HJ50 [HSMC]
NPN EPITAXIAL PLANAR TRANSISTOR; NPN外延平面晶体管
| 型号： | HJ50 |
| 厂家： | 
HI-SINCERITY MOCROELECTRONICS |
| 描述： | NPN EPITAXIAL PLANAR TRANSISTOR |
| 文件： | 总3页 (文件大小：34K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : HE6016
Issued Date : 1996.04.12
Revised Date : 2002.02.26
Page No. : 1/3
HI-SINCERITY
MICROELECTRONICS CORP.
HJ50
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HJ50 is designed for line operated audio output amplifier switch
mode power supply drivers and other switching applications.
TO-252
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ..................................................................................... 15 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 500 V
BVCEO Collector to Emitter Voltage.................................................................................. 400 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current .............................................................................................................. 1 A
Characteristics (Ta=25°C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
BVCEO
BVEBO
ICES
ICEO
IEBO
*VCE(sat)
*VBE(on)
*hFE1
*hFE2
fT
500
400
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
uA
uA
mA
V
IC=1mA
IC=30mA
IC=100uA
VCE=500V
VCE=300V
100
200
1
VEB=5V
1
IC=1A, IB=0.2A
VCE=10V, IC=1A
VCE=10V, IC=0.3A
VCE=10V, IC=1A
VCE=10V, IC=200mA, f=2MHz
1.5
150
-
V
30
10
10
-
MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HJ50
HSMC Product Specification
Spec. No. : HE6016
Issued Date : 1996.04.12
Revised Date : 2002.02.26
Page No. : 2/3
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
1000
CE
CE(sat)
V
C
B
hFE @ V =10V
@ I =5I
125oC
25oC
100
100
75oC
125oC
25oC
75oC
10
10
1
10
100
1000
1
10
100
1000
C
C
Collector Current-I (mA)
Collector Current-I (mA)
ON Voltage & Collector Current
Switching Time & Collector Current
10.0
1000
CC
V
C
B1
B2
=30V, I =10I =-10I
25oC
75oC
125oC
1.0
Tstg
BE(ON)
V
CE
@ V =10V
Ton
Tf
100
0.1
1
10
100
1000
0.1
1.0
10.0
C
Collector Current-I (mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
Safe Operating Area
100
10000
1000
100
10
Cob
T
P =1ms
10
T
P =100ms
T
P =1s
1
1
1
10
100
CE
1000
0.1
1
10
100
Forward Voltage-V (V)
Reverse-Biased Voltage (V)
HJ50
HSMC Product Specification
Spec. No. : HE6016
Issued Date : 1996.04.12
Revised Date : 2002.02.26
Page No. : 3/3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Marking:
A
C
H
J
5 0
D
B
Date Code
Control Code
L
F
G
Style: Pin 1.Base 2.Collector 3.Emitter
3
2
H
E
K
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code: J
*: Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.0866 0.1102
Millimeters
DIM
DIM
Min.
Max.
0.55
1.95
1.50
0.60
6.80
5.80
Min.
Max.
2.80
*2.30
0.90
0.80
5.50
1.60
A
B
C
D
E
F
0.0177 0.0217
0.0650 0.0768
0.0354 0.0591
0.0177 0.0236
0.2520 0.2677
0.2125 0.2283
0.45
1.65
0.90
0.45
6.40
5.40
G
H
I
J
K
L
2.20
-
-
-
*0.0906
0.0354
0.0315
-
-
-
0.2047 0.2165
0.0551 0.0630
5.20
1.40
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ50
HSMC Product Specification
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