ICS84021AYLF [IDT]

Clock Generator, 260MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32;
ICS84021AYLF
型号: ICS84021AYLF
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Clock Generator, 260MHz, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MS-026BBA, LQFP-32

时钟 外围集成电路 晶体
文件: 总19页 (文件大小:737K)
中文:  中文翻译
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ICS84021  
260MHz, Crystal-to-LVCMOS/LVTTL  
Frequency Synthesizer  
DATA SHEET  
General Description  
Features  
The ICS84021 is a general purpose, Crystal-to-LVCMOS/LVTTL  
High Frequency Synthesizer. The ICS84021 has a selectable  
TEST_CLK or crystal input. The VCO operates at a frequency range  
of 620MHz to 780MHz. The VCO frequency is programmed in steps  
equal to the value of the input reference or crystal frequency. The  
VCO and output frequency can be programmed using the serial or  
parallel interface to the configuration logic.  
Two LVCMOS/LVTTL outputs  
Selectable crystal oscillator interface or LVCMOS/LVTTL  
TEST_CLK  
Output frequency range: 103.3MHz to 260MHz  
Crystal input frequency range: 14MHz to 40MHz  
VCO range: 620MHz to 780MHz  
Parallel or serial interface for programming counter and output  
dividers  
RMS period jitter: 14.7ps (typical), (N ÷ 4, VDDO = 3.3V 5%)  
RMS phase jitter at 155.52MHz, using a 38.88MHz crystal (12kHz  
to 20MHz): 2.61ps (typical)  
Offset  
Noise Power  
100Hz.................-87.9 dBc/Hz  
1kHz...................-115.8 dBc/Hz  
10kHz.................-124.2 dBc/Hz  
100kHz...............-127.7 dBc/Hz  
Full 3.3V or mixed 3.3V core/2.5V or 1.8V output supply voltage  
0°C to 70°C ambient operating temperature  
Industrial temperature information available upon request  
Available in both standard (RoHS 5) and lead-free (RoHS 6)  
packages  
Pin Assignment  
Block Diagram  
Pullup  
OE0  
Pullup  
OE1  
Pullup  
VCO_SEL  
32 31 30 29 28 27 26 25  
Pullup  
XTAL_SEL  
1
2
3
4
5
6
7
8
M5  
XTAL_OUT  
24  
23  
22  
21  
20  
Pulldown  
TEST_CLK  
0
M6  
M7  
TEST_CLK  
XTAL_SEL  
VDDA  
XTAL_IN  
1
OSC  
M8  
N0  
XTAL_OUT  
S_LOAD  
N1  
nc  
S_DATA  
S_CLOCK  
MR  
19  
18  
17  
PLL  
GND  
Phase Detector  
9
10 11 12 13 14 15 16  
N
Pulldown  
MR  
÷3  
÷4  
÷5  
÷6  
0
1
VCO  
Q0  
Q1  
÷M  
ICS84021  
32 Lead LQFP  
7mm x 7mm x 1.4mm package body  
Pulldown  
S_LOAD  
S_DATA  
S_CLOCK  
nP_LOAD  
Pulldown  
Pulldown  
Pulldown  
TEST  
Configuration Interface Logic  
Y Package  
Top View  
M5 Pullup; M[0:4, 6:8] Pulldown  
Pulldown  
M[0:8]  
N[0:1]  
ICS84021BY REVISION E AUGUST 18, 2011  
1
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Functional Description  
NOTE: The functional description that follows describes operation  
using a 25MHz crystal. Valid PLL loop divider values for different  
crystal or input frequencies are defined in the Input Frequency  
Characteristics, Table 5, NOTE 1.  
The relationship between the VCO frequency, the crystal frequency  
and the M divider is defined as follows: fVCO = fxtal x M  
The M value and the required values of M0 through M8 are shown in  
Table 3B, Programmable VCO Frequency Function Table. Valid M  
values for which the PLL will achieve lock for a 25MHz reference are  
defined as 25 M 31. The frequency out is defined as follows:  
The ICS84021 features a fully integrated PLL and therefore requires  
no external components for setting the loop bandwidth. A  
fundamental crystal is used as the input to the on-chip oscillator. The  
output of the oscillator is fed into the phase detector. A 25MHz crystal  
provides a 25MHz phase detector reference frequency. The VCO of  
the PLL operates over a range of 620MHz to 780MHz. The output of  
the M divider is also applied to the phase detector.  
