H5TC2G83GFR-H9A [HYNIX]
DDR DRAM, 256MX8, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-78;型号: | H5TC2G83GFR-H9A |
厂家: | HYNIX SEMICONDUCTOR |
描述: | DDR DRAM, 256MX8, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FPBGA-78 动态存储器 双倍数据速率 内存集成电路 |
文件: | 总34页 (文件大小:446K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2Gb DDR3L SDRAM
2Gb DDR3L SDRAM
Lead-Free&Halogen-Free
(RoHS Compliant)
H5TC2G83GFR-xxA
H5TC2G83GFR-xxI
H5TC2G83GFR-xxL
H5TC2G83GFR-xxJ
H5TC2G63GFR-xxA
H5TC2G63GFR-xxI
H5TC2G63GFR-xxL
H5TC2G63GFR-xxJ
* SK Hynix reserves the right to change products or specifications without notice.
Rev. 1.3 / Nov. 2015
1
Revision History
Revision No.
History
Draft Date
Mar. 2015
June. 2015
July. 2015
Oct. 2015
Nov. 2015
Remark
Preliminary
Page 25
0.1
1.0
1.1
1.2
1.3
Preliminary version release
IDD update
Operating NOTE update
IDD update
Page 4
Page 25 - IDD3N x16
Page 4
Typo Correct
Rev. 1.3 / Nov. 2015
2
Description
The H5TC2G83GFR-xxA(I,L,J) and H5TC2G63GFR-xxA(I,L,J) are a 2Gb low power Double Data Rate III
(DDR3L) Synchronous DRAM, ideally suited for the main memory applications which requires large mem-
ory density, high bandwidth and low power operation at 1.35V. SK Hynix DDR3L SDRAM provides back-
ward compatibility with the 1.5V DDR3 based environment without any changes. SK Hynix 2Gb DDR3L
SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While
all addresses and control inputs are latched on the rising edges of the clock (falling edges of the clock),
data, data strobes and write data masks inputs are sampled on both rising and falling edges of it. The data
paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.
Device Features and Ordering Information
FEATURES
• VDD=VDDQ=1.35V + 0.100 / - 0.067V
• Fully differential clock inputs (CK, CK) operation
• Differential Data Strobe (DQS, DQS)
• BL switch on the fly
• 8banks
• AverageRefreshCycle (Tcaseof0 oC~95oC)
- 7.8 µs at 0oC ~ 85 oC
- 3.9 µs at 85oC ~ 95 oC
• On chip DLL align DQ, DQS and DQS transition with CK
transition
Commerical Temperature (0oC ~ 95 oC)
Industrial Temperature(-40oC ~ 95 oC)
• DM masks write data-in at the both rising and falling
edges of the data strobe
• All addresses and control inputs except data,
data strobes and data masks latched on the
rising edges of the clock
• JEDEC standard 78ball FBGA(x8), 96ball FBGA(x16)
• Driver strength selected by EMRS
• Dynamic On Die Termination supported
• Asynchronous RESET pin supported
• ZQ calibration supported
• Programmable CAS latency 6, 7, 8, 9, 10, 11, 12 and
13
supported
• Programmable additive latency 0, CL-1, and CL-2
supported
• TDQS (Termination Data Strobe) supported (x8 only)
• Write Levelization supported
• Programmable CAS Write latency (CWL) = 5, 6, 7, 8
and 9
• 8 bit pre-fetch
• Programmable burst length 4/8 with both nibble
sequential and interleave mode
* This product in compliance with the RoHS directive.
Rev. 1.3 / Nov. 2015
3
ORDERING INFORMATION
Part No.
Configuration
Power Consumption
Temperature
Package
H5TC2G83GFR-*xxA
H5TC2G83GFR-*xxI
H5TC2G83GFR-*xxL
H5TC2G83GFR-*xxJ
H5TC2G63GFR-*xxA
H5TC2G63GFR-*xxI
H5TC2G63GFR-*xxL
H5TC2G63GFR-*xxJ
Commercial
Industrial
Normal Consumption
256M x 8
78ball FBGA
Commercial
Industrial
Low Power Consumption
(IDD6 Only)
Commercial
Industrial
Normal Consumption
128M x 16
96ball FBGA
Commercial
Industrial
Low Power Consumption
(IDD6 Only)
* xx means Speed Bin Grade
OPERATING FREQUENCY
Frequency [Mbps]
CL5 CL6 CL7 CL8 CL9 CL10 CL11 CL12 CL13 CL14
Speed
Grade
(Marking)
Remark
(CL-tRCD-tRP)
-G7*
-H9*
-PB*
-RD
667
667
667
800 1066 1066
DDR3L-1066 7-7-7
800 1066 1066 1333 1333
800 1066 1066 1333 1333
800 1066 1066 1333 1333
DDR3L-1333 9-9-9
1600
1600
DDR3L-1600 11-11-11
DDR3L-1866 13-13-13
1866
*Note1: -RD covers lower speed of -PB and -H9 and -G7.
Rev. 1.3 / Nov. 2015
4
x8 Package Ball out (Top view): 78ball FBGA Package
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
VSS
VSS
VDD
VSSQ
DQ2
DQ6
VDDQ
VSS
VDD
CS
NC
DQ0
DQS
DQS
DQ4
RAS
CAS
WE
NU/TDQS
DM/TDQS
DQ1
VSS
VSSQ
DQ3
VSS
DQ5
VSS
VDD
ZQ
VDD
VDDQ
VSSQ
VSSQ
VDDQ
NC
A
B
C
D
E
F
VDDQ
VSSQ
VREFDQ
NC
VDD
DQ7
CK
G
H
J
ODT
NC
CK
CKE
NC
G
H
J
A10/AP
NC
VSS
BA0
A3
BA2
A0
VREFCA
BA1
A4
VSS
K
L
VDD
VSS
A12/BC
A1
VDD
VSS
K
L
A5
A2
M
N
VDD
VSS
A7
A9
A11
A6
VDD
VSS
M
N
RESET
A13
A14
A8
1
2
3
4
5
6
7
8
9
1
2
3
7
8
9
A
B
C
D
E
(Top View: See the balls through the Package)
F
Populated ball
Ball not populated
G
H
J
K
L
M
N
Rev. 1.3 / Nov. 2015
5
x16 Package Ball out (Top view): 96ball FBGA Package
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
VDDQ
VSSQ
VDDQ
VSSQ
VSS
DQU5
VDD
DQU3
VDDQ
VSSQ
DQL2
DQL6
VDDQ
VSS
DQU7
VSS
DQU1
DMU
DQL0
DQSL
DQSL
DQL4
RAS
CAS
WE
DQU4
DQSU
DQSU
DQU0
DML
DQL1
VDD
VDDQ
DQU6
DQU2
VSSQ
VSSQ
DQL3
VSS
VSS
VSSQ
VDDQ
VDD
VDDQ
VSSQ
VSSQ
VDDQ
NC
A
B
C
D
E
F
VDDQ
VSSQ
VREFDQ
NC
G
H
J
G
H
J
DQL7
CK
DQL5
VSS
K
L
ODT
VDD
CS
CK
VDD
CKE
NC
K
L
NC
A10/AP
NC
ZQ
M
N
P
R
T
VSS
BA0
BA2
A0
VREFCA
BA1
VSS
M
N
P
R
T
VDD
A3
A12/BC
A1
VDD
VSS
VSS
A5
A2
A4
VDD
A7
A9
A11
A6
VDD
VSS
VSS
RESET
A13
NC
A8
1
2
3
4
5
6
7
8
9
Rev. 1.3 / Nov. 2015
6
1
2 3
7
8 9
A
B
C
D
E
F
G
H
J
(Top View: See the balls through the Package)
Populated ball
Ball not populated
K
L
M
N
P
R
T
Pin Functional Description
Symbol
Type
Function
Clock: CK and CK are differential clock inputs. All address and control input signals are
sampled on the crossing of the positive edge of CK and negative edge of CK.
