ESD5V3U1U [INFINEON]

Ultra-Low Capacitance TVS Diode; 超低电容TVS二极管
ESD5V3U1U
型号: ESD5V3U1U
厂家: Infineon    Infineon
描述:

Ultra-Low Capacitance TVS Diode
超低电容TVS二极管

二极管 电视
文件: 总8页 (文件大小:613K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ESD5V3U1U...  
Ultra-Low Capacitance TVS Diode  
ESD / transient protection of high-speed  
data lines exceeding  
IEC61000-4-2 (ESD): 20 kV (air / contact)  
IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)  
IEC61000-4-5 (surge): 3 A (8/20 µs)  
Extremely small form factor down to  
0.62 x 0.32 x 0.31 mm³  
Reverse working voltage: 5.3 V max.  
Very low reverse current: < 10 nA typ.  
Extremely low capacitance: 0.4 pF typ.  
Very low clamping voltage: 12 V typ. at positive  
transients, 4 V typ. at negative transients  
Very low series inductance down to 0.2 nH typ.  
Pb-free (RoHS compliant) package  
Applications  
USB 2.0, 10/100/1000 Ethernet, Firewire, DVI,  
HDMI, S-ATA  
Mobile communication  
Consumer products (STB, MP3, DVD, DSC...)  
LCD displays, camera  
Notebooks and desktop computers, peripherals  
ESD5V3U1U-02LS  
ESD5V3U1U-02LRH  
2
1
Type  
ESD5V3U1U-02LRH  
ESD5V3U1U-02LS  
Package  
TSLP-2-7  
TSSLP-2-1  
Configuration  
1 line, uni-directional  
1 line, uni-directional  
Marking  
E5  
L
2010-03-12  
1
ESD5V3U1U...  
Maximum Ratings at T = 25°C, unless otherwise specified  
A
Parameter  
ESD (air / contact) discharge  
Peak pulse current (t = 8 / 20 µs)  
Symbol  
V
ESD  
I
pp  
Value  
20  
Unit  
kV  
A
1)  
2)  
3
p
°C  
Operating temperature range  
Storage temperature  
T
T
-55...125  
-65...150  
op  
stg  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
Characteristics  
-
6
-
-
5.3  
-
V
Reverse working voltage  
Breakdown voltage  
V
V
RWM  
(BR)  
I
= 1 mA, from pin 1 to 2  
(BR)  
-
< 10  
100 nA  
Reverse current  
I
R
V = 5.3 V, from pin 1 to 2  
R
V
13  
15  
Clamping voltage  
V
V
CL  
FC  
2)  
I
= 1 A, t = 8/20 µs , from pin 1 to 2  
-
-
10  
12  
PP  
p
2)  
I
= 3 A, t = 8/20 µs , from pin 1 to 2  
PP  
p
Forward clamping voltage  
2)  
I
= 1 A, t = 8/20 µs , from pin 2 to 1  
-
-
-
2
4
4
6
PP  
p
2)  
I
= 3 A, t = 8/20 µs , from pin 2 to 1  
PP  
p
3)  
0.4  
0.6 pF  
Line capacitance  
C
T
V = 0 V, f = 1 MHz  
R
Series inductance  
ESD5V3U1U-02LS  
ESD5V3U1U-02LRH  
L
nH  
S
-
-
0.2  
0.4  
-
-
1V  
according to IEC61000-4-2  
ESD  
2I according to IEC61000-4-5  
pp  
3Total capacitance line to ground  
2010-03-12  
2
ESD5V3U1U...  
Clamping voltage, V = ƒ(I )  
Forward clamping voltage V = ƒ(I )  
FC PP  
cl  
pp  
t = 8 / 20 µs, from pin 1 to 2  
t = 8 / 20 µs, from pin 2 to 1  
p
p
13  
V
6
V
11  
10  
9
4
3
2
1
0
8
7
6
A
A
0
1
2
4
0
1
2
3
5
I
I
pp  
pp  
Reverse current I = ƒ (T )  
Line capacitance C = ƒ (V )  
R
A
T
R
V = 5.3 V, from pin 1 to 2  
f = 1 MHz, from pin 1 to 2  
R
10 -6  
A
0.6  
pF  
10 -7  
10 -8  
0.4  
0.3  
0.2  
0.1  
0
10 -9  
10 -10  
10 -11  
25  
°C  
V
50  
75  
100  
150  
0
1
2
3
5
T
V
R
A
2010-03-12  
3
ESD5V3U1U...  
Line capacitance C = ƒ (f)  
Line capacitance C = ƒ(T )  
T A  
T
V = parameter, from pin 1 to 2  
V = 0 V, f = 1 MHz  
R
R
0.7  
pF  
0.6  
pF  
0.5  
VR=0V  
0.4  
0.3  
0.2  
0.1  
0
5.3 V  
0.4  
0.3  
0.2  
0.1  
0
VR=5.3V  
0 V  
MHz  
°C  
0
500  
1000  
1500  
2000  
3000  
-50  
-25  
0
25  
50  
100  
T
f
A
2010-03-12  
4
ESD5V3U1U...  
Application example ESD5V3U1U...  
1-channel, uni-directional  
Protected line, signal level up to +VRWM  
(uni-directional)  
ESD sensitive  
device  
I/O  
1
The protection diode should be placed  
very close to the location where the  
ESD or other transients can occur to  
keep loops and inductances as small  
as possible.  
Pin 2 should be connected directly to a  
ground plane on the board.  
2
2010-03-12  
5
TSLP-2-7 (mm)  
ESD5V3U1U...  
Package Outline  
Top view  
Bottom view  
+±0±1  
±0ꢁ9  
-±0±ꢁ  
±±0±ꢀ  
±06  
±0±ꢀ MAX0  
2
2
1
1
1)  
±±0±ꢁꢀ  
±0ꢀ  
Cathode  
marking  
1) Dimension applies to plated terminal  
Foot Print  
For board assembly information please refer to Infineon website "Packages"  
±06  
±04ꢀ  
Copper  
Solder mask  
Stencil apertures  
Marking Layout (Example)  
BAR9±-±2LRH  
Type code  
Cathode marking  
Laser marking  
Standard Packing  
Reel ø18± mm = 1ꢀ0±±± Pieces/Reel  
Reel øꢁꢁ± mm = ꢀ±0±±± Pieces/Reel (optional)  
±0ꢀ  
4
±076  
Cathode  
marking  
2010-03-12  
6
TSSLP-2-1 (mm)  
ESD5V3U1U...  
2010-03-12  
7
ESD5V3U1U...  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (<www.infineon.com>).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
2010-03-12  
8

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