FOUT = fVCO = fxtal x M  
N
N
Serial operation occurs when nP_LOAD is HIGH and S_LOAD is  
LOW. The shift register is loaded by sampling the S_DATA bits with  
the rising edge of S_CLOCK. The contents of the shift register are  
loaded into the M divider and N output divider when S_LOAD  
transitions from LOW-to-HIGH. The M divide and N output divide  
values are latched on the HIGH-to-LOW transition of S_LOAD. If  
S_LOAD is held HIGH, data at the S_DATA input is passed directly to  
the M divider and N output divider on each rising edge of S_CLOCK.  
The serial mode can be used to program the M and N bits and test  
bits T1 and T0. The internal registers T0 and T1 determine the state  
of the TEST output as follows:  
The phase detector and the M divider force the VCO output  
frequency to be M times the reference frequency by adjusting the  
VCO control voltage. Note that for some values of M (either too high  
or too low), the PLL will not achieve lock. The output of the VCO is  
scaled by a divider prior to being sent to each of the LVCMOS output  
buffers. The divider provides a 50% output duty cycle.  
The programmable features of the ICS84021 support two input  
modes to program the M divider and N output divider. The two input  
operational modes are parallel and serial. Figure 1 shows the timing  
diagram for each mode. In parallel mode, the nP_LOAD input is  
initially LOW. The data on inputs M0 through M8 and N0 and N1 is  
passed directly to the M divider and N output divider. On the  
LOW-to-HIGH transition of the nP_LOAD input, the data is latched  
and the M divider remains loaded until the next LOW transition on  
nP_LOAD or until a serial event occurs. As a result, the M and N bits  
can be hardwired to set the M divider and N output divider to a  
specific default state that will automatically occur during power-up.  
The TEST output is LOW when operating in the parallel input mode.  
T1  
0
T0  
0
TEST Output  
LOW  
0
1
S_DATA, Shift Register Input  
Output of M Divider  
CMOS FOUT  
1
0
1
1
SERIAL LOADING  
S_CLOCK  
T1 T0 *NULL N1 N0 M8 M7 M6 M5 M4 M3 M2 M1 M0  
S_DATA  
S_LOAD  
t
t
S
H
t
nP_LOAD  
S
PARALLEL LOADING  
M, N  
M[0:8], N[0:1]  
nP_LOAD  
t
t
H
S
S_LOAD  
Time  
*NOTE: The NULL timing slot must be observed.  
Figure 1. Parallel & Serial Load Operations  
ICS84021BY REVISION E AUGUST 18, 2011  
2
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 1. Pin Descriptions  
Number  
Name  
Type  
Description  
1
M5  
Input  
Input  
Pullup  
M divider inputs. Data latched on LOW-to-HIGH transition of nP_LOAD  
input. LVCMOS/LVTTL interface levels.  
2, 3, 4,  
28, 29,  
30, 31, 32  
M6, M7, M8,  
M0, M1,  
M2, M3, M4  
Pulldown  
Pulldown  
Determines N output divider value as defined in Table 3C, Function  
Table. LVCMOS/LVTTL interface levels.  
5, 6  
N0, N1  
Input  
7
nc  
Unused  
Power  
No connect.  
8, 16  
GND  
Power supply pins.  
Test output which is ACTIVE in the serial mode of operation.  
Output driven LOW in parallel mode. LVCMOS/LVTTL interface levels.  
9
TEST  
VDD  
Output  
Power  
10  
Core supply pin.  
Output enable. When logic HIGH, the outputs are enabled (default).  
When logic LOW, the outputs are in an Hi-Z state. See Table 3E, OE  
Function Table. LVCMOS/LVTTL interface levels.  
11, 12  
Input  
Pullup  
OE1, OE0  
13  
VDDO  
Power  
Output  
Output supply pin.  
14, 15  
Single-ended clock outputs. LVCMOS/LVTTL interface levels.  
Q1, Q0  
Active High Master Reset. When logic HIGH, the internal dividers are  
reset causing the outputs to go low. When Logic LOW, the internal  
dividers and the outputs are enabled. Assertion of MR does not affect  
loaded M, N, and T values. LVCMOS/LVTTL interface levels.  
17  
MR  
Input  
Pulldown  
Clocks in serial data present at S_DATA input into the shift register on the  
rising edge of S_CLOCK. LVCMOS/LVTTL interface levels.  