CK, CK
Input
Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and
device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down
and Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any
bank).
CKE, (CKE0),
(CKE1)
Input CKE is asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable
during the power on and initialization sequence, they must be maintained during all
operations (including Self-Refresh). CKE must be maintained high throughout read and
write accesses. Input buffers, excluding CK, CK, ODT and CKE, are disabled during power-
down. Input buffers, excluding CKE, are disabled during Self-Refresh.
Chip Select: All commands are masked when CS is registered HIGH.
CS provides for external Rank selection on systems with multiple Ranks.
CS is considered part of the command code.
CS, (CS0),
(CS1), (CS2),
(CS3)
Input
Rev. 1.3 / Nov. 2015
7
Symbol
Type
Function
On Die Termination: ODT (registered HIGH) enables termination resistance internal to the
DDR3L SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS,
NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x4/x8
configurations. For x16 configuration, ODT is applied to each DQ, DQSU, DQSU, DQSL,
DQSL, DMU, and DML signal. The ODT pin will be ignored if MR1 is programmed to disable
ODT.
ODT, (ODT0),
(ODT1)
Input
Command Inputs: RAS, CAS and WE (along with CS) define the command being entered.
RAS.
CAS. WE
Input
Input
Input Data Mask: DM is an input mask signal for write data. Input data is masked when
DM is sampled HIGH coincident with that input data during a Write access. DM is sampled
on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS is enabled by
Mode Register A11 setting in MR1.
DM, (DMU),
(DML)
Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write or Precharge
BA0 - BA2
A0 - A15
Input command is being applied. Bank address also determines if the mode register or extended
mode register is to be accessed during a MRS cycle.
Address Inputs: Provide the row address for Active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective
bank. (A10/AP and A12/BC have additional functions, see below).
Input
The address inputs also provide the op-code during Mode Register Set commands.
Auto-precharge: A10 is sampled during Read/Write commands to determine whether
Autoprecharge should be performed to the accessed bank after the Read/Write operation.
(HIGH: Autoprecharge; LOW: no Autoprecharge).A10 is sampled during a Precharge
command to determine whether the Precharge applies to one bank (A10 LOW) or all
banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank
addresses.
A10 / AP
A12 / BC
Input
Burst Chop: A12 / BC is sampled during Read and Write commands to determine if burst
Input chop (on-the-fly) will be performed.
(HIGH, no burst chop; LOW: burst chopped). See command truth table for details.
Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when
RESET is HIGH. RESET must be HIGH during normal operation.
RESET is a CMOS rail-to-rail signal with DC high and low at 80% and 20% of VDD, i.e.
1.20V for DC high and 0.30V for DC low.
RESET
DQ
Input
Input /
Data Input/ Output: Bi-directional data bus.
Output
Data Strobe: output with read data, input with write data. Edge-aligned with read data,
centered in write data. The data strobe DQS, DQSL, and DQSU are paired with differential
signals DQS, DQSL, and DQSU, respectively, to provide differential pair signaling to the
system during reads and writes. DDR3L SDRAM supports differential data strobe only and
does not support single-ended.
DQU, DQL,
DQS, DQS,
DQSU, DQSU, Output
DQSL, DQSL
Input /
Rev. 1.3 / Nov. 2015
8
Symbol
Type
Function
Termination Data Strobe: TDQS/TDQS is applicable for x8 DRAMs only. When enabled via
Mode Register A11 = 1 in MR1, the DRAM will enable the same termination resistance
TDQS, TDQS Output function on TDQS/TDQS that is applied to DQS/DQS. When disabled via mode register A11
= 0 in MR1, DM/TDQS will provide the data mask function and TDQS is not used. x4
DRAMs must disable the TDQS function via mode register A11 = 0 in MR1.
NC
NF
No Connect: No internal electrical connection is present.
No Function
VDDQ
VSSQ
VDD
Supply DQ Power Supply: 1.35 V +0.100/-0.067V
Supply
Supply
Supply
Supply
Supply
Supply
DQ Ground
Power Supply: 1.35 V +0.100/-0.067V
Ground
VSS
Reference voltage for DQ
Reference voltage for CA
Reference Pin for ZQ calibration
VREFDQ
VREFCA
ZQ
Note:
Input only pins (BA0-BA2, A0-A15, RAS, CAS, WE, CS, CKE, ODT, DM, and RESET) do not supply termination.
ROW AND COLUMN ADDRESS TABLE
2Gb
Configuration
# of Banks
256Mb x 8
128Mb x 16
8
8
Bank Address
Auto precharge
BL switch on the fly
Row Address
Column Address
Page size 1
BA0 - BA2
A10/AP
A12/BC
A0 - A14
A0 - A9
1 KB
BA0 - BA2
A10/AP
A12/BC
A0 - A13
A0 - A9
2 KB
Rev. 1.3 / Nov. 2015
9
Note1: Page size is the number of bytes of data delivered from the array to the internal sense amplifiers
when an ACTIVE command is registered. Page size is per bank, calculated as follows:
page size = 2 COLBITS * ORG 8
where COLBITS = the number of column address bits, ORG = the number of I/O (DQ) bits
Absolute Maximum Ratings
Absolute Maximum DC Ratings
Absolute Maximum DC Ratings
Symbol
Parameter
Voltage on VDD pin relative to Vss
Voltage on VDDQ pin relative to Vss
Voltage on any pin relative to Vss
Storage Temperature
Rating
Units
Notes
VDD
- 0.4 V ~ 1.80 V
V
1,3
VDDQ
VIN, VOUT
TSTG
- 0.4 V ~ 1.80 V
- 0.4 V ~ 1.80 V
-55 to +100
V
1,3
1
V
oC
1, 2
Rev. 1.3 / Nov. 2015
10
Absolute Maximum DC Ratings
Notes:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rat-
ing conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement
conditions, please refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300mV of each other at all times; and VREF must not be greater than
0.6XVDDQ,When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV.
DRAM Component Operating Temperature Range
Temperature Range
Symbol
Parameter
Normal Operating Temperature Range
Extended Temperature Range
Rating
0 to 85
85 to 95
Units
oC
oC
Notes
1,2
1,4
TOPER
-40 to 95
oC
1,3,4
Industrial Temperature Range
Notes:
1. Operating Temperature TOPER is the case surface temperature on the center / top side of the DRAM. For mea-
surement conditions, please refer to the JEDEC document JESD51-2.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. Dur-
ing operation, the DRAM case temperature must be maintained between 0 - 85oC under all operating conditions.
