AUIRF2907ZS7PTR [INFINEON]

Power Field-Effect Transistor, 180A I(D), 75V, 0.0038ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PLASTIC, D2PAK-7;
AUIRF2907ZS7PTR
型号: AUIRF2907ZS7PTR
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 180A I(D), 75V, 0.0038ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PLASTIC, D2PAK-7

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PD - 96321  
AUTOMOTIVE GRADE  
AUIRF2907ZS-7P  
HEXFET® Power MOSFET  
Features  
D
V(BR)DSS  
75V  
3.0m  
l Advanced Process Technology  
l UltraLowOn-Resistance  
l 175°COperatingTemperature  
l Fast Switching  
l Repetitive Avalanche Allowed up to Tjmax  
l Lead-Free,RoHSCompliant  
l Automotive Qualified *  
RDS(on) typ.  
G
max.  
3.8m  
S
S (Pin 2, 3, 5, 6, 7)  
G (Pin 1)  
ID (Silicon Limited)  
180A  
Description  
D
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniquestoachieveextremelylowon-resistancepersilicon  
area. Additional features of this design are a 175°C junction  
operating temperature, fast switching speed and improved  
repetitiveavalancherating.Thesefeaturescombinetomake  
this design an extremely efficient and reliable device for use  
in Automotive applications and a wide variety of other  
applications.  
S
S
S
S
S
G
D2Pak 7 Pin  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
These are stress ratings only; and functional operation of the device at these or any other condition beyond those  
indicatedinthespecificationsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiods  
may affect device reliability. The thermal resistance and power dissipation ratings are measured under board  
mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Absolute Maximum Ratings  
Parameter  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Pulsed Drain Current  
Max.  
180  
120  
700  
300  
Units  
A
I
I
I
@ TC = 25°C  
@ TC = 100°C  
D
D
DM  
P
@TC = 25°C  
W
Maximum Power Dissipation  
D
Linear Derating Factor  
2.0  
± 20  
W/°C  
V
V
Gate-to-Source Voltage  
GS  
EAS  
160  
410  
mJ  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested)  
IAR  
See Fig.12a,12b,15,16  
A
EAR  
mJ  
Repetitive Avalanche Energy  
T
J
-55 to + 175  
Operating Junction and  
T
STG  
°C  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
Mounting torque, 6-32 or M3 screw  
300  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.50  
–––  
62  
Units  
RθJC  
Junction-to-Case  
Case-to-Sink, Flat, Greased Surface  
RθCS  
0.50  
–––  
°C/W  
Rθ  
JA  
Junction-to-Ambient  
RθJA  
–––  
40  
Junction-to-Ambient (PCB Mount, steady state)  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
07/20/10  
AUIRF2907ZS-7P  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
VGS = 0V, ID = 250µA  
Reference to 25°C, ID = 1mA  
GS = 10V, ID = 110A  
V(BR)DSS  
∆Β  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
75  
–––  
–––  
2.0  
–––  
–––  
V
V
DSS/ TJ  
0.066  
–––  
V/°C  
RDS(on) SMD  
V
3.0  
–––  
–––  
–––  
–––  
–––  
–––  
3.8  
4.0  
mΩ  
V
VGS(th)  
VDS = VGS, ID = 250µA  
VDS = 25V, ID = 110A  
VDS = 75V, VGS = 0V  
gfs  
IDSS  
94  
–––  
20  
S
Forward Transconductance  
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
µA  
250  
200  
-200  
V
DS = 75V, VGS = 0V, TJ = 125°C  
VGS = 20V  
GS = -20V  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA  
V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units  
Total Gate Charge  
Conditions  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
170  
55  
66  
21  
90  
92  
44  
260  
–––  
–––  
–––  
–––  
–––  
–––  
ID = 110A  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
V
V
V
DS = 60V  
GS = 10V  
DD = 38V  
nC  
ID = 110A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 2.6  
VGS = 10V  
Between lead,  
LD  
D
S
Internal Drain Inductance  
–––  
–––  
4.5  
7.5  
–––  
–––  
6mm (0.25in.)  
from package  
nH  
pF  
G
LS  
Internal Source Inductance  
and center of die contact  
VGS = 0V  
Ciss  
Input Capacitance  
–––  
–––  
–––  
–––  
–––  
–––  
7580  
970  
–––  
–––  
–––  
–––  
–––  
–––  
Coss  
Crss  
Coss  
Coss  
Output Capacitance  
Reverse Transfer Capacitance  
Output Capacitance  
Output Capacitance  
V
DS = 25V  
540  
ƒ = 1.0MHz, See Fig. 5  
3750  
650  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
VGS = 0V, VDS = 60V, ƒ = 1.0MHz  
VGS = 0V, VDS = 0V to 60V  
Coss eff.  
