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MPXA6115AC6U [FREESCALE]

High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure; 高温度精度集成硅压力传感器，用于测量绝对压力
MPXA6115AC6U
型号： MPXA6115AC6U
厂家： Freescale    Freescale
描述：

High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
高温度精度集成硅压力传感器，用于测量绝对压力

传感器 换能器 压力传感器 PC
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MPXA6115A  
Rev 3, 01/2007  
Freescale Semiconductor  
Technical Data  
High Temperature Accuracy  
Integrated Silicon Pressure Sensor  
for Measuring Absolute Pressure,  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
MPXA6115A  
MPXH6115A  
SERIES  
INTEGRATED PRESSURE SENSOR  
15 TO 115 kPA (2.2 TO 16.7 psi)  
0.2 TO 4.8 V OUTPUT  
The MPXA6115A/MPXH6115A series sensor integrates on-chip, bipolar op  
amp circuitry and thin film resistor networks to provide a high output signal and  
temperature compensation. The small form factor and high reliability of on-chip  
integration make the pressure sensor a logical and economical choice for the  
system designer.  
SMALL OUTLINE PACKAGE  
The MPXA6115A/MPXH6115A series piezoresistive transducer is a state-of-  
the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor  
combines advanced micromachining techniques, thin film metallization, and  
bipolar semiconductor processing to provide an accurate, high level analog  
output signal that is proportional to applied pressure.  
MPXA6115C6U/C6T1  
CASE 482A-01  
MPXA6115A6U/6T1  
CASE 482-01  
Figure 1 shows a block diagram of the internal circuitry integrated on a  
pressure sensor chip.  
SMALL OUTLINE PACKAGE  
PIN NUMBERS(1)  
Features  
1
2
3
4
N/C  
VS  
5
6
7
8
N/C  
N/C  
N/C  
N/C  
•
•
•
•
•
•
Improved Accuracy at High Temperature  
Available in Small and Super Small Outline Packages  
1.5% Maximum Error over 0° to 85°C  
Ideally suited for Microprocessor or Microcontroller-Based Systems  
Temperature Compensated from -40° to +125°C  
Durable Thermoplastic (PPS) Surface Mount Package  
GND  
VOUT  
1. Pins 1, 5, 6, 7, and 8 are internal device  
connections. Do not connect to external  
circuitry or ground. Pin 1 is denoted by the  
notch in the lead.  
Typical Applications  
•
•
•
•
Aviation Altimeters  
SUPER SMALL OUTLINE PACKAGE  
Industrial Controls  
Engine Control/Manifold Absolute Pressure (MAP)  
Weather Station and Weather Reporting Device Barometers  
ORDERING INFORMATION  
MPXH6115A6U/6T1 MPXH6115AC6U/C6T1  
Device  
Type  
Case  
No.  
MPX Series  
Order No.  
Packing  
Options  
Device  
Marking  
Options  
CASE 1317-04  
CASE 1317A-03  
SMALL OUTLINE PACKAGE  
SUPER SMALL OUTLINE PACKAGE  
PIN NUMBERS(1)  
Basic  
Element  
Absolute, Element Only  
482 MPXA6115A6U  
482 MPXA6115A6T1  
482A MPXA6115AC6U  
482A MPXA6115AC6T1  
Rails  
MPXA6115A  
Absolute, Element Only  
Absolute, Axial Port  
Absolute, Axial Port  
Tape & Reel MPXA6115A  
Rails MPXA6115A  
Tape & Reel MPXA6115A  
1
2
3
4
N/C  
VS  
5
6
7
8
N/C  
N/C  
N/C  
N/C  
Ported  
Element  
SUPER SMALL OUTLINE PACKAGE  
GND  
VOUT  
Basic  
Element  
Absolute, Element Only  
Absolute, Element Only  
Absolute, Axial Port  
Absolute, Axial Port  
1317 MPXH6115A6U  
1317 MPXH6115A6T1  
1317A MPXH6115AC6U  
1317A MPXH6115AC6T1  
Rails  
Tape & Reel MPXH6115A  
Rails MPXH6115A  
Tape & Reel MPXH6115A  
MPXH6115A  
1. Pins 1, 5, 6, 7, and 8 are internal device  
connections. Do not connect to external  
circuitry or ground. Pin 1 is denoted by the  
notch in the lead  
Ported  
Element  
© Freescale Semiconductor, Inc., 2007. All rights reserved.  
