SAL-TC364DP-64F300F AA [INFINEON]

SAL-TC364DP-64F300F AA belongs to the  AURIX™  TC36xDP family.  AURIX™ second generation (TC3xx)  comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive and industrial trends and challenges. In terms of performance, T36xDP offers 2 cores running at 300 MHz and up to 672 KBytes embedded RAM, 4MB of flash and consuming below 2W.;
SAL-TC364DP-64F300F AA
型号: SAL-TC364DP-64F300F AA
厂家: Infineon    Infineon
描述:

SAL-TC364DP-64F300F AA belongs to the  AURIX™  TC36xDP family.  AURIX™ second generation (TC3xx)  comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive and industrial trends and challenges. In terms of performance, T36xDP offers 2 cores running at 300 MHz and up to 672 KBytes embedded RAM, 4MB of flash and consuming below 2W.

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AURIXTC36x variants  
About this document  
Scope and purpose  
This document is an addendum to the TC36x Product Data Sheet and User's Manual, listing all planned product  
variants, key parameters such as memory size and optional features.  
The User's Manual lists functions implemented on the Silicon, but this document counts functions that are  
pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are  
overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the  
number of usable functions in an application.  
Naming conventions  
Prefix:  
SAK: Tambient Temperature Range from -40 °C up to +125 °C.  
SAL: Tambient Temperature Range from -40 °C up to +150 °C (packaged device).  
Feature package:  
P: Standard feature.  
E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay  
functionality for calibration, AGBT as trace interface for development (depending on the package).  
C,V,Z: Customer Specific.  
A: ADAS ext. Memory.  
T: ADAS + emulation.  
X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem.  
The ADAS peripherals SPU and RIF are not available.  
M: MotionWise soꢀware.  
F: Extended Flash.  
G: Additional Connectivity.  
H: ADAS Standard feature.  
N: Standard feature with AMU.  
Datasheet addendum  
Please read the Important Notice and Warnings at the end of this document  
v1.5  
www.infineon.com  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
Table of contents  
Table of contents  
About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1
TC36x AA step variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
TC36x AA step (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
TC36x AA step (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
TC36x AA step (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
TC36x AA step (part 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
1.1  
1.2  
1.3  
1.4  
2
Memory maps of TC36x variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Datasheet addendum  
2
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
1
TC36x AA step variants  
1.1  
TC36x AA step (part 1)  
A table listing the TC36x AA step variants.  
Table 1 TC36x AA step (part 1)  
SAK- SAK-  
SAK-  
SAL-  
SAL-  
SAK-  
SAK-  
TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F TC365DP-64F TC365DP-64F TC367DP-48F  
300W  
300W  
AA  
300S  
AA  
300S  
AA  
300W  
AA  
200W  
200S  
Step  
AA  
AA  
AA  
Production Status  
Standard  
Standard  
Standard  
Standard  
Standard  
Customer  
Specific  
Customer  
Specific  
Package Type  
PG-QFP-176  
Pinout  
PG-QFP-144 PG-LFBGA-292 PG-LFBGA-292  
PG-QFP-176  
PG-QFP-176 PG-LFBGA-292  
LQFP 0.5 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm LQFP 0.5 mm LFBGA 0.8 mm  
Reference Silicon  
TC36x  
Temperature Range (Ambient)  
SAK SAK  
TC36x  
TC36x  
TC36x  
TC36x  
TC36x  
TC36x  
SAK  
SAL  
SAL  
SAK  
SAK  
Chip ID  
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.  
