IRF7750 [INFINEON]

Power MOSFET(Vdss=-20V, Rds(on)=0.030ohm); 功率MOSFET ( VDSS = -20V , RDS(ON) = 0.030ohm )
IRF7750
型号: IRF7750
厂家: Infineon    Infineon
描述:

Power MOSFET(Vdss=-20V, Rds(on)=0.030ohm)
功率MOSFET ( VDSS = -20V , RDS(ON) = 0.030ohm )

晶体 小信号场效应晶体管 光电二极管
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中文:  中文翻译
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PD - 93848A  
IRF7750  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Dual P-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile ( < 1.1mm)  
l Available in Tape & Reel  
VDSS = -20V  
RDS(on) = 0.030Ω  
TSSOP-8  
Description  
HEXFET® power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely  
lowon-resistancepersiliconarea.Thisbenefit,combinedwiththeruggedizeddevicedesign,thatInternationalRectifier  
is well known for, provides the designer with an extremely efficient and reliable device for battery and load  
management.  
The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device  
for applications where printed circuit board space is at a premium. The low profile (<1.1mm) allows it to fit easily into  
extremely thin environments such as portable electronics and PCMCIA cards.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-20  
Units  
V
VDS  
ID @ TC = 25°C  
ID @ TC = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
±4.7  
±3.8  
A
±38  
PD @TC = 25°C  
PD @TC = 70°C  
Power Dissipation  
1.0  
W
Power Dissipation  
0.64  
Linear Derating Factor  
0.008  
± 12  
W/°C  
V
VGS  
Gate-to-Source Voltage  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambientƒ  
Max.  
125  
Units  
°C/W  
RθJA  
www.irf.com  
1
5/25/2000  
IRF7750  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
-20 ––– –––  
V
VGS = 0V, ID = -250µA  
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient  
––– 0.012 ––– V/°C Reference to 25°C, ID = -1mA  
––– ––– 0.030  
––– ––– 0.055  
-0.45 ––– -1.2  
11 ––– –––  
––– ––– -1.0  
––– ––– -25  
––– ––– -100  
––– ––– 100  
VGS = -4.5V, ID = -4.7A ‚  
VGS = -2.5V, ID = -3.8A ‚  
VDS = VGS, ID = -250µA  
VDS = -10V, ID = -4.7A  
VDS = -20V, VGS = 0V  
VDS = -16V, VGS = 0V, TJ = 70°C  
VGS = -12V  
RDS(on)  
Static Drain-to-Source On-Resistance  
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
Forward Transconductance  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = 12V  
Qg  
––– 26  
––– 3.9 5.8  
––– 8.0 12  
39  
ID = -4.7A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
nC VDS = -16V  
VGS = -5.0V‚  
VDD = -10V  
––– 15 –––  
––– 54 –––  
––– 180 –––  
––– 210 –––  
––– 1700 –––  
––– 380 –––  
––– 270 –––  
ID = -1.0A  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RD = 10Ω  
RG = 24‚  
Ciss  
Coss  
Crss  
Input Capacitance  
VGS = 0V  
Output Capacitance  
pF  
VDS = -15V  
ƒ = 1.0MHz  
Reverse Transfer Capacitance  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
D
IS  
MOSFET symbol  
showing the  
––– -1.0  
–––  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
p-n junction diode.  
––– ––– -38  
––– ––– -1.2  
S
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
V
TJ = 25°C, IS = -1.0A, VGS = 0V ‚  
––– 26  
––– 16  
39  
24  
ns  
TJ = 25°C, IF = -1.0A  
Qrr  
nC di/dt = 100A/µs ‚  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ When mounted on 1 inch square copper board, t<10 sec  
max. junction temperature.  
‚ Pulse width 300µs; duty cycle 2%.  
