IRF7478 [INFINEON]
Power MOSFET(Vdss=60V); 功率MOSFET （ VDSS = 60V ）
| 型号： | IRF7478 |
| 厂家： | 
Infineon |
| 描述： | Power MOSFET(Vdss=60V) |
| 文件： | 总8页 (文件大小：210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD- 94055A
IRF7478
SMPS MOSFET
HEXFET® Power MOSFET
Applications
l High frequency DC-DC converters
VDSS
60V
RDS(on) max (mΩ)
26@VGS = 10V
ID
4.2A
30@VGS = 4.5V
3.5A
Benefits
A
A
1
2
8
S
S
D
l Low Gate to Drain Charge to Reduce
Switching Losses
7
D
l Fully Characterized Capacitance Including
Effective COSS to Simplify Design, (See
App. Note AN1001)
3
4
6
S
D
5
G
D
l Fully Characterized Avalanche Voltage
and Current
SO-8
Top V iew
Absolute Maximum Ratings
Parameter
Max.
7.0
Units
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
5.6
A
56
PD @TA = 25°C
Power Dissipation
2.5
W
W/°C
V
Linear Derating Factor
0.02
VGS
dv/dt
TJ
Gate-to-Source Voltage
± 20
Peak Diode Recovery dv/dt
Operating Junction and
3.7
V/ns
-55 to + 150
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
°C
300 (1.6mm from case )
Thermal Resistance
Symbol
RθJL
RθJA
Parameter
Junction-to-Drain Lead
Junction-to-Ambient
Typ.
–––
Max.
20
50
Units
–––
°C/W
Notes through are on page 8
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1
3/13/01
IRF7478
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
60 ––– –––
––– 0.065 ––– V/°C Reference to 25°C, ID = 1mA
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
V
VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
–––
–––
1.0
20
23
26
30
VGS = 10V, ID = 4.2A
VGS = 4.5V, ID = 3.5A
VDS = VGS, ID = 250µA
VDS = 48V, VGS = 0V
RDS(on)
VGS(th)
IDSS
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
mΩ
V
––– 3.0
––– ––– 20
––– ––– 100
––– ––– 100
––– ––– -100
µA
Drain-to-Source Leakage Current
VDS = 48V, VGS = 0V, TJ = 125°C
VGS = 20V
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
IGSS
nA
V
GS = -20V
Dynamic @ TJ = 25°C (unless otherwise specified)
Parameter
Forward Transconductance
Total Gate Charge
Min. Typ. Max. Units
Conditions
gfs
17
––– –––
21 31
S
VDS = 50V, ID = 4.2A
ID = 4.2A
Qg
–––
–––
–––
–––
–––
–––
–––
Qgs
Qgd
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
4.3 –––
9.6 –––
7.7 –––
2.6 –––
44 –––
13 –––
nC VDS = 48V
VGS = 4.5V
VDD = 30V
ID = 4.2A
ns
td(off)
tf
Turn-Off Delay Time
Fall Time
RG = 6.2Ω
VGS = 10V
VGS = 0V
Ciss
Coss
Crss
Coss
Coss
Input Capacitance
––– 1740 –––
––– 300 –––
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
VDS = 25V
–––
37 –––
pF
ƒ = 1.0MHz
––– 1590 –––
––– 220 –––
––– 410 –––
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz
VGS = 0V, VDS = 48V, ƒ = 1.0MHz
VGS = 0V, VDS = 0V to 48V ꢀ
Coss eff.
Symbol
EAS
Parameter
Single Pulse Avalanche Energy
Avalanche Current
Typ.
–––
Max.
140
Units
mJ
IAR
–––
4.2
A
Diode Characteristics
Parameter
Min. Typ. Max. Units
Conditions
D
IS
Continuous Source Current
(Body Diode)
MOSFET symbol
2.3
56
––– –––
––– –––
showing the
A
G
ISM
Pulsed Source Current
(Body Diode)
integral reverse
p-n junction diode.
