IRHY53130CMPBF [INFINEON]

Power Field-Effect Transistor, 18A I(D), 100V, 0.07ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED, TO-257AA, 3 PIN;
IRHY53130CMPBF
型号: IRHY53130CMPBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 18A I(D), 100V, 0.07ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AA, HERMETIC SEALED, TO-257AA, 3 PIN

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PD - 93826D  
IRHY57130CM  
JANSR2N7484T3  
100V, N-CHANNEL  
RADIATION HARDENED  
POWER MOSFET  
THRU-HOLE (TO-257AA)  
REF: MIL-PRF-19500/702  
TECHNOLOGY  
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
IRHY57130CM 100K Rads (Si) 0.07Ω  
IRHY53130CM 300K Rads (Si) 0.07Ω  
IRHY54130CM 500K Rads (Si) 0.07Ω  
IRHY58130CM1000K Rads (Si) 0.085Ω  
ID  
QPL Part Number  
18A* JANSR2N7484T3  
18A* JANSF2N7484T3  
18A* JANSG2N7484T3  
18A* JANSH2N7484T3  
TO-257AA  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space  
applications.These devices have been characterized  
for Single Event Effects (SEE) with useful performance  
up to an LET of 80 (MeV/(mg/cm2)). The combination  
of low RDS(on) and low gate charge reduces the  
power losses in switching applications such as DC  
to DC converters and motor control. These devices  
retain all of the well established advantages of  
MOSFETs such as voltage control, fast switching,  
ease of paralleling and temperature stability of  
electrical parameters.  
Features:  
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Ultra Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Eyelets  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
18*  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
14  
72  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
75  
W
W/°C  
V
D
C
Linear Derating Factor  
0.6  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
87  
GS  
E
mJ  
A
AS  
I
18  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
7.5  
mJ  
V/ns  
AR  
dv/dt  
1.4  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Lead Temperature  
Weight  
300 (0.063in./1.6mm from case for 10sec)  
4.3 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
4/26/06  
IRHY57130CM, JANSR2N7484T3  
Pre-Irradiation  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Parameter  
Min Typ Max Units  
Test Conditions  
BV  
Drain-to-Source Breakdown Voltage  
100  
V
V
= 0V, I = 1.0mA  
D
DSS  
GS  
V/°C Reference to 25°C, I = 1.0mA  
BV  
/T Temperature Coefficient of Breakdown  
0.11  
DSS  
J
D
Voltage  
R
V
Static Drain-to-Source On-State  
Resistance  
0.07  
V
= 12V, I = 14A  
DS(on)  
GS D  
Ã
Gate Threshold Voltage  
Forward Transconductance  
Zero Gate Voltage Drain Current  
2.0  
13  
4.0  
10  
25  
V
V
= V , I = 1.0mA  
GS(th)  
fs  
DS  
GS  
D
g
S ( )  
V
> 15V, I  
= 14A Ã  
DS  
V
DS  
I
= 80V ,V =0V  
DS GS  
DSS  
µA  
V
= 80V,  
DS  
= 0V, T = 125°C  
V
GS  
J
I
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain (‘Miller’) Charge  
Turn-On Delay Time  
Rise Time  
6.8  
100  
-100  
50  
7.4  
20  
V
= 20V  
GSS  
GS  
nA  
nC  
V
= -20V  
GSS  
GS  
Q
Q
Q
V
=12V, I = 18A  
g
gs  
gd  
d(on)  
r
GS D  
V
= 50V  
DS  
t
t
t
t
25  
V
= 50V, I = 18A,  
DD  
GS  
D
100  
35  
V
=12V, R = 7.5Ω  
G
ns  
Turn-Off Delay Time  
Fall Time  
Total Inductance  
d(off)  
30  
f
L
+ L  
Measured from drain lead (6mm/  
0.25in. from package) to source  
lead (6mm/0.25in. from package)  
S
D
nH  
C
C
C
Input Capacitance  
1005  
365  
50  
V
= 0V, V  
= 25V  
f = 1.0MHz  
iss  
GS DS  
Output Capacitance  
Reverse Transfer Capacitance  
pF  
oss  
rss  
Source-Drain Diode Ratings and Characteristics  
Parameter  
Min Typ Max Units  
Test Conditions  
I
I
Continuous Source Current (Body Diode)  
Pulse Source Current (Body Diode) À  
Diode Forward Voltage  
18*  
72  
S
A
SM  
V
1.2  
250  
850  
V
T = 25°C, I = 18A, V  
= 0V Ã  
j
SD  
S
GS  
t
Q
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
nC  
T = 25°C, I = 18A, di/dt 100A/µs  
j
rr  
RR  
F
V
DD  
25V Ã  
t
on  
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .  
