SAL-TC364DP-64F300F AA [INFINEON]
SAL-TC364DP-64F300F AA belongs to the AURIX™ TC36xDP family. AURIX™ second generation (TC3xx) comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive and industrial trends and challenges. In terms of performance, T36xDP offers 2 cores running at 300 MHz and up to 672 KBytes embedded RAM, 4MB of flash and consuming below 2W.;型号: | SAL-TC364DP-64F300F AA |
厂家: | Infineon |
描述: | SAL-TC364DP-64F300F AA belongs to the AURIX™ TC36xDP family. AURIX™ second generation (TC3xx) comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive and industrial trends and challenges. In terms of performance, T36xDP offers 2 cores running at 300 MHz and up to 672 KBytes embedded RAM, 4MB of flash and consuming below 2W. |
文件: | 总17页 (文件大小:254K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AURIX™ TC36x variants
About this document
Scope and purpose
This document is an addendum to the TC36x Product Data Sheet and User's Manual, listing all planned product
variants, key parameters such as memory size and optional features.
The User's Manual lists functions implemented on the Silicon, but this document counts functions that are
pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are
overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the
number of usable functions in an application.
Naming conventions
Prefix:
•
•
SAK: Tambient Temperature Range from -40 °C up to +125 °C.
SAL: Tambient Temperature Range from -40 °C up to +150 °C (packaged device).
Feature package:
•
•
P: Standard feature.
E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay
functionality for calibration, AGBT as trace interface for development (depending on the package).
•
•
•
•
C,V,Z: Customer Specific.
A: ADAS ext. Memory.
T: ADAS + emulation.
X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem.
The ADAS peripherals SPU and RIF are not available.
•
•
•
•
•
M: MotionWise soꢀware.
F: Extended Flash.
G: Additional Connectivity.
H: ADAS Standard feature.
N: Standard feature with AMU.
Datasheet addendum
Please read the Important Notice and Warnings at the end of this document
v1.5
www.infineon.com
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
Table of contents
Table of contents
About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1
TC36x AA step variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TC36x AA step (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TC36x AA step (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
TC36x AA step (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
TC36x AA step (part 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.1
1.2
1.3
1.4
2
Memory maps of TC36x variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Datasheet addendum
2
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
1
TC36x AA step variants
1.1
TC36x AA step (part 1)
A table listing the TC36x AA step variants.
Table 1 TC36x AA step (part 1)
SAK- SAK-
SAK-
SAL-
SAL-
SAK-
SAK-
TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F TC365DP-64F TC365DP-64F TC367DP-48F
300W
300W
AA
300S
AA
300S
AA
300W
AA
200W
200S
Step
AA
AA
AA
Production Status
Standard
Standard
Standard
Standard
Standard
Customer
Specific
Customer
Specific
Package Type
PG-QFP-176
Pinout
PG-QFP-144 PG-LFBGA-292 PG-LFBGA-292
PG-QFP-176
PG-QFP-176 PG-LFBGA-292
LQFP 0.5 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm LQFP 0.5 mm LFBGA 0.8 mm
Reference Silicon
TC36x
Temperature Range (Ambient)
SAK SAK
TC36x
TC36x
TC36x
TC36x
TC36x
TC36x
SAK
SAL
SAL
SAK
SAK
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.
