BGSA12UGL8 [INFINEON]

BGSA12UGL8 是一款多功能单刀双掷(SPDT)射频天线孔径开关,针对低 Coff 以及高达 6.0 Ghz 的低 Ron 使能应用进行了优化。该单电源芯片集成了 2 位控制逻辑,具有低电流待机模式。与 GaAs 技术不同,0.1 dB 压缩点超出了开关的最大输入功率水平,从而在所有信号电平下实现了线性性能,只有在外部施加直流电压时,才需要射频端口上的外部直流阻塞电容器。由于其极高的 RF 电压耐用性,它适用于在 RF 匹配电路中切换任何无功设备,如电感器和电容器,而不会在质量因素方面造成重大损失。;
BGSA12UGL8
型号: BGSA12UGL8
厂家: Infineon    Infineon
描述:

BGSA12UGL8 是一款多功能单刀双掷(SPDT)射频天线孔径开关,针对低 Coff 以及高达 6.0 Ghz 的低 Ron 使能应用进行了优化。该单电源芯片集成了 2 位控制逻辑,具有低电流待机模式。与 GaAs 技术不同,0.1 dB 压缩点超出了开关的最大输入功率水平,从而在所有信号电平下实现了线性性能,只有在外部施加直流电压时,才需要射频端口上的外部直流阻塞电容器。由于其极高的 RF 电压耐用性,它适用于在 RF 匹配电路中切换任何无功设备,如电感器和电容器,而不会在质量因素方面造成重大损失。

开关 射频 光电二极管 电容器 电感器 射频天线
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BGSA12UGL8  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Features  
SPDT designed for high-linearity antenna aperture switching and  
RF tuning applications  
Ultra low RON resistance of 0.59 Ω at each port in ON state  
Low COFF capacitance of 270 fF at each port in OFF state  
> 40 V RF voltage OFF state handling  
Low harmonic generation  
Supply voltage range: 1.65 to 3.6 V  
Small form factor 1.1 mm x 1.1 mm  
RoHS and WEEE compliant package  
1.1x1.1mm2  
Application  
Impedance Tuning  
Antenna Tuning  
Inductance Tuning  
Tunable Filters  
Product Validation  
Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.  
Block diagram  
ꢃꢄꢄ  
ꢀꢁꢂ  
ꢃꢊꢋꢌꢍꢎꢏ  
ꢀꢏꢎꢐꢋꢍꢌꢊꢑ  
ꢙꢚꢄ  
ꢛꢚꢜ  
ꢂꢅꢀꢆꢇꢈ  
ꢂꢅꢀꢆꢇꢉ  
ꢄꢑꢗꢘꢏꢑ  
ꢂꢒꢍꢑꢎꢏꢓꢐꢔꢓ  
ꢕꢖꢄ  
ꢀꢁꢈ ꢀꢁꢉ  
Data Sheet  
www.infineon.com  
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Table of Contents  
Table of Contents  
Table of Contents  
1
2
1
Features  
2
3
4
5
6
7
8
Maximum Ratings  
3
DC Characteristics  
RF Small Signal Characteristics  
RF Large Signal Parameter  
Logic Table  
6
7
9
11  
11  
12  
Application Information  
Package Information  
Data Sheet  
1
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Features  
1 Features  
SPDT designed for high-linearity antenna aperture switching and RF  
tuning applications  
Ultra low RON resistance of 0.59 Ω at each port in ON state  
Low COFF capacitance of 270 fF at each port in OFF state  
> 40 V RF voltage OFF state handling  
Low harmonic generation  
GPIO control interface - including 4 control states  
Supply voltage range: 1.65 to 3.6 V  
No RF parameter change within supply voltage range  
Small form factor 1.1 mm x 1.1 mm  
Suitable for EDGE/ CDMA/WCDMA/ C2K/ LTE Applications  
RoHS and WEEE compliant package  
Description  
The BGSA12UGL8 is a versatile Single Pole Double Throw (SPDT) RF antenna aperture switch optimized for low COFF as well as  
low RON enabling applications up to 6.0 GHz. This single supply chip integrates with a 2 bits control logic featuring also a low  
current standby mode. Unlike GaAs technology, the 0.1 dB compression point exceeds the switch maximum input power level,  
resulting in linear performance at all signal levels and external DC blocking capacitors at the RF ports are only required if DC  
voltage is applied externally. Due to its very high RF voltage ruggedness, it is suited for switching any reactive devices such as  
inductors and capacitors in RF matching circuits without significant losses in quality factors.  
