CYPD3184A1-24LQXQT [INFINEON]

PG-VQFN-24 tape and reel packing secondary side controller with PD controller and synchronous rectifier with optocoupler-feedback for USB PD charger and adapters;
CYPD3184A1-24LQXQT
型号: CYPD3184A1-24LQXQT
厂家: Infineon    Infineon
描述:

PG-VQFN-24 tape and reel packing secondary side controller with PD controller and synchronous rectifier with optocoupler-feedback for USB PD charger and adapters

光电二极管
文件: 总28页 (文件大小:403K)
中文:  中文翻译
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EZ-PD™ PAG1S - CYPD3184  
USB PD power adapter SR controller  
General description  
EZ-PD™ PAG1S is an integrated synchronous rectifier (SR) controller and charging port controller. EZ-PD™ PAG1S  
is designed to fit into a traditional primary-controlled flyback system with secondary-side sensing and regulation.  
EZ-PD™ PAG1S is targeted towards power adapters, it fits well into high-efficiency AC-DC flyback designs for USB  
Power Delivery, Qualcomm Quick Charge, and other standard charging protocols. EZ-PD™ PAG1S also supports  
USB Power Delivery (USB PD) programmable power supply (PPS) mode.  
Applications  
• USB PD 3.0 PPS power adapter  
• Quick Charge 4.0 power adapter  
• Power adapters supporting both USB PD and legacy charging  
Features  
• Integrates secondary-side regulation, synchronous rectifier (SR), and charging port controller  
• Optimized efficiency across line and load range  
• Supports both critical conduction mode (CrCM) and valley switching mode  
• Switching frequency range of 20 kHz to 150 kHz  
• Supports constant voltage (CV) and constant current (CC) modes of operation.  
• Configurable overvoltage protection (OVP), undervoltage protection (UVP), overcurrent protection (OCP), short  
circuit protection (SCP), and over-temperature protection (OTP)  
• Supports USB PD2.0, PD 3.0 with PPS, QC4+, QC 4.0, QC 3.0, QC 2.0, Samsung AFC, Apple charging, and BC v1.2  
charging protocols  
• Integrates low-side current sense amplifier (LSCSA), 2x VBUS discharge FETs, and a NFET gate driver to drive  
the load switch  
• Protects against accidental VBUS to CC short; ESD protection on CC, VBUS, and DP/DM lines  
• 24-QFN package with –40°C to +105°C extended industrial temperature range  
Functional block diagram  
SR_CPN  
VDDD  
VCCD  
VBUS_C  
SR_CPP  
SR_GDRV  
V
VBUS_IN  
VBUS_CTRL  
OV, UV  
OV, UV  
SR Sense  
Slew Rate  
Controlled NFET  
Gate Driver  
SR_VSS  
SR_SEN  
VBUS_IN  
Discharge  
SR Gate Driver  
and Doubler  
VBUS_C  
Discharge  
LDO  
Zero Crossing  
Detect (ZCD)  
Negative Sense  
HV  
Regulator  
CC1  
CC2  
BMC  
PHY  
Protocol Engine  
DP_GPIO5  
DM_GPIO4  
CC  
Charger  
Detect  
VBUS_IN  
ADC  
CV  
Reference  
Reference  
Error  
Amplifier  
(CV)  
Error  
Amplifier  
(CC)  
LSCSA  
FB  
XRES  
GPIOs  
POR/RESET  
IDACs  
SCP  
CSN  
EA_OUT  
CC_COMP_GPIO2  
VSS  
GPIO3  
CSP  
GPIO0  
GPIO1  
Datasheet  
www.infineon.com  
Please read the Important Notice and Warnings at the end of this document  
page 1 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Table of contents  
Table of contents  
General description ...........................................................................................................................1  
Applications......................................................................................................................................1  
Features ...........................................................................................................................................1  
Functional block diagram...................................................................................................................1  
Table of contents...............................................................................................................................2  
1 Pinout............................................................................................................................................3  
1.1 Pin description ........................................................................................................................................................5  
2 Application overview ......................................................................................................................9  
2.1 USB Power Delivery power adapter.......................................................................................................................9  
3 Functional description ..................................................................................................................10  
3.1 Start-up behavior..................................................................................................................................................10  
3.2 Fault protection ....................................................................................................................................................10  
3.3 Power modes ........................................................................................................................................................10  
4 Electrical specifications.................................................................................................................11  
4.1 Absolute maximum ratings ..................................................................................................................................11  
4.2 Device-level specifications ...................................................................................................................................12  
4.3 Functional block specifications ...........................................................................................................................13  
4.4 I/O specifications ..................................................................................................................................................19  
4.5 System resources specifications..........................................................................................................................20  
5 Ordering information ....................................................................................................................21  
5.1 Ordering code definitions.....................................................................................................................................21  
6 Packaging ....................................................................................................................................22  
7 Acronyms.....................................................................................................................................24  
8 Document conventions..................................................................................................................26  
8.1 Units of measure ...................................................................................................................................................26  
Revision history ..............................................................................................................................27  
Datasheet  
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USB PD power adapter SR controller  
Pinout  
1
Pinout  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
SR_GDRV  
SR_VSS  
SR_SEN  
XRES  
VBUS_C  
DP_GPIO5  
DM_GPIO4  
VSS  
EPAD  
CC1  
GPIO0  
GPIO1  
CC2  
Figure 1  
24-pin QFN pin map  
Datasheet  
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USB PD power adapter SR controller  
Pinout  
Table 1  
EZ-PD™ PAG1S pin description  
Pin name  
Pin number  
Description  
1
2
3
4
SR_GDRV  
SR_VSS  
SR_SEN  
XRES  
Synchronous-rectifier NFET gate driver  
Synchronous-rectifier NFET ground terminal  
Synchronous-rectifier NFET drain terminal  
External reset input  
5
GPIO0  
GPIO P0.0  
6
GPIO1  
GPIO P0.1  
7
8
9
CC_COMP_GPIO2  
EA_OUT  
FB  
Pin for constant current mode compensation capacitor/GPIO P0.2  
Error amplifier output  
Error amplifier feedback  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
CSN  
CSP  
GPIO3  
CC2  
CC1  
VSS  
Low-side current sense amplifier negative input  
Low-side current sense amplifier positive input  
GPIO P0.3  
Power Delivery communication channel 2  
Power Delivery communication channel 1  
Ground  
USB D-/SWD_DATA/GPIO P0.4  
USB D+/SWD_CLK/GPIO P0.5  
USB Type-C VBUS monitor input  
Load switch NFET gate control  
Power source input  
1.8-V core voltage LDO output  
3.0 V–5.5 V internal LDO Output  
SR doubler capacitor negative pin  
SR doubler capacitor positive pin  
EPAD for ground  
DM_GPIO4  
DP_GPIO5  
VBUS_C  
VBUS_CTRL  
VBUS_IN  
VCCD  
VDDD  
SR_CPN  
SR_CPP  
EPAD  
Datasheet  
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USB PD power adapter SR controller  
Pinout  
1.1  
Pin description  
SR_GDRV, SR_VSS, SR_SEN, SR_CPP, SR_CPN.  
