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MPXA6115AC7U [FREESCALE]

High Temperature Accuracy Integrated Silicon Pressure Sensor; 高温度精度集成硅压力传感器
MPXA6115AC7U
型号： MPXA6115AC7U
厂家： Freescale    Freescale
描述：

High Temperature Accuracy Integrated Silicon Pressure Sensor
高温度精度集成硅压力传感器

传感器 换能器 压力传感器
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中文：  中文翻译
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Pressure  
MPXA6115A  
Rev 5, 10/2009  
Freescale Semiconductor  
High Temperature Accuracy  
Integrated Silicon Pressure Sensor  
for Measuring Absolute Pressure,  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
MPXA6115A  
MPXH6115A  
MPXHZ6115A  
Series  
15 to 115 kPa (2.2 to 16.7 psi)  
0.2 to 4.8 V Output  
Application Examples  
The MPXxx6115A series sensor integrates on-chip, bipolar op amp  
circuitry and thin film resistor networks to provide a high output signal and  
temperature compensation. The small form factor and high reliability of on-  
chip integration make the pressure sensor a logical and economical choice  
for the system designer.  
• Aviation Altimeters  
• Industrial Controls  
• Engine Control/Manifold Absolute  
Pressure (MAP)  
The MPXxx6115A series piezoresistive transducer is a state-of-the-art,  
monolithic, signal conditioned, silicon pressure sensor. This sensor combines  
advanced micromachining techniques, thin film metallization, and bipolar  
semiconductor processing to provide an accurate, high level analog output  
signal that is proportional to applied pressure.  
• Weather Station and Weather  
Reporting Device Barometers  
Features  
• Resistant to High Humidity and Common Automotive Media  
• Improved Accuracy at High Temperature  
• Available in Small and Super Small Outline Packages  
• 1.5% Maximum Error over 0° to 85°C  
• Ideally suited for Microprocessor or Microcontroller-Based Systems  
• Temperature Compensated from -40° to +125°C  
• Durable Thermoplastic (PPS) Surface Mount Package  
ORDERING INFORMATION  
# of Ports  
Single  
Pressure Type  
Differential  
Case  
No.  
Device  
Marking  
Device Name  
None  
Dual  
Gauge  
Absolute  
Small Outline Package (MPXA6115A Series)  
MPXA6115A6U  
MPXA6115A6T1  
MPXA6115AC6U  
MPXA6115AC6T1  
MPXA6115AC7U  
482  
482  
•
•
•
•
•
•
•
MPXA6115A  
MPXA6115A  
MPXA6115A  
MPXA6115A  
MPXA6115A  
482A  
482A  
482C  
•
•
•
Small Outline Package (Media Gel Resistant) (MPXAZ6115A Series)  
MPXAZ6115A6U  
MPXAZ6115AC6U  
MPXAZ6115AC6T1  
MPXAZ6115AP  
482  
•
•
•
•
•
•
MPXAZ6115A  
MPXAZ6115A  
MPXAZ6115A  
MPXAZ6115A  
MPXAZ6115A  
482A  
482A  
1369  
1369  
•
•
•
•
MPXAZ6115APT1  
Super Small Outline Package (MPXH6115A Series)  
MPXH6115A6U  
MPXH6115A6T1  
MPXH6115AC6U  
MPXH6115AC6T1  
1317  
1317  
•
•
•
•
•
•
MPXH6115A  
MPXH6115A  
MPXH6115A  
MPXH6115A  
1317A  
1317A  
•
•
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.  
