IRHM8450UPBF [INFINEON]
Power Field-Effect Transistor, 11A I(D), 500V, 0.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA;
| 型号： | IRHM8450UPBF |
| 厂家： | 
Infineon |
| 描述： | Power Field-Effect Transistor, 11A I(D), 500V, 0.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA 局域网 开关 脉冲 晶体管 |
| 文件： | 总12页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD - 90673A
IRHM7450
IRHM8450
JANSR2N7270
JANSH2N7270
N CHANNEL
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFET® TRANSISTOR
MEGA RAD HARD
Product Summary
500Volt, 0.45Ω, MEGA RAD HARD HEXFET
International Rectifier’s RAD HARD technology
HEXFETs demonstrate excellent threshold voltage
stability and breakdown voltage stability at total
radiaition doses as high as 1x106 Rads(Si). Under
identical pre- and post-irradiation test conditions, In-
ternational Rectifier’s RAD HARD HEXFETs retain
identical electrical specifications up to 1 x 105 Rads
(Si) total dose. No compensation in gate drive circuitry
is required. These devices are also capable of surviv-
ing transient ionization pulses as high as 1 x 1012 Rads
(Si)/Sec, and return to normal operation within a few
microseconds. Since the RAD HARD process utilizes
International Rectifier’s patented HEXFET technology,
the user can expect the highest quality and reliability
in the industry.
Part Number
IRHM7450
IRHM8450
BVDSS
500V
500V
RDS(on)
0.45Ω
0.45Ω
ID
11A
11A
Features:
n
n
n
n
n
n
n
n
n
n
n
n
n
Radiation Hardened up to 1 x 106 Rads (Si)
Single Event Burnout (SEB) Hardened
Single Event Gate Rupture (SEGR) Hardened
Gamma Dot (Flash X-Ray) Hardened
Neutron Tolerant
Identical Pre- and Post-Electrical Test Conditions
Repetitive Avalanche Rating
Dynamic dv/dt Rating
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
RAD HARD HEXFET transistors also feature all of
the well-established advantages of MOSFETs, such
as voltage control, very fast switching, ease of paral-
leling and temperature stability of the electrical pa-
rameters. They are well-suited for applications such
as switching power supplies, motor controls, invert-
ers, choppers, audio amplifiers and high-energy
pulse circuits in space and weapons environments.
Electrically Isolated
Ceramic Eyelets
Pre-Irradiation
Absolute Maximum Ratings
Parameter
IRHM7450, IRHM8450
Units
I
@ V
@ V
= 12V, T = 25°C
Continuous Drain Current
11
D
GS
C
A
I
D
= 12V, T = 100°C Continuous Drain Current
7.0
GS
C
I
Pulsed Drain Current
Max. Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
44
DM
@ T = 25°C
P
D
150
1.2
W
W/°C
V
C
V
±20
500
11
GS
E
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
AS
I
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction
15
mJ
V/ns
AR
dv/dt
3.5
T
-55 to 150
J
oC
g
T
Storage Temperature Range
STG
Lead Temperature
Weight
300 (0.063 in. (1.6mm) from case for 10s)
9.3 (typical)
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1
02/01/99
Pre-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Electrical Characteristics @Tj = 25°C (Unless Otherwise Specified)
Parameter
Min Typ Max Units
Test Conditions
BV
Drain-to-Source Breakdown Voltage
500
—
—
—
—
V
V
= 0V, I = 1.0mA
D
DSS
GS
V/°C Reference to 25°C, I = 1.0mA
∆BV
/∆T Temperature Coefficient of Breakdown
0.6
DSS
J
D
Voltage
R
Static Drain-to-Source On-State
Resistance
—
—
—
—
—
—
—
—
0.45
0.50
4.0
—
V
= 12V, I = 7.0A
ꢀ
GS D
DS(on)
Ω
V
= 12V, I = 11A ꢀ
GS
D
V
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
2.0
4.0
—
V
V
= V , I = 1.0mA
GS(th)
fs
DS
GS
D
Ω
g
S ( )
V
DS
> 15V, I
= 7.0A ꢀ
DS
I
50
V
= 0.8 x Max Rating,V =0V
DS GS
DSS
µA
—
250
V
DS
= 0.8 x Max Rating
V
GS
= 0V, T = 125°C
J
I
I
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
8.7
100
-100
150
30
V
= 20V
GSS
GS
nA
nC
V
= -20V
GSS
GS
Q
Q
Q
V
=12V, I = 11A
GS D
= Max Rating x 0.5
g
gs
gd
d(on)
r
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
V
DS
75
45
t
t
t
t
V
= 250V, I = 11A,
DD D
Rise Time
190
190
130
—
R
G
= 2.35Ω
ns
Turn-Off Delay Time
d(off)
f
FallTime
Measured from drain
lead, 6mm (0.25 in)
from package to center
of die.