3. The Industrial Temperature Range specifies the temperatures where all DRAM specifications will be supported.
During operation, the DRAM case temperature must be maintained between -40 - 85oC under all operating condi-
tions.
4. Some applications require operation of the DRAM in the Extended Temperature Range between 85oC and 95oC
case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply:
a. Refresh commands must be doubled in frequency, therefore reducing the Refresh interval tREFI to 3.9 µs.
b. If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to use the Man-
ual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0b and MR2 A7 = 1b).
AC & DC Operating Conditions
Recommended DC Operating Conditions
Recommended DC Operating Conditions - DDR3L (1.35V) operation
Rating
Symbol
Parameter
Units
Notes
Min.
Typ.
Max.
VDD
1.283
1.35
1.45
V
1,2,3,4
Supply Voltage
Rev. 1.3 / Nov. 2015
11
VDDQ
Notes:
1.283
1.35
1.45
V
1,2,3,4
Supply Voltage for Output
1. Maximum DC value may not be greater than 1.425V. The DC value is the linear average of VDD/VDDQ (t) over a
very long period of time (e.g., 1 sec).
2. If maximum limit is exceeded, input levels shall be governed by DDR3 specifications.
3. Under these supply voltages, the device operates to this DDR3L specification.
4. Once initialized for DDR3L operation, DDR3 operation may only be used if the device is in reset while VDD and
VDDQ are changed for DDR3 operation (see Figure 0).
Recommended DC Operating Conditions - DDR3 (1.5V) operation
Rating
Symbol
Parameter
Units
Notes
Min.
Typ.
Max.
VDD
1.425
1.5
1.575
V
V
1,2,3
1,2,3
Supply Voltage
Supply Voltage for Output
VDDQ
1.425
1.5
1.575
Notes:
1. If minimum limit is exceeded, input levels shall be governed by DDR3L specifications.
2. Under 1.5V operation, this DDR3L device operates to the DDR3 specifications under the same speed timings as
defined for this device.
3. Once initialized for DDR3 operation, DDR3L operation may only be used if the device is in reset while VDD and
VDDQ are changed for DDR3L operation (see Figure 0).
Rev. 1.3 / Nov. 2015
12
Ta
Tb
Tc
Td
Te
Tf
Tg
Th
Ti
Tj
Tk
CK,CK#
tCKSRX
Tmin = 10ns
VDD, VDDQ (DDR3)
VDD, VDDQ (DDR3L)
Tmin = 10ns
Tmin = 200us
T = 500us
RESET#
Tmin = 10ns
CKE
VALID
VALID
tDLLK
tIS
tXPR
tMRD
tMRD
tMRD
tMOD
tZQinit
1)
COMMAND
BA
READ
READ
1)
MRS
MR2
MRS
MR3
MRS
MR1
MRS
MR0
ZQCL
VALID
tIS
tIS
ODT
RTT
READ
Static LOW in case RTT_Nom is enabled at time Tg, otherwise static HIGH or LOW
VALID
NOTE 1: From time point “Td” until “Tk” NOP or DES commands must be applied
between MRS and ZQCL commands.
DON’T CARE
TIME BREAK
Figure 0 - VDD/VDDQ Voltage Switch Between DDR3L and DDR3L
Rev. 1.3 / Nov. 2015
13
IDD and IDDQ Specification Parameters and Test Conditions
IDD and IDDQ Measurement Conditions
In this chapter, IDD and IDDQ measurement conditions such as test load and patterns are defined. Figure
1. shows the setup and test load for IDD and IDDQ measurements.
•
IDD currents (such as IDD0, IDD1, IDD2N, IDD2NT, IDD2P0, IDD2P1, IDD2Q, IDD3N, IDD3P, IDD4R,
IDD4W, IDD5B, IDD6, IDD6ET and IDD7) are measured as time-averaged currents with all VDD balls
of the DDR3L SDRAM under test tied together. Any IDDQ current is not included in IDD currents.
•
IDDQ currents (such as IDDQ2NT and IDDQ4R) are measured as time-averaged currents with all
VDDQ balls of the DDR3L SDRAM under test tied together. Any IDD current is not included in IDDQ
currents.
Attention: IDDQ values cannot be directly used to calculate IO power of the DDR3L SDRAM. They can
be used to support correlation of simulated IO power to actual IO power as outlined in Figure 2. In
DRAM module application, IDDQ cannot be measured separately since VDD and VDDQ are using one
merged-power layer in Module PCB.
For IDD and IDDQ measurements, the following definitions apply:
•
•
”0” and “LOW” is defined as VIN <= V
ILAC(max).
”1” and “HIGH” is defined as VIN >= V
IHAC(max).
•
•
•
•
•
“MID_LEVEL” is defined as inputs are VREF = VDD/2.
Timing used for IDD and IDDQ Measurement-Loop Patterns are provided in Table 1.
Basic IDD and IDDQ Measurement Conditions are described in Table 2.
Detailed IDD and IDDQ Measurement-Loop Patterns are described in Table 3 through Table 10.
IDD Measurements are done after properly initializing the DDR3L SDRAM. This includes but is not lim-
ited to setting
RON = RZQ/7 (34 Ohm in MR1);
Qoff = 0 (Output Buffer enabled in MR1);
B
RTT_Nom = RZQ/6 (40 Ohm in MR1);
RTT_Wr = RZQ/2 (120 Ohm in MR2);
TDQS Feature disabled in MR1
•
Attention: The IDD and IDDQ Measurement-Loop Patterns need to be executed at least one time
before actual IDD or IDDQ measurement is started.
•
•
Define D = {CS, RAS, CAS, WE}:= {HIGH, LOW, LOW, LOW}
Define D = {CS, RAS, CAS, WE}:= {HIGH, HIGH, HIGH, HIGH}
Rev. 1.3 / Nov. 2015
14
IDDQ (optional)
IDD
VDD
RESET
CK/CK
VDDQ
DDR3L
SDRAM
RTT = 25 Ohm
CKE
CS
DQS, DQS
DQ, DM,
VDDQ/2
RAS, CAS, WE
TDQS, TDQS
A, BA
ODT
ZQ
VSS
VSSQ
Figure 1 - Measurement Setup and Test Load for IDD and IDDQ (optional) Measurements
[Note: DIMM level Output test load condition may be different from above]
Application specific
memory channel
environment
IDDQ
Test Load
Channel
IO Power
Simulation
IDDQ
Simulation
IDDQ
Simulation
Correction
Channel IO Power
Number
Figure 2 - Correlation from simulated Channel IO Power to actual Channel IO Power supported
by IDDQ Measurement
Rev. 1.3 / Nov. 2015
15
Table 1 -Timings used for IDD and IDDQ Measurement-Loop Patterns
DDR3L-1066
DDR3L-1333
DDR3L-1600
DDR3L-1866
Symbol
Unit
7-7-7
9-9-9
1.5
9
11-11-11
13-13-13
tCK
1.875
1.25
11
1.07
13
ns
CL
7
7
nCK
nCK
nCK
nCK
nCK
nRCD
nRC
nRAS
nRP
9
11
13
27
20
7
33
24
9
39
45
28
32
11
13
1KB page
20
27
4
20
30
4
24
32
5
26
33
5
nCK
nCK
nCK
nCK
size
nFAW
2KB page
size
1KB page
size
nRRD
2KB page
size
6
5
6
6
nRFC -512Mb
nRFC-1 Gb
nRFC- 2 Gb
nRFC- 4 Gb
nRFC- 8 Gb
48
59
60
74
72
88
85
nCK
nCK
nCK
nCK
nCK
103
150
243
328
86
107
174
234
128
208
280
139
187
Table 2 -Basic IDD and IDDQ Measurement Conditions
Symbol
Description
Operating One Bank Active-Precharge Current
CKE: High; External clock: On; tCK, nRC, nRAS, CL: see Table 1; BL: 8a); AL: 0; CS: High between ACT
and PRE; Command, Address, Bank Address Inputs: partially toggling according to Table 3; Data IO:
MID-LEVEL; DM: stable at 0; Bank Activity: Cycling with one bank active at a time: 0,0,1,1,2,2,... (see
IDD0
Table 3); Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Pattern Details:
see Table 3.
