BUZ102SLE3045A [INFINEON]

Power Field-Effect Transistor, 47A I(D), 55V, 0.024ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC, TO-263, 3 PIN;
BUZ102SLE3045A
型号: BUZ102SLE3045A
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 47A I(D), 55V, 0.024ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC, TO-263, 3 PIN

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中文:  中文翻译
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BUZ 102SL  
Product Summary  
Features  
Drain source voltage  
55  
0.015  
47  
V
V
DS  
N channel  
Drain-Source on-state resistance  
Continuous drain current  
R
Enhancement mode  
DS(on)  
A
I
D
Avalanche rated  
Logic Level  
d  
v/dt rated  
175 ˚C operating temperature  
Pin 1 Pin 2 Pin 3  
Type  
Package  
Ordering Code  
Packaging  
G
D
S
BUZ102SL  
P-TO220-3-1 Q67040-S4010-A2 Tube  
P-TO263-3-2 Q67040-S4010-A6 Tape and Reel  
P-TO263-3-2 Q67040-S4010-A5 Tube  
BUZ102SL E3045A  
BUZ102SL E3045  
Maximum Ratings, at  
T
= 25 ˚C unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
Continuous drain current  
A
I
D
T
= 25 ˚C  
47  
33  
C
T
= 100 ˚C  
C
Pulsed drain current  
= 25 ˚C  
188  
IDpulse  
T
C
Avalanche energy, single pulse  
= 47 A, = 25 V, = 25  
245  
mJ  
E
E
AS  
I
V
R
GS  
D
DD  
12  
6
Avalanche energy, periodic limited by  
Reverse diode d /d  
= 47 A, = 40 V, d  
T
jmax  
AR  
kV/µs  
v
t
d
v
/d  
t
I
V
i/d  
t
= 200 A/  
µ
s,  
S
DS  
T
= 175 ˚C  
jmax  
Gate source voltage  
Power dissipation  
–20  
120  
V
V
P
GS  
W
tot  
T
= 25 ˚C  
C
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
-55... +175  
55/175/56  
˚C  
T , T  
j stg  
Data Book  
1
05.99  
BUZ 102SL  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Characteristics  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leded  
SMD version, device on PCB:  
@ min. footprint  
-
-
-
-
1.25 K/W  
62  
R
R
R
thJC  
thJA  
thJA  
-
-
-
-
62  
40  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
55  
max.  
Static Characteristics  
Drain- source breakdown voltage  
-
-
V
V
V
(BR)DSS  
GS(th)  
DSS  
V
= 0 V, I = 0.25 mA  
D
GS  
1.2  
1.6  
2
Gate threshold voltage, V = V  
GS  
DS  
I = 90 µA  
D
Zero gate voltage drain current  
µA  
I
I
V
V
= 50 V, V = 0 V, T = 25 ˚C  
-
-
0.1  
-
1
DS  
DS  
GS  
j
= 50 V, V = 0 V, T = 150 ˚C  
100  
GS  
j
Gate-source leakage current  
= 20 V, V = 0 V  
-
10  
100 nA  
GSS  
V
GS  
DS  
Drain-Source on-state resistance  
R
DS(on)  
V
V
= 4.5 V, I = 33 A  
-
-
0.021 0.024  
0.0135 0.015  
GS  
GS  
D
= 10 V, I = 33 A  
D
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Data Book  
2
05.99  
BUZ 102SL  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Dynamic Characteristics  
Transconductance  
10  
-
40  
-
S
g
fs  
V
2*I *R  
, I = 33 A  
DS(on)max D  
DS  
D
Input capacitance  
= 0 V, V = 25 V, f = 1 MHz  
1380 1730 pF  
C
C
C
iss  
oss  
V
GS  
DS  
Output capacitance  
= 0 V, V = 25 V, f = 1 MHz  
-
410  
230  
15  
515  
290  
25  
V
GS  
DS  
Reverse transfer capacitance  
= 0 V, V = 25 V, f = 1 MHz  
-
rss  
V
GS  
DS  
Turn-on delay time  
= 30 V, V = 4.5 V, I = 47 A,  
-
ns  
t
t
t
t
d(on)  
V
DD  
GS  
D
R = 3.6 Ω  
G
Rise time  
-
-
-
30  
30  
20  
45  
45  
30  
r
V
= 30 V, V = 4.5 V, I = 47 A,  
GS D  
DD  
R = 3.6 Ω  
G
Turn-off delay time  
= 30 V, V = 4.5 V, I = 47 A,  
d(off)  
V
DD  
GS  
D
R = 3.6 Ω  
G
Fall time  
f
V
= 30 V, V = 4.5 V, I = 47 A,  
GS D  
DD  
R = 3.6 Ω  
G
Data Book  
3
05.99  
BUZ 102SL  
Electrical Characteristics, at T = 25 ˚C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
typ.  
Unit  
min.  
max.  
Dynamic Characteristics  
Gate to source charge  
-
-
-
-
7
10.5 nC  
34.5  
Q
Q
Q
gs  
V
= 40 V, I = 47 A  
D
DD  
Gate to drain charge  
= 40 V, I = 47 A  
23  
60  
4.1  
gd  
V
DD  
D
Gate charge total  
= 40 V, I = 47 A, V = 0 to 10 V  
90  
g
V
DD  
D
GS  
Gate plateau voltage  
= 40 V, I = 47 A  
-
V
V
(plateau)  
V
DD  
D
Reverse Diode  
