SPD02N60S5BTMA1 [INFINEON]

Power Field-Effect Transistor, 1.8A I(D), 600V, 3ohm, 1-Element, N-Channel, Silicon, Metal-Oxide Semiconductor FET, TO-252AA, GREEN, PLASTIC, TO-252, DPAK-3;
SPD02N60S5BTMA1
型号: SPD02N60S5BTMA1
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 1.8A I(D), 600V, 3ohm, 1-Element, N-Channel, Silicon, Metal-Oxide Semiconductor FET, TO-252AA, GREEN, PLASTIC, TO-252, DPAK-3

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SPU02N60S5  
SPD02N60S5  
Cool MOS™ Power Transistor  
Feature  
New revolutionary high voltage technology  
V
600  
3
1.8  
V
A
DS  
R
DS(on)  
I
D
Ultra low gate charge  
PG-TO252  
PG-TO251  
Periodic avalanche rated  
Extreme dv/dt rated  
2
3
Ultra low effective capacitances  
Improved transconductance  
3
1
2
1
Type  
SPU02N60S5  
SPD02N60S5  
Package  
PG-TO251  
PG-TO252  
Ordering Code  
Q67040-S4226  
Q67040-S4213  
Marking  
02N60S5  
02N60S5  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
T
= 25 °C  
= 100 °C  
1.8  
1.1  
3.2  
50  
C
C
T
Pulsed drain current,  
t
limited by  
T
jmax  
I
E
p
D puls  
mJ  
Avalanche energy, single pulse  
= 1.35 A, = 50 V  
AS  
I
V
DD  
D
1)  
E
0.07  
1.8  
Avalanche energy, repetitive  
t
limited by  
limited by  
T
jmax  
AR  
AR  
I
= 1.8 A,  
V
= 50 V  
D
DD  
A
V
Avalanche current, repetitive  
t
T
I
AR  
jmax AR  
Gate source voltage  
V
±20  
30  
25  
GS  
V
P
T
Gate source voltage AC (f >1Hz)  
GS  
tot  
Power dissipation, T = 25°C  
W
°C  
C
Operating and storage temperature  
,
T
-55... +150  
j
stg  
Page 1  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Drain Source voltage slope  
dv/dt  
20  
V/ns  
V
= 480 V, I = 1.8 A, T = 125 °C  
D j  
DS  
Thermal Characteristics  
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
R
-
-
-
5
75  
K/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
thJC  
R
-
thJA  
R
thJA  
-
-
-
-
75  
50  
2
2)  
@ 6 cm cooling area  
Soldering temperature, *)  
T
-
-
260 °C  
sold  
1.6 mm (0.063 in.) from case for 10s  
Electrical Characteristics, at Tj=25°C unless otherwise specified  
Parameter  
Symbol  
Conditions  
Values  
Unit  
min.  
typ. max.  
V
V
=0V, I =0.25mA 600  
-
-
-
V
Drain-source breakdown voltage  
Drain-Source avalanche  
breakdown voltage  
(BR)DSS GS  
D
V
=0V, I =1.8A  
-
700  
V
GS  
D
(BR)DS  
I =80µΑ, V =V  
3.5  
4.5  
5.5  
Gate threshold voltage  
Zero gate voltage drain current  
V
I
D
GS DS  
GS(th)  
V
=600V, V =0V,  
µA  
DS  
GS  
DSS  
T =25°C,  
-
-
0.5  
-
1
50  
j
T =150°C  
j
V
V
=20V, V =0V  
-
-
100 nA  
Gate-source leakage current  
Drain-source on-state resistance R  
I
GSS  
GS  
DS  
=10V, I =1.1A,  
DS(on)  
GS  
D
T =25°C  
-
-
2.7  
7.3  
3
-
j
T =150°C  
j
*) TO252: reflow soldering, MSL3; TO251: wavesoldering  
Page 2  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
Electrical Characteristics , at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
Characteristics  
Transconductance  
g
V
2*I *R ,  
DS(on)max  
-
1.4  
-
S
fs  
DS  
D
I =1.1A  
D
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C
V
=0V, V =25V,  
-
-
-
-
-
-
-
240  
77  
4.4  
35  
35  
35  
-
-
-
-
-
pF  
iss  
GS  
DS  
f=1MHz  
C
oss  
C
rss  
t
V
=350V, V =0/10V,  
ns  
d(on)  
DD  
GS  
I =1.8A, R =50Ω  
t
D
G
r
Turn-off delay time  
Fall time  
t
42  
30  
d(off)  
t
20  
f
Gate Charge Characteristics  
Gate to source charge  
Q
Q
Q
V
=350V, I =1.8A  
-
-
-
2.3  
4.5  
7.3  
-
-
nC  
V
gs  
gd  
g
DD  
D
Gate to drain charge  
V
V
=350V, I =1.8A,  
9.5  
Gate charge total  
DD  
D
=0 to 10V  
GS  
V
=350V, I =1.8A  
-
8
-
Gate plateau voltage  
V(plateau)  
DD  
D
1
2
Repetitve avalanche causes additional power losses that can be calculated asP =E *f.  