VS  
Thin Film  
Temperature  
Compensation  
and  
Gain Stage #1  
Gain Stage #2  
and Ground  
Reference  
Shift  
Sensing  
Element  
VOUT  
Circuitry  
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
GND  
Figure 1. Fully Integrated Pressure Sensor Schematic  
Table 1. Maximum Ratings(1)  
Rating  
Symbol  
Pmax  
Tstg  
Value  
Units  
kPa  
°C  
Maximum Pressure (P1 > P2)  
Storage Temperature  
400  
-40° to +125°  
-40° to +125°  
0.5  
Operating Temperature  
TA  
°C  
Output Source Current @ Full Scale Output(2)  
Io+  
mAdc  
Output Sink Current @ Minimum Pressure Offset(2)  
Io-  
-0.5  
mAdc  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.  
MPXA6115A  
Sensors  
Freescale Semiconductor  
2
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)  
Characteristic  
Symbol  
POP  
Min  
15  
Typ  
—
Max  
115  
Unit  
kPa  
Vdc  
Pressure Range  
Supply Voltage(1)  
Supply Current  
VS  
4.75  
5.0  
5.25  
Io  
-
6.0  
10  
mAdc  
Vdc  
Minimum Pressure Offset(2)  
@ VS = 5.0 Volts  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
Voff  
0.133  
0.200  
0.268  
Full Scale Output(3)  
@ VS = 5.0 Volts  
VFSO  
VFSS  
—
4.633  
4.433  
—
4.700  
4.500  
—
4.768  
4.568  
1.5  
Vdc  
Vdc  
Full Scale Span(4)  
@ VS = 5.0 Volts  
Accuracy(5)  
Sensitivity  
%VFSS  
V/P  
tR  
—
—
45.9  
1.0  
—
—
mV/kPa  
ms  
Response Time(6)  
Warm-Up Time(7)  
Offset Stability(8)  
—
—
—
—
20  
—
—
ms  
0.25  
%VFSS  
1. Device is ratiometric within this specified excitation range.  
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span  
at 25°C due to all sources of error including the following:  
• Linearity:  
Output deviation from a straight line relationship with pressure over the specified pressure range.  
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to  
and from the minimum or maximum operating temperature points, with zero differential pressure applied.  
• Pressure Hysteresis:  
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum  
or maximum rated pressure at 25°C.  
• TcSpan:  
• TcOffset:  
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.  
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.  
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.  
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPXA6115A  
Sensors  
Freescale Semiconductor  
3
.
+5.0 V  
Fluoro Silicone  
Gel Die Coat  
Stainless  
Steel Cap  
Die  
P1  
VS Pin 2  
MPXA6115A  
MPXH6115A  
Vout Pin 4  
Wire Bond  
Thermoplastic  
Case  
to ADC  
100 nF  
Lead  
Frame  
47 pF  
51 K  
GND Pin 3  
Die Bond  
Absolute Element  
Sealed Vacuum Reference  
Figure 2. Cross Sectional Diagram SSOP (Not to Scale)  
Figure 3. Typical Application Circuit  
(Output Source Current Operation)  
5.0  
MAX  
Transfer Function:  
out = Vs* (.009*P-.095) ± Error  
VS = 5.0 Vdc  
4.5  
V
4.0  
TEMP = 0 to 85ºC  
3.5  
3.0  
2.5  
TYP  
2.0  
1.5  
1.0  
0.5  
0
MIN  
Pressure (ref: to sealed vacuum) in kPa  
Figure 4. Output versus Absolute Pressure  
Figure 2 illustrates the absolute sensing chip in the basic  
Super Small Outline chip carrier (Case 1317).  
