AUIRLL024Z [INFINEON]

Advanced Process Technology; 先进的工艺技术
AUIRLL024Z
型号: AUIRLL024Z
厂家: Infineon    Infineon
描述:

Advanced Process Technology
先进的工艺技术

晶体 小信号场效应晶体管
文件: 总13页 (文件大小:234K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97762  
AUTOMOTIVE GRADE  
AUIRLL024Z  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
D
V(BR)DSS  
55V  
UltraLowOn-Resistance  
150°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to  
Tjmax  
RDS(on) typ.  
48m  
60m  
G
max.  
S
ID  
5.0A  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
Description  
D
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest pro-  
cessing techniques to achieve extremely low on-  
resistance per silicon area. Additional features of this  
design are a 175°C junction operating temperature,  
fast switching speed and improved repetitive ava-  
lanche rating . These features combine to make this  
design an extremely efficient and reliable device for  
use in Automotive applications and a wide variety of  
other applications.  
S
D
G
SOT-223  
AUIRLL024Z  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
5.0  
Units  
I
I
I
@ TA = 25°C  
@ TA = 70°C  
D
D
4.0  
A
40  
DM  
2.8  
P
P
@TA = 25°C Power Dissipation  
D
D
1.0  
Power Dissipation  
W
W/°C  
V
@TA = 25°C  
0.02  
± 16  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
EAS  
21  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
E
AS (tested )  
38  
IAR  
EAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
mJ  
-55 to + 150  
Operating Junction and  
T
T
J
Storage Temperature Range  
°C  
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
45  
Units  
RJA  
RJA  
Junction-to-Ambient (PCB mount, steady state)  
Junction-to-Ambient (PCB mount, steady state)  
°C/W  
–––  
120  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
02/28/12  
AUIRLL024Z  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
55 ––– –––  
––– 0.049 –––  
Conditions  
VGS = 0V, ID = 250μA  
V/°C Reference to 25°C, ID = 1mA  
GS = 10V, ID = 3.0A  
V(BR)DSS  
V
V(BR)DSS/TJ  
Breakdown Voltage Temp. Coefficient  
–––  
–––  
–––  
1.0  
48  
60  
80  
V
m
RDS(on)  
Static Drain-to-Source On-Resistance  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
VGS = 5.0V, ID = 3.0A  
VGS = 4.5V, ID = 3.0A  
VDS = VGS, ID = 250μA  
VDS = 25V, ID = 3.0A  
100  
3.0  
–––  
20  
VGS(th)  
Gate Threshold Voltage  
V
gfs  
IDSS  
Forward Transconductance  
Drain-to-Source Leakage Current  
7.5  
S
–––  
–––  
–––  
–––  
μA  
V
DS = 55V, VGS = 0V  
VDS = 55V, VGS = 0V, TJ = 125°C  
nA VGS = 16V  
GS = -16V  
250  
200  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
––– -200  
V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Total Gate Charge  
Min. Typ. Max. Units  
Conditions  
Qg  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
7.0  
1.5  
4.0  
8.6  
33  
11  
ID = 3.0A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
nC  
ns  
V
V
DS = 44V  
GS = 5.0V  
VDD = 28V  
ID = 3.0A  
td(off)  
tf  
RG = 56  
VGS = 5.0V  
VGS = 0V  
Turn-Off Delay Time  
Fall Time  
20  
15  
Ciss  
Coss  
Crss  
Coss  
Coss  
Coss eff.  
Input Capacitance  
380  
66  
Output Capacitance  
Reverse Transfer Capacitance  
Output Capacitance  
Output Capacitance  
Effective Output Capacitance  
V
DS = 25V  
ƒ = 1.0MHz  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
36  
pF  
220  
53  
V
V
GS = 0V, VDS = 44V, ƒ = 1.0MHz  
GS = 0V, VDS = 0V to 44V  
93  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
I
S
Continuous Source Current  
–––  
–––  
5.0  
MOSFET symbol  
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
G
I
–––  
–––  
40  
SM  
S
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
15  
1.3  
23  
14  
V
T = 25°C, I = 3.0A, V = 0V  
SD  
J S GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns  
nC  
T = 25°C, I = 3.0A, VDD = 28V  
J F  
di/dt = 100A/μs  
rr  
Q
t
9.1  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical  
repetitive avalanche performance.  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 4.8mH  
†This value determined from sample failure population,  
starting TJ = 25°C, L = 4.8mH, RG = 25, IAS = 3.0A,  
VGS =10V.  