S D  
* Current is limited by package  
Thermal Resistance  
Parameter  
Min Typ Max Units  
Test Conditions  
R
R
Junction-to-Case  
Junction-to-Ambient  
1.67  
80  
thJC  
thJA  
°C/W  
Note: Corresponding Spice and Saber models are available on International Rectifier Web site.  
For footnotes refer to the last page  
2
www.irf.com  
Radiation Characteristics  
IRHY57130CM, JANSR2N7484T3  
International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability.  
The hardness assurance program at International Rectifier is comprised of two radiation environments.  
Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both  
pre- and post-irradiation performance are tested and specified using the same drive circuitry and test  
conditions in order to provide a direct comparison.  
Table 1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation ÄÅ  
Parameter  
Up to 500K Rads(Si)1 1000K Rads (Si)2 Units  
Test Conditions  
Min  
Max  
Min  
Max  
BV  
Drain-to-Source Breakdown Voltage  
Gate Threshold Voltage  
100  
2.0  
4.0  
100  
1.5  
4.0  
V
V
= 0V, I = 1.0mA  
DSS  
GS D  
V
V
= V , I = 1.0mA  
GS(th)  
GS  
DS  
D
I
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Zero Gate Voltage Drain Current  
100  
-100  
10  
100  
-100  
25  
V
GS  
V
GS  
= 20V  
GSS  
nA  
= -20 V  
GSS  
I
µA  
V
V
= 80V, V =0V  
GS  
= 12V, I =14A  
D
DSS  
DS  
GS  
R
DS(on)  
Static Drain-to-Source  
On-State Resistance (TO-3)  
Static Drain-to-Source  
On-State Resistance (TO-257AA)  
Diode Forward Voltage  
Ã
0.074  
0.09  
R
V
Ã
0.07  
0.085  
V
= 12V, I =14A  
D
GS  
DS(on)  
Ã
1.2  
1.2  
V
= 0V, I = 18A  
V
SD  
GS  
S
1. Part numbers IRHY57130CM (JANSR2N7484T3), IRHY53130CM (JANSF2N7484T3) and IRHY54130CM (JANSG2N7484T3)  
2. Part number IRHY58130CM (JANSH2N7484T3)  
International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for  
Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.  
Table 2. Single Event Effect Safe Operating Area  
VDS (V)  
Ion  
LET  
(MeV/(mg/cm2))  
36.7  
Energy  
(MeV)  
309  
341  
350  
Range  
(µm) @VGS=0V @VGS=-5V @VGS=-10V @VGS=-15V @VGS=-20V  
Br  
I
Au  
39.5  
32.5  
28.4  
100  
100  
100  
100  
100  
100  
100  
100  
80  
100  
35  
25  
100  
25  
59.4  
82.3  
120  
100  
80  
60  
40  
20  
0
Br  
I
Au  
0
-5  
-8  
-10  
-15  
-20  
VGS  
Fig a. Single Event Effect, Safe Operating Area  
For footnotes refer to the last page  
www.irf.com  
3
IRHY57130CM, JANSR2N7484T3  
Pre-Irradiation  
100  
10  
1
100  
VGS  
15V  
VGS  
TOP  
TOP  
15V  
12V  
10V  
9.0V  
8.0V  
7.0V  
6.0V  
12V  
10V  
9.0V  
8.0V  
7.0V  
6.0V  
BOTTOM5.0V  
BOTTOM 5.0V  
5.0V  
10  
5.0V  
20µs PULSE WIDTH  
°
T = 25 C  
J
20µs PULSE WIDTH  
°
T = 150 C  
J
1
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
100  
2.5  
18A
=
I
D
°
T = 25 C  
J
2.0  
1.5  
1.0  
0.5  
0.0  
°
T = 150 C  
J
V
= 50V  
DS  
20µs PULSE WIDTH  
V
=12V  
GS  
10  
5.0  
6.0  
7.0  
8.0 9.0  
10.0  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
V
, Gate-to-Source Voltage (V)  
T , Junction Temperature ( C)  
J
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
4