0x87006580
0x87006480
0x87006780
0x87006780
0x87006580
0x87006580
0x86006780
Cores / Checker Cores
2/2
2/2
300
4
2/2
300
4
2/2
300
4
2/2
300
4
2/2
200
4
2/2
200
3
Max. Freq. (MHz)
300
Program Flash (MB)
4
Data Flash0 (single-ended) (KB)
128 128
128
128
576
0
128
576
0
128
576
0
128
576
0
Total SRAM (without EMEM and Cache) (KB)
576
EMEM Size (KB)
0
576
0
576
0
Datasheet addendum
3
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 1
TC36x AA step (part 1) (continued)
SAK- SAK-
SAK-
SAL-
SAL-
SAK-
SAK-
TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F TC365DP-64F TC365DP-64F TC367DP-48F
300W
DSPR (KB)
192 per CPU
DLMU (KB)
64 per CPU
PSPR (KB)
32 per CPU
LMU (KB)
300W
300S
300S
300W
200W
200S
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
0
0
0
0
0
0
0
0
0
0
DAM (KB)
AMU1)
0
0
No
0
No
0
No
No
No
No
No
ADC (Primary Groups/Channels)
4/25 4/19
ADC (Secondary Groups/Channels)
2/25 2/21
ADC (Fast Compare Channels)
4/32
4/32
2/28
2
4/25
2/25
2
4/25
2/25
2
4/32
2/28
2
2/28
2
2
2
ADC (EDSADC Channels)
4
CAN (Modules/Nodes)
2/2x4
4
4
4
4
4
4
2/2x4
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
FlexRay (Modules/Channels)
1/1x2
HSSL Modules
1
1/1x2
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/10
12/12/8
12/12/10
4/1
12/12/10
4/1
12/12/10
4/1
12/12/10
4/1
12/12/10
4/1
QSPI Modules / with LVDS
4/1
4/1
1
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum
4
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 1
TC36x AA step (part 1) (continued)
SAK- SAK-
SAK-
SAL-
SAL-
SAK-
SAK-
TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F TC365DP-64F TC365DP-64F TC367DP-48F
300W
300W
10
300S
10
300S
300W
10
200W
10
200S
SENT Channels
10
10
10
MSC Modules
1
1
1
1
2
1
1
1
2
PSI5 Channels
2
PSI5-S Module
Yes
2
2
2
2
Yes
No
Yes
No
Yes
Yes
No
Yes
No
Yes
SDMMC Module
No
No
No
Max. Ethernet Availability: 1GBit/100Mbit/No
100Mbit/s
(RMII)
100Mbit/s
(RMII)
1Gbit/s
1Gbit/s
100Mbit/s
(RMII)
100Mbit/s
(RMII)
1Gbit/s
MCDS Availability
No
No
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
ADAS Cluster Available
No
No
No
Yes
CIF
No
HSM Available
Yes
Datasheet addendum
5
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
1.2
TC36x AA step (part 2)
A continuation table listing the TC36x AA step variants.
Table 2
TC36x AA step (part 2)
SAL-TC364DP-64F300F
SAK-TC364DP-64F300F
SAK-TC364DP-48F300F
AA
SAK-TC364DP-48F200F
AA
Step
AA
AA
Standard
PG-QFP-144
TQFP 0.4 mm
TC36x
Production Status
Standard
PG-QFP-144
TQFP 0.4 mm
Customer Specific
PG-QFP-144
TQFP 0.4 mm
TC36x
Customer Specific
PG-QFP-144
TQFP 0.4 mm
TC36x
Package Type
Pinout
Reference Silicon
TC36x
Temperature Range (Ambient)
SAK
SAL
SAK
SAK
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.
0x87006480
Cores / Checker Cores
0x87006480
0x86006480
0x86006480
2/2
300
4
2/2
300
4
2/2
2/2
Max. Freq. (MHz)
300
200
Program Flash (MB)
3
128
3
128
Data Flash0 (single-ended) (KB)
128
128
Total SRAM (without EMEM and Cache) (KB)
576
576
0
576
576
EMEM Size (KB)
0
0
0
DSPR (KB)
192 per CPU
64 per CPU
192 per CPU
64 per CPU
192 per CPU
64 per CPU
192 per CPU
64 per CPU
DLMU (KB)
Datasheet addendum
6
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 2
TC36x AA step (part 2) (continued)
SAK-TC364DP-64F300F
SAL-TC364DP-64F300F
SAK-TC364DP-48F300F
SAK-TC364DP-48F200F
PSPR (KB)
LMU (KB)
DAM (KB)
AMU2)
32 per CPU
32 per CPU
32 per CPU
32 per CPU
0
0
0
0
0
0
0
No
0
No
No
No
ADC (Primary Groups/Channels)
4/16
4/16
2/21
2
4/16
2/21
2
4/16
2/21
2
ADC (Secondary Groups/Channels)
2/21
ADC (Fast Compare Channels)
2
ADC (EDSADC Channels)
4
4
4
4
CAN (Modules/Nodes)
2/2x4
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
FlexRay (Modules/Channels)
1/1x2
HSSL Modules
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/8
12/12/8
12/12/8
4/1
10
12/12/8
4/1
10
QSPI Modules / with LVDS
4/1
4/1
10
1
SENT Channels
10
MSC Modules
1
1
1
PSI5 Channels
2
2
2
2
2
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum
7
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 2
TC36x AA step (part 2) (continued)
SAK-TC364DP-64F300F
SAL-TC364DP-64F300F
SAK-TC364DP-48F300F
SAK-TC364DP-48F200F
PSI5-S Module
SDMMC Module
Yes
No
Yes
No
Yes
Yes
No
No
Max. Ethernet Availability: 1GBit/100Mbit/No
100Mbit/s (RMII) 100Mbit/s (RMII)
MCDS Availability
100Mbit/s (RMII)
100Mbit/s (RMII)
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
ADAS Cluster Available
CIF
HSM Available
Datasheet addendum
8
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
1.3
TC36x AA step (part 3)
A continuation table listing the TC36x AA step variants.
