JANTXV2N6798 [INFINEON]

POWER MOSFET N-CHANNEL(BVdss=200V, Rds(on)=0.40ohm, Id=5.5A); 功率MOSFET N沟道( BVDSS = 200V , RDS(ON) = 0.40ohm ,ID = 5.5A )
JANTXV2N6798
型号: JANTXV2N6798
厂家: Infineon    Infineon
描述:

POWER MOSFET N-CHANNEL(BVdss=200V, Rds(on)=0.40ohm, Id=5.5A)
功率MOSFET N沟道( BVDSS = 200V , RDS(ON) = 0.40ohm ,ID = 5.5A )

晶体 晶体管 功率场效应晶体管 开关 脉冲
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Provisional Data Sheet No. PD-9.431B  
JANTX2N6798  
JANTXV2N6798  
[REF:MIL-PRF-19500/557]  
HEXFET® POWER MOSFET  
[GENERIC:IRFF230]  
N-CHANNEL  
200 Volt, 0.40HEXFET  
Product Summary  
Part Number  
JANTX2N6798  
JANTXV2N6798  
BVDSS  
RDS(on)  
ID  
HEXFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transis-  
tors. The efficient geometry achieves very low on-  
state resistance combined with high transconductance.  
5.5A  
200V  
0.40Ω  
HEXFET transistors also feature all of the well-es-  
tablish advantages of MOSFETs, such as voltage  
control, very fast switching, ease of paralleling and  
electrical parameter temperature stability. They are  
well-suited for applications such as switching power  
supplies, motor controls, inverters, choppers, audio  
amplifiers, and high energy pulse circuits, and virtu-  
ally any application where high reliability is required.  
Features:  
Avalanche Energy Rating  
Dynamic dv/dt Rating  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Absolute Maximum Ratings  
Parameter  
JANTX2N6798, JANTXV2N6798 Units  
I
D
@ V  
= 10V, T = 25°C Continuous Drain Current  
5.5  
GS  
C
A
I
@ V  
= 10V, T = 100°C Continuous Drain Current  
3.5  
22  
D
GS  
C
I
Pulsed Drain Current ➀  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Peak Diode Recovery dv/dt ➂  
Operating Junction  
DM  
@ T = 25°C  
P
25  
W
W/K ➄  
V
D
C
0.20  
±20  
V
GS  
dv/dt  
4.5  
V/ns  
T
-55 to 150  
J
T
Storage Temperature Range  
Lead Temperature  
STG  
oC  
g
(0.063 in. (1.6mm) from  
300  
case for 10.5 seconds)  
0.98 (typical)  
Weight  
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JANTX2N6798, JANTXV2N6798 Device  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Parameter  
Min. Typ. Max. Units  
Test Conditions  
BV  
Drain-to-Source Breakdown Voltage  
200  
V
V
= 0V, I = 1.0 mA  
D
DSS  
GS  
V/°C Reference to 25°C, I = 1.0 mA  
BV  
/T Temperature Coefficient of Breakdown  
0.25  
DSS  
J
D
Voltage  
= 10V, I = 3.5A  
GS D  
R
Static Drain-to-Source  
On-State Resistance  
Gate Threshold Voltage  
ForwardTransconductance  
Zero Gate Voltage Drain Current  
2.0  
2.5  
0.40  
0.46  
4.0  
25  
V
DS(on)  
V
S ( )  
V
= 10V, I = 5.5A  
GS D  
V
g
V
= V , I = 250µA  
GS(th)  
fs  
DS  
GS  
D
V
> 15V, I  
= 3.5A  
DS  
DS  
I
V
= 0.8 x Max Rating,V = 0V  
DSS  
DS  
GS  
µA  
250  
V
= 0.8 x Max Rating  
DS  
V
= 0V, T = 125°C  
GS  
J
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain (“Miller”) Charge  
Turn-On Delay Time  
Rise Time  
Turn-Off Delay Time  
Fall Time  
Internal Drain Inductance  
7.4  
2.5  
6.0  
5.0  
100  
-100  
42.1  
5.3  
28  
30  
50  
50  
40  
V
= 20V  
GS  
GSS  
nA  
nC  
I
V
= -20V  
GSS  
GS  
Q
Q
Q
V
= 10V, I = 5.5A  
= Max. Rating x 0.5  
see figures 6 and 13  
g
gs  
gd  
GS  
D
V
DS  
t
V
= 100V, I = 5.5A,  