www.irf.com  
Pre-Irradiation  
IRHY57130CM, JANSR2N7484T3  
2000  
1600  
1200  
800  
20  
15  
10  
5
V
= 0V,  
f = 1MHz  
C
GS  
I
D
= 18A  
V
V
V
= 80V  
= 50V  
= 20V  
C
= C + C  
SHORTED  
ds  
DS  
DS  
DS  
iss  
gs  
gd ,  
gd  
C
= C  
gd  
rss  
C
= C + C  
ds  
oss  
C
iss  
C
oss  
400  
C
rss  
FOR TEST CIRCUIT  
SEE FIGURE 13  
0
1
0
10  
100  
0
10  
20  
30 40  
50  
V
, Drain-to-Source Voltage (V)  
Q , Total Gate Charge (nC)  
DS  
G
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
100  
10  
1
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
°
T = 150 C  
J
100µs  
°
T = 25 C  
J
1ms  
1
Tc = 25°C  
Tj = 150°C  
10ms  
Single Pulse  
V
= 0 V  
GS  
0.1  
0.1  
0.4  
0.6  
0.8  
1.0  
1.2  
1
10  
100  
1000  
V
,Source-to-Drain Voltage (V)  
SD  
V
, Drain-toSource Voltage (V)  
DS  
Fig 7. Typical Source-Drain Diode  
Fig 8. Maximum Safe Operating Area  
Forward Voltage  
www.irf.com  
5
IRHY57130CM, JANSR2N7484T3  
Pre-Irradiation  
RD  
25  
VDS  
LIMITED BY PACKAGE  
VGS  
D.U.T.  
20  
15  
10  
5
RG  
+VDD  
-
VGS  
Pulse Width ≤ 1 µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
0
25  
50  
75  
100  
125  
150  
°
T , Case Temperature ( C)  
C
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 9. Maximum Drain Current Vs.  
Case Temperature  
Fig 10b. Switching Time Waveforms  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
P
2
DM  
0.1  
SINGLE PULSE  
(THERMAL RESPONSE)  
t
1
0.02  
0.01  
t
2
Notes:  
1. Duty factor D = t / t  
1
2. Peak T =P  
x Z  
+ T  
C
J
DM  
thJC  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
Pre-Irradiation  
IRHY57130CM, JANSR2N7484T3  
150  
120  
90  
60  
30  
0
I
D
TOP  
7.2A  
10A  
18A  
15V  
BOTTOM  
DRIVER  
+
L
V
DS  
.
D.U.T  
R
G
V
DD  
-
I
AS  
V
2
GS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
25  
50  
75  
100  
125  
150  
°
Starting T , Junction Temperature ( C)  
J
V
(BR)DSS  
t
p
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
I
AS  
Current Regulator  
Fig 12b. Unclamped Inductive Waveforms  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
Q
G
.3µF  
+
12 V  
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Basic Gate Charge Waveform  
www.irf.com  
7
IRHY57130CM, JANSR2N7484T3  
Footnotes:  
Pre-Irradiation  
à Pulse width 300 µs; Duty Cycle 2%  
Ä Total Dose Irradiation with V Bias.  
À
Repetitive Rating; Pulse width limited by  
maximum junction temperature.  
GS  
= 0 during  
12 volt V  
applied and V  
DS  
Á
V
= 50V, starting T = 25°C, L= 0.53mH  
J
GS  
irradiation per MIL-STD-750, method 1019, condition A.  
DD  
Peak I = 18A, V  
= 12V  
L
GS  
Å Total Dose Irradiation with V  
Bias.  
 I  
18A, di/dt 155A/µs,  
DS  
= 0 during  
SD  
DD  
80 volt V  
applied and V  
GS  
V
100V, T 150°C  
DS  
irradiation per MlL-STD-750, method 1019, condition A.  
J
Case Outline and Dimensions — TO-257AA  
PIN ASSIGNMENTS  
1 = DRAIN  
2 = SOURCE  
3 = GATE  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information.  
Data and specifications subject to change without notice. 04/2006  
8
www.irf.com  

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