V23818-M305-L57 [INFINEON]
Small Form Factor Multimode 850 nm 2.125 and 1.0625 GBd Fibre Channel 2x5 Transceiver with LC⑩ Connector; 小巧的外形多模850纳米2.125和1.0625 GBd的光纤通道2×收发器LC⑩连接器
| 型号： | V23818-M305-L57 |
| 厂家： | 
Infineon |
| 描述： | Small Form Factor Multimode 850 nm 2.125 and 1.0625 GBd Fibre Channel 2x5 Transceiver with LC⑩ Connector |
| 文件： | 总15页 (文件大小：394K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Fiber Optics
Small Form Factor
V23818-M305-L57
Multimode 850 nm
2.125 and 1.0625 GBd Fibre Channel
2x5 Transceiver with LC™ Connector
Features
• Small Form Factor transceiver
• Full compliant with Fibre Channel
• Data rate autonegotiation between
1.0625 and 2.125 GBd
• Excellent EMI performance
• RJ-45 style LC™ connector system
• Half the size of SC Duplex 1x9 transceiver
• Single power supply (3.3 V)
• Extremely low power consumption of
445 mW typical
• PECL and LVPECL differential inputs and outputs
• System optimized for 62.5/50 µm graded index fiber
• Multisource 2x5 footprint
• Small size for high port density
• UL-94 V-0 certified
• ESD Class 1 per MIL-STD 883D Method 3015.7
• Compliant with FCC (Class B) and EN 55022
• For distances of up to 700 m
• Class 1 FDA and IEC laser safety compliant
• AC/AC coupling in accordance to SFF MSA
• Operating case temperature: –10°C to 85°C
LC™ is a trademark of Lucent
Part Number
Voltage
Signal Detect
Input
AC
Output
V23818-M305-L57
3.3 V
TTL
AC
Data Sheet
1
2002-03-21
V23818-M305-L57
Pin Configuration
Pin Configuration
HL3
MS2
10-PIN MODULE - TOP VIEW
Tx
HL4
10 9 8 7 6
1 2 3 4 5
HL1
MS1
Rx
HL2
Figure 1
Data Sheet
2
2002-03-21
V23818-M305-L57
Pin Configuration
Pin Description
Pin
No.
Symbol Level/Logic Function
Description
1
2
3
VEEr
VCCr
SD
N/A
N/A
TTL
Receiver
Signal Ground
Receiver
Power Supply
Signal Detect
Normal Operation: Logic “1”
Output, represents that light is
present at receiver input
Fault Condition: Logic “0” Output
4
RD–
PECL
Received Data Out
Not
5
6
7
8
RD+
VCCt
PECL
N/A
Received Data Out
Transmitter Power Supply
Transmitter Signal Ground
VEEt
N/A
TxDis
TTL
Input
Transmitter
Disable/Enable
A low signal switches the laser on.
A high signal switches the laser off.
9
TD+
TD–
PECL
PECL
N/A
Transmit Data
Transmitter Data In
10
Transmit Data Not Transmitter Data In
MS1 MS
MS2
Mounting Studs
Mounting Studs are provided for
transceiver mechanical
attachment to the circuit board.
They also provide an optional
connection of the transceiver to
the equipment chassis ground.
HL1
HL2
HL3
HL4
HL
N/A
Housing Leads
The transceiver Housing Leads
are provided for additional signal
grounding. The holes in the circuit
board must be included and be
tied to signal ground (see
“Application Notes” on
Page 11).
Data Sheet
3
2002-03-21
V23818-M305-L57
Description
Description
The Infineon Fibre Channel multimode transceiver – part of Infineon Small Form Factor
transceiver family – is based on the Physical Medium Depend (PMD) sublayer and
baseband medium, type (short wavelength), Fibre Channel
FC-PI 200-M5-SN-I, 200-M6-SN-I
FC-PI 100-M5-SN-I, 100-M6-SN-I
FC-PH2 100-M5-SN-I, FC-PH2 100-M6-SN-I.
The appropriate fiber optic cable is 62.5 µm or 50 µm multimode fiber with LC™
connector.
Operating Range over each Optical Fiber Type
Fiber Type
Limit Values
Unit
min.
typ.
max.
at 2.125 GBd
62.5 micron MMF
50.0 micron MMF
at 1.0625 GBd
0.5
0.5
2 to 150 300
2 to 300 500
meters
meters
62.5 micron MMF
50.0 micron MMF
0.5
0.5
2 to 300 400
2 to 550 700
The Infineon Fibre Channel multimode transceiver is a single unit comprised of a
transmitter, a receiver, and an LC™ receptacle. This design frees the customer from
many alignment and PC board layout concerns.