EZ-PD™ PAG1S senses the voltage across the SR NFET and appropriately controls the gate driver to achieve  
optimum efficiency. The gate driver (SR_GDRV) can be driven to internal VDDD or twice of VDDD to achieve better  
RDS-On of the external NFET. The Gate Driver can be driven to twice of VDDD using an internal doubler circuit,  
with the doubler capacitor connected across SR_CPP and SR_CPN pins. The source terminal of the SR FET shall  
be connected to SR_VSS pin.  
EZ-PD™ PAG1S supports SR in QR/CrCM and valley switching. The SR sense block supports negative sense detect  
and Zero Crossing Detect (ZCD). The voltage at the drain node of the external NFET is sensed using a resistive  
divider. The internal resistor is 2 k, the external resistor needs to be chosen such that the voltage at the SR_SEN  
pin does not exceed 21.5 V.  
The external resistance on SR_SEN pin depends on turns ratio of power transformer. Table 2 provides the values  
required for various values of turns ratio.  
Table 2  
External resistance on SR_SEN vs turns ratio  
Primary : Secondary turns ratio  
Rext ()  
10K  
9K  
4:1  
5:1  
6:1  
7:1  
8:1  
9:1  
10:1  
8K  
7K  
6K  
5K  
4K  
The fast-negative sense comparator can detect a minimum negative voltage of 100 mV to –200 mV on SR_SEN  
pin. Similarly, ZCD can detect a minimum threshold of –16 mV to 0 mV on the SR_SEN pin. See Figure 2 and  
Figure 3 for the waveforms representing the SR_GDRV functionality in CrCM and valley switching mode.  
Datasheet  
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USB PD power adapter SR controller  
Pinout  
Both FET OFF  
Primary FET OFF,  
SR FET ON  
Primary FET OFF,  
SR FET ON  
Primary FET ON,  
SR FET OFF  
Primary FET ON,  
SR FET OFF  
Primary Current  
Secondary Current  
Feed forward sensing  
Peak detect  
SR_SEN  
ZCD  
Negative sense  
detect  
SR_GDRV  
Time  
Figure 2  
SR_SEN and SR_GDRV in QR/CrCM mode  
Datasheet  
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USB PD power adapter SR controller  
Pinout  
Both FET OFF  
Primary FET OFF,  
SR FET ON  
Primary FET OFF,  
SR FET ON  
Primary FET ON,  
SR FET OFF  
Primary FET ON,  
SR FET OFF  
Primary Current  
Secondary Current  
Feed forward sensing  
Valley detect  
SR_SEN  
ZCD  
Negative sense  
detect  
SR_GDRV  
Time  
Figure 3  
SR_SEN and SR_GDRV in valley switching mode  
1.1.1  
FB, EA_OUT, CC_COMP_GPIO2  
EZ-PD™ PAG1S integrates two error amplifier blocks which handles secondary output sensing and regulation for  
CV and CC modes. This block is responsible for both constant voltage and constant current operations. The  
output of the error amplifier is routed to the EA_OUT pin. EA_OUT can further drive an opto-isolator to provide  
feedback to the primary controller. The negative input of the error amplifier is the feedback (FB) pin and the  
positive input is internal reference of 0.744 V. The FB pin has internal resistor divider of 200 kand 35 k, this  
divider sets a default voltage of 0.744 V at FB pin when VBUS_IN is at 5V. Based on the desired VBUS_C output,  
the voltage at the FB pin will be varied using internal current source/sink IDACs. An external compensation  
network is required between FB pin and EA_OUT pin, as shown in Figure 4.  
Constant current operation makes use of an internal LSCSA, the output of which feeds into an independent error  
amplifier as shown in Figure 4. EZ-PD™ PAG1S error amplifier can ensure constant voltage regulation over 3.3 V  
to 21.5 V range and constant current regulation over 1 A to 3 A as required by the USB PD PPS specification.  
1.1.2  
CC1, CC2  
CC1 and CC2 are the communication channels for USB PD protocol. EZ-PD™ PAG1S integrates a USB PD  
transceiver consisting of a transmitter and receiver that communicate biphase mark code (BMC) encoded data  
over the configuration channel (CC) channels as per the USB PD standard. All communication is half-duplex. The  
physical layer implements collision avoidance to minimize communication errors on the channel. This block  
includes all termination resistors (Rp) and their switches as required by the USB PD specification. An external  
390-pF capacitor is required on both the CC1 and CC2 pins.  
