IRF6217PBF [INFINEON]
SMPS MOSFET HEXFET㈢Power MOSFET; 开关电源MOSFET HEXFET㈢Power MOSFET
| 型号： | IRF6217PBF |
| 厂家： | 
Infineon |
| 描述： | SMPS MOSFET HEXFET㈢Power MOSFET |
| 文件： | 总8页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 95252
IRF6217PbF
HEXFET® Power MOSFET
SMPS MOSFET
Applications
l Reset Switch for Active Clamp Reset
VDSS
RDS(on) max
ID
-150V
2.4W@VGS =-10V -0.7A
DC to DC converters
l Lead-Free
Benefits
A
l Low Gate to Drain Charge to Reduce
Switching Losses
l Fully Characterized Capacitance Including
Effective COSS to Simplify Design (See
App. Note AN1001)
1
2
3
4
8
D
S
S
7
D
6
S
G
D
5
D
l Fully Characterized Avalanche Voltage
and Current
SO-8
Top View
Absolute Maximum Ratings
Parameter
Max.
-0.7
Units
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
-0.5
A
-5.0
PD @TA = 25°C
Power Dissipation
2.5
W
W/°C
V
Linear Derating Factor
0.02
VGS
dv/dt
TJ
Gate-to-Source Voltage
± 20
Peak Diode Recovery dv/dt
Operating Junction and
4.5
V/ns
-55 to + 150
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
°C
300 (1.6mm from case )
Thermal Resistance
Symbol
RθJL
Parameter
Junction-to-Drain Lead
Typ.
–––
Max.
20
Units
RθJA
Junction-to-Ambient
–––
50
°C/W
Notes through are on page 8
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1
10/04/04
IRF6217PbF
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
-150 ––– –––
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
V
VGS = 0V, ID = -250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
––– -0.17 ––– V/°C Reference to 25°C, ID = -1mA
RDS(on)
VGS(th)
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
––– ––– 2.4
-3.0 ––– -5.0
––– ––– -25
––– ––– -250
––– ––– -100
––– ––– 100
Ω
V
VGS = -10V, ID = -0.42A
VDS = VGS, ID = -250µA
VDS = -150V, VGS = 0V, TJ = 25°C
VDS = -120V, VGS = 0V, TJ = 125°C
IDSS
Drain-to-Source Leakage Current
µA
nA
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
VGS = -20V
IGSS
VGS = 20V
Dynamic @ TJ = 25°C (unless otherwise specified)
Parameter
Forward Transconductance
Total Gate Charge
Min. Typ. Max. Units
Conditions
gfs
0.55 ––– –––
––– 6.0 9.0
S
VDS = -50V, ID = -0.42A
ID = -0.42A
Qg
Qgs
Qgd
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
–––
–––
–––
–––
–––
–––
1.6 2.4
2.8 4.2
12 –––
7.2 –––
14 –––
16 –––
nC VDS = -120V
VGS = -10V,
VDD = -75V
ID = -0.42A
ns
td(off)
tf
Turn-Off Delay Time
Fall Time
RG = 6.2Ω
VGS = -10V
Ciss
Coss
Crss
Coss
Coss
Coss eff.
Input Capacitance
––– 150 –––
VGS = 0V
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
–––
–––
30 –––
10 –––
VDS = -25V
pF
ƒ = 1.0KHz
––– 150 –––
VGS = 0V, VDS = -1.0V, ƒ = 1.0KHz
VGS = 0V, VDS = -120V, ƒ = 1.0KHz
VGS = 0V, VDS = 0V to -120V
–––
–––
15 –––
45 –––
Avalanche Characteristics
Parameter
Single Pulse Avalanche Energy
Avalanche Current
Typ.
–––
–––
Max.
15
Units
mJ
EAS
IAR
-1.4
A
Diode Characteristics
Parameter
Min. Typ. Max. Units
Conditions
D
IS
Continuous Source Current
(Body Diode)
MOSFET symbol
-1.8
––– –––
showing the
A
G
ISM
Pulsed Source Current
(Body Diode)
integral reverse
p-n junction diode.
––– ––– -5.0
––– ––– -1.6
S
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
V
TJ = 25°C, IS = -0.42A, VGS = 0V
––– 51
77
ns
TJ = 25°C, IF = -0.42A
Qrr
––– 86 130
nC di/dt = -100A/µs
2
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IRF6217PbF
10
10
VGS
VGS
TOP
-15V
-12V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
TOP
-15V
-12V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM
BOTTOM
1
1
-5.0V
0.1
0.1
-5.0V
20µs PULSE WIDTH
°
20µs PULSE WIDTH
°
T = 150
J
C
T = 25
C
J
0.01
0.01
0.1
1
10
100
0.1
1
10
100
-V , Drain-to-Source Voltage (V)
DS
-V , Drain-to-Source Voltage (V)
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
10
2.5
-0.70A
=
I
D
2.0
1.5
1.0
0.5
0.0
°
°
C
T = 25
J
C
T = 150
J
1
0.1
V
= -50V
DS
20µs PULSE WIDTH
V
= -10V
GS
0.01
-60 -40 -20
0
20
40
60
80 100 120 140 160
°
4
5
7
8
9
11
12
T , Junction Temperature
(
C)
-V , Gate-to-Source Voltage (V)
GS
J
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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3
IRF6217PbF
12
10
8
10000
I
V
= 0V,
f = 1 MHZ
=
-0.42A
V
V
V
= -120V
= -75V
= -30V
D
GS
DS
DS
DS
C
= C + C
,
C
SHORTED
iss
gs gd
ds
C
= C
rss
gd
C
= C + C
oss
ds
gd
1000
100
10
Ciss
6
Coss
Crss
4
2
1
0
0
2
4
6
8
1
10
100
1000
Q
, Total Gate Charge (nC)
G
-V , Drain-to-Source Voltage (V)
DS
Fig 6. Typical Gate Charge Vs.