This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45
style backpanels for high end Data Com and Telecom applications while providing the
advantages of fiber optic technology.
The module is designed for low cost SAN, LAN, WAN, Fibre Channel applications. It can
be used as the network end device interface in mainframes, workstations, servers, and
storage devices, and in a broad range of network devices such as bridges, routers, hubs,
and local and wide area switches.
This transceiver operates at 1.0625/2.125 Gbit/s from a single power supply (+3.3 V).
The full differential data inputs and outputs are PECL and LVPECL compatible.
Data Sheet
4
2002-03-21
V23818-M305-L57
Description
Functional Description of 2x5 Pin Row Transceiver
This transceiver is designed to transmit serial data via multimode cable.
Automatic
Shut-Down
TDis
Laser
Coupling Unit
LEN
TD−
TD+
Laser
Driver
e/o
Laser
Power
Control
o/e
Multimode Fiber
Monitor
Rx Coupling Unit
o/e
RD−
RD+
SD
Receiver
Figure 2
Functional Diagram
The receiver component converts the optical serial data into PECL compatible electrical
data (RD+ and RD–). The Signal Detect (SD, active high) shows whether an optical
signal is present.
The transmitter converts PECL compatible electrical serial data (TD+ and TD–) into
optical serial data. Data lines are differentially 100 Ω terminated.
The transmitter contains a laser driver circuit that drives the modulation and bias current
of the laser diode. The currents are controlled by a power control circuit to guarantee
constant output power of the laser over temperature and aging.
The power control uses the output of the monitor PIN diode (mechanically built into the
laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the
operating limits.
Single fault condition is ensured by means of an integrated automatic shutdown circuit
that disables the laser when it detects laser fault to guarantee the laser Eye Safety.
The transceiver contains a supervisory circuit to control the power supply. This circuit
makes an internal reset signal whenever the supply voltage drops below the reset
threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage
has risen above the reset threshold. During this time the laser is inactive.
A low signal on TxDis enables transmitter. If TxDis is high the transmitter is disabled.
Data Sheet
5
2002-03-21
V23818-M305-L57
Description
Regulatory Compliance
Feature
Standard
Comments
ESD:
EIA/JESD22-A114-A
Class 1 (>1000 V)
Electrostatic Discharge (MIL-STD 883D
to the Electrical Pins
Method 3015.7)
Immunity:
EN 61000-4-2
IEC 61000-4-2
Discharges ranging from ±2 kV to
±15 kV on the receptacle cause no
damage to transceiver (under
recommended conditions).
Against Electrostatic
Discharge (ESD) to the
Duplex LC Receptacle
Immunity:
Against Radio
Frequency
EN 61000-4-3
IEC 61000-4-3
With a field strength of 3 V/m rms,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
transceiver performance between
the specification limits.
Electromagnetic Field
Emission:
FCC 47 CFR Part 15, Noise frequency range:
Electromagnetic
Interference (EMI)
Class B
EN 55022 Class B
CISPR 22
30 MHz to 18 GHz
Data Sheet
6
2002-03-21
V23818-M305-L57
Technical Data
Technical Data
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min.
max.
0.5
Package Power Dissipation
Data Input Levels (PECL)
W
V
VCC+0.5
2.5
Differential Data Input Voltage
Storage Ambient Temperature
–40
85
°C
Soldering Conditions, Temp/Time
(MIL-STD 883C, Method 2003)
250/ 5.5 °C/s
VCC max.
5.5
50
V
ECL-Output current data
mA
Exceeding any one of these values may destroy the device immediately.
Recommended Operating Conditions
Parameter
Symbol
Limit Values
typ.
Unit
min.
max.
85
Case Temperature
Power Supply Voltage
Transmitter
TC
–10
°C
V
VCC–VEE 3.1
3.3
3.5
Data Input Differential Voltage VDIFF
250
770
2400
860
mV
nm
Receiver
Input Center Wavelength
λC
Data Sheet
7
2002-03-21
V23818-M305-L57
Technical Data
The electro-optical characteristics described in the following tables are valid only for use
under the recommended operating conditions.
Transmitter Electro-Optical Characteristics
Parameter
Symbol
Limit Values
Unit
min.
–9.5
196
156
830
typ.
–6
max.
