ISL22343UFV20Z_技术文档

ISL22343

®

Quad Digitally Controlled Potentiometer (XDCP™)

Data Sheet

March 13, 2008

FN6423.1

2 ®

Low Noise, Low Power, I C Bus, 256 Taps

Features

The ISL22343 integrates four digitally controlled

potentiometers (DCP), control logic and non-volatile memory

on a monolithic CMOS integrated circuit.

• Four potentiometers in one package

• 256 resistor taps

2

• I C serial interface

The digitally controlled potentiometer is implemented with a

combination of resistor elements and CMOS switches. The

position of the wipers are controlled by the user through the

- Three address pins, up to eight devices per bus

• Non-volatile EEPROM storage of wiper position

• 11 General Purpose non-volatile registers

2

I C bus interface. The potentiometer has an associated

volatile Wiper Register (WRi) and a non-volatile Initial Value

Register (IVRi) that can be directly written to and read by the

user. The contents of the WRi control the position of the

corresponding wiper. At power up the device recalls the

contents of the DCP’s IVRi to the correspondent WRi.

• High reliability

- Endurance: 1,000,000 data changes per bit per register

- Register data retention: 50 years @ T ≤ +55°C

• Wiper resistance: 70Ω typical @ 1mA

• Standby current <4µA max

The ISL22343 also has 11 general purpose non-volatile

registers that can be used as storage of lookup table for

multiple wiper position or any other valuable information.

• Shutdown current <4µA max

• Dual power supply

- VCC = 2.25V to 5.5V

- V- = -2.25V to -5.5V

The ISL22343 features a dual supply, that is beneficial for

applications requiring a bipolar range for DCP terminals

between V- and VCC.

• 10kΩ, 50kΩ or 100kΩ total resistance

• Extended industrial temperature range: -40°C to +125°C

• 20 Ld TSSOP or 20 Ld QFN

Each DCP can be used as three-terminal potentiometers or

as two-terminal variable resistors in a wide variety of

applications including control, parameter adjustments, and

signal processing.

• Pb-free (RoHS compliant)

Ordering Information

RESISTANCE

TEMPERATURE

PART NUMBER

(Notes 1, 2)

OPTION

(kΩ)

RANGE

(°C)

PACKAGE

(Pb-free)

PART MARKING

22343 TFVZ

PKG. DWG. #

M20.173

ISL22343TFV20Z

ISL22343TFR20Z

ISL22343UFV20Z

ISL22343UFR20Z

ISL22343WFV20Z

ISL22343WFR20Z

NOTES:

100

50

-40 to +125

20 Ld TSSOP

22343 TFRZ

20 Ld QFN

L20.5x5

M20.173

L20.5x5

M20.173

L20.5x5

22343 UFVZ

22343 UFRZ

22343 WFVZ

22343 WFRZ

20 Ld TSSOP

20 Ld QFN

50

10

20 Ld TSSOP

20 Ld QFN

10

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte

tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J

STD-020.

2. Add “-TK” suffix for tape and reel. Please refer to TB347 for details on reel specifications

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1

1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) and XDCP are registered trademarks of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

ISL22343

Block Diagram

VCC

V-

RH3

RW3

WR3

WR2

SCL

SDA

A0

POWER-UP,

CONTROL

AND

STATUS

LOGIC

RL3

RH2

2

I C

INTERFACE

A1

A2

RW2

RL2

RH1

WR1

WR0

RW1

RL1

RH0

NON-VOLATILE

REGISTERS

RW0

RL0

GND

Pinouts

ISL22343

(20 LEAD TSSOP)

(20 LEAD QFN)

TOP VIEW

1

RW0

RL0

RH3

20

19

RL3

RW3

A2

2

3

4

5

6

7

8

9

20 19 18 17 16

18 RH0

17 V-

RW3

1

2

3

4

5

15

14

13

12

11

V-

A2

SCL

SDA

GND

VCC

A1

SCL

SDA

GND

RW2

RL2

16 VCC

15 A1

14 A0

A0

13 RH1

12

RH1

RL1

RH2 10

11 RW1

6

7

8

9

10

FN6423.1

March 13, 2008

2

ISL22343

Pin Descriptions

TSSOP PIN

QFN PIN

SYMBOL

RH3

RL3

RW3

A2

DESCRIPTION

1

2

19

20

1

“High” terminal of DCP3

“Low” terminal of DCP3

“Wiper” terminal of DCP3

3

2

4

2

Device address input for the I C interface

2

5

3

SCL

SDA

GND

RW2

RL2

RH2

RW1

RL1

RH1

A0

Open drain I C interface clock input

2

6

4

Open drain Serial data I/O for the I C interface

7

5

Device ground pin

8

6

“Wiper” terminal of DCP2

“Low” terminal of DCP2

“High” terminal of DCP2

“Wiper” terminal of DCP1

“Low” terminal of DCP1

“High” terminal of DCP1

9

7

10

11

12

13

14

15

16

17

18

19

20

8

9

10

11

12

13

14

15

16

17

18

EPAD*

2

Device address input for the I C interface

2

A1

Device address input for the I C interface

VCC

V-

Positive power supply pin

Negative power supply pin

“High” terminal of DCP0

RH0

RL0

RW0

“Low” terminal of DCP0

“Wiper” terminal of DCP0

Exposed Die Pad internally connected to V-

NOTE: *PCB thermal land for QFN EPAD should be connected to V- plane or left floating. For more information refer to

http://www.intersil.com/data/tb/TB389.pdf

FN6423.1

March 13, 2008

3

ISL22343

Absolute Maximum Ratings

Thermal Information

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Voltage at any Digital Interface Pin