sym-
Modified MOSFET
bol showing the internal
inductances.
L
Internal Drain Inductance
D
nH
L
S
Internal Source Inductance
—
8.7
—
Measured from source
lead, 6mm (0.25 in)
from package to
source bonding pad.
C
C
C
Input Capacitance
—
—
—
4000
330
52
—
—
—
V
= 0V, V
= 25V
f = 1.0MHz
iss
GS DS
Output Capacitance
Reverse Transfer Capacitance
pF
oss
rss
Source-Drain Diode Ratings and Characteristics
Parameter
Min Typ Max Units
Test Conditions
I
I
Continuous Source Current (Body Diode)
—
—
—
—
11
44
S
Modified MOSFET symbol
showing the integral reverse
p-n junction rectifier.
A
Pulse Source Current (Body Diode)
SM
V
t
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
—
—
—
—
—
—
1.6
V
T = 25°C, I =11A, V
= 0V ꢀ
j
SD
S
GS
1100 ns
16 µC
T = 25°C, I = 11A, di/dt ≤ 100A/µs
j
rr
F
Q
V
DD
≤ 50V ꢀ
RR
t
on
Forward Turn-On Time
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .
S D
Thermal Resistance
Parameter
Min Typ Max Units
Test Conditions
R
thJC
R
thJA
R
thCS
Junction-to-Case
Junction-to-Ambient
Case-to-Sink
—
—
—
—
0.83
48
—
—
0.21
°C/W
Typical socket mount
2
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Radiation
Characteristics
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Radiation Performance of Rad Hard HEXFETs
International Rectifier Radiation Hardened HEXFETs
are tested to verify their hardness capability. The hard-
ness assurance program at International Rectifier
comprises three radiation environments.
Table 1, column 2, IRHM8450. The values in Table 1
will be met for either of the two low dose rate test
circuits that are used. Both pre- and post-irradiation
performance are tested and specified using the same
drive circuitry and test conditions in order to provide a
direct comparison.
Every manufacturing lot is tested in a low dose rate
(total dose) environment per MIL-STD-750, test
method 1019 condition A. International Rectifier has
imposed a standard gate condition of 12 volts per
note 6 and a VDS bias condition equal to 80% of the
device rated voltage per note 7. Pre- and post- irra-
diation limits of the devices irradiated to 1 x 105 Rads
(Si) are identical and are presented in Table 1, col-
umn 1, IRHM7450. Post-irradiation limits of the de-
vices irradiated to 1 x 106 Rads (Si) are presented in
High dose rate testing may be done on a special
request basis using a dose rate up to 1 x 1012 Rads
(Si)/Sec (See Table 2).
International Rectifier radiation hardened HEXFETs
have been characterized in heavy ion Single Event
Effects (SEE) environments. Single Event Effects char-
acterization is shown in Table 3.