Figure 3 shows a typical application circuit (output source  
current operation).  
A fluorosilicone gel isolates the die surface and wire bonds  
from the environment, while allowing the pressure signal to  
be transmitted to the silicon diaphragm. The MPXA6115A/  
MPXH6115A series pressure sensor operating  
Figure 4 shows the sensor output signal relative to  
pressure input. Typical minimum and maximum output  
curves are shown for operation over 0 to 85×C temperature  
range. The output will saturate outside of the rated pressure  
range.  
characteristics, internal reliability and qualification tests are  
based on use of dry air as the pressure media. Media other  
than dry air may have adverse effects on sensor performance  
and long-term reliability. Contact the factory for information  
regarding media compatibility in your application.  
MPXA6115A  
Sensors  
4
Freescale Semiconductor  
Transfer Function (MPXA6115A/MPXH6115A)  
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095)  
± (Pressure Error x Temp. Factor x 0.009 x VS)  
VS = 5.0 ± 0.25 Vdc  
Temperature Error Band  
MPXA6115A/MPXH6115A SERIES  
4.0  
3.0  
2.0  
1.0  
0.0  
Break Points  
Temp  
Multiplier  
- 40  
0 to 85  
125  
3
1
1.75  
Temperature  
Error  
Factor  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in Cº  
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC  
Pressure Error Band  
Error Limits for Pressure  
3.0  
2.0  
1.0  
0.0  
-1.0  
Pressure (in kPa)  
20  
40  
60  
80  
100  
120  
Pressure  
Error (Max)  
±1.5 (kPa)  
-2.0  
-3.0  
15 to 115 (kPa)  
MPXA6115A  
Sensors  
Freescale Semiconductor  
5
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES  
Surface mount board layout is a critical portion of the total  
design. The footprint for the semiconductor package must be  
the correct size to ensure proper solder connection interface  
between the board and the package. With the correct pad  
geometry, the packages will self-align when subjected to a  
solder reflow process. It is always recommended to fabricate  
boards with a solder mask layer to avoid bridging and/or  
shorting between solder pads, especially on tight tolerances  
and/or tight layouts.  
0.100 TYP  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
mm  
0.100 TYP 8X  
2.54  
Figure 5. SOP Footprint (Case 482)  
0.050  
0.387  
9.83  
1.27  
TYP  
0.150  
3.81  
0.027 TYP 8X  
0.69  
0.053 TYP 8X  
1.35  
inch  
mm  
Figure 6. SSOP Footprint (Case 1317 and 1317A)  
MPXA6115A  
Sensors  
6
Freescale Semiconductor  
PACKAGE DIMENSIONS  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
T
B
5
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
-B-  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
-A-  
D 8 PL  
4
1
M
S
S
A
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
0.25 (0.010)  
T
B
5
8
N
-B-  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
G
INCHES  
MIN MAX  
MILLIMETERS  
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
S
0.415 0.425  
0.415 0.425  
0.500 0.520  
0.038 0.042  
0.100 BSC  
W
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
V
0˚  
7˚  
C
0.444 0.448  
0.709 0.725  
0.245 0.255  
0.115 0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
S
V
W
H
J
-T-  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
7
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1317-04  
ISSUE F  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
8
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1317-04  
ISSUE F  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
9
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1317-04  
ISSUE F  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
10  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1317A-03  
ISSUE C  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
11  
Sensors  
Freescale Semiconductor  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1317A-03  
ISSUE C  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
12  
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© Freescale Semiconductor, Inc. 2007. All rights reserved.  
MPXA6115A  
Rev. 3  
01/2007  

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