Thermal Resistance (Typical, Note 3)

θ

(°C/W)

θ

(°C/W)

JC

JA

20 Lead TSSOP. . . . . . . . . . . . . . . . . . . . . . . .95

20 Lead QFN (Note 4) . . . . . . . . . . . . . . . . . . .32

Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

N/A

3.0

with Respect to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to V +0.3

CC

V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +6V

CC

V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to 0.3V

Voltage at any DCP Pin with

respect to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V- to V

CC

I

(10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA

W

Recommended Operating Conditions

Latchup . . . . . . . . . . . . . . . . . . . . . . . . . Class II, Level A at +125°C

Temperature Range (Full Industrial) . . . . . . . . . . . .-40°C to +125°C

Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mW

ESD

Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5kV

Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .400V

V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.25V to 5.5V

CC

V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-2.25V to -5.5V

Max Wiper Current Iw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±3.0mA

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

NOTE:

3. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

JA

4. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.

JC

Analog Specifications Over recommended operating conditions unless otherwise stated.

MIN

TYP

MAX

SYMBOL

PARAMETER

RHi to RLi Resistance

TEST CONDITIONS

(Note 21) (Note 5) (Note 21)

UNIT

kΩ

R

W option

U option

T option

10

50

TOTAL

kΩ

100

kΩ

RHi to RLi Resistance tolerance

-20

V-

+20

%

End-to-End Temperature Coefficient

W option

±85

±45

ppm/°C

V

U, T option

V

, V

RHi RLi

DCP Terminal Voltage

Wiper Resistance

V

and V to GND

RL

V

RH

CC

R

RH - floating, V = V-, force Iw current to

RL

the wiper, I = (V

70

10/10/25

0.1

250

Ω

W

- V )/R

W

CC

RL TOTAL

C /C /C

W

(Note 19)

Potentiometer Capacitance

Leakage on DCP pins

See Macro Model below.

pF

µA

H

L

I

Voltage at pin from V- to V

@ RHi; measured at RWi, unloaded)

W option

1

LkgDCP

CC

VOLTAGE DIVIDER MODE (V- @ RLi; V

CC

INL

Integral Non-linearity

-1.5

-1.0

-0.5

±0.5

±0.2

1.5

1.0

0.5

LSB

(Note 6)

(Note 10)

U, T option

LSB

(Note 6)

DNL

Differential Non-linearity

Monotonic over all tap positions,

W option

±0.4

LSB

(Note 6)

(Note 9)

U, T option

±0.15

LSB

(Note 6)

ZSerror

(Note 7)

Zero-scale Error

Full-scale Error

W option

0

1

5

2

0

LSB

(Note 6)

U, T option

W option

0.1

-2

FSerror

(Note 8)

-5

-2

LSB

(Note 6)

U, T option

-0.2

FN6423.1

March 13, 2008

4

ISL22343

Analog Specifications Over recommended operating conditions unless otherwise stated. (Continued)

MIN

TYP

MAX

SYMBOL

PARAMETER

TEST CONDITIONS

(Note 21) (Note 5) (Note 21)

UNIT

V

DCP-to-DCP Matching

Wipers at the same tap position, the same

voltage at all RH terminals and the same

voltage at all RL terminals

-2

2

LSB

(Note 6)

MATCH

(Note 11)

TC (Note 12) Ratiometric Temperature Coefficient

DCP register set to 80 hex

±4

1000

250

120

ppm/°C

kHz

V

f

-3dB Cut Off Frequency

Wiper at midpoint (80hex) W option (10k)

Wiper at midpoint (80hex) U option (50k)

Wiper at midpoint (80hex) T option (100k)

cutoff

(Note 19)

kHz

RESISTOR MODE (Measurements between RWi and RLi with RHi not connected, or between RWi and RHi with RLi not connected)

RINL

(Note 16)

Integral Non-linearity

Differential Non-linearity

Offset

W option

-3

±1

±0.3

±0.5

±0.04

1

3

MI

(Note 13)

U, T option

W option

-1

1

MI

(Note 13)

RDNL

(Note 15)

-1.5

-0.5

0

1.5

0.5

5

MI

(Note 13)

U, T option

W option

MI

(Note 13)

Roffset

MI

(Note 14)

(Note 13)

U, T option

0

0.25

2

MI

(Note 13)

R

DCP-to-DCP matching

Wipers at the same tap position with the

same terminal voltages

-3

3

MI

(Note 13)

MATCH

(Note 17)

TC

Resistance Temperature Coefficient

DCP register set between 32 hex and FFhex

±40

ppm/°C

R

(Notes 18, 19)

Operating Specifications Over the recommended operating conditions unless otherwise specified.

