HI5808 [INTERSIL]

12-Bit, 10 MSPS A/D Converter; 12位, 10 MSPS A / D转换器
HI5808
型号: HI5808
厂家: Intersil    Intersil
描述:

12-Bit, 10 MSPS A/D Converter
12位, 10 MSPS A / D转换器

转换器
文件: 总12页 (文件大小:117K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HI5808  
Data Sheet  
February 1999  
File Number 4233.4  
12-Bit, 10 MSPS A/D Converter  
Features  
The HI5808 is a monolithic, 12-bit, Analog-to-Digital  
Converter fabricated in Intersil’s HBC10 BiCMOS process. It  
is designed for high speed, high resolution applications  
where wide bandwidth and low power consumption are  
essential.  
• Sampling Rate . . . . . . . . . . . . . . . . . . . . . . . . . . 10 MSPS  
• Low Power  
• Internal Sample and Hold  
• Fully Differential Architecture  
The HI5808 is designed in a fully differential pipelined  
architecture with a front end differential-in-differential-out  
sample-and-hold (S/H). The HI5808 has excellent dynamic  
performance while consuming 325mW power at 10 MSPS.  
• Full Power Input Bandwidth . . . . . . . . . . . . . . . . . 100MHz  
• Low Distortion  
• Internal Voltage Reference  
The 100MHz full power input bandwidth is ideal for  
communication systems and document scanner  
applications. Data output latches are provided which present  
valid data to the output bus with a latency of 3 clock cycles.  
The digital outputs have a separate supply pin which can be  
powered from a 3V to 5V supply.  
• TTL/CMOS Compatible Digital I/O  
• Digital Outputs . . . . . . . . . . . . . . . . . . . . . . . . . 5V to 3.0V  
Applications  
• Digital Communication Systems  
• Undersampling Digital IF  
• Document Scanners  
Ordering Information  
PART  
NUMBER  
SAMPLE  
RATE  
TEMP.  
PKG.  
NO.  
o
RANGE ( C)  
-40 to 85  
25  
PACKAGE  
28 Ld SOIC  
• Additional Reference Documents  
- AN9214 Using Intersil High Speed A/D Converters  
- AN9724 Using the HI5808EVAL1 Evaluation Board  
HI5808BIB  
10 MSPS  
M28.3  
HI5808EVAL1  
Evaluation Board  
Pinout  
HI5808  
(SOIC)  
TOP VIEW  
CLK  
D0  
28  
1
2
DV  
D
D1  
D2  
27  
26  
CC1  
3
GND1  
DV  
25 D3  
D4  
24  
4
CC1  
D
5
GND1  
AV  
A
6
23 D5  
22 DV  
CC  
7
GND  
CC2  
V
+
21  
20  
19  
18  
17  
16  
15  
D
GND2  
8
IN  
V
-
D6  
9
IN  
V
D7  
10  
11  
12  
13  
14  
DC  
V
D8  
ROUT  
V
D9  
RIN  
D10  
D11  
A
GND  
AV  
CC  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999  
117  
HI5808  
Functional Block Diagram  
V
V
BIAS  
DC  
CLOCK  
REF  
CLK  
-
IN  
V
+
IN  
V
V
ROUT  
RIN  
S/H  
STAGE 1  
DV  
CC2  
4-BIT  
FLASH  
4-BIT  
DAC  
+
-
D11 (MSB)  
D10  
D9  
X8  
D8  
D7  
STAGE 3  
D6  
D5  
D4  
4-BIT  
FLASH  
4-BIT  
DAC  
D3  
+
D2  
-
D1  
X8  
D0 (LSB)  
STAGE 4  
4-BIT  
FLASH  
D
GND2  
AV  
CC  
A
DV  
D
GND1  
GND  
CC1  
Typical Applications Schematic  
(LSB) (28) D0  
(27) D1  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
D9  
(26) D2  
(11)  
V
V
ROUT  
(25) D3  
(12)  
RIN  
(24) D4  
A
(7)  
GND  
A
D
BNC  
(23) D5  
(20) D6  
(19) D7  
(18) D8  
(17) D9  
(16) D10  
GND  
GND  
A
(13)  
GND  
D
D
D
(3)  
GND1  
GND1  
GND2  
(5)  
(21)  
D10  
D11  
(MSB) (15) D11  
V
+
-
V
V
V
+ (8) (4) DV  
CC1  
IN  
IN  
(10)  
(2) DV  
DC  
CC1  
- (9) (22) DV  
IN  
V
+5V  
+5V  
CC2  
IN  
+
10µF  