Fig 5. Typical Capacitance Vs.
Gate-to-Source Voltage
Drain-to-Source Voltage
10
100
10
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
°
T = 150
C
J
1
1
100µsec
1msec
0.1
0.01
10msec
°
T = 25
C
J
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0 V
GS
0.1
0.2
0.6
0.9
1.3
1.6
1
10
100
1000
-V ,Source-to-Drain Voltage (V)
SD
-V
, Drain-toSource Voltage (V)
DS
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
Forward Voltage
4
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IRF6217PbF
1.0
0.8
0.6
0.4
0.2
0.0
RD
VDS
VGS
D.U.T.
RG
-
+
VDD
VGS
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
25
50
T
75
100
125
150
°
C)
, Case Temperature
(
C
10%
Fig 9. Maximum Drain Current Vs.
V
GS
Ambient Temperature
t
t
r
t
t
f
d(on)
d(off)
Fig 10b. Switching Time Waveforms
100
10
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
P
DM
t
1
t
2
Notes:
1. Duty factor D =
2. Peak T = P
t
/ t
1
2
x
Z
+ T
A
J
DM
thJA
0.1
0.0001
0.001
0.01
0.1
1
10
t , Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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5
IRF6217PbF
1.94
1.92
1.90
1.88
9.00
8.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
V
= -10V
GS
1.86
1.84
1.82
1.80
I
= -0.7A
D
0.00
0.25
0.50
0.75
1.00
1.25
1.50
4.5
6.0
-V
7.5
9.0
10.5
12.0
13.5
15.0
Gate -to -Source Voltage (V)
-I , Drain Current (A)
GS,
D
Fig 12. On-Resistance Vs. Drain Current
Fig 13. On-Resistance Vs. Gate Voltage
Current Regulator
Same Type as D.U.T.
Q
G
-VGS
50KΩ
.3µF
.2µF
12V
Q
Q
GD
GS
35
-
I
V
+
DS
D
V
D.U.T.
G
TOP
-0.6A
-1.1A
-1.4A
V
GS
30
25
20
15
10
5
Charge
-3mA
BOTTOM
I
I
D
G
Current Sampling Resistors
Fig 14a&b. Basic Gate Charge Test Circuit
and Waveform
L
V
DS
I
AS
D.U.T
R
G
V
DD
I
A
AS
DRIVER
-20V
0.01
Ω
t
p
0
25
50
75
100
125
150
°
( C)
Starting Tj, Junction Temperature
t
p
15V
V
(BR)DSS
Fig 15c. Maximum Avalanche Energy
Fig 15a&b. Unclamped Inductive Test circuit
Vs. Drain Current
and Waveforms
6
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IRF6217PbF
SO-8 Package Outline
Dimensions are shown in millimeters (inches)
INCHES
MILLIMETERS
DIM
A
D
B
MIN
.0532
MAX
.0688
.0098
.020
MIN
1.35
0.10
0.33
0.19
4.80
3.80
MAX
1.75
0.25
0.51
0.25
5.00
4.00
5
A
E
A1 .0040
b
c
.013
8
1
7
2
6
3
5
.0075
.189
.0098
.1968
.1574
6
H
D
E
e
0.25 [.010]
A
.1497
4
.050 BASIC
1.27 BASIC
e 1 .025 BASIC
0.635 BASIC
H
K
L
y
.2284
.0099
.016
0°
.2440
.0196
.050
8°
5.80
0.25
0.40
0°
6.20
0.50
1.27
8°
e
6X
e1
K x 45°
A
C
y
0.10 [.004]
8X c
A1
B
8X L
8X b
0.25 [.010]
7
C
A
F OOT PRINT
8X 0.72 [.028]
NOT ES :
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
4. OUT L INE CONF OR MS T O JE DE C OU T L INE MS -012AA.
5
6
7
DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS .
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
6.46 [.255]
DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS .
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
ASUBSTRATE.
3X 1.27 [.050]
8X 1.78 [.070]
SO-8 Part Marking
EXAMPLE: THIS IS AN IRF7101 (MOSFET)
DATE CODE (YWW)
P = DE S IGNAT E S L E AD-F R E E
PRODUCT (OPTIONAL)
Y= LAST DIGIT OF THE YEAR
XXXX
F7101
WW = WEEK
INTERNATIONAL
RECTIFIER
LOGO
A = ASSEMBLYSITE CODE
LOT CODE
PART NUMBER
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7
IRF6217PbF
SO-8 Tape and Reel
Dimensions are shown in millimeters (inches)
TERMINAL NUMBER 1
12.3 ( .484 )
11.7 ( .461 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
330.00
(12.992)
MAX.
14.40 ( .566 )
12.40 ( .488 )
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
Notes:
Repetitive rating; pulse width limited by
Pulse width ≤ 400µs; duty cycle ≤ 2%.
max. junction temperature.
When mounted on 1 inch square copper board.
Starting TJ = 25°C, L = 15mH
RG = 25Ω, IAS = -1.4A.
Data and specifications subject to change without notice.
This product has been designed and qualified for the Consumer market.
Qualifications Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.10/04
8
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