Datasheet  
7 of 28  
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USB PD power adapter SR controller  
Pinout  
1.1.3  
DP_GPIO4, DM_GPIO5  
The DP and DM lines are the standard USB D+ and D– lines. EZ-PD™ PAG1S integrates a charge detect block, which  
handles legacy charging protocols such as BC 1.2, Quick Charge, Apple charging, and Samsung AFC. This block  
integrates all the terminations required for these charging protocols and no external components are required.  
When legacy charging is not required in the system, the same DP and DM lines can be reused as standard GPIOs.  
1.1.4  
VBUS_IN, VDDD, VCCD  
EZ-PD™ PAG1S integrates a high-voltage regulator, which is powered from the VBUS_IN rail, the output of the  
regulator powers the VDDD rail. The input to the regulator can range from 3.3 V minimum to 21.5 V maximum.  
When the input is between 5.5 V to 21.5 V, the typical output of the regulator is 5 V. For inputs from 3.3 V to 5.5 V,  
the regulator output is VBUS_IN – 300 mV.  
The regulator can drive a maximum load current of 50 mA, which includes the chip current consumption. This  
regulator is not expected to drive any external loads or ICs. EZ-PD™ PAG1S also has an internal configurable  
discharge path for the VBUS_IN rail, which is used to discharge the VBUS rail during negative voltage transitions.  
The regulated supply VDDD, is either used to directly power some internal analog blocks or further regulated  
down to 1.8 V VCCD, which powers majority of the core. VDDD and VCCD is brought out on to pins to connect  
external capacitors for regulator stability, these are not meant to be used as power supplies.  
1.1.5  
VBUS_C, VBUS_CTRL  
VBUS_C is used to monitor the voltage at the Type-C connector. VBUS_C has an internal configurable discharge  
path, which is used to discharge the VBUS_C rail during negative voltage transitions.  
The load switch is between VBUS_IN and VBUS_C. EZ-PD™ PAG1S integrates a NFET gate driver to control this  
load switch. VBUS_CTRL is the output of this gate driver. To turn off the external NFET, the gate driver drives low.  
To turn on the external NFET, it drives the gate to VBUS_IN + 8 V. In addition, there is a clamp circuit to limit the  
gate to VBUS_IN + 8 V.  
1.1.6  
CSP, CSN  
EZ-PD™ PAG1S integrates a LSCSA to monitor the load current. CSP is the positive input pin for the LSCSA and  
CSN is the negative input. LSCSA offers wide gain options ranging from 5 to 150. Suggested Rsense for LSCSA is  
5 m. LSCSA has an active offset cancellation mechanism to improve accuracy.  
1.1.7  
GPIO0, GPIO1, and GPIO3  
EZ-PD™ PAG1S has six GPIOs, out of which three are dedicated GPIOs and the rest are multiplexed with other  
functionalities. During power-on and reset, the I/O pins (except GPIO1) are forced to the tristate so as not to  
crowbar any inputs and/or cause excess turn-on current. GPIO1 is driven to zero at power-up.  
1.1.8  
XRES  
The XRES pin can be used to initiate a reset, this pin is internally pulled high and needs to be pulled low externally  
to trigger reset.  
Datasheet  
8 of 28  
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USB PD power adapter SR controller  
Application overview  
2
Application overview  
2.1  
USB Power Delivery power adapter  
Figure 4 shows a power adapter application diagram implementing a primary side controlled synchronous  
flyback system. In this system, EZ-PD™ PAG1S engages the error amplifier to take the feedback from the  
secondary side and pass it on to the primary controller over an isolation barrier like an opto-isolator. The primary  
side controller can be any standard flyback controller. In this topology, EZ-PD™ PAG1S integrates three key  
features: secondary side sensing and regulation, SR, and charging port controller.  
Full-bridge  
Snubber  
VBUS_TypeC  
VBUS_IN  
Rectifier  
EMI  
Filter  
CC_COMP_GPIO2  
GD  
CS  
CC1  
VDD700  
CC2  
EA_OUT  
Primary  
Flyback  
Controller  
DP_GPIO5  
DM_GPIO4  
EZ-PD· PAG1S  
FB  
FB  
GPIO1  
GPIO0  
GND  
Temperature  
Sensor  
Primary Side  
Secondary Side  
Figure 4  
Power adapter with primary side control application diagram  
Datasheet  
9 of 28  
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USB PD power adapter SR controller  
Functional description  
3
Functional description  
3.1  
Start-up behavior  
On power-up, the primary side flyback controller shall start controlling the primary switch using its internal  
primary peak current limited soft start mechanism and provide sufficient current to charge the secondary side  
output capacitor and the startup current required for EZ-PD™ PAG1S. The secondary output voltage is the input  
power supply source of EZ-PD™ PAG1S. Once this voltage at VBUS_IN crosses 3.3 V, EZ-PD™ PAG1S gets powered  
up. EZ-PD™ PAG1S firmware boot-up time is in the order of a few milliseconds. Once the boot-up is complete,  
EZ-PD™ PAG1S configures the error-amplifier to achieve 5 V secondary output. The output of the error-amplifier  
is passed on to the primary controller through an opto-coupler.  
3.2  
Fault protection  
3.2.1  
VBUS UVP and OVP  
VBUS undervoltage and overvoltage faults are monitored using internal VBUS_IN/VBUS_C resistor dividers. The  
fault thresholds and response times are configurable in EZ-PD™ PAG1S. Configurability includes choosing  
between auto-restart or latch-off options for each fault.  
3.2.2  
VBUS OCP and SCP  
VBUS overcurrent and short-circuit faults are monitored using internal current sense amplifiers. Same as OVP and  
UVP, the OCP and SCP fault thresholds and response times are configurable as well. Configurability includes  
choosing between auto-restart or latch-off options for each fault.  