Table 1. Low Dose Rate
IRHM7450 IRHM8450
Parameter
100K Rads (Si) 1000K Rads (Si) Units
Test Conditions
Min Max Min
Max
BV
Drain-to-Source Breakdown Voltage 500
—
4.0
500
1.25
—
—
4.5
100
-100
50
V
= 0V, I = 1.0mA
DSS
GS D
V
V
Gate Threshold Voltage ꢀ
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Zero Gate Voltage Drain Current
Static Drain-to-Source ꢀ
2.0
—
—
—
—
V
GS
= V , I = 1.0mA
GS(th)
DS
D
I
I
100
-100
50
V
GS
= 20V
GSS
nA
—
V
= -20 V
GS
GSS
I
—
—
µA
Ω
V
=0.8 x Max Rating, V
V
=0V
GS
= 12V, I = 7.0A
GS
D
DSS
DS
R
0.45
0.6
DS(on)1
On-State Resistance One
V
SD
Diode Forward Voltage ꢀ
—
1.6
—
1.6
V
T
C
= 25°C, I =11A,V
S
= 0V
GS
Table 2. High Dose Rate
1011 Rads (Si)/sec 1012 Rads (Si)/sec
Min Typ Max Min Typ Max Units
Parameter
Test Conditions
V
Drain-to-Source Voltage
—
—
400
—
—
400
V
Applied drain-to-source voltage during
gamma-dot
DSS
I
—
—
27
8
—
—
—
15
—
—
—
133
8
—
—
—
3
—
A
Peak radiation induced photo-current
PP
di/dt
A/µsec Rate of rise of photo-current
µH Circuit inductance required to limit di/dt
L
1
Table 3. Single Event Effects
LET (Si)
Fluence
Range
(µm)
V
Bias
(V)
V
Bias
GS
(V)
DS
Ion
(MeV/mg/cm2)
(ions/cm2)
Ni
28
3x 105
~41
275
-5
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3
Post-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Fig 1. Typical Response of Gate Threshhold
Fig 2. Typical Response of On-State Resistance
Voltage Vs. Total Dose Exposure
Vs. Total Dose Exposure
Fig 4. Typical Response of Drain to Source
Fig 3. Typical Response of Transconductance
Breakdown Vs. Total Dose Exposure
Vs. Total Dose Exposure
4
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Post-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Fig 6. Typical On-State Resistance Vs.
Fig 5. Typical Zero Gate Voltage Drain
NeutronFluenceLevel
Current Vs. Total Dose Exposure
Fig 8a. Gate Stress o
VGSS Equals 12 Volts
DuringRadiation
Fig 7. Typical Transient Response
of Rad Hard HEXFET During
1x1012 Rad (Si)/Sec Exposure
Fig 8b. VDSS Stress
Equals 80% of BVDSS
DuringRadiation
Fig 9. High Dose Rate
(Gamma Dot) Test Circuit
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5
Radiation
Characteristics
Ra
Ch
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
GS
DS
Note: Bias Conditions during radiation: V = 12 Vdc, V = 0 Vdc
Fig 10. Typical Output Characteristics
Fig 11. Typical Output Characteristics
Post-Irradiation100KRads(Si)
Pre-Irradiation
Fig 12. Typical Output Characteristics
Fig 13. Typical Output Characteristics
Post-Irradiation 300K Rads (Si)
Post-Irradiation 1 Mega Rads(Si)
6
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Radiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Characteristics
GS
DS
Note: Bias Conditions during radiation: V = 0 Vdc, V = 400 Vdc
Fig 14. Typical Output Characteristics
Fig 15. Typical Output Characteristics
Pre-Irradiation
Post-Irradiation 100K Rads (Si)
Fig 16. Typical Output Characteristics
Fig 17. Typical Output Characteristics
Post-Irradiation 300K Rads (Si)
Post-Irradiation 1 Mega Rads(Si)
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7
Pre-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Fig 18. Typical Output Characteristics
Fig 19. Typical Output Characteristics
Fig 20. Typical Transfer Characteristics
Fig 21. Normalized On-Resistance
Vs.Temperature
8
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Pre-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Fig 22. Typical Capacitance Vs.
Drain-to-SourceVoltage
Fig 23. Typical Gate Charge Vs.
Gate-to-SourceVoltage
Fig 25. Maximum Safe Operating
Fig 24. Typical Source-Drain Diode
Area
ForwardVoltage
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9
Pre-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
RD
VDS
VGS
D.U.T.
