SSF11NS65U_15 [GOOD-ARK]

650V N-Channel MOSFET;
SSF11NS65U_15
型号: SSF11NS65U_15
厂家: GOOD-ARK ELECTRONICS    GOOD-ARK ELECTRONICS
描述:

650V N-Channel MOSFET

文件: 总7页 (文件大小:1149K)
中文:  中文翻译
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SSF11NS65U  
650V N-Channel MOSFET  
Main Product Characteristics  
VDSS  
RDS(on)  
ID  
650V  
0.32Ω (typ.)  
11A  
MarkingandPin  
SchematicDiagram  
Assignment  
TO-220  
Features and Benefits  
High dv/dt and avalanche capabilities  
100% avalanche tested  
Low input capacitance and gate charge  
Low gate input resistance  
Lead free product  
Description  
The SSF11NS65U series MOSFET is a new technology, which combines an innovative super junction  
technology and advance process. This new technology achieves low RDS (ON), energy saving, high  
reliability and uniformity, superior power density and space saving.  
Absolute Max Rating  
Symbol  
Parameter  
Max.  
11  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V①  
Continuous Drain Current, VGS @ 10V①  
Pulsed Drain Current②  
A
7
44  
83  
W
W/°C  
V
Power Dissipation③  
PD @TC = 25°C  
Linear Derating Factor  
0.66  
650  
VDS  
Drain-Source Voltage  
VGS  
Gate-to-Source Voltage  
± 30  
250  
V
EAS  
Single Pulse Avalanche Energy @ L=133mH  
Avalanche Current @ L=133mH  
Operating Junction and Storage Temperature Range  
mJ  
A
IAS  
1.94  
-55 to +150  
TJ TSTG  
°C  
www.goodark.com  
Page 1 of 7  
Rev.1.2  
SSF11NS65U  
650V N-Channel MOSFET  
Thermal Resistance  
Symbol  
RθJC  
Characteristics  
Typ.  
Max.  
1.5  
Units  
/W  
/W  
Junction-to-case③  
RθJA  
62  
Junction-to-ambient (t ≤ 10s) ④  
Electrical Characteristics @TA=25unless otherwise specified  
Symbol Parameter  
Min.  
650  
2
Typ.  
Max.  
Units  
Conditions  
V(BR)DSS Drain-to-Source breakdown voltage  
V
VGS = 0V, ID = 1mA  
VGS=10V,ID = 3.2A  
TJ = 125°C  
0.32  
0.72  
0.38  
RDS(on)  
VGS(th)  
IDSS  
Static Drain-to-Source on-resistance  
Gate threshold voltage  
Ω
V
4
VDS = VGS, ID = 0.32mA  
TJ = 125°C  
2.1  
1
VDS =650V,VGS = 0V  
TJ = 125°C  
Drain-to-Source leakage current  
Gate-to-Source forward leakage  
μA  
nA  
50  
100  
-100  
VGS =30V  
IGSS  
VGS = -30V  
Qg  
Total gate charge  
Gate-to-Source charge  
Gate-to-Drain("Miller") charge  
Turn-on delay time  
Rise time  
22  
4.3  
8
ID= 6A,  
nC  
ns  
VDS= 200V,  
Qgs  
Qgd  
td(on)  
tr  
VGS = 10V  
11  
6
VGS=10V, VDS=400V,  
RL=81.6Ω,RGEN=3.4Ω  
ID=4.9A  
td(off)  
tf  
Turn-Off delay time  
Fall time  
29  
6
Ciss  
Coss  
Crss  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
804  
34  
3.4  
VGS = 0V  
pF  
VDS = 100V  
ƒ = 600KHz  
Source-Drain Ratings and Characteristics  
Symbol  
Parameter  
Continuous Source Current  
(Body Diode)  
Min.  
Typ.  
Max.  
Units  
Conditions  
MOSFET symbol  
showing the  
IS  
11  
A
integral reverse  
p-n junction diode.  
Pulsed Source Current  
(Body Diode)  
ISM  
44  
A
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
0.82  
247  
1.2  
V
IS=4.9A, VGS=0V  
ns  
μC  
TJ = 25°C, IF =11A,  
di/dt = 100A/μs  
Qrr  
2.46  
www.goodark.com  
Page 2 of 7  
Rev.1.2  
SSF11NS65U  
650V N-Channel MOSFET  
Test Circuits and Waveforms  
Switch Waveforms:  
Notes:  
Calculated continuous current based on maximum allowable junction temperature.  