d(on)  
DD D  
t
R
G
= 7.5, VGS= 10V  
r
ns  
t
d(off)  
t
L
see figure 10  
f
Measured from the  
drain lead, 6mm (0.25  
in.) from package to  
center of die.  
Modified MOSFET  
symbol showing the  
internal inductances.  
D
S
nH  
pF  
Measured from the  
source lead, 6mm  
(0.25 in.) from package  
to source bonding pad.  
L
Internal Source Inductance  
15  
C
C
C
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
600  
250  
80  
V
= 0V, V  
f = 1.0 MHz  
see figure 5  
= 25V  
DS  
iss  
oss  
rss  
GS  
Source-Drain Diode Ratings and Characteristics  
Parameter  
Min. Typ. Max. Units  
Test Conditions  
I
I
Continuous Source Current (Body Diode)  
Pulse Source Current (Body Diode) ➀  
5.5  
22  
Modified MOSFET symbol showing the  
integral reverse p-n junction rectifier.  
S
SM  
A
V
t
Q
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
1.4  
500  
6.0  
V
ns  
µC  
T = 25°C, I = 5.5A, V  
= 0V ➃  
GS  
j
SD  
rr  
RR  
S
T = 25°C, I = 5.5A, di/dt 100A/µs  
j
F
V
50V ➃  
DD  
t
Forward Turn-On Time  
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .  
S D  
on  
Thermal Resistance  
Parameter  
Min. Typ. Max. Units  
Test Conditions  
R
R
Junction-to-Case  
5.0  
thJC  
thJA  
Junction-to-Ambient  
175  
K/W  
Typical socket mount  
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JANTX2N6798, JANTXV2N6798 Device  
Fig. 1 — Typical Output Characteristics  
TC = 25°C  
Fig. 2 — Typical Output Characteristics  
TC = 150°C  
Fig. 3 — Typical Transfer Characteristics  
Fig. 4 — Normalized On-Resistance Vs.Temperature  
Fig. 5 — Typical Capacitance Vs. Drain-to-Source  
Voltage  
Fig. 6 — Typical Gate Charge Vs. Gate-to-Source  
Voltage  
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JANTX2N6798, JANTXV2N6798 Device  
Fig. 7 — Typical Source-to-Drain Diode Forward  
Voltage  
Fig. 8 — Maximum Safe Operating Area  
Fig. 9 — Maximum Drain Current Vs. Case Temperature  
Fig. 10b — Switching Time Waveforms  
Fig. 10a — Switching Time Test Circuit  
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JANTX2N6798, JANTXV2N6798 Device  
Fig. 11 — Maximum Effective Transient Thermal Impedance, Junction-to-Case Vs. Pulse Duration  
Fig. 12b — Unclamped Inductive Waveforms  
Fig. 12a — Unclamped Inductive Test Circuit  
Fig. 13a — Gate Charge Test Circuit  
Fig. 13b — Basic Gate Charge Waveform  
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JANTX2N6798, JANTXV2N6798 Device  
Repetitive Rating; Pulse width limited by  
maximum junction temperature.  
(see figure 11)  
I  
SD  
5.5A, di/dt 120A/µs,  
BV , T 150°C  
V
DD  
DSS  
J
Pulse width 300 µs; Duty Cycle 2%  
@ V  
= 50V, Starting T = 25°C,  
J
DD  
= [0.5  
K/W = °C/W  
2
E
L
(I ) [BV  
/(BV  
-V )]  
DSS DD  
AS  
*
*
*
DSS  
= 10V, 25 R 200Ω  
L
W/K = W/°C  
Peak I = 5.5A, V  
L
GS  
G
Case Outline and Dimensions — TO-205AF (Modified TO-39)  
All dimensions are shown millimeters (inches)  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331  
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020  
IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371  
http://www.irf.com/  
Dataandspecificationssubjecttochangewithoutnotice.  
10/96  
To Order  

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