18  
19  
S_CLOCK  
S_DATA  
Input  
Input  
Pulldown  
Pulldown  
Pulldown  
Shift register serial input. Data sampled on the rising edge of S_CLOCK.  
LVCMOS/LVTTL interface levels.  
Controls transition of data from shift register into the dividers.  
LVCMOS/LVTTL interface levels.  
20  
21  
S_LOAD  
VDDA  
Input  
Power  
Analog supply pin.  
Selects between crystal or test inputs as the PLL reference source.  
Selects XTAL inputs when HIGH. Selects TEST_CLK when LOW.  
LVCMOS/LVTTL interface levels.  
22  
XTAL_SEL  
Input  
Pullup  
23  
TEST_CLK  
Input  
Input  
Pulldown  
Single-ended test clock input. LVCMOS/LVTTL interface levels.  
24,  
25  
XTAL_OUT  
XTAL_IN  
Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the  
output.  
Parallel load input. Determines when data present at M[8:0] is loaded into  
M divider, and when data present at N[1:0] sets the N output divider  
value. LVCMOS/LVTTL interface levels.  
26  
27  
nP_LOAD  
VCO_SEL  
Input  
Input  
Pulldown  
Pullup  
Determines whether synthesizer is in PLL or bypass mode.  
LVCMOS/LVTTL interface levels.  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
ICS84021BY REVISION E AUGUST 18, 2011  
3
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 2. Pin Characteristics  
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
pF  
pF  
pF  
kΩ  
kΩ  
CIN  
Input Capacitance  
4
V
DDO = 3.465V  
VDDO = 2.625V  
DDO = 1.89V  
15  
15  
20  
51  
51  
7
Power Dissipation Capacitance  
(per output)  
CPD  
V
RPULLUP  
Input Pullup Resistor  
RPULLDOWN Input Pulldown Resistor  
V
DDO = 3.3V 5%  
ROUT  
Output Impedance  
VDDO = 2.5V 5%  
VDDO = 1.8V 5%  
7
10  
Function Tables  
Table 3A. Parallel and Serial Mode Function Table  
Inputs  
MR  
nP_LOAD  
M
N
S_LOAD  
S_CLOCK  
S_DATA Conditions  
H
X
X
X
X
X
X
X
X
Reset. Forces outputs LOW.  
Data on M and N inputs passed directly to the M divider and  
N output divider. TEST output forced LOW.  
L
L
L
L
L
Data  
Data  
X
Data  
Data  
X
X
L
L
Data is latched into input registers and remains loaded until  
next LOW transition or until a serial event occurs.  
X
L
X
Serial input mode. Shift register is loaded with data on  
S_DATA on each rising edge of S_CLOCK.  
H
H
Data  
Data  
Contents of the shift register are passed to the M divider and  
N output divider.  
X
X
L
L
L
H
H
H
X
X
X
X
X
X
L
L
X
Data  
X
M divider and N output divider values are latched.  
Parallel or serial input do not affect shift registers.  
S_DATA passed directly to M divider as it is clocked.  
H
Data  
NOTE: L = LOW  
H = HIGH  
X = Don’t care  
= Rising edge transition  
= Falling edge transition  
ICS84021BY REVISION E AUGUST 18, 2011  
4
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
(NOTE 1)  
Table 3B. Programmable VCO Frequency Function Table  
256  
M8  
0
128  
M7  
0
64  
32  
M5  
0
16  
M4  
1
8
M3  
1
4
M2  
0
2
M1  
0
1
M0  
1
VCO Frequency  
(MHz)  
M Divide  
M6  
0
625  
25  
700  
28  
0
0
0
0
1
1
1
0
0
775  
31  
0
0
0
0
1
1
1
1
1
NOTE 1: These M divide values and the resulting frequencies correspond to TEST_CLK or crystal frequency of 25MHz.  