MIN

TYP

MAX

SYMBOL

PARAMETER

TEST CONDITIONS

(Note 21) (Note 5) (Note 21)

UNIT

2

I

V

Supply Current

V = 5.5V, f

CC SCL

Volatile Write states only)

= 400kHz; (for I C Active, Read and

0.006

0.003

-0.012

-0.045

1.0

0.5

mA

CC1

CC

(Volatile Write/Read)

2

V

= 2.25V, f = 400kHz; (for I C Active, Read and

0.25

mA

CC

SCL

Volatile Write states only)

2

I

V- Supply Current (Volatile V- = -5.5V, V

Write/Read)

= 5.5V, f

= 400kHz; (for I C Active,

Read and Volatile Write states only)

-0.5

V-1

CC

SCL

2

V- = -2.25V, V = 2.25V, f = 400kHz; (for I C

Active, Read and Volatile Write states only)

-0.25

CC

SCL

2

I

V

Supply Current (Non-

V = 5.5V, V- = 5.5V, f

CC SCL

= 400kHz; (for I C Active,

Read and Non-volatile Write states only)

2.0

1.0

CC2

CC

volatile Write/Read)

2

V

= 2.25V, V- = -2.25V, f = 400kHz; (for I C

Active, Read and Non-volatile Write states only)

0.3

CC

SCL

2

I

V- Supply Current

V- = -5.5V, V

= 5.5V, f = 400kHz; (for I C Active,

SCL

(Non-Volatile Write/Read) Read and Non-volatile Write states only)

-2.0

-1.0

-1.2

V-2

CC

2

V- Supply Current V- = -2.25V, V = 2.25V, f = 400kHz; (for I C

-0.4

CC SCL

(Non-Volatile Write/Read) Active, Read and Non-volatile Write states only)

FN6423.1

March 13, 2008

5

ISL22343

Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued)

MIN

TYP

MAX

SYMBOL

PARAMETER

TEST CONDITIONS

(Note 21) (Note 5) (Note 21)

UNIT

2

I

V

Current (Standby)

V

= +5.5V, V- = -5.5V @ +85°C, I C interface in

0.5

1.0

2.0

4.0

1.0

2.0

µA

SB

CC

standby state

2

V

= +5.5V, V- = -5.5V @ +125°C, I C interface in

µA

µs

CC

standby state

2

V

= +2.25V, V- = -2.25V @ +85°C, I C interface in

0.2

CC

standby state

2

V

= +2.25V, V- = -2.25V @ +125°C, I C interface in

0.5

CC

standby state

2

I

V- Current (Standby)

V- = -5.5V, V

CC

standby state

= +5.5V @ +85°C, I C interface in

-4.0

-5.0

-2.0

-3.0

-0.7

-1.5

-0.3

-0.4

0.5

V-SB

2

V- = -5.5V, V

standby state

= +5.5V @ +125°C, I C interface in

CC

2

V- = -2.25V, V

standby state

= +2.25V @ +85°C, I C interface in

CC

2

V- = -2.25V, V

standby state

= +2.25V @ +125°C, I C interface in

2

I

V

Current (Shutdown)

V

= +5.5V, V- = -5.5V @ +85°C, I C interface in

2.0

4.0

1.0

2.0

SD

CC

standby state

2

V

= +5.5V, V- = -5.5V @ +125°C, I C interface in

1.0

CC

standby state

2

V

= +2.25V, V- = -2.25V @ +85°C, I C interface in

0.2

CC

standby state

2

V

= +2.25V, V- = -2.25V @ +125°C, I C interface in

0.5

CC

standby state

2

I

V- Current (Shutdown)

V- = -5.5V, V

= +5.5V @ +85°C, I C interface in

-4.0

-5.0

-2.0

-3.0

-1

-0.7

-1.5

-0.3

-0.4

V-SD

CC

standby state

2

V- = -5.5V, V

CC

standby state

= +5.5V @ +125°C, I C interface in

2

V- = -2.25V, V

standby state

= +2.25V @ +85°C, I C interface in

CC

2

V- = -2.25V, V

standby state

= +2.25V @ +125°C, I C interface in

I

Leakage Current, at Pins Voltage at pin from GND to V

A0, A1, A2, SDA, and SCL

1

LkgDig

CC

t

DCP Wiper Response

SCL falling edge of last bit of DCP data byte to wiper

new position

1.5

WRT

(Note 19) Time

t

DCP Recall Time from

SCL falling edge of last bit of ACR data byte to wiper

stored position and RH connection

µs

ShdnRec

(Note 19) Shutdown Mode

Vpor

Power-on Recall Voltage

Ramp Rate

Minimum V

at which memory recall occurs

1.9

0.2

2.1

5

V

CC

VCCRamp

V

V/ms

ms

CC

t

Power-up Delay

V

above Vpor, to DCP Initial Value Register recall

CC

D

2

completed, and I C Interface in standby state

EEPROM SPECIFICATION

EEPROM Endurance

1,000,000

50

Cycles

Years

ms

EEPROM Retention

Temperature T ≤ +55°C

t

Non-volatile Write Cycle

12

20

WC

(Note 20) Time

FN6423.1

March 13, 2008

6

ISL22343

Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued)

MIN

TYP

MAX

SYMBOL

PARAMETER

TEST CONDITIONS

(Note 21) (Note 5) (Note 21)