0x87006580  
0x87006480  
0x87006780  
0x87006780  
0x87006580  
0x87006580  
0x86006780  
Cores / Checker Cores  
2/2  
2/2  
300  
4
2/2  
300  
4
2/2  
300  
4
2/2  
300  
4
2/2  
200  
4
2/2  
200  
3
Max. Freq. (MHz)  
300  
Program Flash (MB)  
4
Data Flash0 (single-ended) (KB)  
128 128  
128  
128  
576  
0
128  
576  
0
128  
576  
0
128  
576  
0
Total SRAM (without EMEM and Cache) (KB)  
576  
EMEM Size (KB)  
0
576  
0
576  
0
Datasheet addendum  
3
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 1  
TC36x AA step (part 1) (continued)  
SAK- SAK-  
SAK-  
SAL-  
SAL-  
SAK-  
SAK-  
TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F TC365DP-64F TC365DP-64F TC367DP-48F  
300W  
DSPR (KB)  
192 per CPU  
DLMU (KB)  
64 per CPU  
PSPR (KB)  
32 per CPU  
LMU (KB)  
300W  
300S  
300S  
300W  
200W  
200S  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
0
0
0
0
0
0
0
0
0
0
DAM (KB)  
AMU1)  
0
0
No  
0
No  
0
No  
No  
No  
No  
No  
ADC (Primary Groups/Channels)  
4/25 4/19  
ADC (Secondary Groups/Channels)  
2/25 2/21  
ADC (Fast Compare Channels)  
4/32  
4/32  
2/28  
2
4/25  
2/25  
2
4/25  
2/25  
2
4/32  
2/28  
2
2/28  
2
2
2
ADC (EDSADC Channels)  
4
CAN (Modules/Nodes)  
2/2x4  
4
4
4
4
4
4
2/2x4  
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
FlexRay (Modules/Channels)  
1/1x2  
HSSL Modules  
1
1/1x2  
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI  
12/12/10  
12/12/8  
12/12/10  
4/1  
12/12/10  
4/1  
12/12/10  
4/1  
12/12/10  
4/1  
12/12/10  
4/1  
QSPI Modules / with LVDS  
4/1  
4/1  
1
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon  
Representative  
Datasheet addendum  
4
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 1  
TC36x AA step (part 1) (continued)  
SAK- SAK-  
SAK-  
SAL-  
SAL-  
SAK-  
SAK-  
TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F TC365DP-64F TC365DP-64F TC367DP-48F  
300W  
300W  
10  
300S  
10  
300S  
300W  
10  
200W  
10  
200S  
SENT Channels  
10  
10  
10  
MSC Modules  
1
1
1
1
2
1
1
1
2
PSI5 Channels  
2
PSI5-S Module  
Yes  
2
2
2
2
Yes  
No  
Yes  
No  
Yes  
Yes  
No  
Yes  
No  
Yes  
SDMMC Module  
No  
No  
No  
Max. Ethernet Availability: 1GBit/100Mbit/No  
100Mbit/s  
(RMII)  
100Mbit/s  
(RMII)  
1Gbit/s  
1Gbit/s  
100Mbit/s  
(RMII)  
100Mbit/s  
(RMII)  
1Gbit/s  
MCDS Availability  
No  
No  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
ADAS Cluster Available  
No  
No  
No  
Yes  
CIF  
No  
HSM Available  
Yes  
Datasheet addendum  
5
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
1.2  
TC36x AA step (part 2)  
A continuation table listing the TC36x AA step variants.  
Table 2  
TC36x AA step (part 2)  
SAL-TC364DP-64F300F  
SAK-TC364DP-64F300F  
SAK-TC364DP-48F300F  
AA  
SAK-TC364DP-48F200F  
AA  
Step  
AA  
AA  
Standard  
PG-QFP-144  
TQFP 0.4 mm  
TC36x  
Production Status  
Standard  
PG-QFP-144  
TQFP 0.4 mm  
Customer Specific  
PG-QFP-144  
TQFP 0.4 mm  
TC36x  
Customer Specific  
PG-QFP-144  
TQFP 0.4 mm  
TC36x  
Package Type  
Pinout  
Reference Silicon  
TC36x  
Temperature Range (Ambient)  
SAK  
SAL  
SAK  
SAK  
Chip ID  
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.  
