IRF7477 [INFINEON]

SMPS MOSFET; 开关电源MOSFET
IRF7477
型号: IRF7477
厂家: Infineon    Infineon
描述:

SMPS MOSFET
开关电源MOSFET

开关
文件: 总8页 (文件大小:214K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD- 94094A  
IRF7477  
SMPS MOSFET  
HEXFET® Power MOSFET  
Applications  
VDSS  
30V  
RDS(on) max (mΩ)  
8.5@VGS = 10V  
ID  
14A  
l High Frequency Synchronous Buck  
Converters for Computers and  
Communications  
10@VGS = 4.5V  
11A  
Benefits  
l Ultra-Low Gate Impedance  
l Very Low RDS(on)  
l Fully Characterized Avalanche Voltage  
and Current  
l Low Charge Ratio to Eliminate False Turn  
On in High Frequency Circuits  
A
A
D
1
2
3
4
8
S
S
7
D
6
S
D
5
G
D
SO-8  
Top View  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-to-Source Voltage  
± 20  
V
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
14  
11  
A
110  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipation„  
Maximum Power Dissipation„  
Linear Derating Factor  
2.5  
W
W
1.6  
0.02  
mW/°C  
°C  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
Thermal Resistance  
Symbol  
RθJL  
Parameter  
Junction-to-Drain Lead  
Typ.  
–––  
Max.  
20  
Units  
RθJA  
Junction-to-Ambient „  
–––  
50  
°C/W  
Notes  through „are on page 8  
www.irf.com  
1
6/26/01  
IRF7477  
Static @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
30 ––– –––  
––– 0.029 ––– V/°C Reference to 25°C, ID = 1mA  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V
VGS = 0V, ID = 250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
–––  
–––  
1.0  
6.5  
7.7  
8.5  
10  
VGS = 10V, ID = 14A ƒ  
VGS = 4.5V, ID = 11A ƒ  
VDS = VGS, ID = 250µA  
VDS = 24V, VGS = 0V  
VDS = 24V, VGS = 0V, TJ = 125°C  
VGS = 16V  
mΩ  
V
RDS(on)  
VGS(th)  
IDSS  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
––– 2.5  
––– ––– 20  
––– ––– 100  
––– ––– 200  
––– ––– -200  
µA  
Drain-to-Source Leakage Current  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
IGSS  
nA  
VGS = -16V  
Dynamic @ TJ = 25°C (unless otherwise specified)  
Symbol  
gfs  
Parameter  
Forward Transconductance  
Total Gate Charge  
Min. Typ. Max. Units  
Conditions  
VDS = 15V, ID = 11A  
ID = 11A  
35  
––– –––  
25 38  
S
Qg  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
Qgs  
Qgd  
Qoss  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Output Gate Charge  
Turn-On Delay Time  
Rise Time  
6.5 –––  
8.2 –––  
30 –––  
12 –––  
9.8 –––  
19 –––  
5.9 –––  
nC  
VDS = 15V  
VGS = 4.5V  
VGS = 0V, VDS = 15V  
VDD = 15V  
ID = 11A  
ns  
pF  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 1.8Ω  
VGS = 4.5V ƒ  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 2710 –––  
––– 1120 –––  
––– 100 –––  
Output Capacitance  
Reverse Transfer Capacitance  
VDS = 15V  
ƒ = 1.0MHz  
Avalanche Characteristics  
Symbol  
EAS  
Parameter  
Single Pulse Avalanche Energy‚  
Avalanche Current  
Typ.  
–––  
–––  
Max.  
