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SAL-TC375TP-96F300W AA [INFINEON]

SAK-TC375TP-96F300W AA belongs to the  AURIX™  TC37xTP family . AURIX™ second generation (TC3xx)  comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive and industrial trends and challenges. This family has more than 20 products to provide the most scalable portfolio of safety microcontrol­ler. In terms of performance, T37x offers 3 cores running at 300 MHz and up to 1.5 MBytes embedded RAM, and consuming below 2 W;
SAL-TC375TP-96F300W AA
型号： SAL-TC375TP-96F300W AA
厂家： Infineon    Infineon
描述：

SAK-TC375TP-96F300W AA belongs to the  AURIX™  TC37xTP family . AURIX™ second generation (TC3xx)  comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive and industrial trends and challenges. This family has more than 20 products to provide the most scalable portfolio of safety microcontrol­ler. In terms of performance, T37x offers 3 cores running at 300 MHz and up to 1.5 MBytes embedded RAM, and consuming below 2 W
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AURIX™ TC37x variants  
About this document  
Scope and purpose  
This document is an addendum to the TC37x Product Data Sheet and User's Manual, listing all planned product  
variants, key parameters such as memory size and optional features.  
The User's Manual lists functions implemented on the Silicon, but this document counts functions that are  
pinning dependent; i.e. functions are counted that are connected to at least one package pin. As pins are  
overlaid with several functions the pinning needs to be checked (see Product Data Sheet) to determine the  
number of usable functions in an application.  
Naming conventions  
Prefix:  
•
•
SAK: Tambient Temperature Range from -40 °C up to +125 °C.  
SAL: Tambient Temperature Range from -40 °C up to +150 °C (packaged device).  
Feature Package:  
•
•
P: Standard feature.  
E: Emulation device with all features of the emulated standard type, additionally full MCDS, overlay  
functionality for calibration, AGBT as trace interface for development (depending on the package). Refer to  
the Emulation devices Data Sheet for further details.  
•
•
•
•
C,I,V,Z: Customer Specific.  
A: ADAS ext. Memory.  
T: ADAS + emulation.  
X: Extended Feature device. These products contain the extended memory (EMEM) of the ADAS subsystem.  
The ADAS peripherals SPU and RIF are not available.  
•
•
•
•
•
M: MotionWise soꢀware.  
F: Extended Flash.  
G: Additional Connectivity.  
H: ADAS Standard feature.  
N: Standard feature with AMU.  
Datasheet addendum  
Please read the Important Notice and Warnings at the end of this document  
v1.5  
www.infineon.com  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
Table of contents  
Table of contents  
About this document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1
1.1  
1.2  
TC37x AA step variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
TC37x AA step (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
TC37x AA step (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
2
Memory maps of TC37x variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Datasheet addendum  
2
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
1 TC37x AA step variants  
1
TC37x AA step variants  
1.1  
TC37x AA step (part 1)  
A table listing the TC37x AA step variants.  
Table 1 TC37x_AA step (part 1)  
SAL- SAK-  
SAL-  
SAK-  
SAK-  
SAL-  
SAK-  
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F  
00S  
300W  
AA  
300S  
AA  
300W  
AA  
300S  
300S  
300W  
Step  
AA  
AA  
AA  
AA  
Production Status  
Standard  
Standard  
Standard  
Standard  
Customer  
Specific  
Customer  
Specific  
Customer  
Specific  
Package Type  
PG-LFBGA-292  
Pinout  
PG-QFP-176 PG-LFBGA-292  
PG-QFP-176 PG-LFBGA-292 PG-LFBGA-292  
PG-QFP-176  
LFBGA 0.8 mm LQFP 0.5 mm LFBGA 0.8 mm LQFP 0.5 mm LFBGA 0.8 mm LFBGA 0.8 mm LQFP 0.5 mm  
Reference Silicon  
TC37x  
Temperature Range (Ambient)  
SAL SAL  
TC37x  
TC37x  
TC37x  
TC37x  
TC37x  
TC37x  
SAK  
SAK  
SAK  
SAL  
SAK  
Chip ID  
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.  
