ISL54002IRTZ [INTERSIL]
Integrated Audio Amplifier Systems; 集成音频放大器系统
| 型号： | ISL54002IRTZ |
| 厂家： | 
Intersil |
| 描述： | Integrated Audio Amplifier Systems |
| 文件： | 总11页 (文件大小：260K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ISL54000, ISL54001, ISL54002
®
Data Sheet
October 17, 2007
FN6458.2
Integrated Audio Amplifier Systems
Features
The Intersil ISL54000, ISL54001, ISL54002 family of devices
are integrated audio power amplifier systems that combine
stereo BTL 8Ω amplifiers in a single package. The devices are
designed to operate from a single +2.7V to +5V power supply.
All devices are offered in a 20 Ld 4x4 thin QFN package.
Targeted applications include handheld equipment such as
cell-phones, MP3 players, and games/toys.
• Pb-Free (RoHS Compliant)
• Class AB 941mW Stereo BTL Speaker Amplifiiers
• Single Supply Operation . . . . . . . . . . . . . . . . .+2.7V to +5.5V
• THD+N at 1kHz, 800mW into 8Ω . . . . . . . . . . . . . . . . . .0.4%
• THD+N at 1kHz, 941mW into 8Ω . . . . . . . . . . . . . . . . . . . 1%
• Low Power Shutdown
The ISL54000, ISL54001, ISL54002 parts contain two class
AB bridge-tied (BTL) type power amplifiers for driving stereo
8Ω speakers. Each BTL is capable of delivering 800mW (typ)
with 0.4% THD+N and 941mW (typ) with 1% THD+N of
continuous average power into an 8Ω BTL speaker load
when using a 5V supply.
• Thermal Shutdown Protection
• “Click and Pop” Suppression Circuitry
• 2:1 Stereo Input Mux (ISL54001, ISL54002)
• Mixing of Two Stereo Inputs (ISL54002)
• TTL Logic-Compatible
The ISL54001 and ISL54002 feature a 2:1 stereo input
multiplexer front-end. This allows selection between two
stereo sources. In addition the ISL54002 has the capability
of mixing the stereo inputs.
• Available in 20 Ld 4x4 Thin QFN
Applications
All devices in this family feature low power shutdown,
thermal overload protection and click/pop suppression. The
click and pop circuitry eliminates audible transients during
audio source changes and transitioning in and out of
shutdown.
• Battery powered, Handheld, and Portable Equipment
- Cellular/mobile Phones
- PDA’s, MP3 Players, DVD Players, Cameras
- Laptops, Notebooks, Palmtops
- Handheld Games and Toys
• Desktop Computers
ISL54002 Typical Application Circuit and Block Diagram
0.1µF
V
DD
0.22µF
IN
IN
1R
2R
RIGHT AUDIO 1
RIGHT AUDIO 2
OUTR+
OUTR-
BTL
BTL
MUX/MIXER
MUX/MIXER
0.22µF
IN
IN
0.22µF
0.22µF
1L
2L
LEFT AUDIO 1
LEFT AUDIO 2
OUTL+
OUTL-
THERMAL
PROTECTION
CLICK AND POP
BIAS
C
REF
REF
SD
1µF
MICRO
CONTROLLER
INS
MIX
LOGIC CONTROL
GND
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
1
All other trademarks mentioned are the property of their respective owners.
ISL54000, ISL54001, ISL54002
Pin Descriptions
Pinouts
ISL54000
(20 LD 4X4 TQFN)
TOP VIEW
PIN
ISL54000 ISL54001 ISL54002
3, 6, 8, 12 3, 6, 8, 12 3, 6, 8, 12
NAME
FUNCTION
V
System Power Supply
Ground Connection
DD
4, 9, 20
11
4, 9, 20
-
4, 9, 20
-
GND
20 19
18
17 16
IN
Left Channel Audio
Input 1
L
OUTL-
NC
SD
NC
V
1
2
3
4
5
15
14
13
12
11
OUTL+
-
-
11
13
-
11
13
-
IN
IN
Left Channel Audio
Input 1
1L
V
DD
Left Channel Audio
Input 2
2L
GND
DD
17
-
IN
Right Channel Audio
Input 1
OUTR+
IN
R
L
6
7
8
9
10
17
19
2
17
19
2
IN
IN
Right Channel Audio
Input 1
1R
-
Right Channel Audio
Input 2
2R
ISL54001
(20 LD 4X4 TQFN)
2
OUTL+
OUTR+
OUTL-
OUTR-
SD
Positive Speaker
Output
TOP VIEW
5
5
5
Positive Speaker
Output
20 19
18
17
16
1
1
1
Negative Speaker
Output
OUTL-
OUTL+
NC
SD
IN
1
2
3
4
5
15
14
13
12
11
7
7
7
Negative Speaker
Output
14
14
14
Shutdown, High to
disable amplifiers,
Low for normal
operation.