0.1µF  
10µF AND 0.1µF CAPS ARE PLACED  
AS CLOSE TO PART AS POSSIBLE  
CLK (1)  
(6) AV  
CLOCK  
CC  
(14) AV  
HI5808  
CC  
+
0.1µF  
10µF  
118  
HI5808  
Absolute Maximum Ratings  
Thermal Information  
o
Supply Voltage, AV  
CC  
or DV  
to A  
GND  
or D  
. . . . . . . . . +6.0V  
GND  
Thermal Resistance (Typical, Note 1)  
θJA ( C/W)  
CC  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V  
D
to A  
GND  
GND  
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
70  
o
Digital I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .D  
Analog I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A  
to DV  
to AV  
GND  
GND  
CC  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150 C  
o
o
CC  
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C  
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . .300 C  
o
Operating Conditions  
(SOIC - Lead Tips Only)  
o
o
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
Electrical Specifications AV = DV  
= DV  
CC2  
= +5V, f = 10 MSPS at 50% Duty Cycle, V = 3.5V, C = 10pF,  
RIN L  
CC  
CC1  
S
o
o
o
T = -40 C to 85 C, Differential Analog Input, Typical Values are Test Results at 25 C,  
A
Unless Otherwise Specified  
HI5808BIB  
o
o
-40 C TO 85 C  
TYP  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNITS  
ACCURACY  
Resolution  
12  
-
-
-
Bits  
LSB  
LSB  
Integral Linearity Error, INL  
f
f
= DC  
±1  
±2  
±1  
IN  
Differential Linearity Error, DNL  
(Guaranteed No Missing Codes)  
= DC  
-
±0.5  
IN  
Offset Error, V  
OS  
f
f
= DC  
= DC  
-
-
19  
32  
-
-
LSB  
LSB  
IN  
Full Scale Error, FSE  
IN  
DYNAMIC CHARACTERISTICS  
Minimum Conversion Rate  
Maximum Conversion Rate  
Effective Number of Bits, ENOB  
No Missing Codes  
No Missing Codes  
-
10  
10.0  
-
0.5  
-
-
-
-
-
MSPS  
MSPS  
Bits  
f
f
= 1MHz  
= 1MHz  
10.8  
66.5  
IN  
Signal to Noise and Distortion Ratio, SINAD  
RMS Signal  
dB  
IN  
-------------------------------------------------------------  
=
RMS Noise + Distortion  
Signal to Noise Ratio, SNR  
RMS Signal  
f
= 1MHz  
-
67.3  
-
-
dB  
IN  
-------------------------------  
=
RMS Noise  
Total Harmonic Distortion, THD  
2nd Harmonic Distortion  
3rd Harmonic Distortion  
f
f
f
f
f
= 1MHz  
= 1MHz  
= 1MHz  
= 1MHz  
-
-
-
-
-
-
-
-75  
-80  
-77  
77  
-65  
1
dBc  
dBc  
IN  
IN  
IN  
IN  
-
-
-
-
-
dBc  
Spurious Free Dynamic Range, SFDR  
Intermodulation Distortion, IMD  
Transient Response  
dBc  
= 1MHz, f = 1.02MHz  
dBc  
1
2
Cycle  
Cycle  
Over-Voltage Recovery  
0.2V Overdrive  
2
ANALOG INPUT  
Maximum Peak-to-Peak Differential Analog Input Range (V + -  
IN  
-
±2.0  
-
V
V
-)  
IN  
Maximum Peak-to-Peak Single-Ended Analog Input Range  
Analog Input Resistance, R  
-
1
4.0  
-
-
V
(Notes 2, 3)  
(Note 3)  
-
MΩ  
pF  
µA  
µA  
IN  
Analog Input Capacitance, C  
-
10  
-
-
+10  
-
IN  
Analog Input Bias Current, I + or I -  
-10  
-
B
B
Differential Analog Input Bias Current  
= (I + - I -)  
±0.5  
I
B DIFF  
B
B
Full Power Input Bandwidth, FPBW  
-
100  
-
MHz  
119  
HI5808  
Electrical Specifications AV = DV  
= DV  
CC2  
= +5V, f = 10 MSPS at 50% Duty Cycle, V  
= 3.5V, C = 10pF,  
RIN L  
CC  
CC1  
S
o
o
o
