V23818-M305-L57-MH [INFINEON]
Transceiver, Through Hole Mount;
| 型号： | V23818-M305-L57-MH |
| 厂家： | 
Infineon |
| 描述： | Transceiver, Through Hole Mount 光纤 |
| 文件： | 总15页 (文件大小：359K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Fiber Optics
Small Form Factor
V23818-M305-L57-MH
Multimode 850 nm 2.488 Gbit/s Transceiver
2x5 Pinning with LC™ Connector
Features
• Small Form Factor transceiver
• Excellent EMI performance
• RJ-45 style LC™ connector system
• Single power supply (3.3 V)
• Extremely low power consumption of
445 mW typical
File: 1147
• PECL and LVPECL differential inputs and outputs
• Multisource 2x5 footprint
• Small size for high port density
• UL-94 V-0 certified
• ESD Class 1 per MIL-STD 883D Method 3015.7
• Compliant with FCC (Class B) and EN 55022
• Class 1 FDA and IEC laser safety compliant
• AC/AC coupling in accordance to SFF MSA
• Operating case temperature: –10°C to 85°C
• Suitable for multirate applications from 1 Gbit/s up to 2.5 Gbit/s
LC™ is a trademark of Lucent
Part Number
Voltage
Signal Detect
Input
Output
V23818-M305-L57-MH
3.3 V
TTL
AC
AC
Data Sheet
1
2004-02-16
V23818-M305-L57-MH
Pin Configuration
Pin Configuration
MS
MS
HL
HL
Tx
10 9 8 7 6 HL
TOP VIEW
1 2 3 4 5 HL
Rx
File: 1331
Figure 1
Pin Description
Pin
No.
Symbol Level/Logic
Description
1
VEEr
VCCr
SD
Ground
Receiver signal ground
Receiver power supply
2
Power supply
LVTTL output
LVPECL output
LVPECL output
Power supply
Ground
3
Receiver optical input level monitor
Receiver data out bar
Receiver data out
4
RD–
RD+
VCCt
VEEt
TDis
TD+
TD–
5
6
Transmitter power supply
Transmitter signal ground
Transmitter disable
7
8
LVTTL input
LVPECL input
LVPECL input
9
Transmitter data in
10
MS
HL
Transmitter data in bar
Mounting studs
Housing leads
Data Sheet
2
2004-02-16
V23818-M305-L57-MH
Pin Configuration
V
EEr / VEEt
Connect pins 1 and 7 to signal ground.
V
CCr / VCCt
A 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply
filter network is given in the termination scheme. Locate power supply filtering directly at
the transceiver power supply pins. Proper power supply filtering is essential for good EMI
performance.
TD+ / TD–
Transmitter data LVPECL level inputs. Terminated and AC coupled internally.
RD– / RD+
Receiver data LVPECL level outputs. Biased and AC coupled internally.
TDis
A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input
must be applied. Leave pin unconnected if feature not required.
SD
LVTTL output. A logical high output indicates normal optical input levels to the receiver.
Low optical input levels at the receiver result in a low output. Signal Detect can be used
to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty
laser source. However it is not a detection of a bad link due to data-related errors.
MS
Mounting studs are provided for transceiver mechanical attachment to the circuit board.
They also provide an optional connection of the transceiver to the equipment chassis
ground. The holes in the circuit board must be tied to chassis ground.
HL
Housing leads are provided for additional signal grounding. The holes in the circuit board
must be included and tied to signal ground.
Data Sheet
3
2004-02-16
V23818-M305-L57-MH
Description
Description
The Infineon multimode transceiver – part of Infineon Small Form Factor transceiver
family – is based on the Physical Medium Depend (PMD) sublayer and baseband
medium.
The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™
connector.
Operating Range over each Optical Fiber Type at 2.488 Gbit/s
Fiber Type
Values
typ.
Unit
min.
0.5
max.
62.5 micron MMF
50 micron MMF
2 to 125 250
2 to 250 400
meters
0.5
The Infineon multimode transceiver is a single unit comprised of a transmitter, a receiver,
and an LC™ receptacle. This design frees the customer from many alignment and PC
board layout concerns.
This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45
style backpanels for high end Data Com and Telecom applications while providing the
advantages of fiber optic technology.
The module is designed for low cost SAN, LAN, WAN, and up to 2.5 Gbit/s applications.
It can be used as the network end device interface in mainframes, workstations, servers,
and storage devices, and in a broad range of network devices such as bridges, routers,
hubs, and local and wide area switches.
This transceiver operates at 1.0625/2.125 and 2.488 Gbit/s from a single power supply
(+3.3 V). The full differential data inputs and outputs are PECL and LVPECL compatible.
Data Sheet
4
2004-02-16
V23818-M305-L57-MH
Description
Functional Description
This transceiver is designed to transmit serial data via multimode cable.