Pressure  
ORDERING INFORMATION  
Small Outline Package (Media Gel Resistant) (MPXHZ6115A Series)  
MPXHZ6115A6U  
MPXHZ6115A6T1  
MPXHZ6115AC6U  
MPXHZ6115AC6T1  
1317  
1317  
•
•
•
•
•
•
MPXHZ6115A  
MPXHZ6115A  
MPXHZ6115A  
MPXHZ6115A  
1317A  
1317A  
•
•
SMALL OUTLINE PACKAGES  
MPXAZ6115AP/T1  
CASE 1369-01  
MPXA6115A6U/T1  
MPXAZ6115A6U  
CASE 482-01  
MPXA6115AC6U/T1  
MPXAZ6115AC6U/T1  
CASE 482A-01  
MPXA6115AC7U  
CASE 482C-03  
SUPER SMALL OUTLINE PACKAGES  
MPXH6115AC6U/T1  
MPXHZ6115AC6U/T1  
CASE 1317A-04  
MPXH6115A6U/T1  
MPXHZ6115A6U/T1  
CASE 1317-04  
MPXA6115A  
Sensors  
Freescale Semiconductor  
2
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)  
Characteristic  
Symbol  
POP  
Min  
15  
Typ  
—
Max  
Unit  
kPa  
Vdc  
Pressure Range  
115  
Supply Voltage(1)  
Supply Current  
VS  
4.75  
5.0  
5.25  
Io  
—
6.0  
10  
mAdc  
Vdc  
Minimum Pressure Offset(2)  
@ VS = 5.0 Volts  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
(0 to 85°C)  
Voff  
0.133  
0.200  
0.268  
Full Scale Output(3)  
@ VS = 5.0 Volts  
VFSO  
VFSS  
—
4.633  
4.433  
—
4.700  
4.500  
—
4.768  
4.568  
±1.5  
Vdc  
Vdc  
Full Scale Span(4)  
@ VS = 5.0 Volts  
Accuracy(5)  
Sensitivity  
%VFSS  
V/P  
tR  
—
—
45.9  
1.0  
—
—
mV/kPa  
ms  
Response Time(6)  
Warm-Up Time(7)  
Offset Stability(8)  
—
—
—
—
20  
—
—
ms  
±0.25  
%VFSS  
1. Device is ratiometric within this specified excitation range.  
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.  
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum rated pressure.  
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span  
at 25°C due to all sources of error including the following:  
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and  
from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or  
maximum rated pressure at 25°C.  
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.  
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.  
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a  
specified step change in pressure.  
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.  
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPXA6115A  
Sensors  
Freescale Semiconductor  
3
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Symbol  
Pmax  
Tstg  
Value  
400  
Units  
kPa  
°C  
Maximum Pressure (P1 > P2)  
Storage Temperature  
-40° to +125°  
-40° to +125°  
0.5  
Operating Temperature  
TA  
°C  
Output Source Current @ Full Scale Output(2)  
Io+  
mAdc  
Output Sink Current @ Minimum Pressure Offset(2)  
Io-  
-0.5  
mAdc  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.  
VS  
2
Thin Film  
Temperature  
Compensation  
and  
Gain Stage #1  
Gain Stage #2  
and Ground  
Reference  
Shift  
Sensing  
Element  
4
VOUT  
Circuitry  
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
GND  
Figure 1. Fully Integrated Pressure Sensor Schematic  
MPXA6115A  
Sensors  
Freescale Semiconductor  
4
Pressure  
On-chip Temperature Compensation and Calibration  
Figure 2 illustrates the absolute sensing chip in the basic  
Super Small Outline chip carrier (Case 1317).  
Figure 3 shows a typical application circuit (output source  
current operation).  
Figure 4 shows the sensor output signal relative to  
pressure input. Typical minimum and maximum output  
curves are shown for operation over 0° to 85°C temperature  
range. The output will saturate outside of the rated pressure  
range.  
A fluorosilicone gel isolates the die surface and wire bonds  
from the environment, while allowing the pressure signal to  
be transmitted to the silicon diaphragm. The MPXxx6115A  
series pressure sensor operating characteristics, internal  
reliability and qualification tests are based on use of dry air as  
the pressure media. Media other than dry air may have  
adverse effects on sensor performance and long-term  
reliability. Contact the factory for information regarding media  
compatibility in your application.  