T = -40 C to 85 C, Differential Analog Input, Typical Values are Test Results at 25 C,  
A
Unless Otherwise Specified (Continued)  
HI5808BIB  
o
o
-40 C TO 85 C  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Analog Input Common Mode Voltage Range (V + + V -)/2  
Differential Mode (Note 2)  
1
2.3  
4
V
IN IN  
INTERNAL VOLTAGE REFERENCE  
Reference Output Voltage, V  
Reference Output Current  
(Loaded)  
-
-
-
3.5  
-
-
1
-
V
ROUT  
mA  
o
Reference Temperature Coefficient  
50  
ppm/ C  
REFERENCE VOLTAGE INPUT  
Reference Voltage Input, V  
-
-
-
3.5  
7.8  
-
-
-
V
RIN  
Total Reference Resistance, R  
Reference Current  
kΩ  
µA  
L
450  
DC BIAS VOLTAGE  
DC Bias Voltage Output, V  
DC  
-
-
2.3  
-
-
V
Max Output Current (Not To Exceed)  
1
mA  
DIGITAL INPUTS (CLK)  
Input Logic High Voltage, V  
IH  
2.0  
-
-
-
V
Input Logic Low Voltage, V  
-
-
-
-
0.8  
10.0  
10.0  
-
V
IL  
Input Logic High Current, I  
V
V
= 5V  
= 0V  
-
µA  
µA  
pF  
IH  
CLK  
CLK  
Input Logic Low Current, I  
-
IL  
Input Capacitance, C  
IN  
7
DIGITAL OUTPUTS (D0-D11)  
Output Logic Sink Current, I  
V
= 0.4V (Note 2)  
1.6  
-
1.6  
-
-
-
-
-
-
mA  
mA  
mA  
mA  
pF  
OL  
O
DV  
CC3  
= 3.0V, V = 0.4V  
-
O
Output Logic Source Current, I  
V
= 2.4V (Note 2)  
-0.2  
OH  
O
DV  
CC3  
= 3.0V, V = 2.4V  
-
-
-0.2  
5
O
Output Capacitance, C  
OUT  
TIMING CHARACTERISTICS  
Aperture Delay, t  
-
-
5
5
-
-
ns  
ps (RMS)  
ns  
AP  
Aperture Jitter, t  
AJ  
Data Output Delay, t  
-
8
-
OD  
Data Output Hold, t  
-
8
-
ns  
H
Data Latency, t  
For a Valid Sample (Note 2)  
10 MSPS Clock  
-
-
3
Cycles  
ns  
LAT  
Clock Pulse Width (Low)  
Clock Pulse Width (High)  
45  
45  
50  
50  
55  
55  
10 MSPS Clock  
ns  
POWER SUPPLY CHARACTERISTICS  
Total Supply Current, I  
V
V
V
V
V
+ - V - = 2V  
IN  
-
-
-
-
-
-
-
65  
46  
17  
2
73  
mA  
mA  
CC  
IN  
IN  
IN  
IN  
IN  
Analog Supply Current, AI  
+ - V - = 2V  
IN  
-
CC  
Digital Supply Current, DI  
+ - V - = 2V  
IN  
-
mA  
CC1  
Output Supply Current, DI  
Power Dissipation  
+ - V - = 2V  
IN  
-
mA  
CC2  
+ - V - = 2V  
IN  
325  
2
365  
mW  
LSB  
LSB  
Offset Error PSRR, V  
OS  
AV  
or DV  
= 5V ±5%  
= 5V ±5%  
-
-
CC  
CC  
CC  
CC  
Gain Error PSRR, FSE  
AV  
or DV  
30  
NOTES:  
2. Parameter guaranteed by design or characterization and not production tested.  
3. With the clock off (clock low, hold mode).  
120  
HI5808  
Timing Waveforms  
ANALOG  
INPUT  
CLOCK  
INPUT  
S
H
S
H
S
H
S
H
S
H
S
H
S
H
S
H
N + 6  
N - 1  
N - 1  
N
N
N + 1  
N + 1  
N + 2  
N + 2  
N + 3  
N + 3  
N + 4  
N + 4  
N + 5  
N + 5  
N + 6  
INPUT  
S/H  
1ST  
STAGE  
B
B
B
B
B
B
B
1, N + 5  
1, N - 1  
1, N  
1, N + 1  
1, N + 2  
1, N + 3  
1, N + 4  
2ND  
STAGE  
B
B
B
B
B
B
B
2, N - 2  
2, N - 1  
2, N  
2, N + 1  
2, N + 2  
2, N + 3  
2, N + 4  
3RD  
STAGE  
B
B
B
B
B
B
B
3, N + 4  
3, N - 2  
3, N - 1  
3, N  
3, N + 1  
3, N + 2  
3, N + 3  
4TH  
STAGE  
B
B
B
B
B
B
B
4, N + 3  
4, N - 3  
4, N - 2  
4, N - 1  
4, N  
4, N + 1  
4, N + 2  
DATA  
OUTPUT  
D
D
D
D
D
D
D
N + 3  
N - 3  
N - 2  
N - 1  
N
N + 1  
N + 2  
t
LAT  
NOTES:  
4. S : N-th sampling period.  
N
5. H : N-th holding period.  
N
6. B  
: M-th stage digital output corresponding to N-th sampled input.  