Launched Power (Average)1)
PO
–4
dBm
µW
OpticalModulation 2.125 Gbit/s OMA
450
450
850
Amplitude2)
1.0625 Gbit/s
Center Wavelength
Spectral Width (RMS)
Relative Intensity Noise
Extinction Ratio (Dynamic)
Total Tx Jitter
λC
860
nm
σl
0.85
–117
RIN
ER
TJ
dB/Hz
dB
9
13
40
80
ps
Reset Threshold3)
Reset Time Out3)
VTH
tRES
tR
2.5
2.75
240
130
45
2.99
560
150
65
V
140
ms
ps
Rise Time, 20%–80%
Supply Current
mA
1)
Into multimode fiber, 62.5 µm or 50 µm diameter.
Fibre Channel PI Standard.
Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES
2)
3)
.
Data Sheet
8
2002-03-21
V23818-M305-L57
Technical Data
Receiver Electro-Optical Characteristics
Parameter
Symbol
Limit Values
Unit
min.
typ.
max.
–16
Sensitivity
2.125 Gbit/s PIN
–18.5
–19
dBm
(Average Power)1)
1.0625 Gbit/s
–17
Saturation (Average Power)
PSAT
0
Min. Optical
Modulation
Amplitude2)
2.125 Gbit/s OMA
1.0625 Gbit/s
24
19
49
31
µW
StressedReceiver 2.125 Gbit/s SPIN
29
24
96
55
Sensitivity
1.0625 Gbit/s
50 µm Fiber3)
Stressed Receiver 2.125 Gbit/s SPIN
34
32
109
67
Sensitivity
1.0625 Gbit/s
62.5 µm Fiber3)
Signal Detect Assert Level4)
Signal Detect Deassert Level5) PSDD
PSDA
–21
–22
1
–18
dBm
–30
Signal Detect Hysteresis
Signal Detect Assert Time
Signal Detect Deassert Time
PSDA
tASS
tDAS
-
PSDD 0.5
dB
µs
100
350
2.5
Receiver 3 dB cut-off
Frequency2)
GHz
Receiver 10 dB cut-off
Frequency2)
6
Data Output Differential
Voltage6)
VDIFF
ARL
0.5
12
0.7
80
1.23
V
Return Loss of Receiver
Supply current7)
dB
90
mA
1)
Average optical power at which the BER is 1x10–12. Measured with a 27–1 NRZ PRBS and ER = 9 dB.
Fibre Channel PI Standard.
Measured at the given Stressed Receiver Eyeclosure Penalty and DCD component given in Fibre Channel PI
Standard (2.03/2.18 dB & 40/80 ps).
2)
3)
4)
5)
6)
7)
An increase in optical power above the specified level will cause the SIGNAL DETECT output to switch from
a Low state to a High state.
A decrease in optical power below the specified level will cause the SIGNAL DETECT to change from a High
state to a Low state.
AC/AC for data. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of 50 mV
should be added.
Supply current excluding Rx output load.
Data Sheet
9
2002-03-21
V23818-M305-L57
Eye Safety
Eye Safety
This laser based multimode transceiver is a Class 1 product.
It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11.
To meet laser safety requirements the transceiver shall be operated within the Absolute
Maximum Ratings.
Attention: All adjustments have been made at the factory prior to shipment of the
devices. No maintenance or alteration to the device is required.
Tampering with or modifying the performance of the device will result
in voided product warranty.
Note: Failure to adhere to the above restrictions could result in a modification that is
considered an act of “manufacturing”, and will require, under law, recertification of
the modified product with the U.S. Food and Drug Administration (ref. 21 CFR
1040.10 (i)).
Laser Data
Wavelength
850 nm
Total output power
<675 µW
(as defined by IEC: 7 mm aperture at 1.4 cm distance)
Total output power
<70 µW
(as defined by FDA: 7 mm aperture at 20 cm distance)
Beam divergence
12°
FDA
IEC
Complies with 21 CFR
1040.10 and 1040.11
Class 1 Laser Product
Figure 3
Required Labels
Indication of
laser aperture
and beam
10 9 8 7 6
Tx
Rx
1 2 3 4 5
Figure 4
Laser Emission
Data Sheet
10
2002-03-21
V23818-M305-L57
Application Notes
Application Notes
Small Form Factor Pinning Comparison
The drawing below gives you a comparison between the different pinnings 2x5, 2x6,
2x10. Dimension for diameter and distance of additional pins is similar to the existing
dimensions of the other pins.
TOP VIEW
RX
TX
20 P MON +
19 P MON -
18 BIAS MON +
17 BIAS MON -
16 TX VEE
15 TXD -
14 TXD +
13 TX DIS
12 TX VEE
11 TX VCC
VCC PIN 1
RX VEE 2
RX VEE 3
RX CLK - 4
RX CLK + 5
RX VEE 6
RX VCC 7
SD 8
12 LASER FAULT
11 TXD -
10 TXD +
9 TX DIS
8 TX VEE
RS 1
RX VEE 2
RX VCC 3
SD 4
RXD - 5
RXD + 6
10 TXD -
9 TXD +
8 TX DIS
7 TX VEE
6 TX VCC
RX VEE 1
RX VCC 2
SD 3
RXD - 4
RXD + 5
RXD - 9
RXD + 10
7 TX VCC
2 x 10
2 x 6
2 x 5
Figure 5
Pin Description
RS pin - The RS Rate Select: is not connected.