V
DD
2L
GND
V
DD
OUTR+
IN
1L
-
-
18
-
18
16
INS
MIX
Input Select
6
7
8
9
10
Mixer, High to mix
Right and Left Audio
Inputs, Low to pass
Audio Inputs without
mixing
ISL54002
(20 LD 4X4 TQFN)
10
10
10
15
REF
NC
Common-mode Bias
Voltage, Bypass with
a 1µF capacitor to
GND
TOP VIEW
20 19
18
17
16
13, 15,
15, 16
No Connect
16, 18, 19
OUTL-
OUTL+
NC
SD
IN
1
2
3
4
5
15
14
13
12
11
V
DD
2L
GND
V
DD
OUTR+
IN
1L
6
7
8
9
10
FN6458.2
October 17, 2007
2
ISL54000, ISL54001, ISL54002
ISL54000 Truth Table
Ordering Information
TEMP.
RANGE
(°C)
PACKAGE
(Pb-Free)
Tape & Reel
SD
OUTR+
OUTR-
OUTL+
OUTL-
PART
PART
PKG.
DWG. #
1
Disabled
Disabled
Disabled
Disabled
NUMBER
MARKING
0
IN
IN
IN
IN
L
ISL54000IRTZ* 540 00IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
(Note) (Pb-free)
R
R
L
ISL54001 Truth Table
ISL54001IRTZ* 540 01IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
(Note) (Pb-free)
SD INS
OUTR+
OUTR-
OUTL+
OUTL-
ISL54002IRTZ* 540 02IRTZ -40 to +85 20 Ld 4x4 TQFN L20.4x4A
(Note) (Pb-free)
1
0
0
X
0
1
Disabled
Disabled
Disabled
Disabled
IN
IN
IN
IN
IN
IN
IN
IN
1R
2R
1R
1L
1L
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
2R
2L
2L
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach materials
and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
ISL54002 Truth Table
SD MIX INS
OUTR+
OUTR-
OUTL+
OUTL-
1
0
0
0
X
0
0
1
X
0
1
X
Disabled
Disabled
Disabled
Disabled
IN
IN
IN
IN
IN
IN
1R
2R
1R
2R
1L
2L
1L
2L
IN
IN
IN
1R
+
IN
1R
+
IN
1L
+
IN +
1L
IN
IN
IN
IN
2R
2R
2L
2L
FN6458.2
October 17, 2007
3
ISL54000, ISL54001, ISL54002
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V
Input Voltages
Thermal Resistance (Typical, Notes 1, 2)
20 Ld 4x4 TQFN Package . . . . . . . . . .
θ
(°C/W)
45
θ
(°C/W)
6.5
JA
JC
In_R, In_L, SD, INS, MIX . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)
Output Voltages
OUT_+, OUT_-. . . . . . . . . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)
Continuous Current (VDD, OUT_, GND) . . . . . . . . . . . . . . . . 750mA
ESD Rating
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV
Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>200V
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ
the
JC,
JA
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
2. For θ , the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical Specifications - 5V Supply
Test Conditions: V
= +5V, GND = 0V, V
= 2.4V, V
INL
= 0.8V, SD = MIX = INS = V ,
INL
DD
INH
C
= 1µF, R is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified
REF
L
(Note 3).