M, N  
7. D : Final data output corresponding to N-th sampled input.  
N
FIGURE 1. INTERNAL CIRCUIT TIMING  
ANALOG  
INPUT  
t
AP  
t
AJ  
CLOCK  
INPUT  
1.5V  
1.5V  
t
OD  
t
H
2.0V  
0.8V  
DATA  
DATA N - 1  
DATA N  
OUTPUT  
FIGURE 2. INPUT-TO-OUTPUT TIMING  
121  
HI5808  
Typical Performance Curves  
11  
70  
f
= 10 MSPS  
S
f
= 10 MSPS  
S
o
10  
9
TEMPERATURE = 25 C  
o
TEMPERATURE = 25 C  
60  
50  
40  
30  
8
7
6
5
10  
INPUT FREQUENCY (MHz)  
1
100  
10  
INPUT FREQUENCY (MHz)  
1
100  
FIGURE 3. EFFECTIVE NUMBER OF BITS (ENOB) vs INPUT  
FREQUENCY  
FIGURE 4. SIGNAL TO NOISE AND DISTORTION (SINAD) vs  
INPUT FREQUENCY  
70  
-40  
f
= 10 MSPS  
f
= 10 MSPS  
S
S
o
o
TEMPERATURE = 25 C  
TEMPERATURE = 25 C  
60  
50  
40  
30  
-50  
-60  
-70  
-80  
10  
INPUT FREQUENCY (MHz)  
10  
INPUT FREQUENCY (MHz)  
1
1
100  
100  
FIGURE 5. SIGNAL TO NOISE RATIO (SNR) vs INPUT  
FREQUENCY  
FIGURE 6. TOTAL HARMONIC DISTORTION (THD) vs INPUT  
FREQUENCY  
80  
11  
2MHz  
5MHz  
1MHz  
f
= 10 MSPS  
S
o
10  
9
TEMPERATURE = 25 C  
70  
60  
50  
40  
10MHz  
20MHz  
8
f
= 10 MSPS  
S
o
TEMPERATURE = 25 C  
7
50MHz  
6
5
100MHz  
0.5  
DUTY CYCLE (t  
0.4  
10  
INPUT FREQUENCY (MHz)  
0.6  
1
100  
/t  
CLK-LOW CLK  
)
FIGURE 7. SPURIOUS FREE DYNAMIC RANGE (SFDR) vs  
INPUT FREQUENCY  
FIGURE 8. EFFECTIVE NUMBER OF BITS (ENOB) vs CLOCK  
DUTY CYCLE AND INPUT FREQUENCY  
122  
HI5808  
Typical Performance Curves (Continued)  
11  
3.525  
2MHz  
5MHz  
10MHz  
1MHz  
10  
9
3.515  
3.505  
3.495  
3.485  
3.475  
V
REFNOM  
20MHz  
8
f
= 10 MSPS  
S
V
REFLD  
7
50MHz  
6
5
100MHz  
-40  
-20  
0
20  
40  
o
60  
80  
-40  
-20  
0
20  
40  
60  
80  
o
TEMPERATURE ( C)  
TEMPERATURE ( C)  
FIGURE 9. EFFECTIVE NUMBER OF BITS (ENOB) vs  
TEMPERATURE AND INPUT FREQUENCY  
FIGURE 10. INTERNAL VOLTAGE REFERENCE OUTPUT  
(V ) vs TEMPERATURE AND LOAD  
ROUT  
326  
324  
70  
I
TOT  
60  
50  
40  
30  
20  
10  
0
f
= 10 MSPS  
S
A
ICC  
322  
320  
318  
316  
V
+ = V - = V  
IN  
IN  
DC  
f
= 10 MSPS  
S
V
+ = V - = V  
IN  
IN  
DC  
D
ICC1  
D
ICC2  
-40  
-20  
0
20  
40  
o
60  
80  
-40  
-20  
0
20  
40  
60  
80  
o
TEMPERATURE ( C)  
TEMPERATURE ( C)  
FIGURE 11. POWER DISSIPATION vs TEMPERATURE  
FIGURE 12. POWER SUPPLY CURRENT vs TEMPERATURE  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
0
f
= 1MHz, f = 10 MSPS  
S
IN  
1024  
FREQUENCY BIN  
2048  
FIGURE 13. 4096 POINT FFT SPECTRAL PLOT  
123  
HI5808  
capacitors. In the next clock phase, φ , the two bottom  
plates of the sampling capacitors are connected together  
and the holding capacitors are switched to the op-amp out-  
2
Pin Descriptions  
PIN NO.  