3.2.3  
OTP  
Overtemperature monitoring is done using an external thermistor and internal ADC. The thermistor can be  
connected to any free GPIO.  
3.2.4  
ESD protection  
EZ-PD™ PAG1S offers ESD protection on all the pins. The ESD protection level is 2.2-kV HBM and 500-V CDM.  
3.2.5  
VBUS to CC short protection  
EZ-PD™ PAG1S offers protection against accidental short from VBUS_C pin short to CC.  
3.3  
Power modes  
EZ-PD™ PAG1S supports three power modes - Active, Sleep, and Deep Sleep. Transitions between these modes  
is handled by the device depending on the operating conditions.  
Datasheet  
10 of 28  
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USB PD power adapter SR controller  
Electrical specifications  
4
Electrical specifications  
4.1  
Absolute maximum ratings  
Table 3  
Absolute maximum ratings[1]  
Description  
Parameter  
VBUS_IN_MAX  
VDDD_MAX  
Min  
Typ  
Max  
24  
6
Unit Details/conditions  
Maximum input supply voltage  
Maximum supply voltage  
Maximum voltage on SR_SEN  
pin  
GPIO voltage  
V_SR_DRAIN_MAX  
VGPIO_ABS  
–0.5  
24  
V
VDDD + 0.5  
Maximum voltage on CC1, CC2  
voltage  
Current per GPIO  
Electrostatic discharge human  
body model  
Electrostatic discharge charged  
device model  
VCC_PIN_ABS  
IGPIO_ABS  
24  
25  
mA  
V
ESD_HBM  
2200  
ESD_CDM  
I_LU  
500  
Pin current for latch-up  
–100  
100  
mA  
Note  
1. Usage of the absolute maximum conditions listed in Table 3 may cause permanent damage to the device.  
Exposure to absolute maximum conditions for extended periods of time may affect device reliability. The  
maximum storage temperature is 150°C in compliance with JEDEC Standard JESD22-A103, High Temperature  
Storage Life. When used below absolute maximum conditions but above normal operating conditions, the  
device may not operate to specification.  
Datasheet  
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USB PD power adapter SR controller  
Electrical specifications  
4.2  
Device-level specifications  
Table 4  
DC specifications  
Spec ID  
Parameter  
Description  
Min  
Typ Max Unit Details/conditions  
VDDD output for 5.5 V   
SID.PWR.1  
VDDD_REG  
4.6  
5.0 5.4  
V
BUS_IN 21.5 V  
ILOAD = 0-50 mA  
VDDD output for 3.3 V   
BUS_IN 5.5 V  
Power supply input voltage  
Output voltage for core  
logic  
Bypass capacitor for VCCD  
VBUS_IN  
0.3  
SID.PWR.2  
SID.PWR.4  
SID.PWR.6  
SID.PWR.8  
SID.PWR.9  
VDDD_MIN  
VBUS_IN  
VCCD  
21.5  
V
V
3.3  
1.8  
1
Cefc  
0.8  
1.8  
1.2  
2.2  
X5R ceramic or  
better  
Decoupling capacitor for  
VDDD  
Cexc  
Decoupling  
µF  
Decoupling capacitor for  
VBUS_IN  
SID.PWR.10  
Cexv  
1
capacitor required  
near the IC pin.  
Capacitor between SR_CPP  
and SR_CPN pins  
X5R ceramic or  
better  
SID.PWR.10A Cexcpp  
0.1  
V
BUS_IN = 5 V,  
Active current from VBUS_IN  
in Type-C attached state  
SID.PWR.15  
SID.PWR.16  
IDD_A  
25  
TA = 25°C,  
CC1/CC2 in TX or RX  
VBUS_IN = 5 V,  
TA = 25°C,  
Type-C attached  
Sleep current from VBUS_IN  
in Type-C attached state  
IDD_S_UA  
3.5  
mA  
VBUS_IN = 5 V,  
TA = 25°C,  
Type-C unattached,  
CPU OFF,  
UVOV block ON,  
WDT Wakeup ON.  
Deep Sleep current from  
VBUS_IN (Type-C  
SID.PWR#16_A I_DS_UA  
0.75  
unattached)  
Voltage allowed on SR_SEN  
pin  
SID.PWR.17  
V_SR_DRAIN  
–0.7  
21.5  
V
Table 5  
AC specifications  
Spec ID  
Parameter  
Description  
Min  
Typ Max Unit Details/conditions  
SID.PWR.14  
Tsleep  
Wakeup from Sleep mode  
0
µs  
Wakeup from Deep Sleep  
mode  
SID.PWR.14A Tdeepsleep  
35  
µs  
Datasheet  
12 of 28  
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USB PD power adapter SR controller  
Electrical specifications  
4.3  
Functional block specifications  
Table 6  
ADC specifications  
Spec ID  
DC specifications  
Parameter  
Description  
Min Typ Max  
Unit Details/conditions  
SID.ADC.1  
Resolution  
ADC resolution  
8
Bits  
Reference voltage =  
VREF_ADC1  
Reference voltage =  
VREF_ADC2  
SID.ADC.2  
INL  
–2.5  
2.5  
Integral nonlinearity  
SYS.ADC.3  
SYS.ADC.4  
INL  
–1.5  
–2.5  
1.5  
2.5  
LSB Reference voltage =  
VREF_ADC1  
DNL  
Differential nonlinearity  
Gain error  
Reference voltage =  
VREF_ADC2  
SYS.ADC.5  
SYS.ADC.6  
DNL  
–1.5  
–1.5  
1.5  
1.5  
Gain Error  
Reference voltage  
generated from  