0x87006480  
Cores / Checker Cores  
0x87006480  
0x86006480  
0x86006480  
2/2  
300  
4
2/2  
300  
4
2/2  
2/2  
Max. Freq. (MHz)  
300  
200  
Program Flash (MB)  
3
128  
3
128  
Data Flash0 (single-ended) (KB)  
128  
128  
Total SRAM (without EMEM and Cache) (KB)  
576  
576  
0
576  
576  
EMEM Size (KB)  
0
0
0
DSPR (KB)  
192 per CPU  
64 per CPU  
192 per CPU  
64 per CPU  
192 per CPU  
64 per CPU  
192 per CPU  
64 per CPU  
DLMU (KB)  
Datasheet addendum  
6
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 2  
TC36x AA step (part 2) (continued)  
SAK-TC364DP-64F300F  
SAL-TC364DP-64F300F  
SAK-TC364DP-48F300F  
SAK-TC364DP-48F200F  
PSPR (KB)  
LMU (KB)  
DAM (KB)  
AMU2)  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
0
0
0
0
0
0
0
No  
0
No  
No  
No  
ADC (Primary Groups/Channels)  
4/16  
4/16  
2/21  
2
4/16  
2/21  
2
4/16  
2/21  
2
ADC (Secondary Groups/Channels)  
2/21  
ADC (Fast Compare Channels)  
2
ADC (EDSADC Channels)  
4
4
4
4
CAN (Modules/Nodes)  
2/2x4  
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
FlexRay (Modules/Channels)  
1/1x2  
HSSL Modules  
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI  
12/12/8  
12/12/8  
12/12/8  
4/1  
10  
12/12/8  
4/1  
10  
QSPI Modules / with LVDS  
4/1  
4/1  
10  
1
SENT Channels  
10  
MSC Modules  
1
1
1
PSI5 Channels  
2
2
2
2
2
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon  
Representative  
Datasheet addendum  
7
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 2  
TC36x AA step (part 2) (continued)  
SAK-TC364DP-64F300F  
SAL-TC364DP-64F300F  
SAK-TC364DP-48F300F  
SAK-TC364DP-48F200F  
PSI5-S Module  
SDMMC Module  
Yes  
No  
Yes  
No  
Yes  
Yes  
No  
No  
Max. Ethernet Availability: 1GBit/100Mbit/No  
100Mbit/s (RMII) 100Mbit/s (RMII)  
MCDS Availability  
100Mbit/s (RMII)  
100Mbit/s (RMII)  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
ADAS Cluster Available  
CIF  
HSM Available  
Datasheet addendum  
8
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
1.3  
TC36x AA step (part 3)  
A continuation table listing the TC36x AA step variants.  
Table 3  
TC36x AA step (part 3)  
SAL- SAK-  
SAK-  
SAL-  
SAK-  
SAK-  
SAL-  
TC366DP-64F TC366DP-64F TC367DP-48F TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F  
300S  
300S  
AA  
300S  
200W  
200W  
200S  
200S  
Step  
AA  
AA  
AA  
AA  
AA  
AA  
Production Status  
Standard  
Standard  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Package Type  
PG-LFBGA-180 PG-LFBGA-180 PG-LFBGA-292  
PG-QFP-176  
PG-QFP-144 PG-LFBGA-292 PG-LFBGA-292  
Pinout  
LFBGA 0.8 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm  
Reference Silicon  
TC36x  
Temperature Range (Ambient)  
SAK SAL  
TC36x  
TC36x  
TC36x  
TC36x  
TC36x  
TC36x  
SAK  
SAL  
SAK  
SAK  
SAL  
Chip ID  
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.  