UNIT

SERIAL INTERFACE SPECS

V

A1, A0, A2, SDA, and SCL

Input Buffer LOW Voltage

0.3*V

V

IL

CC

V

A1, A0, A2, SDA, and SCL

Input Buffer HIGH Voltage

0.7*V

CC

IH

Hysteresis SDA and SCL Input Buffer

(Note 19) Hysteresis

0.05*V

0

V

CC

V

SDA Output Buffer LOW

0.4

10

V

OL

(Note 19) Voltage, Sinking 4mA

Cpin

A1, A0, A2, SDA, and SCL

pF

(Note 19) Pin Capacitance

f

SCL Frequency

400

50

kHz

ns

SCL

t

Pulse Width Suppression Any pulse narrower than the max spec is suppressed

sp

Time at SDA and SCL

Inputs

t

SCL Falling Edge to SDA SCL falling edge crossing 30% of V , until SDA exits

CC

900

ns

AA

(Note 19) Output Data Valid

the 30% to 70% of V

window

CC

t

Time the Bus Must be Free SDA crossing 70% of V

during a STOP condition, to

CC

1300

BUF

(Note 19) Before the Start of a New SDA crossing 70% of V

during the following START

CC

Transmission

condition

t

Clock LOW Time

Clock HIGH Time

Measured at the 30% of V

Measured at the 70% of V

crossing

1300

600

ns

LOW

CC

t

HIGH

t

START Condition Setup

Time

SCL rising edge to SDA falling edge; both crossing 70%

of V

600

SU:STA

HD:STA

SU:DAT

HD:DAT

SU:STO

HD:STO

CC

From SDA falling edge crossing 30% of V

t

START Condition Hold

Time

to SCL

600

100

0

ns

CC

falling edge crossing 70% of V

CC

Input Data Setup Time

From SDA exiting the 30% to 70% of V

SCL rising edge crossing 30% of V

window, to

CC

t

Input Data Hold Time

From SCL rising edge crossing 70% of V

entering the 30% to 70% of V

to SDA

CC

window

CC

t

STOP Condition Setup

Time

From SCL rising edge crossing 70% of V , to SDA

rising edge crossing 30% of V

600

1300

CC

t

STOP Condition Hold

From SDA rising edge to SCL falling edge; both

Time for Read, or Volatile crossing 70% of V

Only Write

CC

t

Output Data Hold Time

SDA and SCL Rise Time

SDA and SCL Fall Time

From SCL falling edge crossing 30% of V , until SDA

CC

0

ns

DH

(Note 19)

enters the 30% to 70% of V

window

CC

t

From 30% to 70% of V

From 70% to 30% of V

20 +

0.1*Cb

250

R

CC

(Note 19)

t

20 +

F

(Note 19)

0.1*Cb

FN6423.1

March 13, 2008

7

ISL22343

Operating Specifications Over the recommended operating conditions unless otherwise specified. (Continued)

MIN

TYP

MAX

SYMBOL

PARAMETER

TEST CONDITIONS

(Note 21) (Note 5) (Note 21)

UNIT

Cb

CapacitiveLoadingofSDA Total on-chip and off-chip

10

1

400

pF

(Note 19) or SCL

Rpu

SDA and SCL Bus Pull-up Maximum is determined by t and t

kΩ

R

F

(Note 19) Resistor Off-chip

For Cb = 400pF, max is about 2~2.5kΩ

For Cb = 40pF, max is about 15~20kΩ

t

A1 and A0 Setup Time

A1 and A0 Hold Time

Before START condition

After STOP condition

600

ns

SU:A

t

HD:A

NOTES:

5. Typical values are for T = +25°C and 3.3V supply voltage.

A

6. LSB: [V(R

)

– V(R ) ]/255. V(R

)

and V(R ) are V(R ) for the DCP register set to FF hex and 00 hex respectively. LSB is the

W 0

W 255

W 0 W 255

W

incremental voltage when changing from one tap to an adjacent tap.

7. ZS error = V(RW) /LSB.

0

8. FS error = [V(RW)

255

– V ]/LSB.

CC

9. DNL = [V(RW) – V(RW) ]/LSB-1, for i = 1 to 255. i is the DCP register setting.

i-1

i

10. INL = [V(RW) – i • LSB – V(RW) ]/LSB for i = 1 to 255.

i

0

11. V

= [V(RWx)i -V(RWy)i]/LSB, for i = 0 to 255, x = 0 to 3, y = 0 to 3.

MATCH

Max(V(RW) ) – Min(V(RW) )

6

10

i

12.

for i = 16 to 240 decimal, T = -40°C to +125°C. Max( ) is the maximum value of the wiper

[Max(V(RW) ) + Min(V(RW) )] ⁄ 2 165°C voltage and Min ( ) is the minimum value of the wiper voltage over the temperature range.

--------------------------------------------------------------------------------------------- ----------------

TC

=

×

V

+

i

13. MI = |RW

– RW |/255. MI is a minimum increment. RW

and RW are the measured resistances for the DCP register set to FF hex and

255 0

255

0

00 hex respectively.

14. Roffset = RW /MI, when measuring between RW and RL.

0

Roffset = RW

/MI, when measuring between RW and RH.

255

15. RDNL = (RW – RW )/MI -1, for i = 16 to 255.

i

i-1

16. RINL = [RW – (MI • i) – RW ]/MI, for i = 16 to 255.

i

0

17. R

18.

= [(Rx)i -(Ry)i]/MI, for i = 0 to 255, x = 0 to 3, y = 0 to 3.