1110  
Effective Output Capacitance  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
S
IS  
Continuous Source Current  
MOSFET symbol  
–––  
–––  
160  
(Body Diode)  
Pulsed Source Current  
showing the  
integral reverse  
A
G
ISM  
–––  
–––  
–––  
–––  
700  
1.3  
(Body Diode)  
p-n junction diode.  
VSD  
T = 25°C, I = 110A, V = 0V  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
V
J
S
GS  
trr  
Qrr  
T = 25°C, I = 110A, VDD = 38V  
–––  
–––  
35  
40  
53  
60  
ns  
nC  
J
F
di/dt = 100A/µs  
ton  
Forward Turn-On Time  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
This value determined from sample failure population starting  
TJ = 25°C, L=0.026mH, RG = 25, IAS = 110A, VGS =10V.  
† This is applied to D2Pak, when mounted on 1" square PCB  
( FR-4 or G-10 Material ). For recommended footprint and  
soldering techniques refer to application note #AN-994.  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C,  
L=0.026mH, RG = 25, IAS = 110A, VGS =10V.  
Part not recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
‡ R is measured at TJ of approximately 90°C.  
θ
„Coss eff. is a fixed capacitance that gives the same  
ˆ Solder mounted on IMS substrate.  
charging time as Coss while VDS is rising from 0 to 80%  
VDSS  
.
2
www.irf.com  
AUIRF2907ZS-7P  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification.  
IR’s Industrial and Consumer qualification level is granted by  
extension of the higher Automotive level.  
Moisture Sensitivity Level  
D2 PAK 7 Pin  
MSL1  
Class M4(425V)  
Machine Model  
(per AEC-Q101-002)  
Class H2(4000V)  
(per AEC-Q101-001)  
Class C4 (1000V)  
(per AEC-Q101-005)  
Yes  
Human Body Model  
ESD  
Charged Device Model  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
www.irf.com  
3
AUIRF2907ZS-7P  
1000  
100  
10  
1000  
100  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
TOP  
TOP  
BOTTOM  
BOTTOM  
4.5V  
4.5V  
10  
60µs PULSE WIDTH  
60µs PULSE WIDTH  
Tj = 175°C  
Tj = 25°C  
1
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 2. Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
200  
150  
100  
50  
1000  
T
= 25°C  
J
100  
10  
1
T
= 175°C  
J
T
= 25°C  
J
T
= 175°C  
J
V
= 10V  
DS  
380µs PULSE WIDTH  
V
= 25V  
DS  
60µs PULSE WIDTH  
0
0.1  
0
25  
50  
75  
100  
125  
150  
1
2
3
4
5
6
7
8
I ,Drain-to-Source Current (A)  
D
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRF2907ZS-7P  
12.0  
10.0  
8.0  
100000  
10000  
1000  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I = 110A  
D
V
V
V
= 60V  
C
C
C
+ C , C  
SHORTED  
ds  
DS  
DS  
DS  
iss  
gs  
gd  
= C  
= 38V  
= 15V  
rss  
oss  
gd  
= C + C  
ds  
gd  
C
iss  
6.0  
C
oss  
4.0  
C
rss  
2.0  
0.0  
100  
0
50  
100  
150  
200  
1
10  
, Drain-to-Source Voltage (V)  
100  
Q
Total Gate Charge (nC)  
V
G
DS  
Fig 5. Typical Capacitance vs.  
Fig 6. Typical Gate Charge vs.  