1
NAME  
DESCRIPTION  
Sample Clock Input.  
put nodes. The charge then redistributes between C and  
S
CLK  
C
completing one sample-and-hold cycle. The output is a  
H
fully-differential, sampled-data representation of the analog  
input. The circuit not only performs the sample-and-hold  
function but will also convert a single-ended input to a fully-  
differential output for the converter core. During the sampling  
2
DV  
D
Digital Supply (5.0V).  
Digital Ground.  
CC1  
3
GND1  
4
DV  
Digital Supply (5.0V).  
Digital Ground.  
CC1  
phase, the V pins see only the on-resistance of a switch  
IN  
5
D
GND1  
and C . The relatively small values of these components  
S
result in a typical full power input bandwidth of 100MHz for  
the converter.  
6
AV  
Analog Supply (5.0V).  
Analog Ground.  
CC  
7
A
GND  
φ1  
φ1  
8
V
Positive Analog Input.  
Negative Analog Input.  
DC Bias Voltage Output.  
Reference Voltage Output.  
Reference Voltage Input.  
Analog Ground.  
IN+  
C
H
φ1  
φ2  
φ1  
9
V
IN-  
C
C
S
V
+
IN  
V
+
OUT  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
V
- +  
+ -  
DC  
V
-
OUT  
V
V -  
IN  
ROUT  
S
V
RIN  
C
H
φ1  
φ1  
A
GND  
AV  
CC  
Analog Supply (5.0V).  
Data Bit 11 Output (MSB).  
Data Bit 10 Output.  
Data Bit 9 Output.  
FIGURE 14. ANALOG INPUT SAMPLE-AND-HOLD  
D11  
As illustrated in the functional block diagram and the timing  
diagram in Figure 1, three identical pipeline subconverter  
stages, each containing a four-bit flash converter, a four-bit digi-  
tal-to-analog converter and an amplifier with a voltage gain of 8,  
follow the S/H circuit with the fourth stage being only a 4-bit  
flash converter. Each converter stage in the pipeline will be  
sampling in one phase and amplifying in the other clock phase.  
Each individual sub-converter clock signal is offset by 180  
degrees from the previous stage clock signal, with the result  
that alternate stages in the pipeline will perform the same  
operation.  
D10  
D9  
D8  
D7  
D6  
Data Bit 8 Output.  
Data Bit 7 Output.  
Data Bit 6 Output.  
D
Digital Output Ground.  
Digital Output Supply (3.0V to 5.0V).  
Data Bit 5 Output.  
GND2  
DV  
CC2  
D5  
The digital output of each of the three identical 4-bit  
subconverter stages is a four-bit digital word containing a sup-  
plementary bit to be used by the digital error correction logic.  
The output of each subconverter stage is input to a digital delay  
line which is controlled by the internal sampling clock. The func-  
tion of the digital delay line is to time align the digital outputs of  
the three identical four-bit subconverter stages with the corre-  
sponding output of the fourth stage flash converter before  
applying the sixteen bit result to the digital error correction logic.  
The digital error correction logic uses the supplementary bits to  
correct any error that may exist before generating the final  
twelve bit digital data output of the converter.  
D4  
D3  
D2  
D1  
D0  
Data Bit 4 Output.  
Data Bit 3 Output.  
Data Bit 2 Output.  
Data Bit 1 Output.  
Data Bit 0 Output (LSB).  
Detailed Description  
Theory of Operation  
Because of the pipeline nature of this converter, the digital  
data representing an analog input sample is output to the  
digital data bus on the 3rd cycle of the clock after the analog  
sample is taken. This time delay is specified as the data  
latency. After the data latency time, the digital data  
representing each succeeding analog sample is output on  
the following clock pulse. The digital output data is synchro-  
nized to the external sampling clock with an output latch.  
The output of the digital error correction circuit is available in  
offset binary format (see Table 1, A/D Code Table).  
