SMBT3906U-E6327 [INFINEON]

Transistor;
SMBT3906U-E6327
型号: SMBT3906U-E6327
厂家: Infineon    Infineon
描述:

Transistor

文件: 总13页 (文件大小:270K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMBT3906...MMBT3906  
PNP Silicon Switching Transistors  
High DC current gain: 0.1 mA to 100 mA  
Low colltector-emitter saturation voltage  
For SMBT3906S and SMBT3906U:  
Two (galvanic) internal isolated transistor  
with good matching in one package  
Complementary types:  
SMBT3904...MMBT3904 (NPN)  
SMBT3904S / U: for orientation in reel  
see package information below  
SMBT3906S/U  
C1  
B2  
E2  
6
5
4
TR2  
TR1  
1
2
3
E1  
B1  
C2  
EHA07175  
Type  
Marking  
s2A  
2A  
Pin Configuration  
Package  
SOT23  
TSLP-3-4  
SMBT3906/ MMBT3906  
SMBT3906L3  
1=B 2=E 3=C  
1=B 2=E 3=C  
-
-
-
-
-
-
SMBT3906S  
SMBT3906U  
s2A  
s2A  
1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SOT363  
1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SC74  
Maximum Ratings  
Parameter  
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
Symbol  
Value  
40  
40  
6
200  
Unit  
V
V
V
V
CEO  
CBO  
EBO  
mA  
I
C
K/W  
Total power dissipation-  
P
tot  
T 71 °C  
330  
250  
250  
330  
S
T tbd °C  
S
T 115 °C  
S
T 105 °C  
S
150  
°C  
Junction temperature  
Storage temperature  
T
T
j
-65 ... 150  
stg  
2006-07-11  
1
SMBT3906...MMBT3906  
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
Value  
Unit  
K/W  
1)  
R
thJS  
SMBT3906/ MMBT3906  
SMBT3906L3  
SMBT3906S  
240  
tbd  
140  
135  
SMBT3906U  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
Collector-emitter breakdown voltage  
40  
-
-
-
-
-
-
V
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
CBO  
I = 1 mA, I = 0  
C
B
Collector-base breakdown voltage  
I = 10 µA, I = 0  
40  
6
C
E
Emitter-base breakdown voltage  
I = 10 µA, I = 0  
-
E
C
Collector-base cutoff current  
I
-
50  
nA  
-
V
= 30 V, I = 0  
CB  
E
2)  
DC current gain  
h
FE  
I = 100 µA, V = 1 V  
60  
80  
100  
60  
-
-
-
-
-
-
-
C
CE  
I = 1 mA, V = 1 V  
C
CE  
I = 10 mA, V = 1 V  
300  
-
-
C
CE  
I = 50 mA, V = 1 V  
C
CE  
I = 100 mA, V = 1 V  
30  
C
CE  
2)  
Collector-emitter saturation voltage  
I = 10 mA, I = 1 mA  
V
V
V
CEsat  
BEsat  
-
-
-
-
0.25  
0.4  
C
B
I = 50 mA, I = 5 mA  
C
B
2)  
Base emitter saturation voltage  
I = 10 mA, I = 1 mA  
0.65  
-
-
-
0.85  
0.95  
C
B
I = 50 mA, I = 5 mA  
C
B
1
2
For calculation of RthJA please refer to Application Note Thermal Resistance  
Pulse test: t < 300µs; D < 2%  
2006-07-11  
2
SMBT3906...MMBT3906  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
AC Characteristics  
250  
-
-
-
-
MHz  
Transition frequency  
f
T
I = 10 mA, V = 20 V, f = 100 MHz  
C
CE  
-
-
3.5 pF  
10  
Collector-base capacitance  
= 5 V, f = 1 MHz  
C
C
cb  
eb  
V
CB  
Emitter-base capacitance  
= 0.5 V, f = 1 MHz  
V
EB  
Delay time  
t
-
-
-
-
35  
35  
ns  
d
V
V
= 3 V, I = 10 mA, IB1 = 1 mA,  
CC  
C
= 0.5 V  
BE(off)  
Rise time  
t
r
V
V
= 3 V, I = 10 mA, IB1 = 1 mA,  
CC  
C
= 0.5 V  
BE(off)  
Storage time  
= 3 V, I = 10 mA, I = I = 1 mA  
t
-
-
-
-
-
-
225  
75  
4
stg  
V
CC  
C
B1  
B2  
Fall time  
= 3 V, I = 10 mA, I = I = 1 mA  