0x89007780  
0x89007580  
0x89007780  
0x89007580  
0xC9007780  
0xC9007780  
0x89007580  
Cores / Checker Cores  
3/2  
3/2  
300  
6
3/2  
300  
6
3/2  
300  
6
2/2  
300  
6
2/2  
300  
6
2/2  
300  
6
Max. Freq. (MHz)  
300  
Program Flash (MB)  
6
Data Flash0 (single-ended) (KB)  
256 256  
256  
256  
992  
256  
768  
0
256  
768  
0
256  
768  
0
Total SRAM (without EMEM and Cache) (KB)  
992  
EMEM Size (KB)  
0
992  
0
992  
0
0
Datasheet addendum  
3
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
1 TC37x AA step variants  
Table 1  
TC37x_AA step (part 1) (continued)  
SAL- SAK-  
SAL-  
SAK-  
SAK-  
SAL-  
SAK-  
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F  
00S  
300W  
300S  
300W  
300S  
300S  
300W  
DSPR (KB)  
240 in CPU0&1;  
96 other  
240 in  
CPU0&1; 96  
other  
240 in  
CPU0&1; 96  
other  
240 in  
CPU0&1; 96  
other  
240 in  
CPU0&1  
240 in  
CPU0&1  
240 in  
CPU0&1; 96  
other  
DLMU (KB)  
64 per CPU  
PSPR (KB)  
64 per CPU  
LMU (KB)  
0
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
64 per CPU  
0
32  
0
32  
0
32  
0
32  
0
32  
0
32  
DAM (KB)  
32  
AMU1)  
No  
No  
No  
No  
No  
No  
No  
ADC (Primary Groups/Channels)  
4/32 4/25  
ADC (Secondary Groups/Channels)  
4/60 4/45  
ADC (Fast Compare Channels)  
4/32  
4/25  
4/45  
4
4/32  
4/60  
4
4/32  
4/60  
4
4/25  
4/45  
4
4/60  
4
4
4
ADC (EDSADC Channels)  
6
CAN (Modules/Nodes)  
2/2x4  
6
6
6
6
6
6
2/2x4  
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
2/2x4  
1/1x2  
1
FlexRay (Modules/Channels)  
1/1x2  
HSSL Modules  
1
1/1x2  
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI  
12/12/11 12/12/10 12/12/11  
12/12/10  
12/12/11  
12/12/11  
12/12/10  
QSPI Modules / with LVDS  
1
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon  
Representative  
Datasheet addendum  
4
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
1 TC37x AA step variants  
Table 1  
TC37x_AA step (part 1) (continued)  
SAL- SAK-  
SAL-  
SAK-  
SAK-  
SAL-  
SAK-  
TC377TP-96F3 TC375TP-96F TC377TP-96F TC375TP-96F TC377DP-96F TC377DP-96F TC375DP-96F  
00S  
300W  
300S  
300W  
300S  
300S  
300W  
5/2  
5/2  
5/2  
5/2  
5/2  
5/2  
5/2  
SENT Channels  
15  
15  
2
15  
2
15  
2
15  
15  
15  
2
MSC Modules  
2
2
2
2
2
PSI5 Channels  
2
PSI5-S Module  
Yes  
2
2
2
2
Yes  
No  
Yes  
No  
Yes  
No  
Yes  
Yes  
Yes  
No  
SDMMC Module  
No  
No  
No  
Max. Ethernet Availability: 1GBit/100Mbit/No  
1Gbit/s  
100Mbit/s  
(RMII)  
1Gbit/s  
100Mbit/s  
(RMII)  
1Gbit/s  
1Gbit/s  
100Mbit/s  
(RMII)  
MCDS Availability  
miniMCDS  
miniMCDS  
miniMCDS  
miniMCDS  
miniMCDS  
miniMCDS  
miniMCDS  
ADAS Cluster Available  
No  
No  
No  
Yes  
No  
No  
Yes  
No  
No  
Yes  
No  
No  
Yes  
No  
No  
Yes  
No  
No  
Yes  
CIF  
No  
HSM Available  
Yes  
Datasheet addendum  
5
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
1 TC37x AA step variants  
1.2  
TC37x AA step (part 2)  
A continuation table listing the TC37x AA step variants.  