Rev. 1.3 / Nov. 2015
16
Symbol
Description
Operating One Bank Active-Precharge Current
CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: see Table 1; BL: 8a); AL: 0; CS: High between
ACT, RD and PRE; Command, Address; Bank Address Inputs, Data IO: partially toggling according to
Table 4; DM: stable at 0; Bank Activity: Cycling with on bank active at a time: 0,0,1,1,2,2,... (see Table
IDD1
4); Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Pattern Details: see
Table 4.
Precharge Standby Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: partially toggling according to Table 5; Data IO: MID_LEVEL; DM: stable at 0;
IDD2N
IDD2NT
IDD2P0
Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable
at 0; Pattern Details: see Table 5.
Precharge Standby ODT Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: partially toggling according to Table 6; Data IO: MID_LEVEL; DM: stable at 0;
Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: tog-
gling according to Table 6; Pattern Details: see Table 6.
Precharge Power-Down Current Slow Exit
CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks closed;
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Precharge Power Down
Mode: Slow Exitc)
Precharge Power-Down Current Fast Exit
CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks closed;
IDD2P1
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Precharge Power Down
Mode: Fast Exitc)
Precharge Quiet Standby Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks closed;
IDD2Q
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0
Rev. 1.3 / Nov. 2015
17
Symbol
Description
Active Standby Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: partially toggling according to Table 5; Data IO: MID_LEVEL; DM: stable at 0;
IDD3N
Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable
at 0; Pattern Details: see Table 5.
Active Power-Down Current
CKE: Low; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: stable at 1; Command, Address,
Bank Address Inputs: stable at 0; Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: all banks open;
IDD3P
Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0
Operating Burst Read Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: High between RD; Command,
Address, Bank Address Inputs: partially toggling according to Table 7; Data IO: seamless read data burst
with different data between one burst and the next one according to Table 7; DM: stable at 0; Bank
Activity: all banks open, RD commands cycling through banks: 0,0,1,1,2,2,...(see Table 7); Output Buffer
IDD4R
and RTT: Enabled in Mode Registersb); ODT Signal: stable at 0; Pattern Details: see Table 7.
Operating Burst Write Current
CKE: High; External clock: On; tCK, CL: see Table 1; BL: 8a); AL: 0; CS: High between WR; Command,
Address, Bank Address Inputs: partially toggling according to Table 8; Data IO: seamless read data burst
with different data between one burst and the next one according to Table 8; DM: stable at 0; Bank
Activity: all banks open, WR commands cycling through banks: 0,0,1,1,2,2,...(see Table 8); Output Buf-
IDD4W
fer and RTT: Enabled in Mode Registersb); ODT Signal: stable at HIGH; Pattern Details: see Table 8.
Burst Refresh Current
CKE: High; External clock: On; tCK, CL, nRFC: see Table 1; BL: 8a); AL: 0; CS: High between REF; Com-
mand, Address, Bank Address Inputs: partially toggling according to Table 9; Data IO: MID_LEVEL; DM:
stable at 0; Bank Activity: REF command every nREF (see Table 9); Output Buffer and RTT: Enabled in
IDD5B
Mode Registersb); ODT Signal: stable at 0; Pattern Details: see Table 9.
Self-Refresh Current: Normal Temperature Range
TCASE: 0 - 85 oC; Auto Self-Refresh (ASR): Disabledd);Self-Refresh Temperature Range (SRT): Normale);
IDD6
CKE: Low; External clock: Off; CK and CK: LOW; CL: see Table 1; BL: 8a); AL: 0; CS, Command, Address,
Bank Address Inputs, Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: Self-Refresh operation; Out-
put Buffer and RTT: Enabled in Mode Registersb); ODT Signal: MID_LEVEL
Rev. 1.3 / Nov. 2015
18
Symbol
Description
Self-Refresh Current: Extended Temperature Range
TCASE: 0 - 95 oC; Auto Self-Refresh (ASR): Disabledd);Self-Refresh Temperature Range (SRT): Extend-
ede); CKE: Low; External clock: Off; CK and CK: LOW; CL: see Table 1; BL: 8a); AL: 0; CS, Command,
Address, Bank Address Inputs, Data IO: MID_LEVEL; DM: stable at 0; Bank Activity: Extended Tempera-
IDD6ET
ture Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registersb); ODT Signal:
MID_LEVEL
Operating Bank Interleave Read Current
CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, NRRD, nFAW, CL: see Table 1; BL: 8a), f); AL: CL-
1; CS: High between ACT and RDA; Command, Address, Bank Address Inputs: partially toggling accord-
ing to Table 10; Data IO: read data burst with different data between one burst and the next one
according to Table 10; DM: stable at 0; Bank Activity: two times interleaved cycling through banks (0,
IDD7
1,...7) with different addressing, wee Table 10; Output Buffer and RTT: Enabled in Mode Registersb);
ODT Signal: stable at 0; Pattern Details: see Table 10.
a) Burst Length: BL8 fixed by MRS: set MR0 A[1,0]=00B
b) Output Buffer Enable: set MR1 A[12] = 0B; set MR1 A[5,1] = 01B; RTT_Nom enable: set MR1 A[9,6,2] = 011B;
RTT_Wr enable: set MR2 A[10,9] = 10B
c) Precharge Power Down Mode: set MR0 A12=0B for Slow Exit or MR0 A12 = 1B for Fast Exit
d) Auto Self-Refresh (ASR): set MR2 A6 = 0B to disable or 1B to enable feature
e) Self-Refresh Temperature Range (SRT): set MR2 A7 = 0B for normal or 1B for extended temperature range
f) Read Burst Type: Nibble Sequential, set MR0 A[3] = 0B
Rev. 1.3 / Nov. 2015
19
Table 3 - IDD0 Measurement-Loop Patterna)
Datab)
0
ACT
D, D
D, D
0
1
1
0
0
1
1
0
1
1
0
1
0
0
0
0
0
0
00
00
00
0
0
0
0
0
0
0
0
0
0
0
0
-
-
-
0
1,2
3,4
...
repeat pattern 1...4 until nRAS - 1, truncate if necessary
nRAS
PRE
0
0
1
0
0
0
00
0
0
0
0
-
...
repeat pattern 1...4 until nRC - 1, truncate if necessary
1*nRC+0
1*nRC+1, 2
1*nRC+3, 4
...
