IRDC3831W [INFINEON]
USER GUIDE FOR IR3831W EVALUATION BOARD; 用户指南IR3831W评估板
| 型号： | IRDC3831W |
| 厂家： | 
Infineon |
| 描述： | USER GUIDE FOR IR3831W EVALUATION BOARD |
| 文件： | 总16页 (文件大小：725K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IRDC3831W
TM
SupIRBuck
USER GUIDE FOR IR3831W EVALUATION BOARD
DESCRIPTION
An output over-current protection function is
implemented by sensing the voltage developed
across the on-resistance of the synchronous
rectifier MOSFET for optimum cost and
performance.
The IR3831W is a synchronous buck
converter, providing compact, high
performance and flexible solution in a small
5mmx6mm Power QFN package.
a
Key features offered by the IR3831W
include programmable soft-start ramp,
This user guide contains the schematic and bill
of materials for the IR3831W evaluation board.
The guide describes operation and use of the
evaluation board itself. Detailed application
information for IR3831W is available in the
IR3831W data sheet.
Power
Good,
thermal
protection,
programmable switching frequency, tracking
input, enable input, input under-voltage
lockout for proper start-up, and pre-bias
start-up.
BOARD FEATURES
• Vin = +12V (13.2V Max)
• Vcc= +5V (5.5V Max)
• Vout = +0.75V @ 0- ±8A
• Fs = 400kHz
• L = 0.6uH
• Cin= 3x10uF (ceramic 1206) + 330uF (electrolytic)
• Cout= 8x22uF (ceramic 0805)
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IRDC3831W
CONNECTIONS and OPERATING INSTRUCTIONS
A well regulated +12V input supply should be connected to VIN+ and VIN-. A maximum ±8A load should be
connected to VOUT+ and VOUT-. The connection diagram is shown in Fig. 1 and inputs and outputs of the
board are listed in Table I.
IR3831W has two input supplies, one for biasing (Vcc) and the other as input voltage (Vin). Separate
supplies should be applied to these inputs. Vcc input should be a well regulated 4.5V-5.5V supply and it
would be connected to Vcc+ and Vcc-.
If single 12V application is required, connect R7 ( zero Ohm resistor) which enables the on board bias
regulator (see schematic). In this case there is no need of external Vcc supply.
The output tracks VDDQ input. The value of R14 and R28 can be selected to provide the desired ratio
between the output voltage and the tracking input. For proper operation of IR3831W, the voltage at Vp pin
should not exceed Vcc.
Table I. Connections
Connection
VIN+
Signal Name
Vin (+12V)
VIN-
Ground of Vin
Vcc input
Vcc+
Vcc-
Ground for Vcc input
Ground of Vout
Vout (+0.75V)
Enable
VOUT-
VOUT+
Enable
VDDQ
Tracking Input
Power Good Signal
PGood
LAYOUT
The PCB is a 4-layer board. All of layers are 2 Oz. copper. The IR3831W SupIRBuck and all of the
passive components are mounted on the top side of the board.
Power supply decoupling capacitors, the Bootstrap capacitor and feedback components are located
close to IR3831W. The feedback resistors are connected to the output voltage at the point of regulation
and are located close to the SupIRBuck. To improve efficiency, the circuit board is designed to
minimize the length of the on-board power ground current path.
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IRDC3831W
Connection Diagram
Vin
GND
Enable
Vp
GND
Vo
VDDQ
AGND
Vcc
GND
PGood
SS
Fig. 1: Connection diagram of IR383xW evaluation boards
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3
IRDC3831W
Fig. 2: Board layout, top overlay
Fig. 3: Board layout, bottom overlay
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IRDC3831W
AGND
Plane
PGND
Plane
Single point
connection
between AGND
and PGND.
Fig. 4: Board layout, mid-layer I
Fig. 5: Board layout, mid-layer II
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IRDC3831W
2
1
1
1
1
n d G 3 A
1 5
o o B t
n a E b l e
c
V c
1 3
1 4
9
8
o o G d P
1
1
1
1
1
1
1
1
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IRDC3831W
Bill of Materials
Item Quantity Part Reference
Value
Description
Manufacturer
Panasonic
TDK
Part Number
1
2
3
1 C1
3 C2 C3 C4
1 C10
330uF
10uF
0.022uF
SMD Elecrolytic, Fsize, 25V, 20%
1206, 16V, X5R, 20%
0603, 16V, X7R, 10%
EEV-FK1E331P
C3216X5R1E106M
ECJ-1VB1C223K
Panasonic- ECG
4
1 C34
10uF
0805, 10V, X5R, 20%
Panasonic - ECG
ECJ-GVB1A106M
5
6
7
5 C7 C13 C14 C24 C32
1 C8
1 C11
0.1uF
2200pF
560pF
0603, 25V, X7R, 10%
0603, 50V, NP0, 5%
0603, 50V, NP0, 5%
Panasonic - ECG
Murata
Panasonic- ECG
ECJ-1VB1E104K
GRM1885C1H222JA01D
ECJ-1VC1H561J
C15 C16 C17 C18 C19 C20
C21 C22
8
9
8
22uF
0805, 6.3V, X5R, 20%
0603, 50V, X7R, 10%
0603, 50V, X7R, 10%
Zener, 5.6V
Panasonic- ECG
Panasonic - ECG
Panasonic - ECG
Fairchild
Delta
Fairchild
Rohm
Rohm
Panasonic - ECG
Vishey/Dale
Rohm
Rohm
Rohm
ECJ-2FB0J226M
ECJ-1VB1H103K
ECJ-1VB1H223K
MM3Z5V6B
1 C25
1 C26
1 D1
1 L1
1 Q1
1 R5
1 R18
1 R4
1 R6
1 R9
1 R12
1 R17
1 R19
1 R10
1 R1