Automatic
Shut-Down
TxDis
Tx
LEN
Laser
Coupling Unit
e/o
Laser
TD−
TD+
Driver
o/e
Power
Control
Multimode Fiber
Rx
Monitor
Receiver
Coupling Unit
RD−
RD+
SD
o/e
File: 1358
Figure 2
Functional Diagram
The receiver component converts the optical serial data into PECL compatible electrical
data (RD+ and RD–). The Signal Detect (SD, active high) shows whether an optical
signal is present.
The transmitter converts PECL compatible electrical serial data (TD+ and TD–) into
optical serial data. Data lines are differentially 100 Ω terminated.
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging.
The power control uses the output of the monitor PIN diode (mechanically built into the
laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the
operating limits.
Single fault condition is ensured by means of an integrated automatic shutdown circuit
that disables the laser when it detects laser fault to guarantee the laser Eye Safety.
The transceiver contains a supervisory circuit to control the power supply. This circuit
makes an internal reset signal whenever the supply voltage drops below the reset
threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage
has risen above the reset threshold. During this time the laser is inactive.
A low signal on TxDis enables transmitter. If TxDis is high the transmitter is disabled.
Data Sheet
5
2004-02-16
V23818-M305-L57-MH
Description
Regulatory Compliance
Feature
Standard
Comments
ESD:
EIA/JESD22-A114-B
Class 1C
Electrostatic Discharge (MIL-STD 883D
to the Electrical Pins
Method 3015.7)
Immunity:
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
Immunity:
Against Radio
Frequency
EN 61000-4-3
IEC 61000-4-3
With a field strength of 3 V/m, noise
frequency ranges from 10 MHz to
2 GHz. No effect on transceiver
performance between the
Electromagnetic Field
specification limits.
Emission:
FCC 47 CFR Part 15, Noise frequency range:
Electromagnetic
Interference (EMI)
Class B
EN 55022 Class B
CISPR 22
30 MHz to 18 GHz
*)
(13.97)
.550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
File: 1501
Figure 3
Transceiver Pitch
Data Sheet
6
2004-02-16
V23818-M305-L57-MH
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min.
max.
0.5
Package Power Dissipation
Data Input Levels (PECL)
W
VCC+0.5
5
V
Differential Data Input Voltage Swing
Storage Ambient Temperature
VIDpk-pk
V
–40
85
°C
°C/s
Soldering Conditions, Temp/Time
(MIL-STD 883C, Method 2003)
250/5.5
VCC max.
5.5
50
V
ECL-Output Current Data
mA
Exceeding any one of these values may destroy the device immediately.
Recommended Operating Conditions
Parameter
Symbol
Values
typ.
Unit
min.
max.
85
Case Temperature
Power Supply Voltage
Transmitter
TC
–10
°C
V
VCC–VEE 3.1
3.3
3.5
Differential Data Input Voltage VIDpk-pk 500
Swing
3200
860
mV
nm
Receiver
Input Center Wavelength
λC
770
Data Sheet
7
2004-02-16
V23818-M305-L57-MH
Technical Data
The electro-optical characteristics described in the following tables are valid only for use
under the recommended operating conditions.
Transmitter Electro-Optical Characteristics
Parameter
Symbol
Values
typ.
Unit
min.
–9.5
830
max.
–4
Launched Power (Average)1)
Center Wavelength
Spectral Width (RMS)
Relative Intensity Noise
Extinction Ratio (Dynamic)
Reset Threshold2)
PO
λC
–6
dBm
nm
850
860
σl
0.85
–117
nm
RIN
ER
VTH
tRES
tR
dB/Hz
dB
9
13
2.5
140
2.75
240
130
45
2.99
560
150
65
V
Reset Time Out2)
ms
Rise Time, 20% - 80%
Supply Current
ps
mA
mUI
mUI
Jitter
p-p
30
rms
3
1)
Into multimode fiber, 62.5 µm or 50 µm diameter.
Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES
2)
.
Data Sheet
8
2004-02-16
V23818-M305-L57-MH
Technical Data
Receiver Electro-Optical Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Sensitivity (Average Power)1)
Saturation (Average Power)
Signal Detect Assert Level2)
PIN
–17
–14
dBm
dBm
dBm
dBm
dB
PSAT
0
PSDA
–21
–22
1
–18
Signal Detect Deassert Level3) PSDD
–30
0.5
Signal Detect Hysteresis
PSDA
–PSDD
Signal Detect Assert Time
tASS
tDAS
100
350
2.5
µs
Signal Detect Deassert Time
µs
Receiver 3 dB Cut-off
Frequency
GHz
Receiver 10 dB Cut-off
Frequency
6
GHz
mV
Differential Data Output Voltage VODpk-pk 500
700
80
1230
Swing4)
Supply Current5)
90
mA
1)
Average optical power at which the BER is 1x10–12. Measured with a 27–1 NRZ PRBS as recommended by
ANSI T1E1.2.