Table 3
TC36x AA step (part 3)
SAL- SAK-
SAK-
SAL-
SAK-
SAK-
SAL-
TC366DP-64F TC366DP-64F TC367DP-48F TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F
300S
300S
AA
300S
200W
200W
200S
200S
Step
AA
AA
AA
AA
AA
AA
Production Status
Standard
Standard
Customer
Specific
Customer
Specific
Customer
Specific
Customer
Specific
Customer
Specific
Package Type
PG-LFBGA-180 PG-LFBGA-180 PG-LFBGA-292
PG-QFP-176
PG-QFP-144 PG-LFBGA-292 PG-LFBGA-292
Pinout
LFBGA 0.8 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm
Reference Silicon
TC36x
Temperature Range (Ambient)
SAK SAL
TC36x
TC36x
TC36x
TC36x
TC36x
TC36x
SAK
SAL
SAK
SAK
SAL
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.
0x87006680
0x87006680
0x86006780
0x87006580
0x87006480
0x87006780
0x87006780
Cores / Checker Cores
2/2
2/2
300
4
2/2
300
3
2/2
2/2
2/2
2/2
Max. Freq. (MHz)
300
200
200
200
200
Program Flash (MB)
4
4
4
4
4
Data Flash0 (single-ended) (KB)
128 128
128
128
128
128
128
Total SRAM (without EMEM and Cache) (KB)
576
EMEM Size (KB)
0
576
576
576
0
576
0
576
0
576
0
0
0
DSPR (KB)
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
Datasheet addendum
9
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 3
TC36x AA step (part 3) (continued)
SAL- SAK-
SAK-
SAL-
SAK-
SAK-
SAL-
TC366DP-64F TC366DP-64F TC367DP-48F TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F
300S
DLMU (KB)
64 per CPU
PSPR (KB)
32 per CPU
LMU (KB)
300S
300S
200W
200W
200S
200S
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
0
0
0
0
0
0
0
0
0
0
DAM (KB)
AMU3)
0
0
No
0
No
0
No
No
No
No
No
ADC (Primary Groups/Channels)
4/19 4/19
ADC (Secondary Groups/Channels)
2/18 2/18
ADC (Fast Compare Channels)
4/32
2/28
2
4/25
2/25
2
4/19
2/21
2
4/32
2/28
2
4/32
2/28
2
2
2
ADC (EDSADC Channels)
4
CAN (Modules/Nodes)
2/2x4
4
4
4
4
4
4
2/2x4
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
FlexRay (Modules/Channels)
1/1x2
HSSL Modules
1
1/1x2
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/9
12/12/9
12/12/10
4/1
12/12/10
4/1
12/12/8
4/1
12/12/10
4/1
12/12/10
4/1
QSPI Modules / with LVDS
4/1
SENT Channels
10
4/1
10
10
10
10
10
10
3
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum
10
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 3
TC36x AA step (part 3) (continued)
SAL- SAK-
SAK-
SAL-
SAK-
SAK-
SAL-
TC366DP-64F TC366DP-64F TC367DP-48F TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F
300S
300S
1
300S
1
200W
1
200W
1
200S
200S
MSC Modules
1
1
2
1
2
PSI5 Channels
2
PSI5-S Module
Yes
2
2
2
2
Yes
Yes
Yes
No
Yes
No
Yes
Yes
SDMMC Module
No
No
No
No
No
Max. Ethernet Availability: 1GBit/100Mbit/No
100Mbit/s
(RMII)
100Mbit/s
(RMII)
1Gbit/s
100Mbit/s
(RMII)
100Mbit/s
(RMII)
1Gbit/s
1Gbit/s
MCDS Availability
No
No
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
ADAS Cluster Available
No
No
No
Yes
CIF
No
HSM Available
Yes
Datasheet addendum
11
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
1.4
TC36x AA step (part 4)
A continuation table listing the TC36x AA step variants.