Table 3C. Programmable Output Divider Function Table (PLL Enabled)  
Inputs  
Output Frequency (MHz)  
N1  
0
N0  
0
N Divider Value  
Minimum  
206.7  
155  
Maximum  
260  
3
4
5
6
0
1
195  
1
0
124  
156  
1
1
103.3  
130  
Table 3D. Commonly Used Configuration Function Table  
Inputs  
Output Frequency (MHz)  
Crystal (MHz)  
19.44  
M Divider Value  
N Divider Value  
Minimum  
155.52  
156.25  
156.25  
125  
32  
32  
25  
25  
25  
25  
25  
16  
4
4
4
5
3
4
6
4
19.53125  
25  
25  
25.50  
212.50  
159.375  
106.25  
155.52  
25.50  
25.50  
38.88  
Table 3E. Output Enable & Clock Enable Function Table  
Control Inputs Output  
OE0  
OE1  
Q0  
Hi-Z  
Q1  
Hi-Z  
0
0
1
1
0
1
0
1
Hi-Z  
Enabled  
Hi-Z  
Enabled  
Enabled  
Enabled  
ICS84021BY REVISION E AUGUST 18, 2011  
5
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond  
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
4.6V  
Inputs, VI  
XTAL_IN  
0V to VDD  
Other Inputs  
-0.5V to VDD + 0.5V  
Outputs, VO  
-0.5V to VDDO + 0.5V  
47.9°C/W (0 lfpm)  
-65°C to 150°C  
Package Thermal Impedance, θJA  
Storage Temperature, TSTG  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, VDD = 3.3V 5%, VDDO = 3.3V 5%, 2.5V 5% or 1.8V 5%, TA = 0°C to 70°C  
Symbol  
VDD  
Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
VDD  
Units  
V
Core Supply Voltage  
Analog Supply Voltage  
VDDA  
VDD – 0.36  
3.135  
3.3  
V
3.3  
3.465  
2.625  
1.89  
110  
V
VDDO  
Output Supply Voltage  
2.375  
2.5  
V
1.71  
1.8  
V
IDD  
Power Supply Current  
Analog Supply Current  
Output Supply Current  
mA  
mA  
mA  
IDDA  
IDDO  
24  
5
ICS84021BY REVISION E AUGUST 18, 2011  
6
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = 3.3V 5%, VDDO = 3.3V 5%, 2.5V 5% or 1.8V 5%, TA = 0°C to 70°C  
Symbol Parameter  
VIH Input High Voltage  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
2
VDD + 0.3  
V
OE[0:1], N[0:1], M[0:8],  
XTAL_SEL, VCO_SEL,  
S_DATA, S_CLOCK,  
-0.3  
-0.3  
0.8  
1.3  
150  
V
V
Input  
Low Voltage  
VIL  
S_LOAD, nP_LOAD, MR  
TEST_CLOCK  
MR, S_CLOCK,  
TEST_CLK, S_DATA,  
S_LOAD, nP_LOAD,  
M[0:4], M[6:8], N0, N1  
VDD = VIN = 3.465V  
VDD = VIN = 3.465V  
VDD = 3.465V, VIN = 0V  
µA  
Input  
High Current  
IIH  
M5, OE0, OE1,  
XTAL_SEL, VCO_SEL  
5
µA  
µA  
µA  
MR, S_CLOCK,  
TEST_CLK, S_DATA,  
S_LOAD, nP_LOAD,  
M[0:4], M[6:8], N0, N1  
-5  
Input  
Low Current  
IIL  
M5, OE0, OE1,  
XTAL_SEL, VCO_SEL  
VDD = 3.465V, VIN = 0V  
VDDO = 3.3V 5%  
-150  
2.6  
1.8  
V
V
V
V
V
VOH  
Output High Voltage; NOTE 1  
Output Low Voltage; NOTE 1  
VDDO = 2.5V 5%  
VDDO = 1.8V 5%  
VDDO - 0.3  
V
DDO = 3.3V 5% or 2.5V 5%  
0.5  
0.4  
VOL  
VDDO = 1.8V 5%  
NOTE 1: Outputs terminated with 50to VDDO/2. See Parameter Measurement Information section, Output Load Test Circuit diagrams.  
Table 5. Input Frequency Characteristics, VDD = 3.3V 5%, VDDO = 3.3V 5%, 2.5V 5% or 1.8V 5%, TA = 0°C to 70°C  
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
MHz  
MHz  
MHz  
TEST_CLK; NOTE 1  
XTAL; NOTE 1  
S_CLOCK  
14  
14  
40  
40  
50  
fIN  
Input Frequency  
NOTE 1: For the input crystal and TEST_CLK frequency range, the M value must be set for the VCO to operate within the 620MHz to 780MHz  
range. Using the minimum input frequency of 14MHz, valid values of M are 45 M 55. Using the maximum input frequency of 40MHz, valid  
values of M are 16 M 19.  