ACT
D, D
D, D
0
1
1
0
0
1
1
0
1
1
0
1
0
0
0
0
0
0
00
00
00
0
0
0
0
0
0
F
F
F
0
0
0
-
-
-
repeat pattern 1...4 until 1*nRC + nRAS - 1, truncate if necessary
PRE 00
1*nRC+nRAS
...
0
0
1
0
0
0
0
0
F
0
-
repeat pattern 1...4 until 2*nRC - 1, truncate if necessary
repeat Sub-Loop 0, use BA[2:0] = 1 instead
repeat Sub-Loop 0, use BA[2:0] = 2 instead
repeat Sub-Loop 0, use BA[2:0] = 3 instead
repeat Sub-Loop 0, use BA[2:0] = 4 instead
repeat Sub-Loop 0, use BA[2:0] = 5 instead
repeat Sub-Loop 0, use BA[2:0] = 6 instead
repeat Sub-Loop 0, use BA[2:0] = 7 instead
1
2
3
4
5
6
7
2*nRC
4*nRC
6*nRC
8*nRC
10*nRC
12*nRC
14*nRC
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Rev. 1.3 / Nov. 2015
20
Table 4 - IDD1 Measurement-Loop Patterna)
Datab)
0
ACT
D, D
D, D
0
1
1
0
0
1
1
0
1
1
0
1
0
0
0
0
0
0
00
00
00
0
0
0
0
0
0
0
0
0
0
0
0
-
-
-
0
1,2
3,4
...
repeat pattern 1...4 until nRCD - 1, truncate if necessary
RD 00
repeat pattern 1...4 until nRAS - 1, truncate if necessary
nRCD
...
0
1
0
1
0
0
0
0
0
0
0
0
00000000
-
nRAS
PRE
0
0
1
0
0
0
00
0
0
...
repeat pattern 1...4 until nRC - 1, truncate if necessary
1*nRC+0
1*nRC+1,2
1*nRC+3,4
...
ACT
D, D
D, D
0
1
1
0
0
1
1
0
1
1
0
1
0
0
0
0
0
0
00
00
00
0
0
0
0
0
0
F
F
F
0
0
0
-
-
-
repeat pattern nRC + 1,...4 until nRC + nRCE - 1, truncate if necessary
RD 00
repeat pattern nRC + 1,...4 until nRC + nRAS - 1, truncate if necessary
PRE 00
1*nRC+nRCD
...
0
1
0
1
0
0
0
0
F
0
00110011
-
1*nRC+nRAS
...
0
0
1
0
0
0
0
0
F
0
repeat pattern nRC + 1,...4 until *2 nRC - 1, truncate if necessary
repeat Sub-Loop 0, use BA[2:0] = 1 instead
repeat Sub-Loop 0, use BA[2:0] = 2 instead
repeat Sub-Loop 0, use BA[2:0] = 3 instead
repeat Sub-Loop 0, use BA[2:0] = 4 instead
repeat Sub-Loop 0, use BA[2:0] = 5 instead
repeat Sub-Loop 0, use BA[2:0] = 6 instead
repeat Sub-Loop 0, use BA[2:0] = 7 instead
1
2
3
4
5
6
7
2*nRC
4*nRC
6*nRC
8*nRC
10*nRC
12*nRC
14*nRC
a) DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID_LEVEL.
Rev. 1.3 / Nov. 2015
21
Table 5 - IDD2N and IDD3N Measurement-Loop Patterna)
Datab)
0
D
D
D
D
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
F
F
0
0
0
0
-
-
-
-
0
1
2
3
1
2
3
4
5
6
7
4-7
repeat Sub-Loop 0, use BA[2:0] = 1 instead
repeat Sub-Loop 0, use BA[2:0] = 2 instead
repeat Sub-Loop 0, use BA[2:0] = 3 instead
repeat Sub-Loop 0, use BA[2:0] = 4 instead
repeat Sub-Loop 0, use BA[2:0] = 5 instead
repeat Sub-Loop 0, use BA[2:0] = 6 instead
repeat Sub-Loop 0, use BA[2:0] = 7 instead
8-11
12-15
16-19
20-23
24-17
28-31
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Table 6 - IDD2NT and IDDQ2NT Measurement-Loop Patterna)
Datab)
0
D
D
D
D
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-
-
-
-
0
1
0
0
0
0
F
F
0
0
0
2
3
1
2
3
4
5
6
7
4-7
repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 1
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 2
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 3
repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 4
repeat Sub-Loop 0, but ODT = 0 and BA[2:0] = 5
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 6
repeat Sub-Loop 0, but ODT = 1 and BA[2:0] = 7
8-11
12-15
16-19
20-23
24-17
28-31
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Rev. 1.3 / Nov. 2015
22
Table 7 - IDD4R and IDDQ4R Measurement-Loop Patterna)
Datab)
0
RD
D
0
1
1
0
1
1
1
0
1
1
0
1
0
0
1
0
0
1
1
0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
00
00
00
00
00
00
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
F
F
F
0
0
0
0
0
0
00000000
0
1
-
2,3
D,D
RD
D
-
4
00110011
5
-
-
6,7
D,D
1
2
3
4
5
6
7
8-15
16-23
24-31
32-39
40-47
48-55
56-63
repeat Sub-Loop 0, but BA[2:0] = 1
repeat Sub-Loop 0, but BA[2:0] = 2
repeat Sub-Loop 0, but BA[2:0] = 3
repeat Sub-Loop 0, but BA[2:0] = 4
repeat Sub-Loop 0, but BA[2:0] = 5
repeat Sub-Loop 0, but BA[2:0] = 6
repeat Sub-Loop 0, but BA[2:0] = 7
a) DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL.
Rev. 1.3 / Nov. 2015
23
Table 8 - IDD4W Measurement-Loop Patterna)
Datab)
0
WR
D
0
1
1
0
1
1
1
0
1
1
0
1
0
0
1
0
0
1
0
0
1
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
00
00
00
00
00
00
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
F
F
F
0
0
0
0
0
0
00000000
0
1
-
2,3
D,D
WR
D
-
4
00110011
5
-
-
6,7
D,D
1
2
3
4
5
6
7
8-15
16-23
24-31
32-39
40-47
48-55
56-63
repeat Sub-Loop 0, but BA[2:0] = 1
repeat Sub-Loop 0, but BA[2:0] = 2
repeat Sub-Loop 0, but BA[2:0] = 3
repeat Sub-Loop 0, but BA[2:0] = 4
repeat Sub-Loop 0, but BA[2:0] = 5
repeat Sub-Loop 0, but BA[2:0] = 6
repeat Sub-Loop 0, but BA[2:0] = 7
a) DM must be driven LOW all the time. DQS, DQS are used according to WR Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Write Command. Outside burst operation, DQ signals are MID-LEVEL.