SYS.ADC.7  
SYS.ADC.8  
VREF_ADC1  
VREF_ADC2  
VDDDmin  
VDDDmax  
VDDD  
ADC reference voltage  
V
Reference voltage  
generate from  
bandgap  
1.96  
2.0  
2.04  
AC specifications  
Rate of change of  
sampled voltage signal  
Guaranteed by  
design  
SID.ADC.9  
Slew_Max  
3
V/ms  
Datasheet  
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USB PD power adapter SR controller  
Electrical specifications  
Table 7  
Spec ID  
Error amplifier  
Parameter  
Description  
Min Typ Max  
Unit Details/conditions  
DC specifications  
VBUS voltage regulation  
accuracy  
Off-state EA_OUT  
current  
SID.DC.VR.1  
SID.DC.VR.2  
VR  
± 3  
2.2  
± 5  
10  
%
Ika_off  
Ika_on  
µA  
Current through  
EA_OUT pin when in  
Sink mode for  
SID.DC.VR.3  
5
mA  
optocoupler application  
Differential nonlinearity  
of NMOS DAC  
Integral nonlinearity of  
NMOS DAC  
SID.DC.VR.4  
SID.DC.VR.5  
SID.DC.VR.6  
SID.DC.VR.7  
SID.DC.VR.8  
SID.DC.VR.9  
DNL_ndac  
INL_ndac  
–1  
–1.5  
–8  
1
1.5  
8
LSB  
%
Gain_  
error_ndac  
Gain error of NMOS DAC  
Differential nonlinearity  
of PMOS DAC  
Integral nonlinearity of  
PMOS DAC  
DNL_pdac  
INL_pdac  
–0.5  
–1  
0.5  
1
LSB  
%
Gain_  
error_pdac  
Gain error of PMOS DAC  
–8  
8
Table 8  
Spec ID  
LSCSA, SCP  
Parameter  
Description  
Min Typ Max  
Unit Details/conditions  
DC specifications  
SID.LSCSA.1  
Cin_inp  
CSP input capacitance  
CSA accuracy with  
5 mV < Vsense < 10 mV  
CSA accuracy with  
10 mV < Vsense < 15 mV  
CSA accuracy with  
15 mV < Vsense  
Short circuit trip point  
with threshold set to 6 A  
10  
15  
pF  
%
SID.LSCSA.2  
Csa_Acc1  
Csa_Acc2  
Csa_Acc3  
SCP_6A  
–15  
SID.LSCSA.3  
SID.LSCSA.4  
SID.LSCSA.5  
–10  
–5  
6
10  
5
5.4  
6.6  
A
Rsense = 5 m  
Short circuit trip point  
with threshold set to  
10 A  
CSA gain values  
supported: 5,10, 20, 35,  
50, 75, 125, 150  
SID.LSCSA.6  
SID.LSCSA.8  
SCP_10A  
Av  
9
5
10  
11  
150  
Datasheet  
14 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Electrical specifications  
Table 8  
Spec ID  
LSCSA, SCP (continued)  
Parameter  
Description  
Min Typ Max  
Unit Details/conditions  
AC specifications  
Delay from OCP  
threshold trip to  
external NFET gate turn  
off  
Delay from SCP  
threshold trip to  
external NFET gate turn  
off  
Delay from SCP  
threshold trip to  
external NFET power  
gate turn off  
SID.LSCSA.AC.1 Tocp_gate  
4
20  
1 nF NFET gate  
µs  
SID.LSCSA.AC.2 Tscp_gate  
SID.LSCSA.AC.3 Tscp_gate_1  
3.1  
7.5  
capacitance  
3 nF NFET gate  
capacitance  
Table 9  
Spec ID  
VBUS UV, OV  
Parameter  
Description  
Min Typ Max  
Unit Details/conditions  
DC specifications  
Over-Voltage threshold  
Accuracy, 4 V to 11 V  
Over-Voltage threshold  
Accuracy, 11 V to 21.5 V  
Under-Voltage  
threshold Accuracy, 3 V  
to 3.3 V  
Under-Voltage  
threshold Accuracy,  
3.3 V to 4.0 V  
Under-Voltage  
threshold Accuracy,  
4.0 V to 11 V  
Under-Voltage  
threshold Accuracy, 11 V  
to 21.5 V  
SID.UVOV.1  
SID.UVOV.2  
VTHOV1  
–3  
3
VTHOV2  
VTHUV1  
–3.2  
3.2  
SID.UVOV.3  
SID.UVOV.4  
SID.UVOV.5  
SID.UVOV.6  
–4  
–3.5  
–3  
4
%
VTHUV2  
VTHUV3  
VTHUV4  
3.5  
3
–2.9  
2.9  
AC specifications  
Delay from OV threshold  
trip to external NFET  
Power Gate Turn off  
SID.UVOV.AC.1 Tov_gate  
50  
µs  
Datasheet  
15 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Electrical specifications  
Table 10  
Spec ID  
PD transceiver  
Parameter  
Description  
Min  
Typ Max Unit Details/conditions  
DC specifications  
Downstream facing port  
(DFP) CC termination for  
default USB power  
SID.PD.1  
Rp_std  
64  
80  
96  
DFP CC termination for  
1.5 A USB power  
DFP CC termination for  
3.0 A USB power  
Ground offset tolerated  
by BMC receiver  
µA  
SID.PD.2  
SID.PD.3  
SID.PD.4  
Rp_1.5A  
166  
304  
180  
330  
194  
356  
500  
Rp_3.0A  
Relative to remote  
BMC transmitter  
Vgndoffset  
–500  
mV  
Table 11  
VBUS discharge  
Parameter  
Spec ID  
Description  
Min Typ Max Unit Details/conditions  
DC specifications  
20 V NMOS ON  
SID.VBUS.DISC.1 R1  
resistance for  
500  
250  
125  
62.5  
2000  
1000  
500  
discharge strength = 1  
20 V NMOS ON  
SID.VBUS.DISC.2 R2  
SID.VBUS.DISC.3 R4  
SID.VBUS.DISC.4 R8  
SID.VBUS.DISC.5 R16  
resistance for  
discharge strength = 2  
20 V NMOS ON  