Table 6. Crystal Characteristics  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
Mode of Oscillation  
Frequency  
Fundamental  
14  
40  
50  
7
MHz  
Equivalent Series Resistance (ESR)  
Shunt Capacitance (CO)  
pF  
ICS84021BY REVISION E AUGUST 18, 2011  
7
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
AC Electrical Characteristics  
Table 7A. AC Characteristics, VDD = VDDO = 3.3V 5%, TA = 0°C to 70°C  
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
260  
Units  
MHz  
ps  
fOUT  
Output Frequency  
103.3  
N = 3  
N = 4  
N = 5  
N = 6  
13.5  
14.7  
16.7  
24.7  
26.4  
34.2  
ps  
42.4  
ps  
40.8  
ps  
tjit(per)  
Period Jitter, RMS; NOTE 1, 2  
M=40, N=4, 16.667MHz XTAL,  
fOUT=166.67MHz  
4.5  
4.6  
6.9  
7.8  
ps  
ps  
M=40, N=5, 16.667MHz XTAL,  
fOUT=133.33MHz  
tsk(o)  
Output Skew; NOTE 2, 3  
Output Rise/Fall Time  
M, N to nP_LOAD  
100  
800  
ps  
ps  
ns  
ns  
ns  
ns  
ns  
ns  
%
tR / tF  
20% to 80%  
100  
5
tS  
Setup Time  
S_DATA to S_CLOCK  
S_CLOCK to S_LOAD  
M, N to nP_LOAD  
5
5
5
tH  
Hold Time  
S_DATA to S_CLOCK  
S_CLOCK to S_LOAD  
5
5
N 3  
44  
56  
55  
M=40, N=4, 16.667MHz XTAL,  
45  
47  
%
odc  
Output Duty Cycle  
fOUT=166.67MHz  
M=40, N=5, 16.667MHz XTAL,  
fOUT=133.33MHz  
53  
1
%
tLOCK  
PLL Lock Time  
ms  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Jitter performance using XTAL inputs.  
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
ICS84021BY REVISION E AUGUST 18, 2011  
8
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 7B. AC Characteristics, VDD = 3.3V 5%, VDDO = 2.5V 5%, TA = 0°C to 70°C  
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
260  
Units  
MHz  
ps  
fOUT  
Output Frequency  
103.3  
N = 3  
N = 4  
N = 5  
N = 6  
11.4  
13.3  
16.0  
19.2  
18.8  
28.3  
ps  
39.8  
ps  
32.4  
ps  
tjit(per)  
Period Jitter, RMS; NOTE 1, 2  
M=40, N=4, 16.667MHz XTAL,  
fOUT=166.67MHz  
4.3  
4.5  
6.2  
7.7  
ps  
ps  
M=40, N=5, 16.667MHz XTAL,  
fOUT=133.33MHz  
tsk(o)  
Output Skew; NOTE 2, 3  
Output Rise/Fall Time  
M, N to nP_LOAD  
90  
ps  
ps  
ns  
ns  
ns  
ns  
ns  
ns  
%
tR / tF  
20% to 80%  
100  
5
800  
tS  
Setup Time  
S_DATA to S_CLOCK  
S_CLOCK to S_LOAD  
M, N to nP_LOAD  
5
5
5
tH  
Hold Time  
S_DATA to S_CLOCK  
S_CLOCK to S_LOAD  
5
5
N 3  
44  
56  
55  
M=40, N=4, 16.667MHz XTAL,  
fOUT=166.67MHz  
45  
47  
%
odc  
Output Duty Cycle  
PLL Lock Time  
M=40, N=5, 16.667MHz XTAL,  
fOUT=133.33MHz  
53  
1
%
tLOCK  
ms  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Jitter performance using XTAL inputs.  