0x87006680  
0x87006680  
0x86006780  
0x87006580  
0x87006480  
0x87006780  
0x87006780  
Cores / Checker Cores  
2/2  
2/2  
300  
4
2/2  
300  
3
2/2  
2/2  
2/2  
2/2  
Max. Freq. (MHz)  
300  
200  
200  
200  
200  
Program Flash (MB)  
4
4
4
4
4
Data Flash0 (single-ended) (KB)  
128 128  
128  
128  
128  
128  
128  
Total SRAM (without EMEM and Cache) (KB)  
576  
EMEM Size (KB)  
0
576  
576  
576  
0
576  
0
576  
0
576  
0
0
0
DSPR (KB)  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
Datasheet addendum  
9
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 3  
TC36x AA step (part 3) (continued)  
SAL- SAK-  
SAK-  
SAL-  
SAK-  
SAK-  
SAL-  
TC366DP-64F TC366DP-64F TC367DP-48F TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F  
300S  
DLMU (KB)  
64 per CPU  
PSPR (KB)  
32 per CPU  
LMU (KB)  
300S  
300S  
200W  
200W  
200S  
200S  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
0
0
0
0
0
0
0
0
0
0
DAM (KB)  
AMU3)  
0
0
No  
0
No  
0
No  
No  
No  
No  
No  
ADC (Primary Groups/Channels)  
4/19 4/19  
ADC (Secondary Groups/Channels)  
2/18 2/18  
ADC (Fast Compare Channels)  
4/32  
2/28  
2
4/25  
2/25  
2
4/19  
2/21  
2
4/32  
2/28  
2
4/32  
2/28  
2
2
2
ADC (EDSADC Channels)  
4
CAN (Modules/Nodes)  
2/2x4  
4
4
4
4
4
4
2/2x4  
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
FlexRay (Modules/Channels)  
1/1x2  
HSSL Modules  
1
1/1x2  
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI  
12/12/9  
12/12/9  
12/12/10  
4/1  
12/12/10  
4/1  
12/12/8  
4/1  
12/12/10  
4/1  
12/12/10  
4/1  
QSPI Modules / with LVDS  
4/1  
SENT Channels  
10  
4/1  
10  
10  
10  
10  
10  
10  
3
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon  
Representative  
Datasheet addendum  
10  
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 3  
TC36x AA step (part 3) (continued)  
SAL- SAK-  
SAK-  
SAL-  
SAK-  
SAK-  
SAL-  
TC366DP-64F TC366DP-64F TC367DP-48F TC365DP-64F TC364DP-64F TC367DP-64F TC367DP-64F  
300S  
300S  
1
300S  
1
200W  
1
200W  
1
200S  
200S  
MSC Modules  
1
1
2
1
2
PSI5 Channels  
2
PSI5-S Module  
Yes  
2
2
2
2
Yes  
Yes  
Yes  
No  
Yes  
No  
Yes  
Yes  
SDMMC Module  
No  
No  
No  
No  
No  
Max. Ethernet Availability: 1GBit/100Mbit/No  
100Mbit/s  
(RMII)  
100Mbit/s  
(RMII)  
1Gbit/s  
100Mbit/s  
(RMII)  
100Mbit/s  
(RMII)  
1Gbit/s  
1Gbit/s  
MCDS Availability  
No  
No  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
ADAS Cluster Available  
No  
No  
No  
Yes  
CIF  
No  
HSM Available  
Yes  
Datasheet addendum  
11  
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
1.4  
TC36x AA step (part 4)  
A continuation table listing the TC36x AA step variants.  
Table 4  
TC36x AA step (part 4)  
SAL-  
SAK-  
SAK-  
SAL-  
SAL-  
SAL-  
TC364DP-64F200 TC364DP-64F20 TC366DP-64F20 TC366DP-64F20 TC364DP-64F20 TC364DP-64F30  
F
0F  
0S  
0S  
0W  
0W  
Step  
AA  
AA  
AA  
AA  
AA  
AA  
Production Status  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Package Type  
PG-QFP-144  
Pinout  
PG-QFP-144  
TQFP 0.4 mm  
TC36x  
PG-LFBGA-180  
LFBGA 0.8 mm  
TC36x  
PG-LFBGA-180  
LFBGA 0.8 mm  
TC36x  
PG-QFP-144  
LQFP 0.5 mm  
TC36x  
PG-QFP-144  
LQFP 0.5 mm  
TC36x  
TQFP 0.4 mm  
Reference Silicon  
TC36x  
Temperature Range (Ambient)  
SAK  
SAL  
SAK  
SAL  
SAL  
SAL  
Chip ID  
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.  