500  
Units  
mJ  
A
IAR  
8.2  
Diode Characteristics  
Symbol  
IS  
Parameter  
Min. Typ. Max. Units  
Conditions  
D
Continuous Source Current  
(Body Diode)  
MOSFET symbol  
2.3  
––– –––  
showing the  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
––– ––– 110  
S
––– 0.80 1.3  
––– 0.65 –––  
––– 91 140  
––– 130 200  
––– 90 140  
––– 140 210  
V
TJ = 25°C, IS = 11A, VGS = 0V ƒ  
TJ = 125°C, IS = 11A, VGS = 0V ƒ  
TJ = 25°C, IF = 11A, VR=15V  
VSD  
Diode Forward Voltage  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
Qrr  
trr  
nC di/dt = 100A/µs ƒ  
ns TJ = 125°C, IF = 11A, VR=15V  
nC di/dt = 100A/µs ƒ  
Qrr  
2
www.irf.com  
IRF7477  
1000  
100  
10  
1000  
100  
10  
VGS  
10V  
VGS  
10V  
TOP  
TOP  
7.0V  
4.5V  
3.7V  
3.5V  
3.3V  
3.0V  
7.0V  
4.5V  
3.7V  
3.5V  
3.3V  
3.0V  
BOTTOM 2.7V  
BOTTOM 2.7V  
2.7V  
2.7V  
20µs PULSE WIDTH  
T = 150 C  
J
20µs PULSE WIDTH  
T = 25 C  
J
°
°
1
0.1  
1
0.1  
1
10  
100  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
2.0  
14A  
=
I
D
1.5  
1.0  
0.5  
0.0  
°
T = 25 C  
J
100  
°
T = 150 C  
J
V
= 50V  
DS  
20µs PULSE WIDTH  
V
= 10V  
GS  
10  
2.5  
3.0  
3.5  
4.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
V
, Gate-to-Source Voltage (V)  
T , Junction Temperature ( C)  
J
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRF7477  
12  
10  
8
100000  
10000  
1000  
I
D
= 11A  
V
= 0V,  
f = 1 MHZ  
GS  
V
V
= 24V  
= 15V  
DS  
DS  
C
= C + C  
,
C
ds  
SHORTED  
iss  
gs  
gd  
C
= C  
rss  
gd  
C
= C + C  
oss  
ds  
gd  
Ciss  
Coss  
6
4
Crss  
100  
2
10  
1
0
0
10  
20  
30  
40  
50  
60  
10  
, Drain-to-Source Voltage (V)  
100  
Q
, Total Gate Charge (nC)  
G
V
DS  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
100  
10  
1
°
T = 150 C  
J
100µsec  
1msec  
°
T = 25 C  
J
Tc = 25°C  
Tj = 150°C  
Single Pulse  
10msec  
100  
V
= 0 V  
GS  
1.0  
1
0.1  
0.2  
0.4  
0.6  
0.8  
1.2  
0.1  
1
10  
1000  
V
,Source-to-Drain Voltage (V)  
SD  
V
, Drain-toSource Voltage (V)  
DS  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
4
www.irf.com  
Fig 6. On-Resistance Vs. Drain Current  
IRF7477  
15  
12  
9
RD  
VDS  
VGS  
10V  
D.U.T.  
RG  
+VDD  
-
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
6
Fig 10a. Switching Time Test Circuit  
3
V
DS  
90%  
0
25  
50  
T
75  
100  
125  
°
150  
, Case Temperature ( C)  
C
10%  
V
GS  
Fig 9. Maximum Drain Current Vs.  
t
t
r
t
t
f
d(on)  
d(off)  
Ambient Temperature  
Fig 10b. Switching Time Waveforms  
100  
10  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
1
P
DM  
t
1
0.1  
0.01  
SINGLE PULSE  
t
2
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =  
t / t  
1 2  
2. Peak T = P  
J
x Z  
+ T  
10  
DM  
thJA  
A
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
www.irf.com  
5
IRF7477  
0.009  
0.008  
0.007  
0.006  
0.005  
0.012  
0.010  
0.008  
0.006  
V
= 4.5V  
= 10V  
GS  
I
= 14A  
D
V
GS  
3.0  
3.4  
3.8  
4.2  
4.6  
0
20  
40  
60  
80  
100  
120  
V
Gate -to -Source Voltage (V)  
I
, Drain Current (A)  
GS,  
D
Fig 12. On-Resistance Vs. Drain Current  
Fig 13. On-Resistance Vs. Gate Voltage  
Current Regulator  
Same Type as D.U.T.  
Q
G
50KΩ  
.3µF  
VGS  
.2µF  
12V  
Q
Q
GD  
GS  
+
1200  
V
DS  
D.U.T.  