6

MATCH

for i = 16 to 240, T = -40°C to +125°C. Max( ) is the maximum value of the resistance and Min ( ) is

the minimum value of the resistance over the temperature range.

[Max(Ri) – Min(Ri)]

10

--------------------------------------------------------------- ----------------

TC

=

×

R

165°C

[Max(Ri) + Min(Ri)] ⁄ 2 +

19. This parameter is not 100% tested.

2

20. t

is the time from a valid STOP condition at the end of a Write sequence of I C serial interface, to the end of the self-timed internal non-

WC

volatile write cycle.

21. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.

FN6423.1

March 13, 2008

8

ISL22343

DCP Macro Model

R

TOTAL

RH

RL

C

L

C

H

C

W

10pF

25pF

RW

SDA vs SCL Timing

t

sp

t

R

F

HIGH

LOW

SCL

t

SU:DAT

t

SU:STO

SU:STA

HD:DAT

t

HD:STA

SDA

(INPUT TIMING)

t

BUF

AA

DH

SDA

(OUTPUT TIMING)

A2, A1 and A0 Pin Timing

STOP

START

SCL

CLK 1

SDA

t

HD:A

SU:A

A2, A1, A0

FN6423.1

March 13, 2008

9

ISL22343

Typical Performance Curves

80

2.0

1.5

1.0

0.5

0

T = +125°C

70

60

50

40

30

20

10

0

T = +25°C

T = -40°C

I

CC

-0.5

-1.0

-1.5

-2.0

I

V-

0

50

100

150

200

250

-40

0

40

TEMPERATURE (°C)

80

120

TAP POSITION (DECIMAL)

FIGURE 2. STANDBY I

and I vs TEMPERATURE

V-

FIGURE 1. WIPER RESISTANCE vs TAP POSITION

[ I(RW) = V /R ] FOR 10kΩ (W)

CC

CC TOTAL

0.50

0.25

0

V

= 5.5V

CC

T = +25°C

V

= 2.25V

CC

0.25

0

-0.25

-0.50

-0.25

-0.50

V

= 5.5V

V

= 2.25V

100

CC

100

TAP POSITION (DECIMAL)

CC

0

50

150

200

250

0

50

150

200

250

TAP POSITION (DECIMAL)

FIGURE 3. DNL vs TAP POSITION IN VOLTAGE DIVIDER

FIGURE 4. INL vs TAP POSITION IN VOLTAGE DIVIDER

MODE FOR 10kΩ (W)

2.0

0

10k

1.6

1.2

-1

V

= 2.25V

CC

50k

V

= 5.5V

CC

-2

0.8

-3

-4

50k

10k

V

= 2.25V

V

= 5.5V

CC

0.4

0

-5

-40

0

40

80

120

-40

0

40

TEMPERATURE (ºC)

80

120

TEMPERATURE (ºC)

FIGURE 6. FS ERROR vs TEMPERATURE

FIGURE 5. ZS ERROR vs TEMPERATURE

FN6423.1

March 13, 2008

10

ISL22343

Typical Performance Curves (Continued)

0.5

2.0

T = +25°C

V

= 5.5V

1.5

1.0

CC

V

= 2.25V

0.25

0

CC

0.5

0

-0.25

-0.50

V

= 2.25V

100

CC

V

= 5.5V

CC

-0.5

0

50

150

200

250

0

50

100

150

200

250

TAP POSITION (DECIMAL)

FIGURE 7. DNL vs TAP POSITION IN RHEOSTAT MODE FOR

FIGURE 8. INL vs TAP POSITION IN RHEOSTAT MODE FOR

10kΩ (W)

200

160

1.60

10k

1.20

10k

120

0.80

5.5V

80

0.40

0.00

50k

40

0

50k

2.25V

-0.40

-40

16

66

116

166

216

266

0

40

80

120

TAP POSITION (DECIMAL)

TEMPERATURE (ºC)

FIGURE 10. TC FOR VOLTAGE DIVIDER MODE IN ppm

FIGURE 9. END TO END R

% CHANGE vs

TOTAL

TEMPERATURE

500

400

300

INPUT

OUTPUT

10k

200

100

50k

WIPER AT MID POINT (POSITION 80h)

R

= 10kΩ

TOTAL

0

16

66

116

166

216

TAP POSITION (DECIMAL)

FIGURE 12. FREQUENCY RESPONSE (1MHz)

FIGURE 11. TC FOR RHEOSTAT MODE IN ppm

FN6423.1

March 13, 2008

11

ISL22343

Typical Performance Curves (Continued)

CS

SCL

WIPER UNLOADED,

MOVEMENT FROM 0h to FFh

WIPER

FIGURE 13. MIDSCALE GLITCH, CODE 7Fh TO 80h

FIGURE 14. LARGE SIGNAL SETTLING TIME

ISL22343. A maximum of eight ISL22343 devices may

occupy the I C serial bus (See Table 3).

Pin Description

Potentiometers Pins

RHI AND RLI

2

Principles of Operation

The ISL22343 is an integrated circuit incorporating four

DCPs with its associated registers, non-volatile memory and

an I C serial interface providing direct communication

between a host and the potentiometer and memory. The

resistor arrays are comprised of individual resistors

connected in a series. At either end of the array and

between each resistor is an electronic switch that transfers

the potential at that point to the wiper.