The HI5808 is a 12-bit fully differential sampling pipeline A/D  
converter with digital error correction. Figure 14 depicts the  
circuit for the front end differential-in-differential-out sample-  
and-hold (S/H). The switches are controlled by an internal  
clock which is a non-overlapping two phase signal, φ and φ ,  
1
2
derived from the master clock. During the sampling phase,  
φ , the input signal is applied to the sampling capacitors,  
1
C . At the same time the holding capacitors, C , are  
S
H
discharged to analog ground. At the falling edge of φ the  
1
input signal is sampled on the bottom plates of the sampling  
124  
HI5808  
TABLE 1. A/D CODE TABLE  
OFFSET BINARY OUTPUT CODE  
DIFFERENTIAL  
INPUT VOLTAGE  
(USING INTERNAL  
REFERENCE)  
MSB  
LSB  
D0  
1
CODE CENTER  
DESCRIPTION  
D11  
1
D10  
1
D9  
1
D8  
1
D7  
1
D6  
1
D5  
1
D4  
1
D3  
1
D2  
1
D1  
1
1
+Full Scale (+FS) - / LSB +1.99976V  
4
1
+FS - 1 / LSB  
4
1.99878V  
732.4µV  
1
1
1
1
1
1
1
1
1
1
1
0
3
+
/
LSB  
1
0
0
0
0
0
0
0
0
0
0
0
4
1
- / LSB  
4
-244.1µV  
-1.99829V  
0
1
1
1
1
1
1
1
1
1
1
1
3
-FS + 1 / LSB  
0
0
0
0
0
0
0
0
0
0
0
1
4
3
-Full Scale (-FS) + / LSB -1.99927V  
0
0
0
0
0
0
0
0
0
0
0
0
4
The voltages listed above represent the ideal center of each offset binary output code shown.  
Internal Reference Generator, V  
ROUT  
and V  
RIN  
The HI5808 has an internal reference generator, therefore, no  
external reference voltage is required. V must be  
A 2.3V DC bias voltage source, V , half way between the  
DC  
top and bottom internal reference voltages, is made avail-  
able to the user to help simplify circuit design when using a  
differential input. This low output impedance voltage source  
is not designed to be a reference but makes an excellent  
bias source and stays within the analog input common mode  
voltage range over temperature.  
ROUT  
when using the internal reference voltage.  
connected to V  
RIN  
The HI5808 can be used with an external reference. The  
converter requires only one external reference voltage con-  
nected to the V  
pin with V  
left open.  
RIN  
ROUT  
The HI5808 is tested with V  
converter, two reference voltages of 1.3V and 3.3V are  
generated for a fully differential input signal range of ±2V.  
equal to 3.5V. Internal to the  
RIN  
The difference between the converter’s two internal voltage  
references is 2V. For the AC coupled differential input, (Figure  
15), if V is a 2V  
sinewave with -V being 180 degrees out  
IN P-P  
IN  
of phase with V , then V + is a 2V  
sinewave riding on a  
and V - is a 2V sinewave  
IN IN P-P  
In order to minimize overall converter noise, it is  
recommended that adequate high frequency decoupling be  
DC bias voltage equal to V  
DC IN P-P  
riding on a DC bias voltage equal to V . Consequently, the  
converter will be at positive full scale, all 1s digital data output  
DC  
provided at the reference voltage input pin, V  
.
RIN  
code, when the V + input is at V  
+1V and the V - input is  
Analog Input, Differential Connection  
IN DC  
IN  
at V  
-1V (V +-V - = 2V). Conversely, the ADC will be  
IN IN  
DC  
The analog input to the HI5808 can be configured in various  
ways depending on the signal source and the required level  
of performance. A fully differential connection (Figure 15) will  
give the best performance for the converter.  
at negative full scale, all 0s digital data output code, when  
the V + input is equal to V -1V and V - is at V +1V  
IN IN DC  
DC  
(V +-V - = -2V). From this, the converter is seen to have  
IN IN  
a peak-to-peak differential analog input voltage range of ±2V.  
The analog input can be DC coupled (Figure 16) as long as  
the inputs are within the analog input common mode voltage  
range (1.0V VDC 4.0V).  
V
V
+
V
IN  
IN  
V
HI5808  
DC  
IN  
V
+
IN  
VDC  
VDC  
R
R
HI5808  
C
-V  
V
IN  
DC  
V -  
IN  
-V  
IN  
FIGURE 15. AC COUPLED DIFFERENTIAL INPUT  
V
-
IN  
Since the HI5808 is powered off a single +5V supply, the  
analog input must be biased so it lies within the analog input  
common mode voltage range of 1.0V to 4.0V. The  
performance of the ADC does not change significantly with  
the value of the analog input common mode voltage.  