TEMP
(°C)
MIN
(Notes 4, 5)
MAX
(Notes 4, 5) UNITS
PARAMETER
GENERAL
TEST CONDITIONS
TYP
Power Supply Range, V
Full
25
2.7
-
5.5
V
DD
Quiescent Supply Current, I
INS = MIX = V
INL
or V
, R = None, Inputs AC
-
-
-
-
-
-
-
-
4.6
5.5
28
31
100
150
10
1
12
-
mA
mA
µA
µA
kΩ
°C
DD
SD
INH
coupled to ground (0.1µF)
L
Full
25
Shutdown Supply Current, I
SD = V
, INS = MIX = V
INH INL
or V
, R = 8Ω
50
-
INH
L
(BTL), Inputs AC coupled to ground (0.1µF)
Full
25
Input Resistance, R
INS = 0V or V
DD
-
IN
Thermal Shutdown, T
INS = MIX = 0V or V
DD
25
-
SD
Thermal Shutdown Hysteresis
SD to Full Operation, T
25
-
°C
INS = 0V or 5V, MIX = 0V or 5V
Full
-
ms
SD(ON)
BTL AMPLIFIER DRIVER
Output Offset Voltage, V
Measured OUT_+ and OUT_-, Input AC coupled to
ground (0.1µF)
25
Full
25
-
-
-
-
38
49
49
47
-
-
-
-
mV
mV
dB
OS
Power Supply Rejection Ratio,
PSRR
V
= 200mV , R = 8Ω,
P-P
F
F
= 217Hz
= 1kHz
RIPPLE
L
RIPPLE
Input AC coupled to ground
(0.1µF)
25
dB
RIPPLE
Output Power, P
OUT
R = 8Ω, THD + N = 1%, f = 1kHz
25
25
25
25
25
25
25
-
941
1.23
0.4
-
-
-
-
-
-
-
mW
W
L
R = 8Ω, THD + N = 10%, f = 1kHz
-
L
Total Harmonic Distortion + Noise, R = 8Ω, P
THD + N
= 800mW, f = 1kHz
-
%
L
OUT
R = 8Ω, P
= 800mW, f = 20Hz to 20kHz
-
7.2
-
0.7
%
L
OUT
Max Output Voltage Swing, V
Signal to Noise Ratio, SNR
R = 8Ω, V
= 5V , f = 1kHz
P-P
7.7
V
OUT
L
SIGNAL
P-P
R = 8Ω, P
= 900mW, f = 1kHz
85
dB
L
OUT
Output Noise, N
OUT
A - Weight filter, BW = 22Hz to 22kHz
-
125
µV
RMS
FN6458.2
October 17, 2007
4
ISL54000, ISL54001, ISL54002
Electrical Specifications - 5V Supply
Test Conditions: V
= +5V, GND = 0V, V
= 2.4V, V
INL
= 0.8V, SD = MIX = INS = V ,
INL
DD
INH
C
= 1µF, R is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified
REF
L
(Note 3). (Continued)
TEMP
(°C)
MIN
(Notes 4, 5)
MAX
(Notes 4, 5) UNITS
PARAMETER
TEST CONDITIONS
TYP
Crosstalk
to L , L
R = 8Ω, P
= 800mW, f = 1kHz, Signal coupled
OUT
25
-
80
-
dB
L
R
to R
CH CH CH
from the input of active amplifier to the output of an
CH
adjacent amplifier with its input AC coupled to ground.
Off-Isolation
SD = V
P
= 800mW, f = 10kHz, Signal
25
25
25
-
-
-
130
+-0.1
0.01
-
-
-
dB
dB
°
INH, OUT
coupled from input to output of a disabled amplifier.
Channel Gain Matching
to L
R = 8Ω, VINxR = VINxL = 3.88V
(Connect to the
L
P-P
R
same source)
CH
CH
Channel Phase Matching
to L
R = 8Ω, VINxR = VINxL = 3.88V
(Connect to the
L
P-P
R
same source)
CH
CH
LOGIC INPUT
Input Leakage Current, I , I
,
V
= 5V, SD = 0V, INS = 0V, MIX = 0V
25
Full
25
-3
-
1.9
1.9
0.02
0.02
-
3
-
µA
µA
µA
µA
V
SD INS
DD
DD
I
MIX
Input Leakage Current, I , I
,
V
= 5V, SD = V , INS = V , MIX = V
DD DD
-1
-
-1
-
SD INS
DD
I
MIX
Full
Full
Full
V
V
2.4
-
-
INH
INL
-
0.8
V
Electrical Specifications - 3.6V Supply Test Conditions: V = +3.6V, GND = 0V, V
= 1.4V. V = 0.4V, SD = MIX = INS = GSO =
INL
= 1µF. R is terminated between OUT_+ and OUT_ -, Unless Otherwise
DD
INH
GS1 = V , C
INL REF
L
Specified (Note 3).