The high (RHi) and low (RLi) terminals of the ISL22343 are

equivalent to the fixed terminals of a mechanical

potentiometer. RHi and RLi are referenced to the relative

position of the wiper and not the voltage potential on the

terminals. With WRi set to 255 decimal, the wiper will be

closest to RHi, and with the WRi set to 0, the wiper is closest

to RLi.

2

RWI

The electronic switches on the device operate in a “make

before break” mode when the wiper changes tap positions.

RWi is the wiper terminal and is equivalent to the movable

terminal of a mechanical potentiometer. The position of the

wiper within the array is determined by the WRi register.

When the device is powered down, the last value stored in

IVRi will be maintained in the non-volatile memory. When

power is restored, the contents of the IVRi are recalled and

loaded into the corresponding WRi to set the wipers to their

initial positions.

Bus Interface Pins

SERIAL DATA INPUT/OUTPUT (SDA)

2

The SDA is a bidirectional serial data input/output pin for I C

interface. It receives device address, operation code, wiper

address and data from an I C external master device at the

DCP Description

2

The DCP is implemented with a combination of resistor

elements and CMOS switches. The physical ends of each

DCP are equivalent to the fixed terminals of a mechanical

potentiometer (RHi and RLi pins). The RWi pin of the DCP is

connected to intermediate nodes, and is equivalent to the

wiper terminal of a mechanical potentiometer. The position

of the wiper terminal within the DCP is controlled by an 8-bit

volatile Wiper Register (WRi). When the WRi of a DCP

contains all zeroes (WRi[7:0]= 00h), its wiper terminal (RWi)

is closest to its “Low” terminal (RLi). When the WRi register

of a DCP contains all ones (WRi[7:0] = FFh), its wiper

terminal (RWi) is closest to its “High” terminal (RHi). As the

value of the WRi increases from all zeroes (0) to all ones

(255 decimal), the wiper moves monotonically from the

position closest to RLi to the position closest to RHi. At the

rising edge of the serial clock SCL, and it shifts out data after

each falling edge of the serial clock.

SDA requires an external pull-up resistor, since it is an open

drain input/output.

SERIAL CLOCK (SCL)

2

This input is the serial clock of the I C serial interface. SCL

requires an external pull-up resistor, since it is an open drain

input.

DEVICE ADDRESS (A2, A1, A0)

The address inputs are used to set three least significant bits

2

of the 7-bit I C interface slave address. A match in the slave

address serial data stream must match with the Address

input pins in order to initiate communication with the

FN6423.1

March 13, 2008

12

ISL22343

same time, the resistance between RWi and RLi increases

monotonically, while the resistance between RHi and RWi

decreases monotonically.

The VOL bit (ACR[7]) determines whether the access to

wiper registers WRi or initial value registers IVRi.

TABLE 2. ACCESS CONTROL REGISTER (ACR)

BIT #

7

6

5

While the ISL22343 is being powered up, the WRi is reset to

80h (128 decimal), which locates RWi roughly at the center

between RLi and RHi. After the power supply voltage

becomes large enough for reliable non-volatile memory

reading, the WRi will be reloaded with the value stored in

corresponding non-volatile Initial Value Register (IVRi).

4

0

3

0

2

0

1

0

NAME

VOL

SHDN WIP

If VOL bit is 0, the non-volatile IVRi registers are accessible.

If VOL bit is 1, only the volatile WRi are accessible.

Note: value is written to IVRi register also is written to the

corresponding WRi. The default value of this bit is 0.

The WRi and IVRi can be read or written to directly using the

2

I C serial interface as described in the following sections.

The SHDN bit (ACR[6]) disables or enables Shutdown mode.

When this bit is 0, DCPs are in Shutdown mode. Default value

of the SHDN bit is 1.

Memory Description

The ISL22343 contains four non-volatile 8-bit Initial Value

Register (IVRi), eleven General Purpose non-volatile 8-bit

registers and five volatile 8-bit registers: four Wiper Registers

(WRi) and Access Control Register (ACR). Memory map of

ISL22343 is in Table 1. The non-volatile registers (IVRi) at

address 0, 1, 2 and 3 contain initial wiper position and volatile

registers (WRi) contain current wiper position.

RHi

RWi

RLi

TABLE 1. MEMORY MAP

FIGURE 15. DCP CONNECTION IN SHUTDOWN MODE

ADDRESS

(hex)

10

F

NON-VOLATILE

VOLATILE

The WIP bit (ACR[5]) is a read-only bit. It indicates that non-

volatile write operation is in progress. It is impossible to write

to the WRi or ACR while WIP bit is 1.

N/A

ACR

Reserved

E

D

C

B

A

9

General Purpose

IVR3

N/A

WR3

WR2

WR1

WR0

2

I C Serial Interface

2

The ISL22343 supports an I C bidirectional bus oriented

protocol. The protocol defines any device that sends data onto

the bus as a transmitter and the receiving device as the

receiver. The device controlling the transfer is a master and

the device being controlled is the slave. The master always

initiates data transfers and provides the clock for both transmit

and receive operations. Therefore, the ISL22343 operates as

a slave device in all applications.

8

7

2

All communication over the I C interface is conducted by

sending the MSB of each byte of data first.