resistance for  
Measured at 0.5 V  
discharge strength = 4  
20 V NMOS ON  
resistance for  
250  
discharge strength = 8  
20 V NMOS ON  
resistance for  
31.25  
125  
10  
discharge strength = 16  
Vbus_stop_  
error  
Error percentage of  
final VBUS value  
When VBUS is  
discharged to 5 V  
SID.VBUS.DISC.6  
%
Datasheet  
16 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Electrical specifications  
Table 12  
Spec ID  
VBUS NFET gate driver  
Parameter  
Description  
Min Typ Max Unit Details/conditions  
DC specifications  
Gate to Source  
SID.GD.1  
GD_VGS  
GD_Rpd  
overdrive during NFET 4.5 5.75  
ON condition  
10  
2
V
Vbus_in = 21.5 V  
Resistance when  
pull-downisenabledto  
turn off external NFET  
SID.GD.2  
0.57  
k  
AC specifications  
VBUS_ctrl Low to High  
(1 V to VBUS + 1 V) with  
3 nF external  
AC.GD.1  
AC.GD.2  
Ton  
Toff  
2
5
7
10  
ms  
µs  
V
V
BUS_IN = 5 V  
capacitance  
VBUS_ctrl High to Low  
(90% to 10%) with 3 nF  
external capacitance  
BUS_IN = 21.5 V  
Table 13  
Spec ID  
High-voltage regulator  
Parameter  
Description  
Min Typ Max Unit Details/conditions  
DC specifications  
VOLTAGE_  
DETECT  
VBUS_IN voltage detect  
threshold  
SID.VREG.1  
1.7 2.1 2.4  
50 200  
V
From VBUS reaching  
Total start-up time for the  
regulator supply outputs  
SID.VREG.2 Tstart  
µs Voltage_detect level to  
95% of final value  
Datasheet  
17 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Electrical specifications  
Table 14  
Spec ID  
SR sense and driver  
Parameter  
Description  
Min Typ Max Unit Details/conditions  
DC specifications  
Voltage doubler output for  
SR.1  
SR.2  
VCPP1  
5
9
3.3 V VBUS_IN 5.5 V  
V
Voltage doubler output for  
5.5 V VBUS_IN 21.5 V  
VCPP2  
TR_SR  
11  
Rise time (20% to 80%) of SR  
gate driver output with  
CL = 6 nF, VBUS_IN = 3.3 V,  
including doubler rise time  
(with and without double  
bypass mode)  
Fall time (80% to 20%) of SR  
gate driver output with  
CL = 6 nF, VBUS_IN = 3.3 V,  
including doubler rise time  
(with and without double  
bypass mode)  
SR.3  
SR.4  
150  
ns  
TF_SR  
100  
1
Input leakage current on  
SR_VSS  
Negative sense trip voltage  
to turn-ON secondary switch  
SR.5  
SR.6  
IIK_SR_VSS  
–1  
µA  
VTRIP_  
NSN_100  
–140 –90 –60  
mV  
Negative sense trip voltage  
to turn-OFF secondary  
switch  
Turn on propagation delay  
from SR_SEN at –100mV to  
SR_GDRV reaching 1V  
Turn off propagation delay  
from SR_SEN at –5mV to  
SR_GDRV reaching 1V  
SR.7  
SR.8  
SR.9  
SR.10  
VTRIP_ZCD  
TD_ON  
–8  
–5  
25  
–3  
50  
ns  
A
TD_OFF  
100 200  
Typical with 3 nF gate  
cap (Guaranteed by  
design)  
Output peak current (Source  
and Sink)  
IO_SRC_SNK  
1
Datasheet  
18 of 28  
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USB PD power adapter SR controller  
Electrical specifications  
4.4  
I/O specifications  
Table 15  
Spec ID  
I/O specifications  
Parameter  
Description  
Min  
Typ Max  
Unit Details/conditions  
DC specifications  
SID.GIO.1  
SID.GIO.2  
SID.GIO.3  
SID.GIO.4  
I_LU  
RPU  
RPD  
IIL  
Latch-up current limits  
Pull-up resistor value  
Pull-down resistor value  
Input leakage current  
–140  
3.5  
3.5  
5.6  
5.6  
140  
8.5  
8.5  
2
mA  
k  
nA  
Capacitance on  
DP/DM lines  
Capacitance on all  
GPIOs, except DP/DM  
lines  
SID.GIO.5  
CPIN_A  
7.8  
3
22  
Max pin capacitance  
pF  
SID.GIO.6  
CPIN  
7
VDDD  
0.6  
SID.GIO.7  
SID.GIO.8  
SID.GIO.9  
Voh_3V  
Vol_3V  
Output voltage high level  
Output voltage low level  
Input voltage high  
threshold  
0.6  
Ioh = –4 mA  
Iol = 10 mA  
0.7 ×  
VDDD  
Vih_CMOS  
V
Input voltage low  
threshold  
0.3 ×  
VDDD  
SID.GIO.10 Vil_CMOS  
SID.GIO.11 Vih_TTL  
SID.GIO.12 Vil_TTL  
SID.GIO.13 Vhysttl  
2
100  
0.05 ×  
VDDD  
LVTTL input  
0.8  
Input hysteresis LVTTL  
Input hysteresis CMOS  
mV  
µA  
SID.GIO.14 Vhyscmos  
Current through  
protection diode to  
VDDD/VSS  
SID.GIO.15 IDIODE  
100  
Rise time in fast strong  
mode  
Fall time in fast strong  
mode  
Rise time in slow strong  
mode  
Fall time in slow strong  
mode  
SID.GIO.16 TriseF  
SID.GIO.17 TfallF  
SID.GIO.18 TriseS  
SID.GIO.19 TfallS  
2
2
12  
12  
60  
60  
ns  
10  
10  
Cload = 25 pF  
GPIO Fout;  
SID.GIO.20 FGPIO_OUT1 3 V VDDD 5.5V;  
7
16  
Fast strong mode.  