TEMP
(°C)
MIN
(Notes 4, 5)
MAX
PARAMETER
GENERAL
Quiescent Supply Current, I
TEST CONDITIONS
TYP
(Notes 4, 5) UNITS
INS = 0V or V , MIX = 0V or V , R = None, Input
25
Full
25
-
-
-
-
2.7
3
12
-
mA
mA
µA
DD
DD
DD
L
AC coupled to ground (0.1µF)
Shutdown Supply Current, I
INS = 0V or V , MIX = 0V or V , R = 8Ω (BTL),
DD DD
Input AC coupled to ground (0.1µF)
13
15
50
-
SD
L
Full
µA
BTL AMPLIFIER DRIVER, HD = V
HO = V UNLESS OTHERWISE SPECIFIED
INH,
INH,
Output Offset Voltage, V
OS
Measured between OUT_+ and OUT_-, Input AC
coupled to ground (0.1µF)
25
Full
25
-
-
-
-
25
40
49
47
-
-
-
-
mV
mV
dB
Power Supply Rejection Ratio, PSRR V
= 200mV , R = 8Ω,
P-P
F
F
= 217Hz
= 1kHz
RIPPLE
L
RIPPLE
RIPPLE
Input AC coupled to ground
25
dB
(0.1µF)
Output Power, P
OUT
R
R
R
R
R
= 8Ω, THD + N = 1%, f = 1kHz
25
25
25
25
25
-
-
-
-
-
310
528
0.4
0.4
5.8
-
-
-
-
-
mW
mW
%
L
L
L
L
L
= 8Ω, THD + N = 10%, f = 1kHz
Total Harmonic Distortion + Noise,
THD + N
= 8Ω, P
= 8Ω, P
= 8Ω, V
= 200mW, f = 1kHz
OUT
= 200mW, f = 20Hz to 20kHz
%
OUT
Max Output Voltage Swing, V
= 3.6V , f = 1kHz
P-P
V
P-P
OUT
SIGNAL
LOGIC INPUT
Input Leakage Current, I , I , I
SD INS MIX
V
= 5V, SD = 0V, INS = 0V, MIX = 0V
25
-3
-
1.9
1.9
3
-
µA
µA
DD
Full
FN6458.2
October 17, 2007
5
ISL54000, ISL54001, ISL54002
Electrical Specifications - 3.6V Supply Test Conditions: V = +3.6V, GND = 0V, V
= 1.4V. V
= 0.4V, SD = MIX = INS = GSO =
INL
DD
INH
GS1 = V , C
= 1µF. R is terminated between OUT_+ and OUT_ -, Unless Otherwise
INL REF
L
Specified (Note 3). (Continued)
TEMP
(°C)
MIN
(Notes 4, 5)
MAX
PARAMETER
TEST CONDITIONS
TYP
0.02
0.02
-
(Notes 4, 5) UNITS
Input Leakage Current, I , I , I
SD INS MIX
V
= 5V, SD = V , INS = V , MIX = V
DD DD DD
25
-1
-
1
-
µA
µA
V
DD
Full
Full
Full
V
V
1.4
-
-
INH
-
0.4
V
INL
NOTES:
3. V = input voltage to perform proper function.
IN
4. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
5. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
ISL54000 Typical Application Circuit and Block Diagram
0.1µF
V
DD
0.22µF
0.22µF
IN
R
OUTR+
OUTR-
RIGHT AUDIO
BTL
BTL
IN
L
OUTL+
OUTL-
LEFT AUDIO
THERMAL
PROTECTION
CLICK AND POP
BIAS
C
REF
REF
1µF
SD
MICRO
CONTROLLER
LOGIC CONTROL
GND
FN6458.2
October 17, 2007
6
ISL54000, ISL54001, ISL54002
ISL54001 Typical Application Circuit and Block Diagram
0.1µF
V
0.22µF
0.22µF
DD
IN
IN
1R
2R
RIGHT 1 AUDIO
RIGHT 2 AUDIO
OUTR+
OUTR-
BTL
BTL
MUX
MUX
0.22µF
0.22µF
IN
IN
1L
2L
LEFT 1 AUDIO
LEFT 2 AUDIO
OUTL+
OUTL-
THERMAL
PROTECTION
CLICK AND POP
BIAS
C
REF
REF
SD
1µF
MICRO
CONTROLLER
INS
LOGIC CONTROL
GND
ISL54002 Typical Application Circuit and Block Diagram
0.1µF
V
DD
0.22µF
IN
1R
2R
RIGHT 1 AUDIO
RIGHT 2 AUDIO
OUTR+
OUTR-
MUX/MIXER
MUX/MIXER
BLT
BLT
0.22µF IN
IN
IN
0.22µF
0.22µF
1L
2L
LEFT 1 AUDIO
LEFT 2 AUDIO
OUTL+
OUTL-
THERMAL
PROTECTION
CLICK AND POP
BIAS
C
REF
REF
SD
1µF
MICRO
CONTROLLER
INS
MIX
LOGIC CONTROL
GND
FN6458.2
October 17, 2007
7
ISL54000, ISL54001, ISL54002
required to calculate the capacitor value is shown in
Equation 1:
Detailed Description
The Intersil ISL54000, ISL54001, ISL54002 family of devices
are integrated audio power amplifier systems designed to
drive 8Ω speaker loads. They can operate with a supply
voltage of +2.7V to +5V and provide good quality audio, while
requiring minimal external components. Its low 0.4% THD+N
while driving 800mW into an 8Ω speaker ensures clean, low
distortion amplification of the audio signals. The devices are
offered in a 20 Ld 4x4 TQFN package. Targeted applications
include handheld equipment such as cell-phones, MP3
players, and games/toys.