Table 2  
TC37x_AA step (part 2)  
SAL-TC375DP-96F300W  
SAK-TC375TI-96F300W  
AA  
SAL-TC375TI-96F300W  
AA  
Step  
AA  
Customer Specific  
PG-QFP-176  
Production Status  
Package Type  
Pinout  
Customer Specific  
PG-QFP-176  
LQFP 0.5 mm  
TC37x  
Customer Specific  
PG-QFP-176  
LQFP 0.5 mm  
TC37x  
LQFP 0.5 mm  
TC37x  
Reference Silicon  
Temperature Range (Ambient)  
SAL  
SAK  
SAL  
Chip ID  
Attention: The value of SCU_CHIPID in the UCODE field contains the default value 0 not the µCode version.  
0x89007580  
0xE9007580  
0xE9007580  
Cores / Checker Cores  
Max. Freq. (MHz)  
2/2  
300  
6
3/2  
3/2  
300  
300  
Program Flash (MB)  
6
6
Data Flash0 (single-ended) (KB)  
256  
256  
256  
Total SRAM (without EMEM and Cache) (KB)  
768  
992  
0
992  
0
EMEM Size (KB)  
0
DSPR (KB)  
240 in CPU0&1; 96 other  
DLMU (KB)  
240 in CPU0&1; 96 other  
64 per CPU  
240 in CPU0&1; 96 other  
64 per CPU  
64 per CPU  
Datasheet addendum  
6
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
1 TC37x AA step variants  
Table 2  
TC37x_AA step (part 2) (continued)  
SAL-TC375DP-96F300W  
SAK-TC375TI-96F300W  
SAL-TC375TI-96F300W  
PSPR (KB)  
LMU (KB)  
DAM (KB)  
AMU2)  
64 per CPU  
64 per CPU  
64 per CPU  
0
32  
0
32  
0
32  
No  
No  
No  
ADC (Primary Groups/Channels)  
4/25  
4/25  
4/45  
4
4/25  
ADC (Secondary Groups/Channels)  
4/45  
4/45  
ADC (Fast Compare Channels)  
4
4
ADC (EDSADC Channels)  
6
6
6
CAN (Modules/Nodes)  
2/2x4  
2/2x4  
1/1x2  
1
2/2x4  
FlexRay (Modules/Channels)  
1/1x2  
1/1x2  
HSSL Modules  
1
1
ASCLIN Modules / with ASC & LIN / with 3-wire SPI  
12/12/10  
12/12/10  
12/12/10  
QSPI Modules / with LVDS  
5/2  
5/2  
15  
2
5/2  
15  
2
SENT Channels  
15  
MSC Modules  
2
PSI5 Channels  
2
2
2
2
AMU is abbreviated as ASC Modeling Unit. For Additional details about AMU, Contact an Infineon  
Representative  
Datasheet addendum  
7
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
1 TC37x AA step variants  
Table 2  
TC37x_AA step (part 2) (continued)  
SAL-TC375DP-96F300W  
SAK-TC375TI-96F300W  
SAL-TC375TI-96F300W  
PSI5-S Module  
Yes  
No  
Yes  
Yes  
SDMMC Module  
No  
No  
Max. Ethernet Availability: 1GBit/100Mbit/No  
100Mbit/s (RMII)  
100Mbit/s (RMII)  
100Mbit/s (RMII)  
MCDS Availability  
miniMCDS  
miniMCDS  
miniMCDS  
ADAS Cluster Available  
No  
No  
No  
Yes  
No  
No  
Yes  
CIF  
No  
HSM Available  
Yes  
Datasheet addendum  
8
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
2 Memory maps of TC37x variants  
2
Memory maps of TC37x variants  
This section describes the influence of the available feature variants on the memory map.  