Product Name  
Marking  
Package  
BGSA12UGL8  
A
TSLP-8-1  
Data Sheet  
2
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Maximum Ratings  
2 Maximum Ratings  
Table 1: Maximum Ratings, Table I at TA = 25 C, unless otherwise specified  
Parameter  
Symbol  
Values  
Unit  
Note / Test Condition  
Min.  
0.4  
Typ.  
Max.  
6
1)  
Frequency Range  
Supply voltage 2)  
f
GHz  
V
VDD  
-0.5  
only for infrequent and short  
duration time periods  
Storage temperature range  
RF input power  
TSTG  
-55  
150  
41  
C  
PRF_max  
dBm  
Pulsed RF input duty cycle of  
25 % and 4620 µs in ON-state,  
measured per 3GPP TS 45.005,  
test condition schematic in  
Fig. 2 and Fig. 3.  
RF voltage  
VRF_max  
50  
V
Short term peaks (1 µs in 0.1 %  
duty cycle), exceeding typical  
linearity, RON and COFF param-  
eters, in Isolation mode, test  
condition schematic in Fig. 1  
ESD capability, CDM 3)  
ESD capability, HBM 4)  
ESD capability, system level (RF port) 5)  
VESD,CDM -1  
VESD,HBM -1  
+1  
+1  
+8  
kV  
kV  
kV  
VESD,ANT  
-8  
RFx vs system GND, with 27 nH  
shunt inductor  
Junction temperature  
TJ  
125  
0
C  
V
Maximum DC-voltage on RF-Ports and RF- VRFDC  
0
No DC voltages allowed on RF-  
Ground  
Ports  
Control Voltage Levels  
VCTRL  
-0.7  
3.3  
V
1) Switch has a low-pass response. For higher frequencies, losses have to be considered for their impact on thermal heating. The DC voltage at RF ports V  
RFDC  
has to be 0 V.  
2) Note: Consider potential ripple voltages on top of V . Including RF ripple, V must not exceed the maximum ratings: V = V + V  
.
RIPPLE  
DD  
DD  
DD  
DC  
3) Field-Induced Charged-Device Model JS-002-2014. Simulates charging/discharging events that occur in production equipment and processes. Potential for  
CDM ESD events occurs whenever there is metal-to-metal contact in manufacturing.  
4) Human Body Model ANSI/ESDA/JEDEC JS-001 (R = 1,5 kΩ, C = 100 pF).  
5) IEC 61000-4-2 (R = 330 , C = 150 pF), contact discharge.  
Warning: Stresses above the max. values listed here may cause permanent damage to the device. Maximum ratings  
are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Expo-  
sure to conditions at or below absolute maximum rating but above the specified maximum operation conditions may  
aꢀect device reliability and life time. Functionality of the device might not be given under these conditions.  
Data Sheet  
3
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Maximum Ratings  
50 Ohm  
Spectrum  
Analyser  
(Hx Monitor)  
SIGNAL  
SOURCE  
50 Ohm Transmission Line  
Power  
Meter  
Vcontrol Vdd  
Vrf  
RFC  
Voltage  
Regulator  
ESD  
ISO  
CTRL 1  
CTRL 2  
Driver  
Chargepump  
RF1 RF2  
GND  
Figure 1: RF operating voltage measurement configuration - OFF mode  
50 Ohm  
SIGNAL  
SOURCE  
50 Ohm Transmission Line  
Vcontrol Vdd  
RFC  
Voltage  
ESD  
Regulator  
ISO  
CTRL 1  
Driver  
CTRL 2  
Chargepump  
Spectrum  
Analyser  
(Hx Monitor)  
RF1 RF2  
GND  
Power  
Meter  
Figure 2: RF operating and Harmonics generation voltage measurement configuration - RF1 ON mode  
Data Sheet  
4
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Maximum Ratings  
50 Ohm  
SIGNAL  
SOURCE  
50 Ohm Transmission Line  
Vcontrol Vdd  
RFC  
Voltage  
Regulator  
ESD  
ISO  
CTRL 1  
CTRL 2  
Driver  
Chargepump  
Spectrum  
Analyser  
(Hx Monitor)  
RF1 RF2  
GND  
Power  
Meter  
Figure 3: RF operating and Harmonics generation voltage measurement configuration - RF2 ON mode  
Data Sheet  
5
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
DC Characteristics  
3 DC Characteristics  
Table 2: Operation Ranges  
Parameter  
Symbol  
Values  
Typ.  