Table 4
TC36x AA step (part 4)
SAL-
SAK-
SAK-
SAL-
SAL-
SAL-
TC364DP-64F200 TC364DP-64F20 TC366DP-64F20 TC366DP-64F20 TC364DP-64F20 TC364DP-64F30
F
0F
0S
0S
0W
0W
Step
AA
AA
AA
AA
AA
AA
Production Status
Customer
Specific
Customer
Specific
Customer
Specific
Customer
Specific
Customer
Specific
Customer
Specific
Package Type
PG-QFP-144
Pinout
PG-QFP-144
TQFP 0.4 mm
TC36x
PG-LFBGA-180
LFBGA 0.8 mm
TC36x
PG-LFBGA-180
LFBGA 0.8 mm
TC36x
PG-QFP-144
LQFP 0.5 mm
TC36x
PG-QFP-144
LQFP 0.5 mm
TC36x
TQFP 0.4 mm
Reference Silicon
TC36x
Temperature Range (Ambient)
SAK
SAL
SAK
SAL
SAL
SAL
Chip ID
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.
0x87006480
0x87006480
0x87006680
0x87006680
0x87006480
0x87006480
Cores / Checker Cores
2/2
2/2
200
4
2/2
200
4
2/2
2/2
2/2
Max. Freq. (MHz)
200
Program Flash (MB)
4
200
200
300
4
4
4
Data Flash0 (single-ended) (KB)
128 128
Total SRAM (without EMEM and Cache) (KB)
128
128
128
128
576
EMEM Size (KB)
576
576
0
576
0
576
0
576
0
0
0
DSPR (KB)
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
192 per CPU
Datasheet addendum
12
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 4
TC36x AA step (part 4) (continued)
SAL- SAK-
SAK-
SAL-
SAL-
SAL-
TC364DP-64F200 TC364DP-64F20 TC366DP-64F20 TC366DP-64F20 TC364DP-64F20 TC364DP-64F30
F
0F
0S
0S
0W
0W
DLMU (KB)
64 per CPU
PSPR (KB)
32 per CPU
LMU (KB)
64 per CPU
64 per CPU
64 per CPU
64 per CPU
64 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
32 per CPU
0
0
0
0
0
0
0
0
0
0
0
DAM (KB)
AMU4)
0
No
No
No
No
No
No
ADC (Primary Groups/Channels)
4/16
4/16
4/19
2/18
2
4/19
2/18
2
4/19
2/21
2
4/19
2/21
2
ADC (Secondary Groups/Channels)
2/21
2/21
2
ADC (Fast Compare Channels)
2
ADC (EDSADC Channels)
4
4
4
4
4
4
CAN (Modules/Nodes)
2/2x4
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
2/2x4
1/1x2
1
FlexRay (Modules/Channels)
1/1x2
HSSL Modules
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI
12/12/8
12/12/8
4/1
12/12/9
4/1
12/12/9
4/1
12/12/8
4/1
12/12/8
4/1
QSPI Modules / with LVDS
4/1
SENT Channels
10
10
10
10
10
10
4
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon
Representative
Datasheet addendum
13
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
1 TC36x AA step variants
Table 4
TC36x AA step (part 4) (continued)
SAL- SAK-
SAK-
SAL-
SAL-
SAL-
TC364DP-64F200 TC364DP-64F20 TC366DP-64F20 TC366DP-64F20 TC364DP-64F20 TC364DP-64F30
F
1
2
0F
1
0S
1
0S
1
0W
1
0W
1
MSC Modules
PSI5 Channels
PSI5-S Module
2
2
2
2
2
Yes
SDMMC Module
No
Yes
No
Yes
No
Yes
No
Yes
No
Yes
No
Max. Ethernet Availability: 1GBit/100Mbit/No
100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII)
MCDS Availability
No
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
No
No
No
Yes
ADAS Cluster Available
No
CIF
No
HSM Available
Yes
Datasheet addendum
14
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
2 Memory maps of TC36x variants
2
Memory maps of TC36x variants
This section describes the influence of the available feature variants on the memory map.