Table 9 - IDD5B Measurement-Loop Patterna)
Datab)
0
1
0
REF
D, D
D, D
0
1
1
0
0
1
0
0
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
F
0
0
0
-
-
-
1.2
00
00
3,4
5...8
repeat cycles 1...4, but BA[2:0] = 1
repeat cycles 1...4, but BA[2:0] = 2
repeat cycles 1...4, but BA[2:0] = 3
repeat cycles 1...4, but BA[2:0] = 4
repeat cycles 1...4, but BA[2:0] = 5
repeat cycles 1...4, but BA[2:0] = 6
repeat cycles 1...4, but BA[2:0] = 7
9...12
13...16
17...20
21...24
25...28
29...32
33...nRFC-1
2
repeat Sub-Loop 1, until nRFC - 1. Truncate, if necessary.
a) DM must be driven LOW all the time. DQS, DQS are MID-LEVEL.
b) DQ signals are MID-LEVEL.
Rev. 1.3 / Nov. 2015
24
Table 10 - IDD7 Measurement-Loop Patterna)
ATTENTION! Sub-Loops 10-19 have inverse A[6:3] Pattern and Data Pattern than Sub-Loops 0-9
Datab)
0
1
0
1
2
...
ACT
RDA
D
0
0
1
0
1
0
1
0
0
1
1
0
0
0
0
0
0
0
00
00
00
0
1
0
0
0
0
0
0
0
0
0
0
-
00000000
-
repeat above D Command until nRRD - 1
nRRD
nRRD+1
nRRD+2
...
2*nRRD
3*nRRD
4*nRRD
ACT
RDA
D
0
0
1
0
1
0
1
0
0
1
1
0
0
0
0
1
1
1
00
00
00
0
1
0
0
0
0
F
F
F
0
0
0
-
00110011
-
repeat above D Command until 2* nRRD - 1
repeat Sub-Loop 0, but BA[2:0] = 2
repeat Sub-Loop 1, but BA[2:0] = 3
2
3
D
1
0
0
0
0
3
00
0
0
F
0
-
-
4
Assert and repeat above D Command until nFAW - 1, if necessary
repeat Sub-Loop 0, but BA[2:0] = 4
repeat Sub-Loop 1, but BA[2:0] = 5
repeat Sub-Loop 0, but BA[2:0] = 6
repeat Sub-Loop 1, but BA[2:0] = 7
5
6
7
8
nFAW
nFAW+nRRD
nFAW+2*nRRD
nFAW+3*nRRD
nFAW+4*nRRD
D
1
0
0
0
0
7
00
0
0
F
0
9
Assert and repeat above D Command until 2* nFAW - 1, if necessary
2*nFAW+0
2*nFAW+1
ACT
RDA
D
0
0
1
0
1
0
1
0
0
1
1
0
0
0
0
0
0
0
00
00
00
0
1
0
0
0
0
F
F
F
0
0
0
-
00110011
-
10
2&nFAW+2
Repeat above D Command until 2* nFAW + nRRD - 1
2*nFAW+nRRD
2*nFAW+nRRD+1 RDA
ACT
0
0
1
0
1
0
1
0
0
1
1
0
0
0
0
1
1
1
00
00
00
0
1
0
0
0
0
0
0
0
0
0
0
-
00000000
-
11
D
2&nFAW+nRRD+
2
Repeat above D Command until 2* nFAW + 2* nRRD - 1
12 2*nFAW+2*nRRD repeat Sub-Loop 10, but BA[2:0] = 2
13 2*nFAW+3*nRRD repeat Sub-Loop 11, but BA[2:0] = 3
D
1
0
0
0
0
3
00
0
0
0
0
-
14 2*nFAW+4*nRRD
Assert and repeat above D Command until 3* nFAW - 1, if necessary
repeat Sub-Loop 10, but BA[2:0] = 4
15 3*nFAW
16 3*nFAW+nRRD
repeat Sub-Loop 11, but BA[2:0] = 5
17 3*nFAW+2*nRRD repeat Sub-Loop 10, but BA[2:0] = 6
18 3*nFAW+3*nRRD repeat Sub-Loop 11, but BA[2:0] = 7
D
1
0
0
0
0
7
00
0
0
0
0
-
19 3*nFAW+4*nRRD
Assert and repeat above D Command until 4* nFAW - 1, if necessary
a) DM must be driven LOW all the time. DQS, DQS are used according to RD Commands, otherwise MID-LEVEL.
b) Burst Sequence driven on each DQ signal by Read Command. Outside burst operation, DQ signals are MID-LEVEL.
Rev. 1.3 / Nov. 2015
25
IDD Specifications
IDD values are for full operating range of voltage and temperature unless otherwise noted.
IDD Specification
Speed Grade
Bin
DDR3L - 1066 DDR3 L- 1333 DDR3L - 1600 DDR3L - 1866
7-7-7
Max.
28
33
32
41
11
11
11
14
13
14
15
16
14
16
19
23
23
29
50
90
54
95
143
150
9
9-9-9
Max.
28
11-11-11
Max.
28
13-13-13
Max.
32
Unit
Notes
Symbol
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
x8
x16
x8
I
DD0
33
35
36
32
32
36
I
DD01
41
45
45
x16
x8
11
11
11
I
I
DD2P0
11
11
11
x16
x8
11
11
11
DD2P1
14
14
14
x16
x8
14
14
16
I
DD2N
14
14
16
x16
x8
16
18
19
I
DD2NT
16
18
19
x16
x8
14
16
16
I
DD2Q
16
16
16
x16
x8
19
19
20
I
DD3P
DD3N
DD4R
DD4w
24
24
25
x16
x8
24
25
26
I
31
32
33
x16
x8
63
69
82
I
100
68
110
74
125
87
x16
x8
I
105
143
150
9
115
146
155
9
130
146
155
9
x16
x8
I
I
DD5
x16
x8
DD6
9
9
9
9
x16
x8/16
x8
I
Low Power)
6
6
6
6
DD6 (
11
11
104
180
11
11
11
I
DD6ET
11
11
11
x16
x8
114
180
115
185
130
189
I
DD7
x16
Notes:
1. Applicable for MR2 settings A6=0 and A7=0. Temperature range for IDD6 is 0 - 85oC.
2. Applicable for MR2 settings A6=0 and A7=1. Temperature range for IDD6ET is 0 - 95oC.
Rev. 1.3 / Nov. 2015
26
Input/Output Capacitance
DDR3L-1066 DDR3L-1333 DDR3L-1600 DDR3L-1866
Parameter
Symbol
Units Notes
Min
Max Min Max Min Max Min Max
Input/output capacitance
(DQ, DM, DQS, DQS, TDQS,
TDQS)
CIO
1.4
2.7
1.4
2.5
1.4
2.3
1.4
2.2
pF
1,2,3
Input capacitance, CK and
CK
Input capacitance delta
CK and CK
Input capacitance delta,
DQS and DQS
Input capacitance
(All other input-only pins)
Input capacitance delta
(All CTRL input-only pins)
Input capacitance delta
(All ADD/CMD input-only
pins)
CCK
CDCK
CDDQS
CI
0.8
0
1.6
0.8
0
1.4
0.15
0.15
1.3
0.8
0
1.4
0.15
0.15
1.3
0.8
0
1.3
0.15
0.15
1.2
pF
pF
pF
pF
pF
2,3
2,3,4
2,3,5
2,3,6
2,3,7,8
0.15
0.20
0
0
0
0
0.75
-0.5
1.35 0.75
0.75
-0.4
0.75
-0.4
CDI_CTRL
0.3
0.5
-0.4
-0.4
0.2
0.2
0.2
CDI_ADD_
-0.5
0.4
-0.4
0.4
-0.4
0.4
pF 2,3,9,10
CMD
Input/output capacitance
delta
(DQ, DM, DQS, DQS)
Input/output capacitance of
ZQ pin
CDIO
-0.5
-
0.3
3
-0.5
-
0.3
3
-0.5
-
0.3
3
-0.5
-
0.3
3
pF
pF
2,3,11
2,3,12
CZQ
Notes:
1. Although the DM, TDQS and TDQS pins have different functions, the loading matches DQ and DQS.
2. This parameter is not subject to production test. It is verified by design and characterization. The capacitance is
measured according to JEP147(“PROCEDURE FOR MEASURING INPUT CAPACITANCE USING A VECTOR NETWORK
ANALYZER(VNA)”) with VDD, VDDQ, VSS,VSSQ applied and all other pins floating (except the pin under test, CKE,
RESET and ODT as necessary). VDD=VDDQ=1.5V, VBIAS=VDD/2 and on-die termination off.
3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here
4. Absolute value of CCK-CCK.
5. Absolute value of CIO(DQS)-CIO(DQS).
6. CI applies to ODT, CS, CKE, A0-A15, BA0-BA2, RAS, CAS, WE.
7. CDI_CTR applies to ODT, CS and CKE.
8. CDI_CTRL=CI(CNTL) - 0.5 * CI(CLK) + CI(CLK))
9. CDI_ADD_CMD applies to A0-A15, BA0-BA2, RAS, CAS and WE.
10. CDI_ADD_CMD=CI(ADD_CMD) - 0.5*(CI(CLK)+CI(CLK))
11. CDIO=CIO(DQ) - 0.5*(CIO(DQS)+CIO(DQS))
12. Maximum external load capacitance an ZQ pin: 5 pF.
Rev. 1.3 / Nov. 2015
27
Standard Speed Bins
DDR3L SDRAM Standard Speed Bins include tCK, tRCD, tRP, tRAS and tRC for each corresponding bin.
DDR3L-1066 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3L-1066
7-7-7
Unit
Note
CL - nRCD - nRP
Parameter
Symbol
min
max
Internal read command to
first data
tAA
13.125
20
ns
ns
ns
ns
ACT to internal read or
write delay time
tRCD
13.125
13.125
50.625
—
—
—
tRP
PRE command period
ACT to ACT or REF
command period
tRC
ACT to PRE command
period
tRAS
37.5
3.0
9 * tREFI
3.3
ns
ns
1, 2, 3, 4, 6,
12,13
tCK(AVG)
CWL = 5
CL = 5
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 6
Reserved
ns
ns
4
1, 2, 3, 6
1, 2, 3, 4
4
CWL = 5
CL = 6
2.5
3.3
CWL = 6
Reserved
Reserved
ns
CWL = 5
CL = 7
ns
CWL = 6
1.875
1.875
< 2.5
< 2.5
ns
1, 2, 3, 4
4
CWL = 5
CL = 8
Reserved
ns
CWL = 6
ns
1, 2, 3
13
nCK
nCK
Supported CL Settings
Supported CWL Settings
5, 6, 7, 8
5, 6
Rev. 1.3 / Nov. 2015
28
DDR3L-1333 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3L-1333
9-9-9
Unit
Note
CL - nRCD - nRP
Parameter
Symbol
min
13.5
max
Internal read
command to first data
tAA
tRCD
tRP
20
ns
ns
ns
ns
(13.125)5,11
13.5
(13.125)5,11
ACT to internal read or
write delay time
—
—
—
13.5
(13.125)5,11
PRE command period
49.5
(49.125)5,11
ACT to ACT or REF
command period
tRC
ACT to PRE command
period
tRAS
36
9 * tREFI
3.3
ns
ns
1, 2, 3, 4,
7, 12,13
tCK(AVG)
CWL = 5
CL = 5
3.0
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 6, 7
Reserved
ns
ns
ns
ns
ns
4
CWL = 5
2.5
3.3
1, 2, 3, 7
CL = 6
CL = 7
CL = 8
CWL = 6
CWL = 7
CWL = 5
Reserved
Reserved
Reserved
1, 2, 3, 4, 7
4
4
1.875
1.875
< 2.5
< 2.5
tCK(AVG)
CWL = 6
ns
1, 2, 3, 4, 7
(Optional)5
Reserved
Reserved
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 7
CWL = 5
ns
ns
ns
ns
ns
ns
ns
1, 2, 3, 4
4
CWL = 6
1, 2, 3, 7
1, 2, 3, 4
4
CWL = 7
Reserved
Reserved
CWL = 5, 6
CWL = 7
CL = 9
1.5
1.5
<1.875
<1.875
1, 2, 3, 4
4
CWL = 5, 6
Reserved
(Optional)
CL = 10
ns
ns
1, 2, 3
5
tCK(AVG)
CWL = 7
nCK
Supported CL Settings
Supported CWL Settings
5, 6, 8, (7), 9, (10)
5, 6, 7
nCK
Rev. 1.3 / Nov. 2015
29
DDR3L-1600 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3L-1600
11-11-11
Unit
Note
CL - nRCD - nRP
Parameter
Symbol
min
13.75
max
Internal read
command to first data
tAA
tRCD
tRP
20
ns
ns
ns
ns
(13.125)5,11
13.75
(13.125)5,11
ACT to internal read or
write delay time
—
—
—
13.75
(13.125)5,11
PRE command period
48.75
(48.125)5,11
ACT to ACT or REF
command period
tRC
ACT to PRE command
period
tRAS
35
9 * tREFI
3.3
ns
ns
1, 2, 3, 4,
8, 12,13
4
tCK(AVG)
CWL = 5
CL = 5
3.0
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 6, 7
Reserved
ns
ns
ns
ns
ns
CWL = 5
2.5
3.3
1, 2, 3, 8
CL = 6
CL = 7
CWL = 6
CWL = 7
CWL = 5
Reserved
Reserved
Reserved
1, 2, 3, 4, 8
4
4
1.875
< 2.5
tCK(AVG)
CWL = 6
ns
1, 2, 3, 4, 8
(Optional)5
Reserved
Reserved
Reserved
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 7
CWL = 8
CWL = 5
CWL = 6
CWL = 7
CWL = 8
CWL = 5, 6
ns
ns
ns
ns
ns
ns
ns
1, 2, 3, 4, 8
4
4
1.875
1.5
< 2.5
1, 2, 3, 8
1, 2, 3, 4, 8
1, 2, 3, 4
4
CL = 8
CL = 9
Reserved
Reserved
Reserved
<1.875
tCK(AVG)
CWL = 7
ns
1, 2, 3, 4, 8
(Optional)5
Reserved
Reserved
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 8
ns
ns
1, 2, 3, 4
4
CWL = 5, 6
CL = 10 CWL = 7
CWL = 8
1.5
<1.875
<1.5
ns
1, 2, 3, 8
1, 2, 3, 4
4
Reserved
Reserved
ns
CWL = 5, 6,7
CL = 11
ns
CWL = 8
1.25
ns
1, 2, 3
nCK
nCK
Supported CL Settings
Supported CWL Settings
5, 6, (7), 8, (9), 10, 11
5, 6, 7, 8
Rev. 1.3 / Nov. 2015
30
DDR3L-1866 Speed Bins
For specific Notes see “Speed Bin Table Notes” on page 31.