t
f
V
CC  
C
B1  
B2  
dB  
Noise figure  
I = 100 µA, V = 5 V, f = 1 kHz,  
F
C
CE  
f = 200 Hz, R = 1 kΩ  
S
2006-07-11  
3
SMBT3906...MMBT3906  
Test circuit  
Delay and rise time  
-3.0 V  
275  
<1.0 ns  
+0.5 V  
10 kΩ  
0
C
<4.0 pF  
-10.6 V  
D = 2%  
300 ns  
EHN00059  
Storage and fall time  
-3.0 V  
<1.0 ns  
275  
+9.1 V  
0
10 kΩ  
C
<4.0 pF  
-10.9 V  
10 <t1< 500 µs  
D = 2%  
1N916  
t 1  
EHN00060  
2006-07-11  
4
SMBT3906...MMBT3906  
DC current gain h = ƒ(I )  
Saturation voltage I = ƒ(V  
; V  
)
CEsat  
FE  
C
C
BEsat  
V
= 1 V  
h
= 10  
CE  
FE  
EHP00767  
EHP00774  
101  
5
2
mA  
102  
Ι C  
h FE  
5
125 C  
25 C  
VBE  
VCE  
100  
5
101  
5
-55 C  
100  
0
10-1  
10 -1  
5 10 0  
5 10 1  
mA 10 2  
Ι C  
0.2  
0.4  
0.6  
0.8  
1.0 V 1.2  
VBE sat ,VCE sat  
Collector-base capacitance C = ƒ(V  
)
Total power dissipation P = ƒ(T )  
tot S  
cb  
CB  
Emitter-base capacitance C = ƒ(V )  
SMBT3906/ MMBT3906  
eb  
EB  
360  
mW  
8
pF  
7
300  
270  
240  
210  
180  
150  
120  
90  
6.5  
6
5.5  
5
4.5  
4
3.5  
3
CEB  
2.5  
2
60  
30  
1.5  
1
CCB  
22  
0
V
0
4
8
12  
16  
0
15 30 45 60 75 90 105 120  
150  
°C  
T
S
C
/C  
CB EB  
2006-07-11  
5
SMBT3906...MMBT3906  
Total power dissipation P = ƒ(T )  
Total power dissipation P = ƒ(T )  
tot S  
tot  
S
SMBT3906S  
SMBT3906U  
300  
mW  
360  
mW  
250  
225  
200  
175  
150  
125  
100  
75  
300  
270  
240  
210  
180  
150  
120  
90  
50  
60  
25  
30  
0
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Permissible Pulse Load  
Permissible Puls Load R  
= ƒ (t )  
thJS p  
P
/P  
= ƒ(t )  
SMBT3906S  
totmax totDC  
p
10 3  
K/W  
EHP00936  
103  
Ptotmax  
PtotDC  
t p  
5
t p  
T
D
=
T
10 2  
10 1  
10 0  
10 -1  
102  
5
D
0
=
0.005  
0.01  
0.02  
0.05  
0.1  
0.5  
0.2  
0.2  
0.5  
0.1  
101  
5
0.05  
0.02  
0.01  
0.005  
D = 0  
100  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10-6 10-5 10-4 10-3 10-2  
s
100  
s
t
p
t p  
2006-07-11  
6
SMBT3906...MMBT3906  
Permissible Pulse Load  
/P = ƒ(t )  
Permissible Puls Load R  
SMBT3906U  
= ƒ (t )  
thJS  
p
P
totmax totDC  
p
SMBT3906S  
10 3  
10 3  
K/W  
-
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 2  
10 2  
0.2  
D=0.5  
0.5  
0.2  
0.1  
10 1  
10 1  
0.05  
0.02  
0.01  
0.005  
0
10 0  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
Permissible Pulse Load  
/P = ƒ(t )  
Delay time t = ƒ(I )  
d C  
P
Rise time t = ƒ(I )  
totmax totDC  
p
r C  
SMBT3906U  
10 2  
EHP00772  
103  
ns  
t r  
t d  
D=0  
tr  
t
d
,
hFE = 10  
0.005  
0.01  
0.02  
0.05  
0.1  
102  
101  
100  
V
CC = 3 V  
0.2  
10 1  
0.5  
15 V  
40 V  
V
BE= 2 V  
0 V  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 0  
5
10 1  
5
10 2 mA  
5
10 3  
s
t
p
Ι C  
2006-07-11  
7
SMBT3906...MMBT3906  
Storage time t = ƒ(I )  
Fall time t = ƒ(I )  
f C  
stg  
C
EHP00762  
EHP00773  
103  
ns  
103  
ns  
25 C  
125 C  
ts  
25 C  
t f  
hFE= 20  
10  
125 C  
VCC = 40 V  
102  
101  
100  
102  
101  
100  
hFE = 20  
hFE= 20  
10  
hFE = 10  
10 0  
5
10 1  
5 10 2 mA 5 10 3  
10 0  
5 10 1  
5 10 2  
mA 10 3  
Ι C  
Ι C  
Rise time t = ƒ(I )  