0x87006480  
0x87006480  
0x87006680  
0x87006680  
0x87006480  
0x87006480  
Cores / Checker Cores  
2/2  
2/2  
200  
4
2/2  
200  
4
2/2  
2/2  
2/2  
Max. Freq. (MHz)  
200  
Program Flash (MB)  
4
200  
200  
300  
4
4
4
Data Flash0 (single-ended) (KB)  
128 128  
Total SRAM (without EMEM and Cache) (KB)  
128  
128  
128  
128  
576  
EMEM Size (KB)  
576  
576  
0
576  
0
576  
0
576  
0
0
0
DSPR (KB)  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
192 per CPU  
Datasheet addendum  
12  
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 4  
TC36x AA step (part 4) (continued)  
SAL- SAK-  
SAK-  
SAL-  
SAL-  
SAL-  
TC364DP-64F200 TC364DP-64F20 TC366DP-64F20 TC366DP-64F20 TC364DP-64F20 TC364DP-64F30  
F
0F  
0S  
0S  
0W  
0W  
DLMU (KB)  
64 per CPU  
PSPR (KB)  
32 per CPU  
LMU (KB)  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
32 per CPU  
0
0
0
0
0
0
0
0
0
0
0
DAM (KB)  
AMU4)  
0
No  
No  
No  
No  
No  
No  
ADC (Primary Groups/Channels)  
4/16  
4/16  
4/19  
2/18  
2
4/19  
2/18  
2
4/19  
2/21  
2
4/19  
2/21  
2
ADC (Secondary Groups/Channels)  
2/21  
2/21  
2
ADC (Fast Compare Channels)  
2
ADC (EDSADC Channels)  
4
4
4
4
4
4
CAN (Modules/Nodes)  
2/2x4  
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
FlexRay (Modules/Channels)  
1/1x2  
HSSL Modules  
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI  
12/12/8  
12/12/8  
4/1  
12/12/9  
4/1  
12/12/9  
4/1  
12/12/8  
4/1  
12/12/8  
4/1  
QSPI Modules / with LVDS  
4/1  
SENT Channels  
10  
10  
10  
10  
10  
10  
4
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon  
Representative  
Datasheet addendum  
13  
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
1 TC36x AA step variants  
Table 4  
TC36x AA step (part 4) (continued)  
SAL- SAK-  
SAK-  
SAL-  
SAL-  
SAL-  
TC364DP-64F200 TC364DP-64F20 TC366DP-64F20 TC366DP-64F20 TC364DP-64F20 TC364DP-64F30  
F
1
2
0F  
1
0S  
1
0S  
1
0W  
1
0W  
1
MSC Modules  
PSI5 Channels  
PSI5-S Module  
2
2
2
2
2
Yes  
SDMMC Module  
No  
Yes  
No  
Yes  
No  
Yes  
No  
Yes  
No  
Yes  
No  
Max. Ethernet Availability: 1GBit/100Mbit/No  
100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII) 100Mbit/s (RMII)  
MCDS Availability  
No  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
No  
No  
No  
Yes  
ADAS Cluster Available  
No  
CIF  
No  
HSM Available  
Yes  
Datasheet addendum  
14  
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
2 Memory maps of TC36x variants  
2
Memory maps of TC36x variants  
This section describes the influence of the available feature variants on the memory map.  
Program flash  
Variants:  
4 MB: umbrella (2 x 2 MB), see User's Manual.  
3 MB: 2 + 1 MB (see Figure below).  
Sectors available in  
1 MB Bank  
Sectorization of each 2 MB Bank  
PFlash Variants:  
4 MB  
3 MB  
Logical Phys. Sub-  
Offset  
Logical  
Sector  
Size  
Sector  
Sector  
Address  
00 0000H  
00 4000H  
00 8000H  
0F 4000H  
0F 8000H  
0F C000H  
10 0000H  
10 4000H  
10 8000H  
8/A000 0000H  
S0  
S1  
16 KB  
16 KB  
16 KB  
16 KB  
16 KB  
16 KB  
16 KB  
16 KB  
16 KB  
S0  
S1  
S2  
PFlash0  
(2 MB)  
PFlash0  
(2 MB)  
S2  
PS0  
(1 MB)  
S61  
S62  
S63  
S64  
S65  
S66  
S125  
S126  
S127  
S61  
S62  
S63  
8/A020 0000H  
8/A030 0000H  
Reserved  
Reserved  
PFlash1  
(1 MB)  
PFlash1  
(2 MB)  
PS1  
(1 MB)  
PFlash1  
Reserved  
(1 MB)  
Reserved  
16 KB  
16 KB  
16 KB  
1F 4000H  
1F 8000H  
1F C000H  
8/A050 0000H  
8/A060 0000H  
Reserved  
Reserved  
Figure 1  
TC36x PFlash variants  
Ethernet availability  
1Gbit/s: umbrella for TC36x, see User's Manual.  
