SGP20N60HSXK [INFINEON]

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SGP20N60HSXK
型号: SGP20N60HSXK
厂家: Infineon    Infineon
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SIGC18T60SNC  
IGBT Chip in NPT-technology  
C
FEATURES:  
This chip is used for:  
SGP20N60  
·
·
·
·
·
600V NPT technology  
100µm chip  
short circuit prove  
positive temperature coefficient  
easy paralleling  
·
Applications:  
drives  
G
E
·
Chip Type  
VCE  
ICn  
20A  
20A  
Die Size  
4.3 x 4.3 mm2  
4.3 x 4.3 mm2  
Package  
Ordering Code  
Q67041-S2856-  
A001  
Q67041-S2856-  
A002  
SIGC18T60SNC  
600V  
sawn on foil  
SIGC18T60SNC  
600V  
unsawn  
MECHANICAL PARAMETER:  
mm2  
Raster size  
4.3 x 4.3  
18.49 / 14.3  
2.48 x 2.98  
0.7 x 1.08  
100  
Area total / active  
Emitter pad size  
Gate pad size  
Thickness  
µm  
mm  
deg  
Wafer size  
150  
Flat position  
270  
Max.possible chips per wafer  
Passivation frontside  
Emitter metallization  
796  
Photoimide  
3200 nm Al Si 1%  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, £500µm  
Reject Ink Dot Size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AI PS DD HV3, L 7242-S, Edition 2, 28.11.2003  
SIGC18T60SNC  
MAXIMUM RATINGS:  
Parameter  
Symbol  
VCE  
Value  
Unit  
Collector-emitter voltage, T =25 °C  
600  
V
A
j
1 )  
DC collector current, limited by T  
IC  
jmax  
Pulsed collector current, tp limited by T  
Gate emitter voltage  
Icpuls  
VGE  
60  
±20  
A
jmax  
V
Operating junction and storage temperature  
1 ) depending on thermal properties of assembly  
Tj, Ts t g  
-55 ... +150  
°C  
STATIC CHARACTERISTICS (tested on chip), T =25 °C, unless otherwise specified:  
j
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
600  
1.6  
3
max.  
Collector-emitter breakdown voltage  
Collector-emitter saturation voltage  
Gate-emitter threshold voltage  
Zero gate voltage collector current  
Gate-emitter leakage current  
V(BR)CES  
VCE(sat)  
VGE(th)  
ICES  
VGE=0V, IC=500µA  
VGE=15V, IC=20A  
IC=500µA, VGE=VCE  
VCE=600V, VGE=0V  
VCE=0V, VGE=20V  
1.9  
4
2.5  
5
V
70  
µA  
nA  
IGES  
120  
DYNAMIC CHARACTERISTICS (tested at component):  
Value  
Parameter  
Symbol  
Unit  
Conditions  
min. typ.  
max.  
Input capacitance  
Ciss  
Coss  
Crss  
VC E=25V  
VGE=0V  
f=1MHz  
-
-
-
1100 1320 pF  
Output capacitance  
107  
63  
128  
75  
Reverse transfer capacitance  
SWITCHING CHARACTERISTICS (tested at component), Inductive Load:  
Value  
Parameter  
Symbol  
Unit  
Conditions*  
min. typ.  
max.  
ns  
Tj=150° C  
Turn-on delay time  
Rise time  
td(on)  
tr  
td(of f )  
tf  
-
-
-
-
36  
30  
46  
VC C =400V  
IC =20A  
36  
300  
76  
VGE=+15/0V  
Turn-off delay time  
Fall time  
250  
63  
RG=16W  
* switching conditions different to 600V LowLoss, under comparable switching conditions 40% faster turnoff  
than LowLoss. Values also influenced by parasitic L- and C- in measurement and package.  
Edited by INFINEON Technologies AI PS DD HV3, L 7242-S, Edition 2, 28.11.2003  
SIGC18T60SNC  
CHIP DRAWING:  
Edited by INFINEON Technologies AI PS DD HV3, L 7242-S, Edition 2, 28.11.2003  
SIGC18T60SNC  
FURTHER ELECTRICAL CHARACTERISTICS:  
This chip data sheet refers to the  
device data sheet  
SGP20N60  
Package :TO220  
Description:  
AQL 0,65 for visual inspection according to failure catalog  
Electrostatic Discharge Sensitive Device according to MIL-STD 883  
Test-Normen Villach/Prüffeld  
Published by  
Infineon Technologies AG,  
Bereich Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 2002  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see  
address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types  
in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or  
system. Life support devices or systems are intended to be implanted in the human body, or to support  
and / or maintain and sustain and / or protect human life. If they fail, it is reasonable to assume that the  
health of the user or other persons may be endangered.  
Edited by INFINEON Technologies AI PS DD HV3, L 7242-S, Edition 2, 28.11.2003  

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