FIGURE 16. DC COUPLED DIFFERENTIAL INPUT  
The resistors, R, in Figure 16 are not absolutely necessary  
but may be used as load setting resistors. A capacitor, C,  
connected from V + to V - will help filter any high  
IN IN  
125  
HI5808  
frequency noise on the inputs, also improving performance.  
Values around 20pF are sufficient and can be used on AC  
coupled inputs as well. Note, however, that the value of  
capacitor C chosen must take into account the highest  
frequency component of the analog input signal.  
Digital I/O and Clock Requirements  
The HI5808 provides a standard high-speed interface to  
external TTL/CMOS logic families. The digital CMOS clock  
input has TTL level thresholds. The low input bias current  
allows the HI5808 to be driven by CMOS logic.  
Analog Input, Single-Ended Connection  
The digital CMOS outputs have a separate digital supply. This  
allows the digital outputs to operate from a 3.0V to 5.0V supply.  
When driving CMOS logic, the digital outputs will swing to the  
rails. When driving standard TTL loads, the digital outputs will  
meet standard TTL level requirements even with a 3.0V supply.  
The configuration shown in Figure 17 may be used with a  
single ended AC coupled input. Sufficient headroom must be  
provided such that the input voltage never goes above +5V  
or below A  
.
GND  
In order to ensure rated performance of the HI5808, the duty  
cycle of the clock should be held at 50% ±5%. It must also  
have low jitter and operate at standard TTL levels.  
V
+
V
IN  
IN  
Performance of the HI5808 will only be guaranteed at  
conversion rates above 0.5 MSPS. This ensures proper  
performance of the internal dynamic circuits.  
HI5808  
VDC  
Supply and Ground Considerations  
V
-
IN  
The HI5808 has separate analog and digital supply and  
ground pins to keep digital noise out of the analog signal path.  
The part should be mounted on a board that provides sepa-  
rate low impedance connections for the analog and digital  
supplies and grounds. For best performance, the supplies to  
the HI5808 should be driven by clean, linear regulated sup-  
plies. The board should also have good high frequency  
decoupling capacitors mounted as close as possible to the  
converter. If the part is powered off a single supply then the  
analog supply and ground pins should be isolated by ferrite  
beads from the digital supply and ground pins.  
FIGURE 17. AC COUPLED SINGLE ENDED INPUT  
Again, the difference between the two internal voltage  
references is 2V. If V is a 4V  
sinewave, then V + is a  
IN  
P-P  
sinewave riding on a positive voltage equal to VDC.  
IN  
4V  
P-P  
The converter will be at positive full scale when V + is at  
IN  
VDC + 2V (V + - V - = 2V) and will be at negative full  
IN  
IN  
scale when V + is equal to VDC - 2V (V + - V - = -2V).  
IN IN IN  
In this case, VDC could range between 2V and 3V without  
a significant change in ADC performance. The simplest  
way to produce VDC is to use the V  
of the HI5808.  
bias voltage output  
DC  
Refer to the Application Note AN9214, “Using Intersil High  
Speed A/D Converters” for additional considerations when  
using high speed converters.  
The single ended analog input can be DC coupled (Figure  
18) as long as the input is within the analog input common  
mode voltage range.  
Static Performance Definitions  
V
IN  
Offset Error (V  
OS  
)
V
+
VDC  
IN  
1
The midscale code transition should occur at a level / LSB  
4
R
above half-scale. Offset is defined as the deviation of the  
actual code transition from this point.  
HI5808  
C
Full-Scale Error (FSE)  
The last code transition should occur for an analog input that  
3
VDC  
V
-
IN  
is  
/
LSB below positive full scale with the offset error  
4
removed. Full-scale error is defined as the deviation of the  
actual code transition from this point.  
FIGURE 18. DC COUPLED SINGLE ENDED INPUT  
Differential Linearity Error (DNL)  
The resistor, R, in Figure 18 is not absolutely necessary but  
may be used as a load setting resistor. A capacitor, C, con-  
DNL is the worst case deviation of a code width from the  
ideal value of 1 LSB.  
nected from V + to V - will help filter any high frequency  
IN IN  
noise on the inputs, also improving performance. Values  
around 20pF are sufficient and can be used on AC coupled  
inputs as well. Note, however, that the value of capacitor C  
chosen must take into account the highest frequency  
component of the analog input signal.  
Integral Linearity Error (INL)  
INL is the worst case deviation of a code center from a best  
fit straight line calculated from the measured data.  
Power Supply Rejection Ratio (PSRR)  
A single ended source will give better overall system  
performance if it is first converted to differential before  
driving the HI5808.  