Cores / checker cores  
Variants:  
•
•
3/2: umbrella, see User's Manual.  
2/2: reduced CPU variant, not available is CPU2 including its RAMs (DSPR, DCACHE, DTAG, PSPR, PCACHE,  
PTAG, DLMU).  
HSM  
Variants:  
•
•
Yes: umbrella, see User's Manual.  
No: HSM and DF1 are not available.  
Ethernet availability  
•
•
1Gbit/s: umbrella, see User's Manual.  
100Mbit/s (RMII): due to pin limitations in this package the GETH module can be only used in RMII mode.  
ADC availability  
Limitation on availability of ADC channels are caused by pin limitations. See Data Sheet for the pinning  
•
table of the package.  
Datasheet addendum  
9
v1.5  
2020-11  
OPEN MARKET VERSION  
AURIX™ TC37x variants  
Revision history  
Revision history  
Document  
version  
Date of  
release  
Description of changes  
V1.0  
V1.1  
2019-02-05  
2019-03-01  
•
First release.  
•
•
Removed devices: SAK-TC377T-96F300S and SAK-TC375T-96F300W.  
Added devices: SAK-TC377DP-96F300S and SAL-TC377DP-96F300S.  
V1.2  
V1.3  
2019-06-12  
2020-01-10  
•
•
•
Chapter 1: TC37x AA step variants table format changed to fit all the  
contents.  
Chapter 1: Added new row in the variant tables called "AMU" with the  
footnote for additional details.  
Chapter: About this document: Feature package definitions are updated  
to consistent with the product naming nomenclature definition.  
•
•
•
Chapter 1: New TC37x AA step variants added: SAK-  
TC375DP-96F300W,SAL-TC375DP-96F300W .  
Page 1: About the document:Feature Package 'X' definition is updated to  
remove CIF.  
Chapter 1:Added new row in the variant tables called "CIF" indicating the  
Camera Interface availability.  
V1.4  
V1.5  
2020-04-30  
2020-11-18  
•
•
Chapter 1: New TC37x AA step variants added: SAK-TC375TI-96F300W,SAL-  
TC375TI-96F300W .  
About this document section: Added an additional note for the Feature  
package 'E'.  
•
Chapter 1: Removed Bare Die Marking variant SAL-TC370TP-96F300.  
Datasheet addendum  
10  
v1.5  
2020-11  
OPEN MARKET VERSION  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
Edition 2020-11  
IMPORTANT NOTICE  
WARNINGS  
The information given in this document shall in no  
event be regarded as a guarantee of conditions or  
characteristics (“Beschaffenheitsgarantie”).  
With respect to any examples, hints or any typical  
values stated herein and/or any information regarding  
the application of the product, Infineon Technologies  
hereby disclaims any and all warranties and liabilities  
of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any  
third party.  
In addition, any information given in this document is  
subject to customer’s compliance with its obligations  
stated in this document and any applicable legal  
requirements, norms and standards concerning  
customer’s products and any use of the product of  
Infineon Technologies in customer’s applications.  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon  
Technologies office.  
Except as otherwise explicitly approved by Infineon  
Technologies in a written document signed by  
authorized representatives of Infineon Technologies,  
Infineon Technologies’ products may not be used in  
any applications where a failure of the product or  
any consequences of the use thereof can reasonably  
be expected to result in personal injury.  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
©
2020 Infineon Technologies AG  
All Rights Reserved.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Document reference  
IFX-vxe1559112312940  
The data contained in this document is exclusively  
intended for technically trained staff. It is the  
responsibility of customer’s technical departments to  
evaluate the suitability of the product for the intended  
application and the completeness of the product  
information given in this document with respect to such  
application.  
OPEN MARKET VERSION  

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