Q67040-S4488 [INFINEON]
Fast Switching EmCon Diode; 快速开关EMCON二极管
| 型号： | Q67040-S4488 |
| 厂家： | 
Infineon |
| 描述： | Fast Switching EmCon Diode |
| 文件： | 总9页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IDP30E60
IDB30E60
Fast Switching EmCon Diode
Product Summary
Feature
V
600
30
V
A
V
RRM
• 600 V EmCon technology
• Fast recovery
• Soft switching
• Low reverse recovery charge
• Low forward voltage
• 175°C operating temperature
• Easy paralleling
I
F
V
T
1.5
175
F
°C
jmax
P-TO220-3.SMD
P-TO220-2-2.
Type
Package
Ordering Code Marking Pin 1 PIN 2 PIN 3
Q67040-S4488
P-TO220-3.SMD Q67040-S4376
C
NC
A
C
-
A
IDP30E60
IDB30E60
P-TO220-2-2.
D30E60
D30E60
Maximum Ratings, at T = 25 °C, unless otherwise specified
Parameter
Repetitive peak reverse voltage
Continous forward current
Symbol
Value
600
Unit
V
A
V
RRM
I
F
T =25°C
52.3
34.9
C
T =90°C
C
Surge non repetitive forward current
I
I
117
FSM
FRM
T =25°C, t =10 ms, sine halfwave
C
p
Maximum repetitive forward current
81
T =25°C, t limited by T
, D=0.5
C
p
jmax
W
Power dissipation
P
tot
T =25°C
142.9
80.9
C
T =90°C
C
-55...+175
255
°C
°C
Operating and storage temperature
T , T
S
Soldering temperature
T
1.6mm(0.063 in.) from case for 10s
Page 1
Rev.2
2003-07-31
IDP30E60
IDB30E60
Thermal Characteristics
Parameter
Symbol
Values
typ. max.
Unit
min.
Characteristics
-
-
-
-
1.05 K/W
62
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
R
R
R
thJC
thJA
thJA
-
-
-
35
62
-
2
1)
@ 6 cm cooling area
Electrical Characteristics, at T = 25 °C, unless otherwise specified
Parameter
Symbol
Values
typ. max.
Unit
µA
V
min.
Static Characteristics
Reverse leakage current
V =600V, T =25°C
I
R
-
-
-
-
50
2500
R
j
V =600V, T =150°C
R
j
Forward voltage drop
V
F
I =30A, T =25°C
-
-
1.5
1.5
2
-
F
j
I =30A, T =150°C
F
j
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
Rev.2
2003-07-31
IDP30E60
IDB30E60
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
typ. max.
Unit
min.
Dynamic Characteristics
Reverse recovery time
ns
A
t
I
rr
V =400V, I =30A, di /dt=1000A/µs, T =25°C
-
-
-
126
171
178
-
-
-
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =125°C
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =150°C
R
F
F
j
Peak reverse current
rrm
V =400V, I = 30A, di /dt=1000A/µs, T =25°C
-
-
-
19
22
24
-
-
-
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =125°C
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =150°C
R
F
F
j
nC
Reverse recovery charge
Q
S
rr
V =400V, I =30A, di /dt=1000A/µs, T =25°C
-
-
-
1100
1950
2150
-
-
-
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =125°C
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =150°C
R
F
F
j
Reverse recovery softness factor
V =400V, I =30A, di /dt=1000A/µs, T =25°C
-
-
-
4
4.6
4.8
-
-
-
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =125°C
R
F
F
j
V =400V, I =30A, di /dt=1000A/µs, T =150°C
R
F
F
j
Page 3
Rev.2
2003-07-31
IDP30E60
IDB30E60
1 Power dissipation
= f (T )
2 Diode forward current
I = f(T )
P
tot