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
ICS84021BY REVISION E AUGUST 18, 2011  
9
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 7C. AC Characteristics, VDD = 3.3V 5%, VDDO = 1.8V 5%, TA = 0°C to 70°C  
Symbol  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
260  
Units  
MHz  
ps  
fOUT  
Output Frequency  
103.3  
N = 3  
N = 4  
N = 5  
N = 6  
9.4  
13.2  
10.8  
12.7  
13.4  
19.6  
ps  
32.5  
ps  
25.4  
ps  
tjit(per)  
Period Jitter, RMS; NOTE 1, 2  
M=40, N=4, 16.667MHz XTAL,  
fOUT=166.67MHz  
5.4  
5.1  
8.3  
8.8  
ps  
ps  
M=40, N=5, 16.667MHz XTAL,  
fOUT=133.33MHz  
tsk(o)  
Output Skew; NOTE 2, 3  
Output Rise/Fall Time  
M, N to nP_LOAD  
90  
ps  
ps  
ns  
ns  
ns  
ns  
ns  
ns  
%
tR / tF  
20% to 80%  
100  
5
800  
tS  
Setup Time  
S_DATA to S_CLOCK  
S_CLOCK to S_LOAD  
M, N to nP_LOAD  
5
5
5
tH  
Hold Time  
S_DATA to S_CLOCK  
S_CLOCK to S_LOAD  
5
5
N 3  
40  
60  
56  
M=40, N=4, 16.667MHz XTAL,  
fOUT=166.67MHz  
44  
48  
%
odc  
Output Duty Cycle  
PLL Lock Time  
M=40, N=5, 16.667MHz XTAL,  
fOUT=133.33MHz  
52  
1
%
tLOCK  
ms  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Jitter performance using XTAL inputs.  
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
ICS84021BY REVISION E AUGUST 18, 2011  
10  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Parameter Measurement Information  
1.65V 5%  
1.65V 5%  
2.05V 5%  
1.25V 5%  
2.05V 5%  
15  
SCOPE  
V
DD,  
V
DDO  
V
DD  
SCOPE  
15Ω  
V
Qx  
DDA  
V
DDO  
Qx  
V
DDA  
GND  
GND  
-
-1.65V 5%  
-1.25V 5%  
3.3V Core/3.3V Output Load AC Test Circuit  
3.3V Core/2.5V Output Load AC Test Circuit  
2.4V 5%  
0.9V 5%  
VOH  
2.4V 5%  
VREF  
V
DD  
SCOPE  
15Ω  
VOL  
V
DDO  
1σ contains 68.26% of all measurements  
2σ contains 95.4% of all measurements  
Qx  
V
DDA  
3σ contains 99.73% of all measurements  
4σ contains 99.99366% of all measurements  
6σ contains (100-1.973x10-7)% of all measurements  
GND  
Histogram  
Reference Point  
(Trigger Edge)  
Mean Period  
(First edge after trigger)  
-0.9V 5%  
3.3V Core/1.8V Output Load AC Test Circuit  
Period Jitter  
VDDO  
80%  
80%  
tR  
Qx  
Qy  
2
20%  
20%  
Q[0:1]  
VDDO  
2
tF  
tsk(o)  
Output Skew  
Output Rise/Fall Time  
ICS84021BY REVISION E AUGUST 18, 2011  
11  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Parameter Measurement Information, continued  
VDDO  
2
Q[0:1]  
tPW  
tPERIOD  
tPW  
x 100%  
odc =  
tPERIOD  
Output Duty Cycle/Pulse Width/Period  
Applications Information  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
Crystal Inputs  
TEST Output  
The unused TEST output can be left floating. There should be no  
trace attached.  
For applications not requiring the use of the crystal oscillator input,  
both XTAL_IN and XTAL_OUT can be left floating. Though not  
required, but for additional protection, a 1kresistor can be tied from  
XTAL_IN to ground.  
LVCMOS Outputs  
All unused LVCMOS outputs can be left floating. We recommend that  
there is no trace attached.  
TEST_CLK Input  
For applications not requiring the use of the test clock, it can be left  
floating. Though not required, but for additional protection, a 1kΩ  
resistor can be tied from the TEST_CLK to ground.  
LVCMOS Control Pins  
All control pins have internal pullups or pulldowns; additional  
resistance is not required but can be added for additional protection.  
A 1kresistor can be used.  
ICS84021BY REVISION E AUGUST 18, 2011  
12  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Overdriving the XTAL Interface  
The XTAL_IN input can accept a single-ended LVCMOS signal  
through an AC coupling capacitor. A general interface diagram is  
shown in Figure 2A. The XTAL_OUT pin can be left floating. The  
maximum amplitude of the input signal should not exceed 2V and the  
input edge rate can be as slow as 10ns. This configuration requires  
that the output impedance of the driver (Ro) plus the series  
resistance (Rs) equals the transmission line impedance. In addition,  
matched termination at the crystal input will attenuate the signal in  
half. This can be done in one of two ways. First, R1 and R2 in parallel  
should equal the transmission line impedance. For most 50Ω  
applications, R1 and R2 can be 100. This can also be  
accomplished by removing R1 and making R2 50. By overdriving  
the crystal oscillator, the device will be functional, but note, the device  
performance is guaranteed by using a quartz crystal.  