2.8  
Unit  
Note / Test Condition  
Min.  
1.65  
45  
Max.  
3.6  
3501  
Supply voltage  
Supply current  
VDD  
IDD  
V
60  
µA  
1 TA = 85 C,  
PIN = 40 dBm, ON mode  
TA = 40 C...+85 C,  
VDD = 1.65 - 3.6 V  
Supply current in low power mode IDD,LP  
1
µA  
Control voltage low  
Control voltage high  
Control current low  
Control current high  
VCTRL,low  
0
0.45  
2.85  
1
V
VCTRL,high  
ICTRL,low  
ICTRL,high  
1.2  
-1  
1.8  
0
V
VCTRL,high VDD  
µA  
µA  
-1  
0
4
VCTRL,high VDD  
1 MΩ Pull-Down resistor at  
Control Pins  
Ambient temperature  
RF switching time  
TA  
-40  
4.7  
25  
5
85  
C  
tST  
5.5  
µs  
PIN = 0 dBm, Z0 = 50 ,  
TA = 40 C... +85 C  
VDD = 1.65 - 3.6 V  
Ref. Fig. 4 and Fig. 5  
Startup time  
tPUP  
5
6
7
µs  
VDD  
CTRL  
t Pup  
t ST  
90%  
RF Signal  
Figure 4: Power Up settling time and switching time  
VDD  
CTRL  
RF Signal  
Acve  
Close-down  
Start-up  
Figure 5: Timing of Control and RF signals for valid operation  
Data Sheet  
6
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
RF Small Signal Characteristics  
4 RF Small Signal Characteristics  
Parameter  
Symbol  
Values  
Typ.  
Unit  
STATE / Notes  
Min.  
0.4  
0.5  
Max.  
6.0  
0.7  
Frequency range  
RF1 or RF2 to RFc  
ON DC resistance  
RF1 or RF2 to RFc  
OFF DC resistance  
RF1 or RF2 to RFc  
OFF capacitance  
f
GHz  
Ω
RON  
0.59  
42.5  
270  
VDD = 1.65 - 3.6 V,  
TA = 25 C,  
Four-terminal sensing method  
ROFF  
COFF  
38  
45  
kΩ  
235  
305  
fF  
VDD = 1.65 - 3.6 V, TA = 25 C,  
extracted from Isolation (S21) mea-  
surement Z0 = 50 Ω  
Table 3: RF electrical parameters  
Insertion Loss: RF1 to RFc or RF2 to RFc (SPDT mode) (1,2,3)  
Parameter  
Symbol  
Values  
Unit  
STATE / Notes  
Min.  
0.07  
0.20  
0.24  
0.33  
0.40  
0.69  
0.69  
1.3  
Typ.  
0.14  
0.26  
0.31  
0.39  
0.48  
0.88  
1.2  
Max.  