2)
3)
4)
5)
An increase in optical power above the specified level will cause the Signal Detect output to switch from a low
state to a high state.
A decrease in optical power below the specified level will cause the Signal Detect to change from a high state
to a low state.
AC/AC for data. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of 50 mV
should be added.
Supply current excluding Rx output load.
Data Sheet
9
2004-02-16
V23818-M305-L57-MH
Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1 product.
It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11.
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Attention: All adjustments have been made at the factory prior to shipment of the
devices. No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result
in voided product warranty.
Note: Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Data
Wavelength
850 nm
Total output power
< 675 µW
(as defined by IEC: 7 mm aperture at 14 mm distance)
Total output power
< 70 µW
(as defined by FDA: 7 mm aperture at 20 cm distance)
Beam divergence
20°
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
File: 1401
Figure 4
Required Labels
Indication of
laser aperture
and beam
10 9 8 7 6
Tx
TOP VIEW
Rx
1 2 3 4 5
File: 1332
Figure 5
Laser Emission
Data Sheet
10
2004-02-16
V23818-M305-L57-MH
Application Notes
Application Notes
Small Form Factor Pinning Comparison
The drawing below gives you a comparison between the different pinnings 2x5, 2x6,
2x10. Dimension for diameter and distance of additional pins is similar to the existing
dimensions of the other pins.
Top view
Rx
Tx
VCCPIN 1
20 PMON+
19 PMON−
18 BIASMON+
17 BIASMON−
16 TxVEE
15 TxD−
14 TxD+
13 TxDis
12 TxVEE
RxVEE
RxVEE
2
3
RxCLK− 4
RxCLK+ 5
12 Laser Fault
11 TxD−
10 TxD+
9 TxDis
8 TxVEE
7 TxVCC
RS 1
RxVEE
RxVCC
6
7
10 TxD−
9 TxD+
8 TxDis
7 TxVEE
6 TxVCC
RxVEE
RxVCC
SD 3
RxD− 4
RxD+ 5
1
2
RxVEE
RxVCC
2
3
SD 8
RxD− 9
RxD+ 10
SD 4
RxD− 5
RxD+ 6
11 TxVCC
2 x 10
2 x 6
2 x 5
File: 1506
Figure 6
Pin Description
RS pin - The RS (Rate Select) is not connected.
LF pin - The LF pin (Laser Fault) is a TTL output of the Laser Driver Supervisor Circuit.
A Logic 1 level can be measured in case of a laser fault. It will not show a fault
if the laser is being disabled using the TxDis input, since this is not a fault
condition.
Data Sheet
11
2004-02-16
V23818-M305-L57-MH
Application Notes
EMI-Recommendations
To avoid electromagnetic radiation exceeding the required limits please take note of the
following recommendations.
When Gigabit switching components are found on a PCB (multiplexers, clock recoveries
etc.) any opening of the chassis may produce radiation also at chassis slots other than
that of the device itself. Thus every mechanical opening or aperture should be as small
as possible.
On the board itself every data connection should be an impedance matched line (e.g.
strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should
be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched
line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:
for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not planned, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an εr of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
Data Sheet
12
2004-02-16
V23818-M305-L57-MH
Recommended Termination Scheme
Recommended Termination Scheme
2x5 AC/AC Transceiver
VCC SerDes
7
9
VEEt
VCC
TD+
+
SerDat Out
ECL/
PECL
Driver
Laser
Driver
100 Ω
C4
TD− 10
SerDat Out −
TDis
8
6
TDis
C1
L1
L2
VCCt
VCC
3.3 V
SFF Transceiver
Serializer/
Deserializer
VCCr
2
C3 C6
C2
Signal
Detect
SD
3
4
SD
Limiting
Amplifier
RD−
RD−
Pre-
Amp
SerDat In −
Receiver
PLL etc.
C5
RD+
5
1
RD+
SerDat In +
VEEr
C1/2/3
C4/5/6
= 4.7 ... 10 µF
= Design criterion is the resonance frequency only. The self resonant frequency of the
capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory.
= 1 ... 4.7 µH
L1/2*)
R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω
differential is provided. Check for termination inside of SerDes chip.
R5/6
= Biasing (depends on SerDes chip).
Place R1/2/3/4/5/6 close to SerDes chip.
*)
The inductors may be replaced by appropriate Ferrite beads.
File: 1393
Figure 7
Data Sheet
13
2004-02-16
V23818-M305-L57-MH
Package Outlines
Package Outlines
a) recommended bezel position
Drawing shown is with collar
Dimensions in mm [inches]
File: 1212
Figure 8
Data Sheet
14
2004-02-16
V23818-M305-L57-MH
Revision History:
2004-02-16
DS0
Previous Version:
none
Page
Subjects (major changes since last revision)
Edition 2004-02-16
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München, Germany
© Infineon Technologies AG 2004.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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