2
www.irf.com  
IRF7750  
1000  
100  
10  
1000  
100  
10  
VGS  
VGS  
TOP  
-7.50V  
-5.00V  
-4.00V  
-3.50V  
-3.00V  
-2.50V  
-2.00V  
TOP  
-7.50V  
-5.00V  
-4.00V  
-3.50V  
-3.00V  
-2.50V  
-2.00V  
BOTTOM -1.50V  
BOTTOM -1.50V  
-1.50V  
-1.50V  
1
1
20µs PULSE WIDTH  
20µs PULSE WIDTH  
°
T = 25 C  
J
°
T = 150 C  
J
0.1  
0.1  
0.1  
0.1  
1
10  
100  
1
10  
100  
-V , Drain-to-Source Voltage (V)  
DS  
-V , Drain-to-Source Voltage (V)  
DS  
Fig 2. Typical Output Characteristics  
Fig 1. Typical Output Characteristics  
100  
100  
°
T = 25 C  
J
10  
°
T = 150 C  
J
°
T = 150 C  
J
10  
1
°
T = 25 C  
J
V
= -15V  
DS  
20µs PULSE WIDTH  
V
= 0 V  
GS  
1
1.5  
0.1  
0.2  
2.0  
2.5  
3.0  
0.4  
0.6  
0.8  
1.0  
1.2  
-V , Gate-to-Source Voltage (V)  
GS  
-V ,Source-to-Drain Voltage (V)  
SD  
Fig 4. Typical Source-Drain Diode  
Fig 3. Typical Transfer Characteristics  
Forward Voltage  
www.irf.com  
3
IRF7750  
2500  
10  
8
V
GS  
= 0V,  
f = 1MHz  
C
I
D
=
-4.7A  
C
= C + C  
SHORTED  
ds  
iss  
gs  
gd ,  
gd  
V
=-16V  
DS  
C
= C  
gd  
rss  
C
= C + C  
2000  
1500  
1000  
500  
0
oss ds  
C
iss  
6
4
2
C
oss  
rss  
C
0
0
10  
20  
30  
40  
1
10  
100  
Q , Total Gate Charge (nC)  
-V , Drain-to-Source Voltage (V)  
DS  
G
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
1.00  
0.80  
0.60  
0.40  
0.20  
1000  
OPERATION IN THIS AREA LIMITED  
BY R  
DS(on)  
100  
10  
1
10us  
100us  
1ms  
I
= -250µA  
D
10ms  
°
= 25 C  
°
= 150 C  
Single Pulse  
T
A
T
J
0.1  
0.1  
1
10  
100  
-75 -50 -25  
0
25  
50  
75 100 125 150  
-V , Drain-to-Source Voltage (V)  
DS  
T
, Temperature ( °C )  
J
Fig 8. Maximum Safe Operating Area  
Fig 7. Threshold Voltage Vs. Temperature  
4
www.irf.com  
IRF7750  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
20  
16  
12  
8
4
0
25  
50  
75  
100  
125  
150  
0.01  
0.10  
1.00  
10.00  
100.00  
°
T , Case Temperature ( C)  
C
Time (sec)  
Fig 10. Typical Power Vs. Time  
Fig 9. Maximum Drain Current Vs.  
Case Temperature  
1000  
100  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
P
DM  
0.02  
0.01  
t
1
t
2
SINGLE PULSE  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D = t / t  
1
2
2. Peak T =P  
J
x Z  
+ T  
thJA A  
DM  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Typical Effective Transient Thermal Impedance, Junction-to-Ambient  
www.irf.com  
5
IRF7750  
2.0  
0.08  
0.06  
0.04  
0.02  
0.00  
-4.7A  
=
I
D
1.5  
1.0  
0.5  
0.0  
V
= -2.5V  
GS  
V
= -4.5V  
30  
GS  
V
= -4.5V  
GS  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
0
10  
20  
40  
T , Junction Temperature ( C)  
J
-I , Drain Current (A)  
D
Fig 12. Normalized On-Resistance  
Fig 13. Typical On-Resistance Vs. Drain  
Vs. Temperature  
Current  
0.08  
0.06  
0.04  
0.02  
I
= -4.7A  
D
0.00  
2.0  
2.5  
3.0  
3.5  
-V  
Gate -to -Source Voltage (V)  
GS,  
Fig 14. Typical On-Resistance Vs. Gate  
Voltage  
6
www.irf.com  
IRF7750  
TSSOP-8 Package Outline  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 252-7105  
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020  
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 838 4630  
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936  
Data and specifications subject to change without notice. 5/2000  
www.irf.com  
7

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