6

5

Protocol Conventions

4

Data states on the SDA line must change only during SCL

LOW periods. SDA state changes during SCL HIGH are

reserved for indicating START and STOP conditions

(see Figure 16). On power-up of the ISL22343, the SDA pin

is in the input mode.

3

2

IVR2

1

IVR1

0

IVR0

2

All I C interface operations must begin with a START

condition, which is a HIGH to LOW transition of SDA while

SCL is HIGH. The ISL22343 continuously monitors the SDA

and SCL lines for the START condition and does not

respond to any command until this condition is met (See

Figure 16). A START condition is ignored during the power-

up of the device.

The non-volatile IVRi and volatile WRi registers are

accessible with the same address.

The Access Control Register (ACR) contains information

and control bits described below in Table 2.

2

All I C interface operations must be terminated by a STOP

condition, which is a LOW to HIGH transition of SDA while

FN6423.1

March 13, 2008

13

ISL22343

SCL is HIGH (see Figure 16). A STOP condition at the end

of a read operation, or at the end of a write operation places

the device in its standby mode.

Byte of a write operation. The master must respond with an

ACK after receiving a Data Byte of a read operation

A valid Identification Byte contains 1010 as four MSBs, and

the following three bits matching the logic values present at

pins A2, A1 and A0. The LSB is the Read/Write bit. Its value

is “1” for a Read operation and “0” for a Write operation (See

Table 3).

An ACK (Acknowledge) is a software convention used to

indicate a successful data transfer. The transmitting device,

either master or slave, releases the SDA bus after

transmitting eight bits. During the ninth clock cycle, the

receiver pulls the SDA line LOW to acknowledge the

reception of the eight bits of data (see Figure 17).

TABLE 3. IDENTIFICATION BYTE FORMAT

LOGIC VALUES AT PINS A2, A1 AND A0, RESPECTIVELY

The ISL22343 responds with an ACK after recognition of a

START condition followed by a valid Identification Byte, and

once again after successful receipt of an Address Byte. The

ISL22343 also responds with an ACK after receiving a Data

1

0

1

0

A2

A1

A0

R/W

(MSB)

(LSB)

SCL

SDA

START

DATA

STOP

STABLE

CHANGE STABLE

FIGURE 16. VALID DATA CHANGES, START AND STOP CONDITIONS

SCL FROM

MASTER

1

8

9

SDA OUTPUT FROM

TRANSMITTER

HIGH IMPEDANCE

SDA OUTPUT FROM

RECEIVER

START

ACK

FIGURE 17. ACKNOWLEDGE RESPONSE FROM RECEIVER

WRITE

S

SIGNALS FROM

THE MASTER

T

A

R

T

S

T

O

P

IDENTIFICATION

BYTE

ADDRESS

BYTE

DATA

BYTE

SIGNAL AT SDA

1 0 1 0 A2A1A0 0

0 0 0 0

SIGNALS FROM

THE SLAVE

A

C

K

A

C

K

A

C

K

FIGURE 18. BYTE WRITE SEQUENCE

FN6423.1

March 13, 2008

14

ISL22343

S

T

A

R

T

S

T

A

R

T

SIGNALS

FROM THE

MASTER

S

T

O

P

A

C

K

A

C

K

IDENTIFICATION

BYTE WITH

R/W = 0

IDENTIFICATION

BYTE WITH

R/W = 1

A

C

K

ADDRESS

BYTE

SIGNAL AT SDA

1 0 1 0 A2 A1A0 0

0 0 0 0

1 0 1 A2A1A0 1

0

A

C

K

A

C

K

A

C

K

SIGNALS FROM

THE SLAVE

FIRST READ

DATA BYTE

LAST READ

DATA BYTE

FIGURE 19. READ SEQUENCE

Write Operation

Applications Information

A Write operation requires a START condition, followed by a

valid Identification Byte, a valid Address Byte, a Data Byte,

and a STOP condition. After each of the three bytes, the

ISL22343 responds with an ACK. At this time, the device

enters its standby state (see Figure 18).

When stepping up through each tap in voltage divider mode,

some tap transition points can result in noticeable voltage

transients (or overshoot/undershoot) resulting from the

sudden transition from a very low impedance “make” to a

much higher impedance “break within an extremely short

period of time (<50ns). Two such code transitions are EFh to

F0h, and 0Fh to 10h. Note that all switching transients will

settle well within the settling time as stated on the datasheet.

A small capacitor can be added externally to reduce the

amplitude of these voltage transients, but that will also

reduce the useful bandwidth of the circuit, thus this may not

be a good solution for some applications. It may be a good

idea, in that case, to use fast amplifiers in a signal chain for

fast recovery.

The non-volatile write cycle starts after STOP condition is

determined and it requires up to 20ms delay for the next

non-volatile write. Thus, non-volatile registers must be

written individually.

Read Operation

A Read operation consist of a three byte instruction followed

by one or more Data Bytes (see Figure 19). The master

initiates the operation issuing the following sequence: a

START, the Identification byte with the R/W bit set to “0”, an

Address Byte, a second START, and a second Identification

byte with the R/W bit set to “1”. After each of the three bytes,

the ISL22343 responds with an ACK. Then the ISL22343

transmits Data Bytes as long as the master responds with an

ACK during the SCL cycle following the eighth bit of each

byte. The Data Bytes are from the registers indicated by an

internal pointer. This pointers initial value is determined by

the Address Byte in the Read operation instruction, and

increments by one during transmission of each Data Byte.