Speed Bin
DDR3L-1866
13-13-13
Unit
Note
CL - nRCD - nRP
Parameter
Symbol
min
max
13.91
(13.125)5,14
13.91
(13.125)5,14
13.91
(13.125)5,14
Internal read command
to first data
tAA
tRCD
tRP
20
ns
ns
ns
ns
ns
ACT to internal read or
write delay time
—
—
PRE command period
ACT to PRE command
period
tRAS
tRC
34
9 * tREFI
47.91
(47.125)5,14
3.0
ACT to ACT or PRE
command period
-
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
tCK(AVG)
CWL = 5
CL = 5
3.3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
nCK
nCK
1, 2, 3, 4, 9
CWL = 6,7,8,9
Reserved
4
CWL = 5
2.5
3.3
1, 2, 3, 9
CL = 6
CL = 7
CWL = 6
CWL = 7,8,9
CWL = 5
Reserved
Reserved
Reserved
1, 2, 3, 4, 9
4
4
CWL = 6
1.875
1.875
< 2.5
< 2.5
1, 2, 3, 4, 9
CWL = 7,8,9
CWL = 5
Reserved
Reserved
4
4
CWL = 6
1, 2, 3, 9
CL = 8
CL = 9
CWL = 7
Reserved
Reserved
Reserved
1, 2, 3, 4, 9
CWL = 8,9
CWL = 5, 6
CWL = 7
4
4
1.5
<1.875
1, 2, 3, 4, 9
CWL = 8
Reserved
Reserved
Reserved
1, 2, 3, 4, 9
CWL = 9
4
CWL = 5, 6
CWL = 7
4
1, 2, 3, 9
1, 2, 3, 4, 9
4
CL = 10
CL = 11
1.5
<1.875
<1.5
CWL = 8
Reserved
Reserved
CWL = 5,6,7
CWL = 8
1.25
1, 2, 3, 4, 9
1, 2, 3, 4
4
CWL = 9
Reserved
Reserved
Reserved
Reserved
CWL = 5,6,7,8
CWL = 9
CL = 12
CL = 13
1,2,3,4
4
CWL = 5,6,7,8
CWL = 9
1.07
<1.25
1, 2, 3
Supported CL Settings
Supported CWL Settings
6, 8, 10, 13, (7), (9), (11)
5, 6, 7, 8, 9
Rev. 1.3 / Nov. 2015
31
Speed Bin Table Notes
Absolute Specification (TOPER; VDDQ = VDD = 1.5V +/- 0.075 V);
1. The CL setting and CWL setting result in tCK(AVG).MIN and tCK(AVG).MAX requirements. When making
a selection of tCK(AVG), both need to be fulfilled: Requirements from CL setting as well as requirements
from CWL setting.
2. tCK(AVG).MIN limits: Since CAS Latency is not purely analog - data and strobe output are synchronized
by the DLL - all possible intermediate frequencies may not be guaranteed. An application should use the
next smaller JEDEC standard tCK(AVG) value (3.0, 2.5, 1.875, 1.5, or 1.25 ns) when calculating CL [nCK]
= tAA [ns] / tCK(AVG) [ns], rounding up to the next ‘Supported CL’, where tCK(AVG) = 3.0 ns should
only be used for CL = 5 calculation.
3. tCK(AVG).MAX limits: Calculate tCK(AVG) = tAA.MAX / CL SELECTED and round the resulting tCK(AVG)
down to the next valid speed bin (i.e. 3.3ns or 2.5ns or 1.875 ns or 1.25 ns). This result is tCK(AVG).MAX
corresponding to CL SELECTED.
4. ‘Reserved’ settings are not allowed. User must program a different value.
5. ‘Optional’ settings allow certain devices in the industry to support this setting, however, it is not a man-
datory feature. Refer to SK Hynix DIMM data sheet and/or the DIMM SPD information if and how this
setting is supported.
6. Any DDR3L-1066 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
7. Any DDR3L-1333 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
8. Any DDR3L-1600 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
9. Any DDR3L-1866 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
10. Any DDR3L-2133 speed bin also supports functional operation at lower frequencies as shown in the table
which are not subject to Production Tests but verified by Design/Characterization.
11. SK Hynix DDR3L SDRAM devices supporting optional down binning to CL=7 and CL=9, and tAA/tRCD/
tRP must be 13.125 ns or lower. SPD settings must be programmed to match. For example, DDR3L-
1333H devices supporting down binning to DDR3L-1066F should program 13.125 ns in SPD bytes for
tAAmin (Byte 16), tRCDmin (Byte 18), and tRPmin (Byte 20). DDR3L-1600K devices supporting down
binning to DDR3L-1333H or DDR3L-1600F should program 13.125 ns in SPD bytes for tAAmin (Byte 16),
tRCDmin (Byte 18), and tRPmin (Byte 20). Once tRP (Byte 20) is programmed to 13.125ns, tRCmin
(Byte 21,23) also should be programmed accordingly. For example, 49.125ns (tRASmin + tRPmin = 36
ns + 13.125 ns) for DDR3L-1333H and 48.125ns (tRASmin + tRPmin = 35 ns + 13.125 ns) for DDR3L-
1600K.
12. DDR3L 800 AC timing apply if DRAM operates at lower than 800 MT/s data rate.
13. For CL5 support, refer to DIMM SPD information. DRAM is required to support CL5. CL5 is not mandatory
in SPD coding.
14. SK Hynix DDR3L SDRAM devices supporting optional down binning to CL=11, CL=9 and CL=7, tAA/
tRCD/tRPmin must be 13.125ns. SPD setting must be programed to match. For example, DDR3L-1866M
devices supporting down binning to DDR3L-1600K or DDR3L-1333H or 1066F should program 13.125ns
in SPD bytes for tAAmin(byte 16), tRCDmin(byte 18) and tRPmin(byte 20) is programmed to 13.125ns,
tRCmin(byte 21,23) also should be programmed accordingly. For example, 47.125ns (tRASmin + tRPmin
= 34ns +13.125ns)
Rev. 1.3 / Nov. 2015
32
Package Dimensions
Package Dimension(x8): 78Ball Fine Pitch Ball Grid Array Outline
Rev. 1.3 / Nov. 2015
33
Package Dimension(x16): 96Ball Fine Pitch Ball Grid Array Outline
相关型号:
©2020 ICPDF网 联系我们和版权申明