RG
+VDD
-
12V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 27a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
Fig 26. Maximum Drain Current Vs.
t
t
r
t
t
f
d(on)
d(off)
CaseTemperature
Fig 27b. Switching Time Waveforms
Fig28. MaximumEffectiveTransientThermalImpedance,Junction-to-Case
10
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Pre-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
1 5V
DRIVER
L
V
G
DS
D.U.T
R
+
V
D D
-
I
A
AS
12V
20V
0.01
Ω
t
p
Fig 29a. Unclamped Inductive Test Circuit
V
(BR)DSS
t
p
Fig 29c. Maximum Avalanche Energy
Vs. DrainCurrent
I
AS
Current Regulator
Fig29b. UnclampedInductiveWaveforms
Same Type as D.U.T.
50KΩ
.2µF
12V
Q
G
.3µF
+
12 V
V
DS
D.U.T.
-
Q
Q
GD
GS
V
GS
V
G
3mA
I
I
D
G
Charge
Current Sampling Resistors
Fig 30b. Gate Charge Test Circuit
Fig30a. Basic Gate Charge Waveform
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11
Pre-Irradiation
IRHM7450, IRHM8450, JANSR-, JANSH-, 2N7270 Devices
Total Dose Irradiation with V
Bias.
GS
= 0 during
See Figures 18 through 31 for pre-irradiation
curves
12 volt V
applied and V
GS
DS
irradiation per MIL-STD-750, method 1019, codition A.
Repetitive Rating; Pulse width limited by
maximum junction temperature.
Refer to current HEXFET reliability report.
Total Dose Irradiation with V Bias.
DS
(pre-irradiation)
V
= 0.8 rated BV
DS
applied and V
DSS
= 0 during irradiation per
GS
V
Starting T = 25°C,
J
DD = 25V,
MlL-STD-750, method 1019, condition A.
Peak I = 11A, L ≥7.4mH, R =25Ω
L
G
This test is performed using a flash x-ray
source operated in the e-beam mode (energy
~2.5 MeV), 30 nsec pulse.
I
≤ 11A, di/dt ≤ 140A/µs,
SD
V
≤ BV
, T ≤ 150°C
DSS J
DD
Suggested RG =2.35Ω
All Pre-Irradiation and Post-Irradiation test
ꢀPulse width ≤ 300 µs; Duty Cycle ≤ 2%
conditions are identical to facilitate direct
comparison for circuit applications.
Case Outline and Dimensions —TO-254AA
.12
( .00 5 )
1 3.8 4
1 3.5 9
(
(
.545
.535
)
)
-B-
6 .6 0
6 .3 2
(
(
.2 60
.2 49
)
)
3.7 8
3.5 3
(
(
.149
.139
)
)
1 .2 7
1 .0 2
(
(
.0 50
.0 40
)
)
-A-
20 .3 2
20 .0 7
(
(
.8 00
.7 90
)
)
17.4 0
16.8 9
(
(
.68 5
.66 5
)
)
13 .84
13 .59
(
(
.5 45
.5 35
)
)
1
2 3
W
3 1.40
3 0.39
(
(
1.2 35
1.1 99
)
)
1
2
3
-C -
1 .1 4
0 .8 9
(
(
.0 45
.0 35
)
)
3 X
3 .81
(
.1 50
)
3.81
( .15 0 )
2X
.5 0
.2 5
(
(
.0 20
.0 10
)
)
M
M
C
C
A
M
B
LEGEND
1- DRAIN
2- SOURCE
3- GATE
LEGEND
1- DRAIN
2- SOURCE
3- GATE
N OTES:
1 . D IM EN SIO N ING
&
TOL ER ANC IN G PER AN SI Y14 .5 M , 198 2.
IN M IL LIM ETERS IN C H ES ).
2 . AL L D IM EN SION S ARE SH OW
N
(
Conforms to JEDEC Outline TO-254AA
Dimensions in Millimeters and ( Inches )
CAUTION
BERYLLIA WARNING PER MIL-PRF-19500
Package containing beryllia shall not be ground, sandblasted
machined, or have other operations performed on them which
will produce beryllia or beryllium dust. Furthermore, beryllium
oxide packages shall not be placed in acids that will produce
fumes containing beryllium.
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020
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http://www.irf.com/
Data and specifications subject to change without notice.
2/99
12
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