RG = 25, IAS = 3.0A, VGS =10V.  
Part not recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
„ Coss eff. is a fixed capacitance that gives the same  
charging time as Coss while VDS is rising from  
‡When mounted on 1 inch square copper board.  
ˆWhen mounted on FR-4 board using minimum  
recommended footprint.  
0 to 80% VDSS  
.
2
www.irf.com  
AUIRLL024Z  
Qualification Information†  
Automotive  
(per AEC-Q101)  
Comments: This part number(s) passed Automotive  
qualification. IR’s Industrial and Consumer qualification  
level is granted by extension of the higher Automotive  
level.  
Qualification Level  
SOT-223  
MSL1  
Class M1B (+/- 100V)††  
AEC-Q101-002  
Moisture Sensitivity Level  
Machine Model  
Class H0 (+/- 250V)††  
AEC-Q101-001  
Human Body Model  
ESD  
Class C5 (+/- 1125V)††  
AEC-Q101-005  
Charged Device Model  
Yes  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Highest passing voltage.  
www.irf.com  
3
AUIRLL024Z  
100  
10  
1
100  
10  
VGS  
10V  
VGS  
10V  
TOP  
TOP  
9.0V  
7.0V  
5.0V  
4.5V  
4.0V  
3.5V  
3.0V  
9.0V  
7.0V  
5.0V  
4.5V  
4.0V  
3.5V  
3.0V  
BOTTOM  
BOTTOM  
3.0V  
3.0V  
1
60μs PULSE WIDTH  
Tj = 150°C  
60μs PULSE WIDTH  
Tj = 25°C  
0.1  
0.1  
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
10  
T = 25°C  
J
8
T
= 150°C  
J
10  
1
T
= 150°C  
J
6
4
2
0
T
= 25°C  
V
J
V
= 10V  
DS  
300μs PULSE WIDTH  
= 10V  
DS  
60μs PULSE WIDTH  
0.1  
0
2
4
6
8
10  
0
2
4
6
8
10  
12  
I ,Drain-to-Source Current (A)  
D
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRLL024Z  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
10000  
1000  
100  
V
= 0V,  
= C  
f = 1 MHZ  
GS  
I = 3.0A  
D
C
C
C
+ C , C  
SHORTED  
iss  
gs  
gd  
ds  
= C  
V
= 44V  
rss  
oss  
gd  
= C + C  
DS  
V
V
= 28V  
= 11V  
ds  
gd  
DS  
DS  
C
iss  
C
C
oss  
rss  
10  
1
10  
100  
0
1
2
3
4
5
6
7
8
Q
Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
G
DS  
Fig 6. Typical Gate Charge vs.  
Fig 5. Typical Capacitance vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
100  
10  
1
1000  
100  
OPERATION IN THIS AREA  
LIMITED BY R (on)  
DS  
T
= 150°C  
J
10  
100μsec  
1
T
= 25°C  
0.1  
J
1msec  
10msec  
0.01  
0.001  
0.0001  
DC  
T
= 25°C  
A
Tj = 150°C  
V
= 0V  
GS  
Single Pulse  
0
0.0  
0.5  
V
1.0  
1.5  
2.0  
2.5  
3.0  
0.1  
1.0  
10  
100  
1000.0  
, Source-to-Drain Voltage (V)  
V
, Drain-to-Source Voltage (V)  
SD  
DS  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
nce  
Forward Voltage  
www.irf.com  
5
AUIRLL024Z  
2.0  
1.5  
1.0  
0.5  
5
4
3
2
1
0
I
= 3.0A  
D
V
= 10V  
GS  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
25  
50  
75  
100  
125  
150  
T
J
, Junction Temperature (°C)  
T
, Ambient Temperature (°C)  
A
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current vs.  