Each of the power supplies are moved plus and minus 5%  
and the shift in the offset and gain error (in LSBs) is noted.  
126  
HI5808  
Dynamic Performance Definitions  
Fast Fourier Transform (FFT) techniques are used to  
evaluate the dynamic performance of the HI5808. A low  
distortion sine wave is applied to the input, it is coherently  
sampled, and the output is stored in RAM. The data is then  
transformed into the frequency domain with an FFT and ana-  
lyzed to evaluate the dynamic performance of the A/D. The  
sine wave input to the part is -0.5dB down from full scale for  
all these tests. SNR and SINAD are quoted in dB. The  
distortion numbers are quoted in dBc (decibels with respect  
to carrier) and DO NOT include any correction factors for  
normalizing to full scale.  
Transient Response  
Transient response is measured by providing a full-scale  
transition to the analog input of the ADC and measuring the  
number of cycles it takes for the output code to settle within  
12-bit accuracy.  
Over-Voltage Recovery  
Over-voltage Recovery is measured by providing a full-scale  
transition to the analog input of the ADC which overdrives  
the input by 200mV, and measuring the number of cycles it  
takes for the output code to settle within 12-bit accuracy.  
Signal-to-Noise Ratio (SNR)  
Full Power Input Bandwidth (FPBW)  
SNR is the measured RMS signal to RMS noise at a  
specified input and sampling frequency. The noise is the  
RMS sum of all of the spectral components except the  
fundamental and the first five harmonics.  
Full power input bandwidth is the analog input frequency at  
which the amplitude of the digitally reconstructed output has  
decreased 3dB below the amplitude of the input sinewave.  
The input sinewave has an amplitude which swings from -f  
S
to +f . The bandwidth given is measured at the specified  
Signal-to-Noise + Distortion Ratio (SINAD)  
S
sampling frequency.  
SINAD is the measured RMS signal to RMS sum of all  
other spectral components below the Nyquist frequency,  
Timing Definitions  
f /2, excluding DC.  
S
Refer to Figure 1, Internal Circuit Timing, and Figure 2,  
Input-To-Output Timing, for these definitions.  
Effective Number Of Bits (ENOB)  
The effective number of bits (ENOB) is calculated from the  
SINAD data by:  
Aperture Delay (t  
)
AP  
Aperture delay is the time delay between the external  
sample command (the falling edge of the clock) and the time  
at which the signal is actually sampled. This delay is due to  
internal clock path propagation delays.  
ENOB = (SINAD + V  
-1.76)/6.02,  
CORR  
where: V  
= 0.5dB.  
adjusts the ENOB for the amount the input is below  
CORR  
V
CORR  
Aperture Jitter (t  
)
AJ  
full scale.  
Aperture Jitter is the RMS variation in the aperture delay due  
to variation of internal clock path delays.  
Total Harmonic Distortion (THD)  
THD is the ratio of the RMS sum of the first 5 harmonic  
components to the RMS value of the fundamental input  
signal.  
Data Hold Time (t )  
H
Data hold time is the time to where the previous data (N - 1)  
is no longer valid.  
2nd and 3rd Harmonic Distortion  
Data Output Delay Time (t  
)
OD  
This is the ratio of the RMS value of the applicable  
harmonic component to the RMS value of the fundamental  
input signal.  
Data output delay time is the time to where the new data (N)  
is valid.  
Data Latency (t  
)
Spurious Free Dynamic Range (SFDR)  
LAT  
After the analog sample is taken, the digital data is output on  
the bus at the third cycle of the clock. This is due to the pipe-  
line nature of the converter where the data has to ripple  
through the stages. This delay is specified as the data  
latency. After the data latency time, the data representing  
each succeeding sample is output at the following clock  
pulse. The digital data lags the analog input sample by 3  
clock cycles.  
SFDR is the ratio of the fundamental RMS amplitude to the  
RMS amplitude of the next largest spur or spectral compo-  
nent in the spectrum below f /2.  
S
Intermodulation Distortion (IMD)  
Nonlinearities in the signal path will tend to generate inter-  
modulation products when two tones, f and f , are present  
1
2
at the inputs. The ratio of the measured signal to the  
distortion terms is calculated. The terms included in the  
calculation are (f + f ), (f - f ), (2f ), (2f ), (2f + f ),  
1
2
1
2
1
2
1
2
(2f - f ), (f + 2f ), (f - 2f ). The ADC is tested with each  
1
2
1
2
1
2
tone 6dB below full scale.  
127  
HI5808  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
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NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
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1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
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TEL: (321) 724-7000  
FAX: (321) 724-7240  
128  

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