VCC  
XTAL_OUT  
R1  
100  
C1  
Rs  
Zo = 50 ohms  
Ro  
XTAL_IN  
.1uf  
R2  
100  
Zo = Ro + Rs  
LVCMOS Driver  
Figure 2A. General Diagram for LVCMOS Driver to XTAL Input Interface  
XTAL_OUT  
C2  
Zo = 50 ohms  
XTAL_I N  
.1uf  
Zo = 50 ohms  
R1  
50  
R2  
50  
LVPECL Driver  
R3  
50  
Figure 2B. General Diagram for LVPECL Driver to XTAL Input Interface  
ICS84021BY REVISION E AUGUST 18, 2011  
13  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Layout Guideline  
Figure 3 shows a schematic example of the ICS84021. In this  
example, a series termination is shown. Additional LVCMOS  
termination approaches are shown in the LVCMOS Termination  
Application Note. In this example, an 18pF parallel resonant crystal  
is used. The C1 = 22pF and C2 = 22pF are approximate values for  
frequency accuracy. The C1 and C2 may be slightly adjusted for  
optimizing frequency accuracy.  
device side of the PCB and the other components can be placed on  
the opposite side.  
Power supply filter recommendations are a general guideline to be  
used for reducing external noise from coupling into the devices. The  
filter performance is designed for wide range of noise frequencies.  
This low-pass filter starts to attenuate noise at approximately 10kHz.  
If a specific frequency noise component is known, such as switching  
power supply frequencies, it is recommended that component values  
be adjusted and if required, additional filtering be added. Additionally,  
good general design practices for power plane voltage stability  
suggests adding bulk capacitances in the local area of all devices.  
As with any high speed analog circuitry, the power supply pins are  
vulnerable to noise. To achieve optimum jitter performance, power  
supply isolation is required. The ICS84021 provides separate power  
supplies to isolate from coupling into the internal PLL.  
In order to achieve the best possible filtering, it is recommended that  
the placement of the filter components be on the device side of the  
PCB as close to the power pins as possible. If space is limited, the  
0.1uF capacitor in each power pin filter should be placed on the  
The schematic example focuses on functional connections and is not  
configuration specific. Refer to the pin description and functional  
tables in the datasheet to ensure the logic control inputs are properly  
set.  
C1  
X1  
C2  
Logic Input Pin Examples  
22p  
22p  
Set Logic  
Input to '1'  
Set Logic  
Input to '0'  
VDD  
VDD  
18pF  
RU1  
1K  
RU2  
Not Install  
U1  
VDD  
To Logic  
Input  
To Logic  
Input  
pins  
1
24  
R7  
M5  
M6  
M7  
M8  
N0  
N1  
nc  
X_OU T  
T_CLK  
2
3
4
5
6
7
8
23  
22  
21  
20  
19  
18  
17  
15 - 24  
pins  
nXTAL_SEL  
VDDA  
VDDA  
RD1  
RD2  
1K  
Not Install  
S_LOAD  
S_DATA  
S_CLOCK  
MR  
C11  
C16  
10u  
0.01u  
GND  
ICS84021  
VDD  
3.3V  
BLM18BB221SN1  
2
1
1
Ferrite Bead  
C18  
10uF  
C14  
0.1u  
C17  
0.1uF  
R1  
43  
Zo = 50 Ohm  
3.3V, 2.5V or 1.8V  
BLM18BB221SN2  
2
VDDO  
R2  
43  
Zo = 50 Ohm  
Ferrite Bead  
C20  
C19  
C15  
0.1u  
0.1uF  
10uF  
Figure 3. ICS84021 Application Schematic Example  
ICS84021BY REVISION E AUGUST 18, 2011  
14  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Reliability Information  
Table 8. θJA vs. Air Flow Table for a 32 Lead LQFP  
θJA by Velocity  
0
Linear Feet per Minut  
1
2.5  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
55.9°C/W  
42.1°C/W  
50.1°C/W  
39.4°C/W  
Transistor Count  
The transistor count for ICS84021 is: 4325  
ICS84021BY REVISION E AUGUST 18, 2011  
15  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Package Outline and Package Dimensions  