AR  
AV  
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 3  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
T =25°C  
-
-
1.8  
3.2  
1.2  
A
Inverse diode continuous  
forward current  
I
C
S
Inverse diode direct current,  
I
-
-
SM  
pulsed  
V
=0V, I =I  
F S  
-
-
-
1
V
Inverse diode forward voltage  
Reverse recovery time  
V
GS  
SD  
t
V =350V, I =I ,  
860 1460 ns  
1.6 µC  
rr  
R
F S  
di /dt=100A/µs  
Reverse recovery charge  
Q
-
F
rr  
Typical Transient Thermal Characteristics  
Symbol  
Value  
typ.  
Unit  
Symbol  
Value  
typ.  
Unit  
Thermal resistance  
Thermal capacitance  
0.1  
K/W  
0.00002806  
0.0001113  
0.0001679  
0.000547  
0.001388  
0.019  
R
R
R
R
Rth5  
R
C
Ws/K  
th1  
th2  
th3  
th4  
th1  
0.184  
0.306  
1.207  
0.974  
0.251  
C
th2  
C
th3  
C
th4  
C
th5  
C
th6  
th6  
External Heatsink  
Tj  
Rth1  
Rth,n  
Tcase  
Ptot (t)  
Cth1  
Cth2  
Cth,n  
Tamb  
Page 4  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
1 Power dissipation  
= f (T )  
2 Safe operating area  
I = f ( V  
P
)
DS  
tot  
C
D
parameter : D = 0 , T =25°C  
C
10 1  
SPU02N60S5  
28  
W
A
24  
22  
20  
18  
16  
14  
12  
10  
8
10 0  
tp = 0.001 ms  
10 -1  
tp = 0.01 ms  
tp = 0.1 ms  
tp = 1 ms  
DC  
6
4
2
10 -2  
0
0
20  
40  
60  
80 100 120  
160  
10 0  
10 1  
10 2  
10 3  
°C  
V
V
T
DS  
C
3 Typ. output characteristic  
I = f (V ); T =25°C  
4 Drain-source on-state resistance  
= f (T )  
R
D
DS  
j
DS(on)  
j
parameter: t = 10 µs, V  
parameter : I = 1.1 A, V = 10 V  
p
GS  
D
GS  
SPU02N60S5  
6
17  
20V  
12V  
A
14  
12  
10  
8
4
3
2
1
0
10V  
9V  
8.5V  
6
8V  
98%  
4
7.5V  
typ  
2
7V  
6V  
0
°C  
0
5
10  
15  
25  
-60  
-20  
20  
60  
100  
180  
V
V
T
DS  
j
Page 5  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
5 Typ. transfer characteristics  
I = f ( V ); V 2 x I x R  
6 Typ. gate charge  
= f (Q  
V
)
Gate  
D
GS  
DS  
D
DS(on)max  
GS  
parameter: t = 10 µs  
parameter: I = 1.8 A pulsed  
p
D
SPU02N60S5  
6
16  
V
A
0.2 VDS max  
0.8 VDS max  
12  
4
3
2
1
0
10  
8
6
4
2
0
nC  
0
4
8
12  
20  
0
1
2
3
4
5
6
7
8
10  
V
GS  
Q
V
Gate  
7 Forward characteristics of body diode  
I = f (V )  
8 Avalanche SOA  
= f (t )  
I
F
SD  
AR  
AR  
parameter: T , tp = 10 µs  
par.: T 150 °C  
j
j
10 1  
SPU02N60S5  
2
A
A
1.6  
1.4  
1.2  
1
T
=25°C  
j(START)  
10 0  
0.8  
T
=125°C  
j(START)  
10 -1  
0.6  
0.4  
0.2  
0
Tj = 25 °C typ  
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
10 -2  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
10 -3 10 -2 10 -1 10 0 10 1 10 2  
10 4  
V
V
µs  
AR  
t
SD  
Page 6  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
9 Avalanche energy  
= f (T )  
10 Drain-source breakdown voltage  
= f (T )  
E
V
(BR)DSS  
AS  
j
j
par.: I = 1.35 A, V = 50 V  
D
DD  
SPU02N60S5  
50  
720  
V
mJ  
680  
660  
640  
620  
600  
580  
560  
540  
30  
20  
10  
0
20  
40  
60  
80  
100  
120  
160  
-60  
-20  
20  
60  
100  
180  
°C  
°C  
T
T
j
j
11 Typ. capacitances  
C = f (V )  
DS  
parameter: V =0V, f=1 MHz  
GS  
10 4  
pF  
10 3  
C
iss  
10 2  
10 1  
10 0  
C
oss  
C
rss  
0
10 20 30 40 50 60 70 80  
100  
V
V
DS  
Page 7  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
Definition of diodes switching characteristics  
Page 8  
Rev. 2.5  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
PG-TO252-3-1, PG-TO252-3-11, PG-TO252-3-21 (D-PAK)  
Rev. 2.5  
Page 9  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
PG-TO251-3-1, PG-TO251-3-21 (I-PAK)  
Rev. 2.5  
Page 10  
2008-04-07  
SPU02N60S5  
SPD02N60S5  
Page 11  
Rev. 2.5  
2008-04-07  

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