After reaching the memory location 0Fh, the pointer “rolls

over” to 00h, and the device continues to output data for

each ACK received.The master terminates the read

Application Example

Figure 20 shows an example of using ISL22343 for gain

setting and offset correction in a high side current

measurement application. DCP0 applies a programmable

offset voltage of ±25mV to the FB+ pin of the Instrumentation

Amplifier ISL28272 to adjust output offset to zero voltages.

DCP1 programs the gain of the ISL28272 from 90 to 110

with 5V output for 10A current through current sense

resistor. DCP2 and DCP3 are used for another channel of

dual ISL28272 correspondently (not shown in Figure 20).

More application examples can be found at

http://www.intersil.com/data/an/AN1145.pdf

operation issuing a NACK (ACK) and a STOP condition

following the last bit of the last Data Byte (See Figure 19).

FN6423.1

March 13, 2008

15

ISL22343

1.2V

DC/DC CONVERTER

OUTPUT

PROCESSOR LOAD

10A, MAX

0.005Ω

+5V

16

10k

0.1µF

1/2 ISL28272

7

V+

6

5

3

4

IN+

EN

IN-

2

V

= 0V TO +5V TO ADC

OUT

FB+

+5V

R

4

FB-

V-

150k, 1%

R

1

8

50k, 1%

RH1

RL1

RH0

RW1

R

5

309, 1%

R

2

1k, 1%

RW0

RL0

50k

DCP0 (1/4 ISL22343U)

PROGRAMMABLE OFFSET ±25mV

DCP1 (1/4 ISL22343U)

PROGRAMMABLE GAIN 90 TO 110

R

6

R

3

1.37k, 1%

50k, 1%

-5V

ISL22343UFV20Z

16

18

19

20

+5V

I C bus

VCC

RH0

RL0

RW0

DCP0

DCP1

5

6

4

15

2

SCL

SDA

A2

A1

A0

13

12

11

RH1

RL1

RW1

14

10

9

8

7

RH2

RL2

RW2

GND

DCP2

DCP3

17

-5V

V-

1

2

3

RH3

RL3

RW3

FIGURE 20. CURRENT SENSING WITH GAIN AND OFFSET CONTROL

FN6423.1

March 13, 2008

16

ISL22343

Quad Flat No-Lead Plastic Package (QFN)

Micro Lead Frame Plastic Package (MLFP)

L20.5x5

20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE

MILLIMETERS

SYMBOL

MIN

NOMINAL

MAX

1.00

0.05

1.00

NOTES

A

A1

A2

A3

b

0.80

0.90

-

0.02

-

0.65

9

0.20 REF

9

0.23

2.95

0.30

0.38

3.25

5, 8

D

5.00 BSC

-

D1

D2

E

4.75 BSC

9

3.10

7, 8

5.00 BSC

-

E1

E2

e

4.75 BSC

9

3.10

7, 8

0.65 BSC

-

k

0.20

0.35

-

0.60

20

5

-

L

0.75

8

N

2

Nd

Ne

P

3

5

3

-

0.60

12

9

θ

-

9

Rev. 4 11/04

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on each D and E.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensionsare provided toassistwith PCBLandPattern

Design efforts, see Intersil Technical Brief TB389.

9. Features and dimensions A2, A3, D1, E1, P & θ are present when

Anvil singulation method is used and not present for saw

singulation.

10. Compliant to JEDEC MO-220VHHC Issue I except for the "b"

dimension.

FN6423.1

March 13, 2008

17

ISL22343

Thin Shrink Small Outline Plastic Packages (TSSOP)

N

M20.173

INDEX

AREA

0.25(0.010)

M

B M

E

20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC

PACKAGE

E1

-B-

GAUGE

PLANE

INCHES

MIN

MILLIMETERS

SYMBOL

MAX

0.047

0.006

0.051

0.0118

0.0079

0.260

0.177

MIN

-

MAX

1.20

0.15

1.05

0.30

0.20

6.60

4.50

NOTES

1

2

3

A

A1

A2

b

-

L

0.002

0.031

0.0075

0.0035

0.252

0.169

0.05

0.80

0.19

0.09

6.40

4.30

-

0.25

0.010

0.05(0.002)

SEATING PLANE

A

-

-A-

D

9

c

-

-C-

α

D

3

A2

e

A1

E1

e

4

c

b

0.10(0.004)

0.026 BSC

0.65 BSC

-

0.10(0.004) M

C

A M B S

E

0.246

0.256

6.25

0.45

6.50

0.75

-

L

0.0177

0.0295

6

NOTES:

N

20

7

1. These package dimensions are within allowable dimensions of

JEDEC MO-153-AC, Issue E.

o

0

8

0

8

-

α

Rev. 1 6/98

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm

(0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-

sion at maximum material condition. Minimum space between protru-

sion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact. (Angles in degrees)

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6423.1

March 13, 2008

18


型号：	ISL22343UFV20Z
厂家：	Intersil
描述：	Quad Digitally Controlled Potentiometer XDCP 四通道数字电位XDCP
文件：	总18页 (文件大小：698K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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