GPIO Fout;  
SID.GIO.21 FGPIO_OUT2 3V VDDD 5.5 V;  
Slow strong mode.  
MHz  
GPIO input operating  
SID.GIO.22 FGPIO_IN  
frequency;  
16  
3 V VDDD 5.5 V  
Datasheet  
19 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Electrical specifications  
4.5  
System resources specifications  
Table 16  
Power-on reset (POR) specifications  
Spec ID  
SID.POR.1  
SID.POR.2  
Parameter  
VRISEIPOR  
VFALLIPOR  
Description  
POR rising trip voltage  
POR falling trip voltage  
Brown-out-detect  
(BOD) trip voltage  
active/ sleep modes  
Min  
0.8  
0.7  
Typ  
Max  
1.5  
1.4  
Unit  
Details/conditions  
V
SID.POR.3  
SID.CLK#6  
VFALLPPOR  
SR_POWER  
1.48  
0.40  
1.62  
67  
On power-up and  
power-down  
Power supply slew rate  
V/ms  
Datasheet  
20 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Ordering information  
5
Ordering information  
Table 17  
EZ-PD™ PAG1S ordering information  
Application  
MPN  
Package type  
Si ID  
Si Rev  
CYPD3184A1-24LQXQ  
CYPD3184A1-24LQXQT  
USB Power Delivery adapter with primary side  
control  
24-pin QFN  
2B00  
A1  
5.1  
Ordering code definitions  
XX  
X
CY PD  
X
XX  
XX XX  
X
X
XX  
X
-
T = Tape and reel  
ES (Optional field) = Pre-production Engineering samples only. Non  
orderable.  
Temperature Range: Q = Extended industrial (-40ºC to +105ºC)  
X = Pb-free  
Package type: LQ = QFN  
Number of pins in the package  
Si Rev  
Application and feature combination designation  
Number of Type-C ports: 1 = 1 port  
Product type: 3 = Third generation  
Marketing code: PD = Power Delivery product family  
Company ID: CY = Infineon  
Datasheet  
21 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Packaging  
6
Packaging  
Table 18  
Package characteristics  
Description  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Operating ambient  
temperature  
Operating junction  
temperature  
TA  
TJ  
–40  
25  
105  
Extended industrial  
°C  
–40  
25  
120  
TJA  
TJC  
Package JA  
Package JC  
19.98  
4.78  
°C/W  
Table 19  
Solder reflow peak temperature  
Maximum time within 5°C of peak  
temperature  
Package  
24-pin QFN  
Maximum peak temperature  
260°C  
30 seconds  
Table 20  
Package moisture sensitivity level (MSL), IPC/JEDEC J-STD-2  
Package  
MSL  
24-pin QFN  
MSL 3  
Datasheet  
22 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Packaging  
NOTES  
DIMENSIONS  
1. ALL DIMENSIONS ARE IN MILLIMETERS.  
SYMBOL  
MIN. NOM. MAX.  
0.60  
2. DIE THICKNESS ALLOWABLE IS 0.305 mm MAXIMUM(.012 INCHES MAXIMUM)  
3. DIMENSIONING & TOLERANCES CONFORM TO ASME Y14.5M. -1994.  
A
A1  
4. THE PIN #1 IDENTIFIER MUST BE PLACED ON THE TOP SURFACE OF THE  
PACKAGE BY USING INDENTATION MARK OR OTHER FEATURE OF  
PACKAGE BODY.  
0.00  
0.05  
A3 (Option 1)  
A3 (Option 2)  
0.152 REF  
0.127 REF  
0.25  
5. EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL.  
6. PACKAGE WARPAGE MAX 0.08 mm.  
0.18  
2.65  
0.30  
2.85  
b
7. APPLIED FOR EXPOSED PAD AND TERMINALS. EXCLUDE EMBEDDING PART  
OF EXPOSED PAD FROM MEASURING.  
D
4.00 BSC  
2.75  
D2  
E
8. APPLIED ONLY TO TERMINALS.  
4.00 BSC  
2.75  
9. JEDEC SPECIFICATION NO. REF: N.A.  
E2  
L
2.65  
0.30  
2.85  
0.50  
10. INDEX FEATURE CAN EITHER BE AN OPTION 1 : "MOUSE BITE" OR  
OPTION 2 : CHAMFER.  
0.40  
e
0.50 BSC  
R
0.09  
002-16934 *E  
24-pin QFN ((4.0 × 4.0 × 0.6 mm), 2.75 × 2.75 mm E-Pad (Sawn)) package outline, 002-16934  
Figure 5  
Datasheet  
23 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Acronyms  
7
Acronyms  
Table 21  
Acronym  
ADC  
API  
Acronyms used in this document  
Description  
analog-to-digital converter  
application programming interface  
Arm®  
CC  
advanced RISC machine, a CPU architecture  
constant current  
CC  
configuration channel  
CV  
constant voltage  
BOD  
BMC  
CPU  
CRC  
CrCM  
CS  
Brown out Detect  
biphase mark code  
central processing unit  
cyclic redundancy check, an error-checking protocol  
critical conduction mode  
current sense  
DCM  
DFP  
discontinuous conduction mode  
downstream facing port  
DIO  
DRP  
digital input/output, GPIO with only digital capabilities, no analog. See GPIO.  