vs.Temperature  
AmbientTemperature  
100  
D = 0.50  
10  
1
0.20  
0.10  
0.05  
0.02  
0.01  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W) i (sec)  
5.3396 0.000805  
0.1  
J J  
C  
11  
2 2  
33  
19.881 0.706300  
0.01  
0.001  
0.0001  
19.771  
20.80000  
Ci= iRi  
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthja + Tc  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
6
www.irf.com  
AUIRLL024Z  
15V  
100  
80  
60  
40  
20  
0
I
D
TOP  
3.0A  
0.80A  
BOTTOM 0.69A  
DRIVER  
+
L
V
DS  
D.U.T  
AS  
R
G
V
DD  
-
I
A
V
20V  
GS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
2.5  
V
G
Charge  
2.0  
1.5  
1.0  
I
= 250μA  
D
Fig 13a. Basic Gate Charge Waveform  
L
VCC  
DUT  
-75 -50 -25  
0
25  
50  
75 100 125 150  
0
T
, Temperature ( °C )  
1K  
J
Fig 14. Threshold Voltage vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRLL024Z  
100  
10  
Duty Cycle = Single Pulse  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming Tj = 25°C due to  
avalanche losses  
0.01  
1
0.1  
0.05  
0.10  
0.01  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
1.0E+00  
1.0E+01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
25  
20  
15  
10  
5
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
TOP  
BOTTOM 1% Duty Cycle  
= 3.0A  
Single Pulse  
I
D
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
0
25  
50  
75  
100  
125  
150  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
8
www.irf.com  
AUIRLL024Z  
Driver Gate Drive  
P.W.  
P.W.  
D =  
D.U.T  
Period  
Period  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
 Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth µs  
Duty Factor  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRLL024Z  
SOT-223 (TO-261AA) Package Outline  
Dimensions are shown in milimeters (inches)  
SOT-223 (TO-261AA) Part Marking Information  
PartNumber  
AUL024Z  
DateCode  
Y= Year  
WW= Work Week  
A=Automotive,LeadFree  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRLL024Z  
SOT-223 (TO-261AA) Tape & Reel Information  
Dimensions are shown in milimeters (inches)  
4.10 (.161)  
3.90 (.154)  
0.35 (.013)  
0.25 (.010)  
1.85 (.072)  
1.65 (.065)  
2.05 (.080)  
1.95 (.077)  
TR  
7.55 (.297)  
7.45 (.294)  
16.30 (.641)  
15.70 (.619)  
7.60 (.299)  
7.40 (.292)  
1.60 (.062)  
1.50 (.059)  
TYP.  
FEED DIRECTION  
2.30 (.090)  
2.10 (.083)  
7.10 (.279)  
6.90 (.272)  
12.10 (.475)  
11.90 (.469)  
NOTES :  
1. CONTROLLING DIMENSION: MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
3. EACH O330.00 (13.00) REEL CONTAINS 2,500 DEVICES.  
13.20 (.519)  
12.80 (.504)  
15.40 (.607)  
11.90 (.469)  
4
330.00  
(13.000)  
MAX.  
50.00 (1.969)  
MIN.  
18.40 (.724)  
NOTES :  
MAX.  
1. OUTLINE COMFORMS TO EIA-418-1.  
2. CONTROLLING DIMENSION: MILLIMETER..  
3. DIMENSION MEASURED @ HUB.  
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.  
14.40 (.566)  
12.40 (.488)  
4
3
www.irf.com  
11  
AUIRLL024Z  
Ordering Information  
Base part  
Package Type  
Standard Pack  
Form  
Complete Part Number  
Quantity  
95  
AUIRLL024Z  
SOT-223  
Tube  
AUIRLL024Z  
Tape and Reel  
2500  
AUIRLL024ZTR  
12  
www.irf.com  
AUIRLL024Z  
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subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and  
other changes to its products and services at any time and to discontinue any product or services without  
notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific  
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DLA as military-grade, in applications requiring military grade products, is solely at the Buyer’s own risk and  
that they are solely responsible for compliance with all legal and regulatory requirements in connection with  
such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless  
the specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part  
number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
13  

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