Fluorosilicone  
Gel Die Coat  
Stainless  
Steel Cap  
Die  
P1  
Wire Bond  
Thermoplastic  
Case  
Lead  
Frame  
Die Bond  
Absolute Element  
Sealed Vacuum Reference  
Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)  
+5.0 V  
VS Pin 2  
MPXxx6115A  
to ADC  
100 nF  
Vout Pin 4  
47 pF  
51 K  
GND Pin 3  
Figure 3. Typical Application Circuit  
(Output Source Current Operation)  
5.0  
4.5  
Transfer Function:  
MAX  
V
V
out = Vs* (.009*P-.095) ± Error  
S = 5.0 Vdc  
4.0  
TEMP = 0 to 85ºC  
3.5  
3.0  
2.5  
TYP  
2.0  
1.5  
1.0  
0.5  
0
MIN  
Pressure (ref: to sealed vacuum) in kPa  
Figure 4. Output vs. Absolute Pressure  
MPXA6115A  
Sensors  
Freescale Semiconductor  
5
Pressure  
Transfer Function (MPXxx6115A)  
Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095)  
± (Pressure Error x Temp. Factor x 0.009 x VS)  
VS = 5.0 ± 0.25 Vdc  
Temperature Error Band  
MPXxxA6115A SERIES  
4.0  
3.0  
2.0  
1.0  
0.0  
Break Points  
Temp  
Multiplier  
- 40  
0 to 85  
125  
3
1
1.75  
Temperature  
Error  
Factor  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
Temperature in Cº  
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC  
Pressure Error Band  
Error Limits for Pressure  
3.0  
2.0  
1.0  
0.0  
-1.0  
Pressure (in kPa)  
20  
40  
60  
80  
100  
120  
Pressure  
Error (Max)  
±1.5 (kPa)  
-2.0  
-3.0  
15 to 115 (kPa)  
MPXA6115A  
Sensors  
Freescale Semiconductor  
6
Pressure  
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES  
Surface mount board layout is a critical portion of the total  
design. The footprint for the semiconductor package must be  
the correct size to ensure proper solder connection interface  
between the board and the package. With the correct pad  
geometry, the packages will self-align when subjected to a  
solder reflow process. It is always recommended to fabricate  
boards with a solder mask layer to avoid bridging and/or  
shorting between solder pads, especially on tight tolerances  
and/or tight layouts.  
0.100 TYP  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
mm  
0.100 TYP 8X  
2.54  
Figure 5. SOP Footprint (Case 482)  
0.050  
0.387  
9.83  
1.27  
TYP  
0.150  
3.81  
0.027 TYP 8X  
0.69  
0.053 TYP 8X  
1.35  
inch  
mm  
Figure 6. SSOP Footprint (Case 1317 and 1317A)  
MPXA6115A  
Sensors  
Freescale Semiconductor  
7
Pressure  
PACKAGE DIMENSIONS  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
T
B
5
-B-  
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
-A-  
D
8 PL  
4
1
M
S
S
A
NOTES:  
0.25 (0.010)  
T
B
5
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
N
-B-  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
G
8
INCHES  
MIN MAX  
MILLIMETERS  
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
S
0.415 0.425  
0.415 0.425  
0.500 0.520  
0.038 0.042  
0.100 BSC  
W
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
V
0˚  
7˚  
C
0.444 0.448  
0.709 0.725  
0.245 0.255  
0.115 0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
S
V
W
H
J
-T-  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
8
Pressure  
PACKAGE DIMENSIONS  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4
5
8
N
–B–  
D 8 PL  
G
M
S
S
INCHES  
MILLIMETERS  
0.25 (0.010)  
T
B
A
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.034  
MIN  
10.54  
10.54  
12.70  
0.66  
MAX  
10.79  
10.79  
13.21  
0.864  
0.415  
0.415  
0.500  
0.026  
DETAIL X  
S
W
G
J
K
M
N
S
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0
0.011  
0.120  
15  
0.23  
2.54  
0
0.28  
3.05  
15  
PIN 1  
IDENTIFIER  
V
0.444  
0.540  
0.245  
0.115  
0.448  
0.560  
0.255  
0.125  
11.28  
13.72  
6.22  
2.92  
11.38  
14.22  
6.48  
3.17  
C
V
W
SEATING  
PLANE  
–T–  
K
M
J
DETAIL X  
CASE 482C-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
9
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXA6115A  
10  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
11  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1317-04  
ISSUE F  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
12  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1317-04  
ISSUE F  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
13  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1317-04  
ISSUE F  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
14  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1317A-04  
ISSUE D  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
Sensors  
Freescale Semiconductor  
15  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1317A-04  
ISSUE D  
SUPER SMALL OUTLINE PACKAGE  
MPXA6115A  
16  
Sensors  
Freescale Semiconductor  
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© Freescale Semiconductor, Inc. 2009. All rights reserved.  
MPXA6115A  
Rev. 5  
11/2009  

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