100Mbit/s (RMII): due to pin limitations in this package the GETH module can be only used in RMII mode.  
ADC availability  
Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning  
table of the package.  
Datasheet addendum  
15  
v1.5  
2021-03  
OPEN MARKET VERSION  
AURIXTC36x variants  
Revision history  
Revision history  
Document  
version  
Date of  
release  
Description of changes  
V1.0  
V1.1  
2019-03-01  
2019-06-13  
First release.  
Added new Variants SAK-TC365DP-64F200W,SAK-TC365DP-64F200F, SAK-  
TC365DP-64F200S,SAK-TC365DP-64F200.  
Chapter 1: Added new row in the variant tables called "AMU" with the  
footnote for additional details.  
Chapter: About this document: Feature package definitions are updated  
to consistent with the product naming nomenclature definition.  
V1.2  
V1.3  
2019-08-02  
2020-01-10  
For the Product Variants SAK-TC364DP-64F300F, SAL-TC364DP-64F300F ,  
SAK-TC364DP-48F300F ,SAK-TC364DP-48F200F - Number of ADC  
(Secondary Groups/ Channels) were corrected from 2/24 to 2/21.  
For the Product Variants SAK-TC366DP-64F300S , SAL-TC366DP-64F300S -  
Number of ADC (Secondary Groups/ Channels) were corrected from 2/21  
to 2/18.  
Chapter 1: Updated the "Production status" for SAK-TC367DP-48F300S,  
SAK-TC364DP-48F300F to "Customer Specific".  
Page 1: About the document:Feature Package 'X' definition is updated to  
remove CIF.  
Chapter 1 and 2:Added new row in the variant tables called "CIF"  
indicating the Camera Interface availability.  
V1.4  
V1.5  
2020-11-18  
2021-03-05  
Chapter 1: Removed Bare Die Marking variants SAL-TC360DP-64F300, SAL-  
TC360DP-64F200.  
Chapter 1: Added new Variants SAK-TC364DP-64F200F, SAK-  
TC364DP-64F200W, SAK-TC366DP-64F200S, SAK-TC367DP-64F200S, SAL-  
TC364DP-64F200F, SAL-TC364DP-64F200W, SAL-TC364DP-64F300W, SAL-  
TC365DP-64F200W, SAL-TC366DP-64F200S, SAL-TC367DP-64F200S .  
Datasheet addendum  
16  
v1.5  
2021-03  
OPEN MARKET VERSION  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
Edition 2021-03  
IMPORTANT NOTICE  
WARNINGS  
The information given in this document shall in no  
event be regarded as a guarantee of conditions or  
characteristics (“Beschaffenheitsgarantie”).  
With respect to any examples, hints or any typical  
values stated herein and/or any information regarding  
the application of the product, Infineon Technologies  
hereby disclaims any and all warranties and liabilities  
of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any  
third party.  
In addition, any information given in this document is  
subject to customer’s compliance with its obligations  
stated in this document and any applicable legal  
requirements, norms and standards concerning  
customer’s products and any use of the product of  
Infineon Technologies in customer’s applications.  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon  
Technologies office.  
Except as otherwise explicitly approved by Infineon  
Technologies in a written document signed by  
authorized representatives of Infineon Technologies,  
Infineon Technologies’ products may not be used in  
any applications where a failure of the product or  
any consequences of the use thereof can reasonably  
be expected to result in personal injury.  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
©
2021 Infineon Technologies AG  
All Rights Reserved.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Document reference  
IFX-cxy1559114683516  
The data contained in this document is exclusively  
intended for technically trained staff. It is the  
responsibility of customer’s technical departments to  
evaluate the suitability of the product for the intended  
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information given in this document with respect to such  
application.  
OPEN MARKET VERSION  

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