0.25  
0.39  
0.45  
0.55  
0.65  
1.25  
1.75  
698 - 960 MHz  
961 - 1710 MHz  
1711 - 1910 MHz  
1911 - 2169 MHz  
2170 - 2690 MHz  
3300 - 3800 MHz  
3801 - 4800 MHz  
4801 - 6000 MHz  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
ILSPDT  
VDD = 1.65 - 3.6 V, Z0 = 50 ,  
TA = 40 C...+85 C  
1.9  
2.3  
Isolation: RF1 to RFc or RF2 to RFc (SPDT mode) (1,2,3)  
698 - 960 MHz  
961 - 1710 MHz  
1711 - 1910 MHz  
1911 - 2169 MHz  
2170 - 2690 MHz  
3300 - 3800 MHz  
3801 - 4800 MHz  
4801 - 6000 MHz  
23  
15.5  
14.5  
14  
12  
9.5  
9
24  
17  
16  
15  
13.5  
11  
10.5  
8.8  
25  
18  
17  
16  
15  
12  
11.5  
10.5  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
ISOSPDT  
VDD = 1.65 - 3.6 V, Z0 = 50 ,  
TA = 40 C...+85 C  
8
1) Valid for all RF power levels, no compression behavior  
2) SOLT-calibrated, P = 0 dBm  
IN  
3)On application board without any matching components  
Data Sheet  
7
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
RF Small Signal Characteristics  
Table 3: RF electrical parameters (continued)  
Isolation: RFc to RFx (Isolation mode, no switch selection)(1,2,3)  
Parameter  
Symbol  
Values  
Typ.  
18  
11.5  
11  
10  
9
8
Unit  
STATE / Notes  
Min.  
17  
10.5  
10  
9
8
7
6.5  
5.5  
Max.  
19  
12.5  
12  
11  
10  
9
8.5  
8.5  
698 - 960 MHz  
961 - 1710 MHz  
1711 - 1910 MHz  
1911 - 2169 MHz  
2170 - 2690 MHz  
3300 - 3800 MHz  
3801 - 4800 MHz  
4801 - 6000 MHz  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
ISOISO  
VPDD = 1.65 - 3.6 V, Z0 = 50 ,  
TA = 40 C...+85 C  
7.5  
7
Isolation: RF1 to RF2 or RF2 to RF1 (SPDT mode)(1,2,3)  
698 - 960 MHz  
961 - 1710 MHz  
1711 - 1910 MHz  
1911 - 2169 MHz  
2170 - 2690 MHz  
3300 - 3800 MHz  
3801 - 4800 MHz  
4801 - 6000 MHz  
19  
14  
13  
12  
11  
8
21  
16  
15  
14  
13  
10  
9
23  
18  
17  
16  
15  
12  
11  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
ISOSPDT  
VDD = 1.65 - 3.6 V, Z0 = 50 ,  
TA = 40 C...+85 C  
7
6
8
10  
Isolation: RF1 to RF2 or RF2 to RF1 (Isolation mode, no switch selection)(1,2,3)  
698 - 960 MHz  
961 - 1710 MHz  
1711 - 1910 MHz  
1911 - 2169 MHz  
2170 - 2690 MHz  
3300 - 3800 MHz  
3801 - 4800 MHz  
4801 - 6000 MHz  
34  
25  
23  
21  
18  
14  
12  
10  
36  
27  
25  
23  
20  
16  
14  
12  
38  
29  
27  
25  
22  
18  
16  
14  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
ISOISO  
VDD = 1.65 - 3.6 V, Z0 = 50 ,  
TA = 40 C...+85 C  
1) Valid for all RF power levels, no compression behavior  
2) SOLT-calibrated, P = 0 dBm  
IN  
3)On application board without any matching components  
Data Sheet  
8
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
RF Large Signal Parameter  
5 RF Large Signal Parameter  
Table 4: RF large signal specifications at TA = 25 C  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note / Test Condition  
Min.  
Max.  