C
F
C
parameter: T ≤ 175 °C
parameter: T ≤ 175°C
j
j
55
150
W
A
45
40
35
30
25
20
15
10
5
120
110
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
175
25
50
75
100
125
175
°C
°C
T
T
C
C
3 Typ. diode forward current
I = f (V )
4 Typ. diode forward voltage
V = f (T )
F
F
F
j
2
90
V
60A
A
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
70
60
50
40
30
20
10
0
-55°C
25°C
100°C
150°C
30A
15A
0
0.5
1
1.5
2.5
-60
-20
20
60
100
160
V
°C
T
V
F
j
Page 4
Rev.2
2003-07-31
IDP30E60
IDB30E60
5 Typ. reverse recovery time
t = f (di /dt)
6 Typ. reverse recovery charge
Q =f(di /dt)
rr
F
rr
F
parameter: V = 400V, T = 125°C
parameter: V = 400V, T = 125 °C
R
j
R j
500
2600
ns
nC
60A
400
350
300
250
200
150
100
2200
2000
1800
1600
1400
1200
1000
60A
30A
15A
30A
15A
200 300 400 500 600 700 800
1000
200 300 400 500 600 700 800
1000
A/µs
A/µs
di /dt
di /dt
F
F
7 Typ. reverse recovery current
8 Typ. reverse recovery softness factor
S = f(di /dt)
I = f (di /dt)
rr
F
F
parameter: V = 400V, T = 125°C
parameter: V = 400V, T = 125°C
R
j
R j
26
12
A
22
20
18
16
14
12
10
8
10
9
60A
30A
15A
60A
30A
15A
8
7
6
5
4
6
3
200 300 400 500 600 700 800
1000
200 300 400 500 600 700 800
1000
A/µs
di /dt
A/µs
di /dt
F
F
Page 5
Rev.2
2003-07-31
IDP30E60
IDB30E60
9 Max. transient thermal impedance
= f (t )
Z
thJC
p
parameter : D = t /T
p
10 1
IDP30E60
K/W
10 0
10 -1
10 -2
D = 0.50
0.20
0.10
0.05
0.02
10 -3
single pulse
0.01
10 -4
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2
10 0
s
t
p
Page 6
Rev.2
2003-07-31
IDP30E60
IDB30E60
TO-220-2-2
A
N
P
dimensions
[mm]
[inch]
min max
symbol
E
min
9.70
15.30
0.65
3.55
2.60
9.00
13.00
17.20
4.40
0.40
max
D
A
B
C
D
E
F
G
H
J
K
L
M
N
P
T
10.10 0.3819 0.3976
15.90 0.6024 0.6260
U
0.85
3.85
3.00
9.40
0.0256 0.0335
0.1398 0.1516
0.1024 0.1181
0.3543 0.3701
V
B
H
F
14.00 0.5118 0.5512
17.80 0.6772 0.7008
W
4.80
0.60
1.05 typ.
0.1732 0.1890
0.0157 0.0236
0.41 typ.
J
2.54 typ.
4.4 typ.
0.1 typ.
0.173 typ.
X
L
1.10
1.40
0.0433 0.0551
0.095 typ.
G
2.4 typ.
6.6 typ.
13.0 typ.
7.5 typ.
U
V
W
X
0.26 typ.
0.51 typ.
0.295 typ.
0.00
0.40
0.0000 0.0157
T
C
M
K
Page 7
Rev.2
2003-07-31
IDP30E60
IDB30E60
TO-220-3-45 (P-TO220SMD)
dimensions
[mm]
[inch]
max
10.00 0.3858 0.3937
symbol
min
9.80
max
min
A
B
C
D
E
F
G
H
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
1.3 typ.
0.0512 typ.
1.25
0.95
1.75
1.15
0.0492 0.0689
0.0374 0.0453
0.1 typ.
2.54 typ.
0.72
0.85
0.0283 0.0335
0.2 typ.
5.08 typ.
4.30
1.28
9.00
2.30
4.50
1.40
9.40
2.50
0.1693 0.1772
0.0504 0.0551
0.3543 0.3701
0.0906 0.0984
0.5551 typ.
14.1 typ.
0.00
3.30
0.20
3.90
0.0000 0.0079
0.1299 0.1535
8° max
8° max
1.70
0.50
2.50
0.65
0.0669 0.0984
0.0197 0.0256
0.4252 typ.
10.8 typ.
1.35 typ.
6.43 typ.
4.60 typ.
9.40 typ.
16.15 typ.
0.0532 typ.
0.2532 typ.
0.1811 typ.
0.3701 typ.
0.6358 typ.
Page 8
Rev.2
2003-07-31
IDP30E60
IDB30E60
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 9
Rev.2
2003-07-31
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