dual role port  
EEPROM electrically erasable programmable read-only memory  
a USB cable that includes an IC that reports cable characteristics (e.g., current rating) to the Type-C  
ports  
EMCA  
EMI  
ESD  
FPB  
FS  
electromagnetic interference  
electrostatic discharge  
flash patch and breakpoint  
full-speed  
GPIO  
IC  
general-purpose input/output  
integrated circuit  
IDE  
integrated development environment  
I2C, or IIC Inter-Integrated Circuit, a communications protocol  
ILO  
IMO  
I/O  
LSCSA  
LVD  
internal low-speed oscillator, see also IMO  
internal main oscillator, see also ILO  
input/output, see also GPIO  
low-side current sense amplifier  
low-voltage detect  
LVTTL  
MCU  
NC  
low-voltage transistor-transistor logic  
microcontroller unit  
no connect  
NMI  
nonmaskable interrupt  
NMOS  
N-type metal-oxide-semiconductor  
Datasheet  
24 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Acronyms  
Table 21  
Acronym  
NVIC  
opamp  
OCP  
OVP  
Acronyms used in this document (continued)  
Description  
nested vectored interrupt controller  
operational amplifier  
overcurrent protection  
overvoltage protection  
over-temperature protection  
printed circuit board  
OTP  
PCB  
PD  
power delivery  
PGA  
PHY  
programmable gain amplifier  
physical layer  
PMOS  
POR  
PPS  
PRES  
PSoC™  
PWM  
RAM  
RISC  
RMS  
RTC  
P-type metal-oxide-semiconductor  
power-on reset  
programmable power supply  
precise power-on reset  
programmable system-on-chip  
pulse-width modulator  
random-access memory  
reduced-instruction-set computing  
root-mean-square  
real-time clock  
RX  
receive  
SAR  
SCL  
successive approximation register  
I2C serial clock  
SCP  
SDA  
short circuit protection  
I2C serial data  
S/H  
sample and hold  
SPI  
SR  
Serial Peripheral Interface, a communications protocol  
synchronous rectifier  
SRAM  
SWD  
TX  
static random access memory  
serial wire debug, a test protocol  
transmit  
a new standard with a slimmer USB connector and a reversible cable, capable of sourcing up to  
100 W of power  
Type-C  
UART  
USB  
Universal Asynchronous Transmitter Receiver, a communications protocol  
Universal Serial Bus  
USBIO  
UVP  
USB input/output, CCG5 pins used to connect to a USB port  
undervoltage protection  
WDT  
watchdog timer  
USBIO  
XRES  
ZCD  
USB input/output, CCG5 pins used to connect to a USB port  
external reset I/O pin  
zero crossing detect  
Datasheet  
25 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Document conventions  
8
Document conventions  
8.1  
Units of measure  
Table 22  
Symbol  
°C  
Units of measure  
Unit of measure  
degrees Celsius  
hertz  
Hz  
KB  
kHz  
k  
1024 bytes  
kilohertz  
kilo ohm  
Mbps  
MHz  
M  
Msps  
µA  
µF  
µs  
µV  
megabits per second  
megahertz  
mega-ohm  
megasamples per second  
microampere  
microfarad  
microsecond  
microvolt  
µW  
mA  
ms  
mV  
nA  
microwatt  
milliampere  
millisecond  
millivolt  
nanoampere  
nanosecond  
ohm  
ns  
pF  
picofarad  
ppm  
ps  
s
parts per million  
picosecond  
second  
sps  
V
samples per second  
volt  
Datasheet  
26 of 28  
002-26809 Rev. *D  
2022-06-16  
USB PD power adapter SR controller  
Revision history  
Revision history  
Document  
Date of release  
version  
Description of changes  
*B  
*C  
2019-08-22  
2022-05-18  
Changed document status from Preliminary to Final.  
Updated Ordering information:  
Updated part numbers.  
Updated Packaging:  
spec 002-16934 – Changed revision from *B to *E.  
Migrated to Infineon template.  
Updated Electrical specifications:  
Updated Device-level specifications:  
Updated Table 4:  
Changed maximum value of Cexc parameter from 4.7 µF to 2.2 µF.  
Updated System resources specifications:  
Updated Table 16:  
*D  
2022-06-16  
Added SR_POWER parameter and its corresponding details.  
Completing Sunset Review.  
Datasheet  
27 of 28  
002-26809 Rev. *D  
2022-06-16  
Please read the Important Notice and Warnings at the end of this document  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
IMPORTANT NOTICE  
For further information on the product, technology,  
The information given in this document shall in no  
event be regarded as a guarantee of conditions or  
characteristics (“Beschaffenheitsgarantie”).  
Edition 2022-06-16  
Published by  
delivery terms and conditions and prices please  
contact your nearest Infineon Technologies office  
(www.infineon.com).  
Infineon Technologies AG  
81726 Munich, Germany  
With respect to any examples, hints or any typical  
values stated herein and/or any information  
regarding the application of the product, Infineon  
Technologies hereby disclaims any and all  
warranties and liabilities of any kind, including  
without limitation warranties of non-infringement of  
intellectual property rights of any third party.  
WARNINGS  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon  
Technologies office.  
© 2022 Infineon Technologies AG.  
All Rights Reserved.  
Except as otherwise explicitly approved by Infineon  
Technologies in a written document signed by  
In addition, any information given in this document  
is subject to customer’s compliance with its  
obligations stated in this document and any  
applicable legal requirements, norms and standards  
concerning customer’s products and any use of the  
product of Infineon Technologies in customer’s  
applications.  
Do you have a question about this  
document?  
Go to www.infineon.com/support  
authorized  
representatives  
of  
Infineon  
Technologies, Infineon Technologies’ products may  
not be used in any applications where a failure of the  
product or any consequences of the use thereof can  
reasonably be expected to result in personal injury.  
Document reference  
002-26809 Rev. *D  
The data contained in this document is exclusively  
intended for technically trained staff. It is the  
responsibility of customer’s technical departments  
to evaluate the suitability of the product for the  
intended application and the completeness of the  
product information given in this document with  
respect to such application.  

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