40  
Max. RF Operating Voltage  
VRF_opr  
V
In Isolation mode, test condition  
schematic in Fig. 1  
for H2/H3 < -40 dBm @ 50 Ω  
RF1 or RF2 in ON mode, test  
condition schematic in Fig. 2 or  
Fig. 3  
Max. RF Operating Power  
VRF_pwr  
40  
dBm  
for H2/H3 < -40 dBm @ 50 Ω  
Harmonic Generation up to 12.75 GHz  
All RF Ports - Second Order Har- PH2  
monics  
95  
105  
120  
90  
-
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
dBc  
25 dBm, 50 Ω, f0 = 824 MHz, test  
condition in Fig. 2 an Fig. 3  
25 dBm, 50 Ω, f0 = 824 MHz, test  
condition in Fig. 2 an Fig. 3  
36 dBm, 50 Ω, f0 = 824 MHz, test  
condition in Fig. 2 an Fig. 3  
36 dBm, 50 Ω, f0 = 824 MHz, test  
condition in Fig. 2 an Fig. 3  
36 dBm, 50 Ω, f0 = 1800 MHz, test  
condition in Fig. 2 an Fig. 3  
25 dBm, 50 Ω, f0 = 1800 MHz, test  
condition in Fig. 2 an Fig. 3  
25 dBm, 50 Ω, f0 = 1800 MHz, test  
condition in Fig. 2 an Fig. 3  
36 dBm, 50 Ω, f0 = 1800 MHz, test  
condition in Fig. 2 an Fig. 3  
25 dBm, 50 Ω  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
110  
80  
90  
90  
95  
All RF Ports - Second Order Har- PH2  
monics  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
100  
100  
105  
120  
90  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
All RF Ports - Second Order Har- PH2  
monics  
AllRFPorts-ThirdOrderHarmon- PH3  
ics  
110  
80  
105  
All RF Ports - Second Order Har- PH2  
monics  
Higher order harmonic products PHx  
Intermodulation Distortion IMD2  
IIP2, low  
IIP2, high  
IIP2L  
IIP2H  
110  
117  
114  
120  
dBm  
dBm  
IIP2 conditions table 5  
Intermodulation Distortion IMD3  
IIP3  
IIP3  
71  
71  
75  
75  
dBm  
dBm  
IIP3 conditions table 6  
SV LTE Intermodulation  
IIP3,SVLTE  
IIP3SV  
SV-LTE conditions table 7  
Data Sheet  
9
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
RF Large Signal Parameter  
Table 5: IIP2 conditions table  
Band  
In-Band Frequency  
Blocker Frequency 1  
Blocker Power 1  
Blocker Frequency 2  
Blocker Power 2  
[MHz]  
2140  
[MHz]  
1950  
[dBm]  
20  
[MHz]  
190  
[dBm]  
-15  
Band 1 Low  
Band 1 High  
Band 5 Low  
Band 5 High  
2140  
1950  
20  
4090  
45  
-15  
881.5  
881.5  
836.5  
836.5  
20  
-15  
20  
1718  
-15  
Table 6: IIP3 conditions table  
Band  
In-Band Frequency  
Blocker Frequency 1  
Blocker Power 1  
Blocker Frequency 2  
Blocker Power 2  
[MHz]  
2140  
[MHz]  
1950  
[dBm]  
20  
[MHz]  
1760  
[dBm]  
-15  
Band 1  
Band 5  
881.5  
836.5  
20  
791.5  
-15  
Table 7: SV-LTE conditions table  
Band  
In-Band Frequency  
Blocker Frequency 1  
Blocker Power 1  
Blocker Frequency 2  
Blocker Power 2  
[MHz]  
872  
[MHz]  
827  
[dBm]  
23  
[MHz]  
872  
[dBm]  
14  
Band 5  
Band 13  
Band 20  
747  
786  
23  
747  
14  
878  
833  
23  
2544  
14  
Data Sheet  
10  
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Application Information  
6 Logic Table  
Table 8: Logic Table  
CTRL 1  
CTRL 2  
Mode  
0
0
1
0
1
Low power mode  
RF2 connected to RFC  
0
1
RF1 connected to RFC  
1
Isolation mode (no switch selection)  
7 Application Information  
Pin Configuration and Function  
ꢀꢁꢊ  
ꢀꢁꢂ  
ꢆꢇꢈ  
ꢉꢈꢈ  
ꢀꢁꢃ  
ꢆꢇꢈ  
ꢊꢋꢀꢌꢍꢃ  
ꢊꢋꢀꢌꢍꢂ  
Figure 6: BGSA12UGL8 Pin Configuration (top view)  
Table 9: Pin Definition and Function  
Pin No.  