S
VSD
trr
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
––– ––– 1.3
––– 52 78
––– 100 150
V
TJ = 25°C, IS = 4.2A, VGS = 0V
TJ = 25°C, IF = 4.2A
ns
nC
Qrr
2
di/dt = 100A/µs
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IRF7478
100
10
1
100
10
1
VGS
15V
10V
4.5V
3.7V
3.5V
3.3V
3.0V
VGS
15V
10V
4.5V
3.7V
3.5V
3.3V
3.0V
TOP
TOP
BOTTOM 2.7V
BOTTOM 2.7V
2.7V
2.7V
20µs PULSE WIDTH
T = 150 C
J
20µs PULSE WIDTH
T = 25 C
J
°
°
0.1
1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
2.5
100
7.0A
=
I
D
T
= 150°C
2.0
1.5
1.0
0.5
0.0
J
10
T
= 25°C
J
V
= 25V
DS
20µs PULSE WIDTH
V
GS
= 10V
1
2.5
3.0
3.5 4.0
-60 -40 -20
0
20 40 60 80 100 120 140 160
°
T , Junction Temperature ( C)
J
V
, Gate-to-Source Voltage (V)
GS
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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3
IRF7478
10
8
100000
10000
1000
V
= 0V,
f = 1 MHZ
I = 4.2A
D
GS
C
= C + C
,
C
ds
SHORTED
V
V
V
= 48V
= 30V
= 12V
DS
DS
DS
iss
gs
gd
C
= C
rss
gd
C
= C + C
oss
ds gd
6
Ciss
Coss
4
100
Crss
10
2
10
1
0
100
0
10
20
30
40
Q , Total Gate Charge (nC)
V
, Drain-to-Source Voltage (V)
G
DS
Fig 6. Typical Gate Charge Vs.
Fig 5. Typical Capacitance Vs.
Gate-to-Source Voltage
Drain-to-Source Voltage
1000
100
10
100
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
°
T = 150 C
J
10
10us
100us
1ms
1
°
1
T = 25 C
10ms
J
°
T = 25 C
A
°
T = 150 C
Single Pulse
J
V
= 0 V
GS
1.8
0.1
0.1
0.2
1
10
100
1000
0.6
1.0
1.4
2.2
V
, Drain-to-Source Voltage (V)
V
,Source-to-Drain Voltage (V)
DS
SD
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
Forward Voltage
4
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IRF7478
8.0
6.0
4.0
2.0
0.0
RD
VDS
VGS
10V
D.U.T.
RG
+VDD
-
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
25
50
T
75
100
125
°
150
, Case Temperature ( C)
C
10%
Fig 9. Maximum Drain Current Vs.
V
GS
Ambient Temperature
t
t
r
t
t
f
d(on)
d(off)
Fig 10b. Switching Time Waveforms
100
10
D = 0.50
0.20
0.10
0.05
0.02
0.01
1
P
DM
t
SINGLE PULSE
(THERMAL RESPONSE)
1
0.1
0.01
t
2
Notes:
1. Duty factor D =
t / t
1 2
2. Peak T = P
J
x Z
+ T
10
DM
thJA
A
0.00001
0.0001
0.001
0.01
0.1
1
100
t , Rectangular Pulse Duration (sec)
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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5
IRF7478
0.04
0.03
0.02
0.01
0.028
0.026
0.024
0.022
0.020
0.018
0.016
V
= 4.5V
GS
I
= 7.0A
D
V
= 10V
GS
0.0
2.0
V
4.0
6.0
8.0 10.0 12.0 14.0 16.0
0
10
20
30
40
50
60
Gate -to -Source Voltage (V)
I
, Drain Current (A)
GS,
D
Fig 12. On-Resistance Vs. Drain Current
Fig 13. On-Resistance Vs. Gate Voltage
Current Regulator
Same Type as D.U.T.
Q
G
50KΩ
.3µF
VGS
.2µF
12V
Q
Q
GD
GS
+
400
V
DS
D.U.T.