Program flash
Variants:
•
•
4 MB: umbrella (2 x 2 MB), see User's Manual.
3 MB: 2 + 1 MB (see Figure below).
Sectors available in
1 MB Bank
Sectorization of each 2 MB Bank
PFlash Variants:
4 MB
3 MB
Logical Phys. Sub-
Offset
Logical
Sector
Size
Sector
Sector
Address
00 0000H
00 4000H
00 8000H
…
0F 4000H
0F 8000H
0F C000H
10 0000H
10 4000H
10 8000H
…
8/A000 0000H
S0
S1
16 KB
16 KB
16 KB
…
16 KB
16 KB
16 KB
16 KB
16 KB
16 KB
…
S0
S1
S2
PFlash0
(2 MB)
PFlash0
(2 MB)
S2
…
PS0
(1 MB)
…
S61
S62
S63
S64
S65
S66
…
S125
S126
S127
S61
S62
S63
8/A020 0000H
8/A030 0000H
Reserved
Reserved
PFlash1
(1 MB)
PFlash1
(2 MB)
PS1
(1 MB)
PFlash1
Reserved
(1 MB)
Reserved
16 KB
16 KB
16 KB
1F 4000H
1F 8000H
1F C000H
8/A050 0000H
8/A060 0000H
Reserved
Reserved
Figure 1
TC36x PFlash variants
Ethernet availability
•
•
1Gbit/s: umbrella for TC36x, see User's Manual.
100Mbit/s (RMII): due to pin limitations in this package the GETH module can be only used in RMII mode.
ADC availability
Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning
•
table of the package.
Datasheet addendum
15
v1.5
2021-03
OPEN MARKET VERSION
AURIX™ TC36x variants
Revision history
Revision history
Document
version
Date of
release
Description of changes
V1.0
V1.1
2019-03-01
2019-06-13
•
•
First release.
Added new Variants SAK-TC365DP-64F200W,SAK-TC365DP-64F200F, SAK-
TC365DP-64F200S,SAK-TC365DP-64F200.
•
•
Chapter 1: Added new row in the variant tables called "AMU" with the
footnote for additional details.
Chapter: About this document: Feature package definitions are updated
to consistent with the product naming nomenclature definition.
V1.2
V1.3
2019-08-02
2020-01-10
•
•
For the Product Variants SAK-TC364DP-64F300F, SAL-TC364DP-64F300F ,
SAK-TC364DP-48F300F ,SAK-TC364DP-48F200F - Number of ADC
(Secondary Groups/ Channels) were corrected from 2/24 to 2/21.
For the Product Variants SAK-TC366DP-64F300S , SAL-TC366DP-64F300S -
Number of ADC (Secondary Groups/ Channels) were corrected from 2/21
to 2/18.
•
•
•
Chapter 1: Updated the "Production status" for SAK-TC367DP-48F300S,
SAK-TC364DP-48F300F to "Customer Specific".
Page 1: About the document:Feature Package 'X' definition is updated to
remove CIF.
Chapter 1 and 2:Added new row in the variant tables called "CIF"
indicating the Camera Interface availability.
V1.4
V1.5
2020-11-18
2021-03-05
•
•
Chapter 1: Removed Bare Die Marking variants SAL-TC360DP-64F300, SAL-
TC360DP-64F200.
Chapter 1: Added new Variants SAK-TC364DP-64F200F, SAK-
TC364DP-64F200W, SAK-TC366DP-64F200S, SAK-TC367DP-64F200S, SAL-
TC364DP-64F200F, SAL-TC364DP-64F200W, SAL-TC364DP-64F300W, SAL-
TC365DP-64F200W, SAL-TC366DP-64F200S, SAL-TC367DP-64F200S .
Datasheet addendum
16
v1.5
2021-03
OPEN MARKET VERSION
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2021-03
IMPORTANT NOTICE
WARNINGS
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2021 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-cxy1559114683516
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
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application.
OPEN MARKET VERSION
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