
—
—
0.1
20
—
—
—
mAdc
ms
Warm-Up Time(8)
Offset Stability(9)
—
±0.5
%VFSS
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX5100
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Storage Temperature
Pmax
400
kPa
Tstg
TA
-40° to +125°
-40° to +125°
°C
°C
Operating Temperature
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package.
VS
3
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
Vout
1
Sensing
Element
Gain Stage #1
2
Pins 4, 5, and 6 are NO CONNECTS.
GND
Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices
Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package.
VS
2
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Thin Film
Temperature
Compensation
and
Vout
4
Sensing
Element
Gain Stage #1
3
Pins 1 and 5-8 are NO CONNECTS.
GND
Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices
MPX5100
Sensors
Freescale Semiconductor
4
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 5. The
output will saturate outside of the specified pressure range.
Figure 4 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
5
V
= V *(0.009*P+0.04)
S
out
± (Pressure Error * Temperature Factor * 0.009 * V )
S
V
= 5.0 V ± 0.25 Vdc
S
4
3
2
1
0
PE = 2.5
TM = 1
TEMP = 0 to 85°C
MAX
TYP
MIN
(Typ)
Pressure (kPa)
Offset
Figure 3. Output vs. Pressure Differential
Fluorosilicone Gel
Die Coat
Fluorosilicone
Gel Die Coat
Stainless Steel
Metal Cover
Stainless Steel
Metal Cover
Die
Die
Epoxy Plastic
Epoxy Plastic
Case
Wire Bond
Case
Wire Bond
Die Bond
Die Bond
Lead Frame
Lead Frame
Differential/Gauge Element
Absolute Element
Figure 4. Cross Sectional Diagrams (not to scale)
Figure 5 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
+5.0 V
VOUT
OUTPUT
Vs
IPS
GND
1.0 μF
0.01 μF
470 pF
Figure 5. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
MPX5100
Sensors
Freescale Semiconductor
5
Pressure
Transfer Function (MPX5100D, MPX5100G, MPXV5100G
Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V
Temperature Error Multiplier
MPX5100D/MPX5100G/MPXV5100G Series
Break Points
Temp
Multiplier
4.0
- 40
0 to 85°C
+125°
3
1
3
3.0
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
MPX5100D/MPX5100G/MPXV5100G Series
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure in kPa
0
20
40
60
80
100
120
-1.0
-2.0
-3.0
Pressure
0 to 100 kPa
Error (max)
± 2.5 kPa
MPX5100
Sensors
Freescale Semiconductor
6
Pressure
Transfer Function (MPX5100A)
Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ± 0.25 V
Temperature Error Multiplier
Series
MPX5100A
Break Points
Temp
Multiplier
4.0
- 40
0 to 85°C
+125°
3
1
3
3.0
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
130
140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
Series
MPX5100A
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure in kPa
0
20
40
60
80
100
130
-1.0
-2.0
-3.0
Pressure
15 to 115 kPa
Error (max)
± 2.5 kPa
MPX5100
Sensors
Freescale Semiconductor
7
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
Part Number
MPX5100A, MPX5100D
MPX5100DP
Case Type
867
Pressure (P1) Side Identifier
Stainless Steel Cap
867C
867B
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Port Attached
MPX5100AP, MPX5100GP
MPXV5100GC6U
482A
MPXV5100GC7U
482C
1351
MPXV5100DP
MPXV5100GP
1369
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Surface Mounted Applications
Surface mount board layout is a critical portion of the total
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Figure 6. Small Outline Package Footprint
MPX5100
Sensors
8
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
4
M
S
S
0.25 (0.010)
T
B
A
5
8
N
–B–
G
INCHES
MILLIMETERS
1
DIM
A
B
C
D
MIN
MAX
0.425
0.425
0.520
0.042
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
0.415
0.415
0.500
0.038
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC
2.54 BSC
0.002
0.009
0.061
0
0.010
0.011
0.071
7
0.448
0.725
0.255
0.125
0.05
0.23
1.55
0
0.25
0.28
1.80
7
11.38
18.41
6.48
3.17
V
0.444
0.709
0.245
0.115
11.28
18.01
6.22
2.92
C
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-A-
4
5
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
N
-B-
D
S
8 PL
G
M
S
INCHES
MILLIMETERS
0.25 (0.010)
T B
A
1
DIM MIN MAX MIN
MAX
10.79
10.79
13.21
0.864
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
0.520 12.70
DETAIL X
0.415
0.500
0.026
S
W
0.034
0.66
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
V
PIN 1
IDENTIFIER
0.444
0.540
0.245
0.115
0.448 11.28
0.560 13.72
11.38
14.22
6.48
3.17
C
V
W
0.255
0.125
6.22
2.92
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
9
Pressure
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
P
2. CONTROLLING DIMENSION: INCH.
–A–
M
M
0.25 (0.010)
T Q
INCHES
MILLIMETERS
U
W
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
MIN
MAX
1.175
0.715
0.435
0.033
0.064
MIN
29.08
17.40
10.29
0.68
1.22
2.54 BSC
MAX
29.85
18.16
11.05
0.84
X
1.145
0.685
0.405
0.027
0.048
L
R
V
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2 VACUUM (P2)
1.63
PORT #1 POSITIVE
PRESSURE (P1)
0.100 BSC
N
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
0.36
17.65
7.37
10.67
3.89
3.89
1.60
0.41
18.42
7.62
11.18
4.04
4.04
2.11
–Q–
PORT #2
VACUUM
(P2)
B
PIN 1
5.59
6.10
U
V
W
X
0.910 BSC
23.11 BSC
K
1
2
3
4
5
6
0.182
0.310
0.248
0.194
0.330
0.278
4.62
7.87
6.30
4.93
8.38
7.06
C
S
SEATING
–T–
SEATING
PLANE
–T–
PLANE
STYLE 1:
PIN 1.
6 PL
D
G
V
OUT
J
F
M
M
2. GROUND
0.13 (0.005)
A
3.
V
CC
4. V1
5. V2
6.
V
EX
CASE 867-08
ISSUE N
UNIBODY PACKAGE
C
NOTES:
R
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
POSITIVE PRESSURE
(P1)
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D
6 PL
30˚ NOM
30˚ NOM
M
M
0.136 (0.005)
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
UNIBODY PACKAGE
MPX5100
Sensors
Freescale Semiconductor
10
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5100
11
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5100
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5100
13
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5100
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
15
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
16
Sensors
Freescale Semiconductor
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MPX5100
Rev. 13
05/2010
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