Drain-to-SourceVoltage  
Gate-to-SourceVoltage  
10000  
1000  
100  
10  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
T
= 175°C  
J
1msec  
100µsec  
10msec  
T
= 25°C  
J
LIMITED BY PACKAGE  
1
1
DC  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
V
= 0V  
1.2  
GS  
0.1  
0.1  
0.1  
1.0  
10.0  
100.0  
0.0  
0.2  
V
0.4  
0.6  
0.8  
1.0  
1.4  
V
, Drain-toSource Voltage (V)  
, Source-to-Drain Voltage (V)  
DS  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
www.irf.com  
5
AUIRF2907ZS-7P  
200  
160  
120  
80  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
I
= 180A  
= 10V  
D
V
GS  
40  
0
-60 -40 -20 0 20 40 60 80 100120140160180  
, Junction Temperature (°C)  
25  
50  
75  
100  
125  
150  
175  
T
T
, Case Temperature (°C)  
J
C
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current vs.  
vs.Temperature  
CaseTemperature  
1
D = 0.50  
0.20  
0.10  
0.05  
0.1  
0.01  
0.02  
0.01  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W) τi (sec)  
τ
J τJ  
τ
Cτ  
0.1072  
0.2787  
0.1143  
0.000096  
0.002614  
0.013847  
τ
τ
1τ1  
τ
2τ2  
3τ3  
SINGLE PULSE  
( THERMAL RESPONSE )  
Ci= τi/Ri  
0.001  
/
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.0001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRF2907ZS-7P  
700  
600  
500  
400  
300  
200  
100  
0
I
D
15V  
TOP  
24A  
34A  
BOTTOM 110A  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
2
V0GVS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
25  
50  
75  
100  
125  
150  
175  
t
p
Starting T , Junction Temperature (°C)  
J
Fig 12c. Maximum Avalanche Energy  
I
vs. Drain Current  
AS  
Fig 12b. Unclamped Inductive Waveforms  
Q
G
10 V  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
Q
Q
GD  
GS  
V
G
Charge  
I
I
I
= 250µA  
= 1.0mA  
= 1.0A  
D
D
D
Fig 13a. Basic Gate Charge Waveform  
Current Regulator  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
.3µF  
-75 -50 -25  
0
T
25 50 75 100 125 150 175 200  
, Temperature ( °C )  
+
V
DS  
J
D.U.T.  
-
V
GS  
3mA  
I
I
D
G
Current Sampling Resistors  
Fig 13b. Gate Charge Test Circuit  
Fig 14. Threshold Voltage vs. Temperature  
www.irf.com  
7
AUIRF2907ZS-7P  
1000  
Duty Cycle = Single Pulse  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming Tj = 25°C due to  
avalanche losses  
100  
10  
1
0.01  
0.05  
0.10  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
200  
150  
100  
50  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
TOP  
Single Pulse  
BOTTOM 1% Duty Cycle  
= 110A  
I
D
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. T = Allowable rise in junction temperature, not to exceed  
T
jmax (assumed as 25°C in Figure 15, 16).  
0
tav = Average time in avalanche.  
25  
50  
75  
100  
125  
150  
175  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
8
www.irf.com  
AUIRF2907ZS-7P  
Driver Gate Drive  
P.W.  
P.W.  
D =  
D.U.T  
Period  
Period  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
LowStrayInductance  
Ground Plane  
LowLeakageInductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple  
5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRF2907ZS-7P  
D2Pak - 7 Pin Package Outline  
Dimensions are shown in millimeters (inches)  
D2Pak - 7 Pin Part Marking Information  
PartNumber  
AUIRF2907ZS-7  
DateCode  
Y= Year  
WW= Work Week  
A= Automotive, Lead Free  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRF2907ZS-7P  
D2Pak - 7 Pin Tape and Reel  
www.irf.com  
11  
AUIRF2907ZS-7P  
Ordering Information  
Base part number  
Package Type  
Standard Pack  
Form  
Complete Part Number  
Quantity  
AUIRF2907ZS-7P  
D2Pak  
Tube  
50  
AUIRF2907ZS-7P  
AUIRF2907ZS7PTL  
AUIRF2907ZS7PTR  
Tape and Reel Left  
Tape and Reel Right  
800  
800  
12  
www.irf.com  
AUIRF2907ZS-7P  
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IRproductsareneitherdesignednorintendedforuseinautomotiveapplicationsorenvironmentsunlessthespecificIRproductsaredesignated  
by IR as compliant with ISO/TS 16949 requirements and bear a part number including the designation “AU”. Buyers acknowledge and agree  
that, if they use any non-designated products in automotive applications, IR will not be responsible for any failure to meet such requirements  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
233 Kansas St., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
13  

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