Repetitive rating; pulse width limited by max. junction temperature.  
The power dissipation PD is based on max. junction temperature, using junction-to-case thermal  
resistance.  
The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a  
still air environment with TA =25°C  
www.goodark.com  
Page 3 of 7  
Rev.1.2  
SSF11NS65U  
650V N-Channel MOSFET  
Typical Electrical and Thermal Characteristics  
Figure 2. Gate to source cut-off voltage  
Figure 1: Typical Output Characteristics  
Figure 3. Drain-to-Source Breakdown Voltage Vs.  
Case Temperature  
Figure 4: Normalized On-Resistance Vs. Case  
Temperature  
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Page 4 of 7  
Rev.1.2  
SSF11NS65U  
650V N-Channel MOSFET  
Typical Electrical and Thermal Characteristics  
Figure 5. Maximum Drain Current Vs. Case  
Temperature  
Figure 6. Typical Capacitance Vs. Drain-to-Source  
Voltage  
Figure7. Drain-to-Source Voltage Vs. Gate-to-Source Voltage  
Figure8. Maximum Effective Transient Thermal Impedance,  
Junction-to-Case  
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Page 5 of 7  
Rev.1.2  
SSF11NS65U  
650V N-Channel MOSFET  
Mechanical Data  
TO220 PACKAGE OUTLINE DIMENSION_GN  
Dimension In Millimeters  
Dimension In Inches  
Symbol  
Min  
Nom  
4.550  
1.300  
2.340  
1.270  
1.370  
0.800  
0.500  
15.400  
8.900  
2.800  
10.000  
8.700  
3.600  
Max  
Min  
0.173  
0.050  
0.088  
-
0.050  
0.030  
0.019  
0.594  
0.346  
0.107  
0.390  
-
Nom  
0.179  
0.051  
0.092  
0.050  
0.054  
0.031  
0.020  
0.606  
0.350  
0.110  
0.394  
0.343  
0.142  
Max  
0.185  
0.052  
0.096  
-
0.058  
0.033  
0.021  
0.618  
0.354  
0.113  
0.398  
-
A
A1  
A2  
b
b1  
b2  
C
4.400  
1.270  
2.240  
-
1.270  
0.750  
0.480  
15.100  
8.800  
2.730  
9.900  
-
4.700  
1.330  
2.440  
-
1.470  
0.850  
0.520  
15.700  
9.000  
2.870  
10.100  
-
D
D1  
D2  
E
E1  
ФP  
3.570  
1.400  
3.630  
1.600  
0.141  
0.143  
ФP1  
1.500  
0.055  
0.059  
0.1BSC  
0.2BSC  
0.526  
0.063  
2.54BSC  
5.08BSC  
13.360  
e
e1  
L
13.150  
13.570  
0.518  
0.534  
L1  
L2  
7.35REF  
0.29REF  
2.900  
1.650  
0.900  
50  
50  
50  
3.000  
1.750  
1.000  
70  
70  
70  
3.100  
1.850  
1.100  
90  
90  
90  
0.114  
0.065  
0.035  
50  
50  
50  
0.118  
0.069  
0.039  
70  
70  
70  
0.122  
0.073  
0.043  
90  
90  
90  
L3  
L4  
Q 1  
Q 2  
Q 3  
Q 4  
10  
30  
50  
10  
30  
50  
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Page 6 of 7  
Rev.1.2  
SSF11NS65U  
650V N-Channel MOSFET  
Ordering and Marking Information  
Device Marking: SSF11NS65U  
Package (Available)  
TO-220  
Operating Temperature Range  
C : -55 to 150 ºC  
Devices per Unit  
Package Units/ Tubes/Inner  
Units/Inner Inner  
Units/Carton  
Type  
Tube  
Box  
Box  
Boxes/Carton Box  
Box  
TO-220  
50  
20  
1000  
6
6000  
Reliability Test Program  
Test Item  
High  
Conditions  
Tj=125to 150@  
Duration Sample Size  
168 hours  
500 hours  
1000 hours  
3 lots x 77 devices  
Temperature  
Reverse  
80% of Max  
V
DSS/VCES/VR  
Bias(HTRB)  
High  
Tj=150@ 100% of  
168 hours  
500 hours  
1000 hours  
3 lots x 77 devices  
Temperature  
Gate  
Max VGSS  
Bias(HTGB)  
www.goodark.com  
Page 7 of 7  
Rev.1.2  

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