r
C
EHP00764  
103  
ns  
tr  
25 C  
125 C  
VCC = 40 V  
hFE = 10  
102  
101  
100  
10 0  
5 10 1  
5 10 2  
mA 10 3  
Ι C  
2006-07-11  
8
Package SC74  
SMBT3906...MMBT3906  
Package Outline  
±0.2  
2.9  
B
1.1 MAX.  
(2.25)  
+0.1  
-0.06  
0.15  
(0.35)  
6
1
5
2
4
3
+0.1  
-0.05  
A
0.35  
0.95  
M
0.2  
B 6x  
Pin 1  
marking  
0.1 MAX.  
M
0.2  
A
1.9  
Foot Print  
0.5  
0.95  
Marking Layout (Example)  
Small variations in positioning of  
Date code, Type code and Manufacture are possible.  
Manufacturer  
2005, June  
Date code (Year/Month)  
Pin 1 marking  
Laser marking  
BCW66H  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
For symmetric types no defined Pin 1 orientation in reel.  
4
0.2  
3.15  
1.15  
Pin 1  
marking  
2006-07-11  
9
Package SOT23  
SMBT3906...MMBT3906  
Package Outline  
±0.1  
1
0.1 MAX.  
±0.1  
2.9  
B
3
1
2
1)  
+0.1  
-0.05  
0.4  
A
0.08...0.15  
C
0.95  
0...8˚  
1.9  
0.25 B C  
1) Lead width can be 0.6 max. in dambar area  
M
M
0.2  
A
Foot Print  
0.8  
0.8  
1.2  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
EH  
s
Pin 1  
BCW66  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
1.15  
3.15  
Pin 1  
2006-07-11  
10  
Package SOT363  
SMBT3906...MMBT3906  
Package Outline  
±0.2  
2
±0.1  
0.9  
+0.1  
-0.05  
6x  
0.2  
0.1 MAX.  
0.1  
M
0.1  
A
6
1
5
4
3
2
Pin 1  
marking  
+0.1  
0.15  
-0.05  
0.65 0.65  
M
0.2  
A
Foot Print  
0.3  
0.65  
0.65  
Marking Layout (Example)  
Small variations in positioning of  
Date code, Type code and Manufacture are possible.  
Manufacturer  
2005, June  
Date code (Year/Month)  
Pin 1 marking  
Laser marking  
BCR108S  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
For symmetric types no defined Pin 1 orientation in reel.  
4
0.2  
1.1  
2.15  
Pin 1  
marking  
2006-07-11  
11  
Package TSLP-3-4  
SMBT3906...MMBT3906  
Package Outline  
Top view  
Bottom view  
0.4+0.1  
±0.05  
0.6  
1)  
0.05 MAX.  
±0.035  
0.5  
3
2
3
1
1
2
±0.05  
0.35  
Pin 1  
marking  
1)  
±0.035  
2x0.15  
1) Dimension applies to plated terminal  
Foot Print  
For board assembly information please refer to Infineon website "Packages"  
0.6  
0.5  
R0.19  
R0.1  
0.2  
0.2  
0.17  
0.225  
0.225  
0.15  
Copper  
Solder mask  
Stencil apertures  
Marking Layout (Example)  
BCR133L3  
Type code  
Pin 1 marking  
Laser marking  
Standard Packing  
Reel ø180 mm = 15.000 Pieces/Reel  
0.5  
4
0.76  
Pin 1  
marking  
2006-07-11  
12  
SMBT3906...MMBT3906  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2006.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2006-07-11  
13  

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