1 R2
2 R14, R28
1 U1
10000pF
22000pF
MM3Z5V6B
0.6uH
MMBT3904/SOT NPN, 40V, 200mA, SOT-23
3.3k
49.9k
210
20
35.7k
3.24k
10.0k
7.5k
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
11.5x10x4mm, 20%, 1.7mOhm
MPL104-0R6IR
MMBT3904/SOT
MCR03EZPFX3301
MCR03EZPFX4992
ERJ-3EKF2100V
CRCW060320R0FKEA
MCR03EZPFX3572
MCR03EZPFX3241
MCR03EZPFX1002
MCR03EZPFX7501
RC0603FR-100RL
MCR03EZPFX1481
MCR03EZPFX6651
MCR03EZPFX1501
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10 W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10 W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
Thick Film, 0603,1/10W,1%
8A SupIRBuck, 6mmx5mm
Rohm
Yageo
Rohm
Rohm
0
1.48k
6.65k
1.50k
IR3831W
Rohm
International Rectifier IR3831WMPbF
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IRDC3831W
TYPICAL OPERATING WAVEFORMS
Vin=12.0V, Vcc=5V, Vo=0.75V, Io=0- ±8A, Room Temperature, No Air Flow
Fig. 7: Start up at 8A, sourcing current
Ch1:PGood, Ch2:Vout, Ch3:SS, Ch4:VDDQ
Fig. 8: Start up with Prebias, 0A Load
Ch1:PGood, Ch2:Vout, Ch3:SS, Ch4:VDDQ
Fig. 10: Inductor node at -3A, sinking
current, Ch3:SW , Ch4:Iout
Fig. 9: Inductor node at 8A, sourcing
current, Ch3:SW, Ch4:Iout
Fig. 11: Output Voltage Ripple, 8A,
sourcing current, Ch2: Vout
Fig. 12: Short (Hiccup) Recovery
Ch2:Vout, Ch3:VSS , Ch4:PGood
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IRDC3831W
TYPICAL OPERATING WAVEFORMS
Vin=12V, Vcc=5V, Vo=0.75V, Room Temperature, No Air Flow
Fig. 14: Tracking -3A load, sinking current,
Ch2:Vout, Ch2: IL, Ch3:VDDQ, Ch4:PGood
Fig. 13: Tracking 8A, sourcing current,
Ch2:Vout, Ch3:VDDQ, Ch4:PGood
Fig. 15: Transient Response, 1A/us
-0.5A to +0.5A load , Ch1:Vout, Ch3:Io
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IRDC3831W
TYPICAL OPERATING WAVEFORMS
Vin=12V, Vcc=5V, Vo=0.75V, Io=+8A, Room Temperature, No Air Flow
Fig.16: Bode Plot at 8A load (sourcing current) shows a bandwidth of 59kHz and phase margin of 59 degrees
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IRDC3831W
TYPICAL OPERATING WAVEFORMS
Vin=12V, Vo=0.75V, Io=0- +8A, Room Temperature, No Air Flow
89
88
87
86
85
84
83
10
20
30
40
50
60
70
80
90
100
Load Percentage (%)
Fig.17: Efficiency versus load current
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
10
20
30
40
50
60
70
80
90
100
Load Percentage(%)
Fig.18: Power loss versus load current
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IRDC3831W
THERMAL IMAGES
Vin=12V, Vo=0.75V, Io=+8A, Room Temperature, No Air Flow
Fig.19: Thermal Image at 8A load
Test Point 1: IR3831W, Test Point 2: Inductor
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IRDC3831W
PCB Metal and Components Placement
The lead lands (the 11 IC pins) width should be equal to the nominal part lead width. The minimum
lead to lead spacing should be ≥ 0.2mm to minimize shorting.
Lead land length should be equal to the maximum part lead length + 0.3 mm outboard extension. The
outboard extension ensures a large and inspectable toe fillet.
The pad lands (the 4 big pads other than the 11 IC pins) length and width should be equal to
maximum part pad length and width. However, the minimum metal to metal spacing should be no less
than 0.17mm for 2 oz. Copper; no less than 0.1mm for 1 oz. Copper and no less than 0.23mm for 3 oz.
Copper.
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IRDC3831W
Solder Resist
It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder resist
should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure NSMD
pads.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist
onto the copper of 0.05mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due to the
high aspect ratio of the solder resist strip separating the lead lands from the pad land.
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IRDC3831W
Stencil Design
•
The Stencil apertures for the lead lands should be approximately 80% of the area of the
lead lads. Reducing the amount of solder deposited will minimize the occurrences of lead
shorts. If too much solder is deposited on the center pad the part will float and the lead
lands will be open.
•
The maximum length and width of the land pad stencil aperture should be equal to the
solder resist opening minus an annular 0.2mm pull back to decrease the incidence of
shorting the center land to the lead lands when the part is pushed into the solder paste.
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IRDC3831W
BOTTOM VIEW
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
This product has been designed and qualified for the Consumer market.
Visit us at www.irf.com for sales contact information
Data and specifications subject to change without notice. 11/07
11/05/09
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