1
Name  
RF1  
Function  
RF port  
2
3
4
5
6
7
8
GND  
VDD  
CTL1  
CTL2  
GND  
RF2  
Ground  
DC Supply Voltage  
Control Pin 1  
Control Pin 2  
Ground  
RFport  
RFC  
Common RF  
Data Sheet  
11  
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Package Information  
8 Package Information  
0.39+-00..0031  
1.1±0.05  
0.2±0.035  
0.1 A  
A
4
5
6
7
3
2
1
8
0.4  
0.02 MAX.  
INDEX  
(LASERED)  
STAND OFF  
ALL DIMENSIONS ARE IN UNITS MM  
THE DRAWING IS IN COMPLIANCE WITH ISO 128 & PROJECTION METHOD 1 [  
]
Figure 7: TSLP-8-1 Package Outline (top, side and bottom views)  
TYPE CODE  
DATE CODE  
PIN1 MARKING  
(YW)  
(LASERED)  
Figure 8: Marking Specification (top view): Date code digits Y and W defined in Table 10/11  
Data Sheet  
12  
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Package Information  
Table 10: Year date code marking - digit "Y"  
Year  
"Y"  
0
1
Year  
2010  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
2018  
2019  
"Y"  
0
1
Year  
"Y"  
0
1
2000  
2001  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
2
2
2
3
3
3
4
4
4
5
5
5
6
7
6
7
6
7
8
9
8
9
8
9
Table 11: Week date code marking - digit "W"  
Week  
"W"  
Week  
"W"  
N
P
Week  
"W"  
4
Week  
34  
35  
"W"  
h
j
Week  
45  
"W"  
v
1
A
12  
23  
2
B
13  
24  
5
46  
47  
x
3
C
14  
Q
R
25  
6
36  
37  
k
l
y
4
5
D
E
15  
26  
27  
7
48  
49  
50  
51  
z
16  
S
a
38  
39  
40  
41  
n
p
q
r
8
6
7
F
17  
T
28  
29  
30  
31  
b
c
9
G
H
J
18  
U
V
2
8
9
10  
11  
19  
d
e
52  
3
20  
21  
W
Y
42  
43  
s
53  
M
K
32  
f
t
L
22  
Z
33  
g
44  
u
Data Sheet  
13  
Revision 2.3  
2019-08-13  
BGSA12UGL8  
Low Resistance SPDT Antenna Aperture Switch  
Package Information  
0.25  
0.25  
0.4  
0.4  
copper  
solder mask  
stencil apertures  
ALL DIMENSIONS ARE IN UNITS MM  
Figure 9: Footprint Recommendation  
2
PIN 1  
4
0.5  
INDEX MARKING  
1.25  
ALL DIMENSIONS ARE IN UNITS MM  
THE DRAWING IS IN COMPLIANCE WITH ISO 128 & PROJECTION METHOD 1 [  
]
Figure 10: TSLP-8-1 Carrier Tape  
Data Sheet  
14  
Revision 2.3  
2019-08-13  
Revision History  
Creation of document Revision 2.3, 2019-08-13  
Page or Item  
6
Subjects (major changes since previous revision)  
Updated Vddmin to 1.65V  
Other Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
IMPORTANT NOTICE  
Theinformationgiveninthisdocumentshallinnoevent For further information on technology, delivery terms  
Edition 2019-08-13  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
be regarded as a guarantee of conditions or characteris- and conditions and prices, please contact the nearest  
tics ("Beschaꢀenheitsgarantie"). With respect to any ex- Infineon Technologies Oꢀice (www.infineon.com).  
amples, hints or any typical values stated herein and/or  
any information regarding the application of the prod-  
uct, Infineon Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including without  
limitationwarrantiesofnon-infringementofintellectual  
property rights of any third party. In addition, any infor-  
mation given in this document is subject to customer’s  
WARNINGS  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon Tech-  
nologies oꢀice.  
c
2019 Infineon Technologies AG.  
All Rights Reserved.  
compliance with its obligations stated in this document Except as otherwise explicitly approved by Infineon  
and any applicable legal requirements, norms and stan- Technologies in a written document signed by autho-  
dards concerning customer’s products and any use of rized representatives of Infineon Technologies, Infineon  
the product of Infineon Technologies in customer’s ap- Technologies products may not be used in any applica-  
plications. The data contained in this document is ex- tionswhereafailureoftheproductoranyconsequences  
clusively intended for technically trained staꢀ. It is the of the use thereof can reasonably be expected to result  
responsibility of customer’s technical departments to in personal injury.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Document reference  
Doc_Number  
evaluate the suitability of the product for the intended  
application and the completeness of the product infor-  
mation given in this document with respect to such ap-  
plication.  

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