IPB60R330P6 [INFINEON]
Material Content Data Sheet;
| 型号： | IPB60R330P6 |
| 厂家： | 
Infineon |
| 描述： | Material Content Data Sheet |
| 文件： | 总1页 (文件大小：33K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Material Content Data Sheet
Sales Product Name IPB60R160P6
Issued
27. August 2015
1565.10 mg
MA#
MA001393452
PG-TO263-3-2
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
9.747
0.304
0.62
0.02
0.01
19.43
1.69
0.63
6.95
34.56
0.62
0.01
0.00
0.01
0.01
0.39
0.04
0.01
35.00
0.62
6228
195
6228
leadframe
iron
phosphorus
copper
0.091
58
304.026
26.409
9.895
19.46
1.69
194253
16874
6323
69548
345632
6247
146
194506
16874
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
108.849
540.949
9.777
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
42.14
0.62
421503
6247
leadfinish
plating
nickel
0.228
phosphorus
silver
0.001
0.01
0.41
1
146
solder
0.161
103
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
tin
0.129
82
lead
6.156
3933
350
4118
heatspreader
*deviation
iron
0.548
phosphorus
copper
0.165
105
547.666
35.05
349922
350378
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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