Inverse diode continuous forward current  
-
-
-
-
-
-
-
47  
188  
1.7  
A
V
I
S
T = 25 ˚C  
C
Inverse diode direct current,pulsed  
I
SM  
T = 25 ˚C  
C
Inverse diode forward voltage  
1.1  
75  
0.15  
V
SD  
V
= 0 V, I = 94 A  
F
GS  
Reverse recovery time  
V = 30 V, I =I , di /dt = 100 A/µs  
115 ns  
0.25 µC  
t
rr  
R
F
S
F
Reverse recovery charge  
Q
rr  
V = 30 V, I =l , di /dt = 100 A/µs  
R
F S  
F
Data Book  
4
05.99  
BUZ 102SL  
Power Dissipation  
Drain current  
I = f (T )  
P
= f (T )  
C
tot  
D
C
parameter: V 10 V  
GS  
BUZ102SL  
BUZ102SL  
130  
W
55  
A
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
45  
40  
35  
P
I
30  
25  
20  
15  
10  
5
0
˚C  
˚C  
190  
0
20 40 60 80 100 120 140 160  
190  
0
20 40 60 80 100 120 140 160  
T
T
C
C
Safe operating area  
I = f (V  
Transient thermal impedance  
)
Z
= f (t )  
D
DS  
thJC p  
parameter : D = 0 , T = 25 ˚C  
parameter : D = t /T  
C
p
BUZ102SL  
BUZ102SL  
10 3  
10 1  
K/W  
A
10 0  
t
= 21.0µs  
p
10 2  
10 -1  
I
I
Z
100 µs  
10 -2  
V
D = 0.50  
0.20  
R
10 1  
10 -3  
0.10  
1 ms  
0.05  
10 ms  
0.02  
single pulse  
10 -4  
0.01  
DC  
V
10 0  
10 -5  
10 -1  
10 0  
10 1  
10 2  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
V
t
p
DS  
Data Book  
5
05.99  
BUZ 102SL  
Typ. output characteristics  
I = f (V  
Typ. drain-source-on-resistance  
= f (I )  
)
DS  
D
R
DS(on)  
D
parameter: t = 80 µs  
p
parameter: V  
GS  
BUZ102SL  
BUZ102SL  
120  
A
Ptot = 120W  
0.080  
b
c
d
e
f
V
[V]  
k
i
GS  
a
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
j
l
h
g
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
6.5  
7.0  
8.0  
10.0  
b
c
d
e
f
f
0.060  
I
0.050  
e
R
g
h
i
0.040  
0.030  
0.020  
d
b
j
k
l
g
k
c
a
h
j
l
i
V
[V] =  
c
GS  
b
0.010  
d
e
f
g
h
i
j
k
l
3.0 3.5 4.0 4.5 5.0  
5.5 6.0 6.5 7.0  
8.0 10.0  
V
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0  
5.0  
0.000  
A
0
10 20 30 40 50 60 70 80  
100  
V
DS  
I
D
Typ. forward transconductance  
Typ. transfer characteristics I = f (V  
)
D
GS  
g = f(I ); T = 25˚C  
parameter: t = 80 µs  
fs  
D
j
p
parameter: g  
V
2 x I x R  
fs  
DS  
D
DS(on)max  
80  
45  
S
35  
30  
A
I
g
25  
40  
20  
0
20  
15  
10  
5
0
V
A
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
5.0  
0
10  
20  
30  
40  
50  
65  
V
I
D
GS  
Data Book  
6
05.99  
BUZ 102SL  
Gate threshold voltage  
= f (T )  
Drain-source on-resistance  
= f (T )  
V
GS(th)  
j
R
DS(on)  
j
parameter : V = V , I = 90 µA  
GS  
DS D  
parameter : I = 33 A, V = 4.5 V  
D
GS  
BUZ102SL  
3.0  
V
0.085  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.070  
0.060  
0.050  
0.040  
0.030  
0.020  
0.010  
0.000  
V
R
98%  
typ  
max  
typ  
min  
˚C  
-60  
-20  
20  
60  
100  
140  
200  
˚C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
T
j
Typ. capacitances  
C = f (V  
Forward characteristics of reverse diode  
I = f (V  
)
)
SD  
DS  
F
parameter: V = 0 V, f = 1 MHz  
parameter: T , t = 80 µs  
GS  
j
p
BUZ102SL  
10 4  
10 3  
A
pF  
10 2  
10 1  
10 0  
Ciss  
C
I
10 3  
Coss  
Crss  
Tj = 25 ˚C typ  
Tj = 175 ˚C typ  
Tj = 25 ˚C (98%)  
Tj = 175 ˚C (98%)  
10 2  
V
0
10  
20  
40  
V
0.0  
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
3.0  
V
V
DS  
SD  
Data Book  
7
05.99  
BUZ 102SL  
Typ. gate charge  
Avalanche Energy E = f (T )  
AS  
j
V
= f (Q  
)
parameter: I = 47 A, V = 25 V  
GS  
Gate  
D
DD  
parameter: I  
= 47 A  
R
= 25 Ω  
D puls  
GS  
BUZ102SL  
260  
mJ  
16  
V
220  
200  
180  
160  
140  
120  
100  
80  
12  
10  
8
E
V
V
V
DS max  
0,2  
0,8  
DS max  
6
4
60  
40  
2
20  
0
0
˚C  
20  
40  
60  
80 100 120 140  
180  
0
10 20 30 40 50 60 70 80  
100  
nC  
T
Q
Gate  
j
Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
BUZ102SL  
66  
V
64  
62  
60  
58  
56  
54  
52  
50  
V
˚C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
Data Book  
8
05.99  

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