I
-
D
V
G
TOP
1.9A
3.4A
BOTTOM 4.2A
V
GS
3mA
Charge
I
I
D
G
300
200
100
0
Current Sampling Resistors
Fig 14a&b. Basic Gate Charge Test Circuit
and Waveform
15 V
V
(B R )D S S
DRIVER
L
t
p
V
DS
D.U.T
AS
R
G
+
V
DD
-
25
50
75
100
125
150
I
A
20V
°
Starting T , Junction Temperature ( C)
0.01
Ω
t
p
J
I
A S
Fig 15c. Maximum Avalanche Energy
Fig 15a&b. Unclamped Inductive Test circuit
Vs. Drain Current
and Waveforms
6
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IRF7478
SO-8 Package Details
INC HES
M ILLIM ETER S
DIM
D
M IN
M AX
.0688
.0098
.018
M IN
1.35
0.10
0.36
0.19
4.80
3.81
M AX
1.75
0.25
0.46
0.25
4.98
3.99
5
-
7
2
B -
A
.0532
.0040
.014
A1
B
8
1
6
3
5
4
5
H
E
A
C
D
E
.0075
.189
.0098
.196
0 .25 (.01 0)
M
A M
-
-
.150
.157
e
e
.050 BASIC
.025 BASIC
1.27 BASIC
K
x 4 5°
6X
e1
e1
H
K
0.635 BASIC
θ
.2284
.011
0.16
0°
.2440
5.80
0.28
0.41
0°
6.20
0.48
1.27
8°
A
.019
.050
8°
- C
-
0.1 0 (.0 04 )
6
C
8 X
L
8X
L
A 1
B
8 X
θ
0.2 5 (.010 )
M
C A S B S
R E C O M M E N D E D F O O T P R IN T
N O T E S :
0.7 2 (.028
8X
)
1. D IM E N S IO N IN G A N D T O LE R A N C IN G P E R A N S I Y 14 .5M -19 82 .
2. C O N T R O LL IN G D IM E N S IO N : IN C H .
3. D IM E N S IO N S A R E S H O W N IN M IL LIM E T E R S (IN C H E S ).
4. O U TL IN E C O N F O R M S TO JE D E C O U TL IN E M S -01 2A A .
6.46 ( .2 55
)
1.78 (.0 70 )
8X
5
D IM E N S IO N D O E S N O T IN C L U D E M O L D P R O TR U S IO N S
M O LD P R O T R U S IO N S N O T TO E XC E E D 0.25 (.0 06 ).
D IM E N S IO N S IS TH E LE N G T H O F LE A D F O R S O LD E R IN G T O
A
S U B S TR A TE ..
6
1 .27
(
.05 0
)
3 X
SO-8 Part Marking
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7
IRF7478
SO-8 Tape and Reel
TERM INAL NUM BER
1
12.3
11.7
(
(
.484
.461
)
)
8.1 ( .318
7.9 ( .312
)
)
FEED DIRECTION
N OTES :
1. CO NTRO LLING DIM E NSIO N : M ILLIM ETER .
2. ALL DIM ENS ION S ARE SHO W N IN M ILL IM E TER S(INC HES).
3. OU TL IN E CO N FO RM S TO EIA-481
& EIA-541.
330.00
(12.992)
M AX.
14.40 ( .566
12.40 ( .488
)
)
NOTES
:
1. CO NTROLLING DIM ENSION : M ILLIMETER.
2. OUTLINE CONFORM S TO EIA-481 & EIA-541.
Notes:
Repetitive rating; pulse width limited by When mounted on 1 inch square copper board
max. junction temperature.
ꢀCoss eff. is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS
Starting TJ = 25°C, L = 16mH
RG = 25Ω, IAS = 4.2A.
ISD ≤ 4.2A, di/dt ≤ 160A/µs, VDD ≤ V(BR)DSS
TJ ≤ 150°C
,
Pulse width ≤ 400µs; duty cycle ≤ 2%.
Data and specifications subject to change without notice.
This product has been designed and qualified for the industrial market.
Qualification Standards can be found on IR’s Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.3/01
8
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