HM5401 [HSMC]
NPN EPITAXIAL PLANAR TRANSISTOR; NPN外延平面晶体管
| 型号： | HM5401 |
| 厂家： | 
HI-SINCERITY MOCROELECTRONICS |
| 描述： | NPN EPITAXIAL PLANAR TRANSISTOR |
| 文件： | 总4页 (文件大小：38K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 1/4
HI-SINCERITY
MICROELECTRONICS CORP.
HM5401
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HM5401 is designed for general purpose applications requiring
high breakdown voltages.
SOT-89
Features
• High current-emitter breakdown voltage.VCEO=150V(@IC=1mA)
• Complements to NPN type HM5551
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)....................................................................................... 1 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ...................................................................................... -160 V
VCES Collector to Emitter Voltage ................................................................................... -150 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ...................................................................................................... -600 mA
Characteristics (Ta=25°C)
Symbol
Min.
Max.
Unit
Test Conditions
BVCBO
BVCEO
BVEBO
ICBO
-160
-150
-5
-
-
-
-
-
V
V
V
nA
nA
V
V
V
V
IC=-100uA
IC=-1mA
IE=-10uA
VCB=-120V
VEB=-5V
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
VCE=-5V, IC=-1mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-50mA
VCE=-10V, IC=-10mA, f=100MHz
VCB=-10V, f=1MHz
-50
-50
-0.2
-0.5
-1
-1
-
240
-
-
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
*hFE1
-
-
-
-
50
60
50
100
-
*hFE2
*hFE3
fT
Cob
MHz
pF
6
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HM5401
HSMC Product Specification
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 2/4
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
100
10
100000
10000
1000
100
CE(sat)
V
C
B
@ I =10I
125oC
75oC
25oC
75oC
125oC
25oC
CE
hFE @ V =5V
1
10
1
10
100
1000
0.1
1
10
Collector Current-I (mA)
100
1000
C
Collector Current-I (mA)
C
Saturation Voltage & Collector Current
Capacitance & Reverse-Biased Voltage
1000
100
25oC
75oC
125oC
10
BE(sat)
V
C
B
@ I =10I
Cob
100
1
0.1
1
10
Collector Current-I (mA)
100
1000
0.1
1
10
100
C
Reverse Biased Voltage (V)
Cutoff Frequency & Collector Current
Safe Operating Area
10000
1000
100
10
1000
T
P =1ms
T
P =100ms
T
P =1s
CE
=10V
V
100
1
10
1
10
100
1
10
100
1000
CE
Forward Biased Voltage-V (V)
Collector Current (mA)
HM5401
HSMC Product Specification
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 3/4
HI-SINCERITY
MICROELECTRONICS CORP.
PD - Tc
PD - Ta
6
5
4
3
2
1
0
1.2
1
0.8
0.6
0.4
0.2
0
0
50
100
Temperature-T ( C )
150
200
0
50
100
Temperature-T ( C )
150
200
o
o
C
a
HM5401
HSMC Product Specification
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 4/4
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking:
C
2
H
Date Code
H M
5 4 0 1
Laser Marking
D
B
1
3
Style: Pin 1.Base 2.Collector 3.Emitter
I
E
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
*: Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.0583 0.0598
0.1165 0.1197
0.0551 0.0630
0.0138 0.0161
Millimeters
DIM
DIM
Min.
4.40
4.05
1.50
2.40
0.36
Max.
4.60
4.25
1.70
2.60
0.51
Min.
1.48
2.96
1.40
0.35
Max.
1.52
3.04
1.60
0.41
A
B
C
D
E
0.1732 0.1811
0.1594 0.1673
0.0591 0.0663
0.0945 0.1024
0.0141 0.0201
F
G
H
I
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
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HSMC Product Specification
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