I
-
D
V
G
TOP  
3.7A  
6.6A  
BOTTOM 8.2A  
V
GS  
3mA  
Charge  
1000  
800  
600  
400  
200  
0
I
I
D
G
Current Sampling Resistors  
Fig 14a&b. Basic Gate Charge Test Circuit  
and Waveform  
15 V  
V
(B R )D S S  
DRIVER  
L
t
p
V
DS  
D.U.T  
AS  
R
G
+
V
DD  
-
25  
50  
75  
100  
125  
150  
I
A
20V  
°
Starting T , Junction Temperature ( C)  
0.01  
t
p
J
I
A S  
Fig 15c. Maximum Avalanche Energy  
Fig 15a&b. Unclamped Inductive Test circuit  
Vs. Drain Current  
and Waveforms  
6
www.irf.com  
IRF7477  
SO-8 Package Details  
INC HES  
M ILLIM ETER S  
DIM  
D
M IN  
M AX  
.0688  
.0098  
.018  
M IN  
1.35  
0.10  
0.36  
0.19  
4.80  
3.81  
M AX  
1.75  
0.25  
0.46  
0.25  
4.98  
3.99  
5
-
7
2
B -  
A
.0532  
.0040  
.014  
A1  
B
8
1
6
3
5
4
5
H
E
A
C
D
E
.0075  
.189  
.0098  
.196  
0 .25 (.01 0)  
M
A M  
-
-
.150  
.157  
e
e
.050 BASIC  
.025 BASIC  
1.27 BASIC  
K
x 4 5°  
6X  
e1  
e1  
H
K
0.635 BASIC  
θ
.2284  
.011  
0.16  
0°  
.2440  
5.80  
0.28  
0.41  
0°  
6.20  
0.48  
1.27  
8°  
A
.019  
.050  
8°  
- C  
-
0.1 0 (.0 04 )  
6
C
8 X  
L
8X  
L
A 1  
B
8 X  
θ
0.2 5 (.010 )  
M
C A S B S  
R E C O M M E N D E D F O O T P R IN T  
N O T E S :  
0.7 2 (.028  
8X  
)
1. D IM E N S IO N IN G A N D T O LE R A N C IN G P E R A N S I Y 14 .5M -19 82 .  
2. C O N T R O LL IN G D IM E N S IO N : IN C H .  
3. D IM E N S IO N S A R E S H O W N IN M IL LIM E T E R S (IN C H E S ).  
4. O U TL IN E C O N F O R M S TO JE D E C O U TL IN E M S -01 2A A .  
6.46 ( .2 55  
)
1.78 (.0 70 )  
8X  
5
D IM E N S IO N D O E S N O T IN C L U D E M O L D P R O TR U S IO N S  
M O LD P R O T R U S IO N S N O T TO E XC E E D 0.25 (.0 06 ).  
D IM E N S IO N S IS TH E LE N G T H O F LE A D F O R S O LD E R IN G T O  
A
S U B S TR A TE ..  
6
1 .27  
(
.05 0  
)
3 X  
SO-8 Part Marking  
www.irf.com  
7
IRF7477  
SO-8 Tape and Reel  
TERM INAL NUM BER  
1
12.3  
11.7  
(
(
.484  
.461  
)
)
8.1 ( .318  
7.9 ( .312  
)
)
FEED DIRECTION  
N OTES :  
1. CO NTRO LLING DIM E NSIO N : M ILLIM ETER .  
2. ALL DIM ENS ION S ARE SHO W N IN M ILL IM E TER S(INC HES).  
3. OU TL IN E CO N FO RM S TO EIA-481  
& EIA-541.  
330.00  
(12.992)  
M AX.  
14.40 ( .566  
12.40 ( .488  
)
)
NOTES  
:
1. CO NTROLLING DIM ENSION : M ILLIMETER.  
2. OUTLINE CONFORM S TO EIA-481 & EIA-541.  
Notes:  
Repetitive rating; pulse width limited by  
ƒPulse width 400µs; duty cycle 2%.  
max. junction temperature.  
„When mounted on 1 inch square copper board  
‚Starting TJ = 25°C, L = 15mH  
RG = 25, IAS = 8.2A.  
Data and specifications subject to change without notice.  
This product has been designed and qualified for the Industrial market.  
Qualification Standards can be found on IR’s Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information. 6/01  
8
www.irf.com  

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