LF pin - The LF pin (Laser Fault) is a TTL output of the Laser Driver Supervisor Circuit.
A Logic “1” level can be measured in case of a laser fault. It will not show a fault
if the laser is being disabled using the TxDis input, since this is not a fault
condition.
EMI-Recommendation
To avoid electromagnetic radiation exceeding the required limits please take note of the
following recommendations.
When Gigabit switching components are found on a PCB (multiplexers, clock recoveries
etc.) any opening of the chassis may produce radiation also at chassis slots other than
that of the device itself. Thus every mechanical opening or aperture should be as small
as possible.
On the board itself every data connection should be an impedance matched line (e.g.
strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should
be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched
Data Sheet
11
2002-03-21
V23818-M305-L57
Application Notes
line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In
DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows:
For 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data
and Datanot. Please consider whether there is an internal termination inside an IC or a
transceiver.
In certain cases signal GND is the most harmful source of radiation. Connecting chassis
GND and signal GND at the plate/ bezel/ chassis rear e.g. by means of a fiber optic
transceiver may result in a large amount of radiation. Even a capacitive coupling
between signal GND and chassis may be harmful if it is too close to an opening or an
aperture.
If a separation of signal GND and chassis GND is not possible, it is strongly
recommended to provide a proper contact between signal GND and chassis GND at
every location where possible. This concept is designed to avoid hotspots. Hotspots are
places of highest radiation which could be generated if only a few connections between
signal and chassis GND exist. Compensation currents would concentrate at these
connections, causing radiation.
By use of Gigabit switching components in a design, the return path of the RF current
must also be considered. Thus a split GND plane of Tx and Rx portion may result in
severe EMI problems.
A recommendation is to connect the housing leads to signal GND. However, in certain
applications it may improve EMI performance by connecting them to chassis GND.
The cutout should be sized so that all contact springs make good contact with the face
plate.
Please consider that the PCB may behave like a waveguide. With an εr of 4, the
wavelength of the harmonics inside the PCB will be half of that in free space. In this
scenario even the smallest PCBs may have unexpected resonances.
*)
(13.97)
.550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
Figure 6
Transceiver Pitch
Data Sheet
12
2002-03-21
V23818-M305-L57
Application Notes
Multimode 850 nm Fibre Channel 2x5 Transceiver, AC/AC TTL
VCC SerDes
3.3 V
7
9
VEEt
TD+
VCC
Tx+
ECL/PECL
Driver
VCSEL
Driver
100 Ω
10
TD−
Tx−
8
6
TxDis
VCCt
L1
L2
VCC
3.3 V
Serializer/
Deserializer
Infineon Transceiver
V23818-M305-L57
C1
2
3
VCCr
C3
Gigabit
Transceiver
Chip
C2
Signal
Detect
SD
TTL level
SD to upper level
Limiting
Pre-
RD−
RD+
VEEr
4
5
1
RD−
Amplifier
Amp
Receiver
PLL etc.
RD+
C1/2/3 = 4.7 µF
L1/2 = 1 µH
R1/2 = Depends on SerDes chip used
R3/4 = Depends on SerDes chip used
R7/8 = Biasing (depends on SerDes chip)
Place R1/2/3/4/7/8 close to SerDes chip
Place R5/6 close to Infineon transceiver
Figure 7
Values of R1/2/3/4 may vary as long as proper 50 Ω termination to VEE or 100 Ω
differential is provided. The power supply filtering is required for good EMI performance.
Use short tracks from the inductor L1/L2 to the module VCCRx/VCCTx.
Data Sheet
13
2002-03-21
V23818-M305-L57
Package Outlines
Package Outlines
a) recommended bezel position
Drawing shown is with collar
Dimensions in mm [inches]
Figure 8
Data Sheet
14
2002-03-21
V23818-M305-L57
Revision History:
2002-03-21
DS0
Previous Version:
Page
Subjects (major changes since last revision)
Document’s layout has been changed: 2002-Aug.
For questions on technology, delivery and prices please contact the Infineon
Technologies Offices in Germany or the Infineon Technologies Companies and
Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2002-03-21
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81541 München, Germany
© Infineon Technologies AG 2002.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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