Package Outline - Y Suffix for 32 Lead LQFP  
Table 9. Package Dimensions for 32 Lead LQFP  
JEDEC Variation: BBC - HD  
All Dimensions in Millimeters  
Symbol  
Minimum  
Nominal  
Maximum  
N
32  
A
1.60  
0.15  
1.45  
0.45  
0.20  
A1  
0.05  
1.35  
0.30  
0.09  
0.10  
1.40  
0.37  
A2  
b
c
D & E  
9.00 Basic  
7.00 Basic  
5.60 Ref.  
0.80 Basic  
0.60  
D1 & E1  
D2 & E2  
e
L
0.45  
0°  
0.75  
7°  
θ
ccc  
0.10  
Reference Document: JEDEC Publication 95, MS-026  
ICS84021BY REVISION E AUGUST 18, 2011  
16  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Ordering Information  
Table 10. Ordering Information  
Part/Order Number  
84021BY  
84021BYT  
84021BYLF  
84021BYLFT  
Marking  
ICS84021BY  
ICS84021BY  
ICS84021BYLF  
ICS84021BYLF  
Package  
32 Lead LQFP  
32 Lead LQFP  
Shipping Packaging  
Tray  
1000 Tape & Reel  
Tray  
Temperature  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
“Lead-Free” 32 Lead LQFP  
“Lead-Free” 32 Lead LQFP  
1000 Tape & Reel  
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the  
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal  
commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not  
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product  
for use in life support devices or critical medical instruments.  
ICS84021BY REVISION E AUGUST 18, 2011  
17  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Revision History Sheet  
Rev  
Table  
Page  
Description of Change  
Date  
T2  
4
Pin Characteristics Table - added ROUT rows.  
Added Schematic Layout.  
B
12  
1/5/04  
Changed XTAL naming convention to XTAL_IN/XTAL_OUT throughout the data sheet.  
1
2
Features Section - added Lead-Free bullet.  
Updated Parallel & Serial Load Operations Diagram.  
Crystal Characteristics Table - added Drive Level.  
Ordering Information Table - added Lead-Free package.  
C
6/9/05  
T6  
7
T10  
15  
1
Features section - updated RMS period jitter spec in bullet; added RMS phase jitter bullet.  
Block Diagram - added pullups/pulldowns to input pins and added “N” in output divider box.  
Absolute Maximum Ratings - updated Inputs, VI.  
6
6
T4A  
T6  
Power Supply DC Characteristics - updated VDDA, IDD, IDDA and IDDO specs.  
Crystal Characteristics - deleted Drive Level row.  
7
T7A - T7C  
8 - 10  
Updated Period Jitter, Output Rise/Fall Time and Output Duty Cycle specs. Added thermal  
note.  
D
11  
Parameter Measurement Information - corrected Output Load AC Test Circuit diagrams to  
1/5/11  
coincide with 15VDDA  
.
12  
13  
13  
14  
17  
Added Recommendations for Unused Input & Output Pins.  
Deleted Power Supply Filtering Techniques section, added to schematic layout.  
Added Overdriving the XTAL Interface section.  
Updated Layout Guideline and diagram.  
T10  
T7A  
Ordering Information Table - updated Part/Order Numbers and Marking to revision “B”.  
Converted datasheet format.  
8
AC Characteristics Table - corrected Period Jitter N = 4 spec, from 32.2ps max. to 34.2ps  
max.  
E
8/18/11  
13  
Deleted Crystal Input Interface section, added to the schematic.  
ICS84021BY REVISION E AUGUST 18, 2011  
18  
©2011 Integrated Device Technology, Inc.  
ICS84021 Data Sheet  
260MHz, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
We’ve Got Your Timing Solution  
6024 Silver Creek Valley Road Sales  
Technical Support  
800-345-7015 (inside USA)  
netcom@idt.com  
San Jose, California 95138  
+408-284-8200 (outside USA) +480-763-2056  
Fax: 408-284-2775  
www.IDT.com/go/contactIDT  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,  
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not  
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the  
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any  
license under intellectual property rights of IDT or any third parties.  
IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT  
product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third  
party owners.  
Copyright 2010. All rights reserved.  

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