(EQ. 1)
C ≥ 1 ⁄ 6.28 • f • 100kΩ
The 100kΩ is the impedance looking into the input of the
ISL54000, ISL54001, and ISL54002 devices.
BTL Speaker Amplifiers
The ISL54000, ISL54001, and ISL54002 contain two
bridge-tied load (BTL) amplifiers designed to drive a speaker
load differentially. The output from one BTL is OUTL+ and
OUTL-. The output of the other BTL is OUTR+ and OUTR-.
The ISL54000, ISL54001, ISL54002 parts contain two class
AB bridge-tied (BTL) type power amplifiers for driving stereo
8Ω speakers. When powered with a 5V supply, each BTL is
capable of delivering 941mW (typ) of continuous average
power to an 8Ω speaker load with 1% THD+N performance.
When the speaker load is connected across the positive and
negative terminals of the BTL driver, the voltage is doubled
across the load and the power is quadrupled.
A single BTL driver consists of inverting and non-inverting
power op amps. The AC signal out of each op amp are equal
in magnitude but 180° out-of-phase, so the AC signal at
OUTL+ and OUTL- have the same amplitude but are 180°
out-of-phase. The same is true of OUTR+ and OUTR-. The
speaker load gets connected between the + terminal and
- terminal outputs.
The ISL54001 and ISL54002 feature a 2:1 stereo input
multiplexer front-end. This allows selection between two
stereo sources. The INS control pin determines which stereo
input is active. Applying a logic “0” to the INS control pin
Driving the load differentially using a BTL configuration
doubles the output voltage across the speaker load and
quadruples the power to the load. In effect you get a gain of
two due to this configuration at the load as compared to
driving the load with a single-ended amplifier with its load
connected between a single amplifier’s output and ground.
selects stereo input 1 (R and L ). Applying a logic “1” to the
1
1
INS control pin selects stereo input 2 (R and L ).
2
2
The ISL54002 has the capability of mixing the two stereo
inputs. When in MIX Mode (MIX = “1”) the ISL54002 mixes
The outputs of each BTL are biased at V /2. When the
DD
load gets connected across the + and - terminal of the BTL,
the mid supply DC bias voltage at each output gets
cancelled out eliminating the need for large bulky output
coupling capacitors.
the R input with the R input and sends the combined
1
2
signal to the OUTR_ BTL driver and it mixes the L input
1
with the L input and sends the combined signal to the
2
OUTL_ BTL driver.
All devices in this family feature low power shutdown,
thermal overload protection and click/pop suppression. The
click and pop circuitry prohibits switching between input
channels until the audio input signals are at their lowest
point, which eliminates audible transients in the speakers
when changing audio input sources. The click/pop circuitry
also keeps speaker transients to an inaudibile level when
entering and leaving shutdown.
Low Power Shutdown
With a logic “1” at the SD control pin the device enters the
low power shutdown state. When in shutdown the output
amplifiers go into an high impedance state and supply
current is reduced to 26µA (typ).
In shutdown mode before the amplifiers enter the high
impedance/low current drive state, the bias voltage of V /2
DD
remains connected at the output through a 100kΩ resistor.
This resistor is not present during active operation of the
drivers but gets switched in when the SD pin goes high and
disconnected when the SD pin goes low.
Typical application circuits and block diagrams for each
device in the family are on page 6 and 7.
DC Bias Voltage
Leaving the DC bias voltage connected through this 100kΩ
resistor reduces the transient that is generated across the
speaker, while going into or out of shutdown, to a level that
does not produce clicking or popping in the speaker.
The ISL54000, ISL54001, ISL54002 have internal DC bias
circuitry, which DC offsets the incoming audio signal at
V
/2. When using a 5V supply, the DC offset will be 2.5V.
DD
When using a 3.6V supply, the DC offset will be 1.8V.
Since the signal gets biased internally at V /2, the audio
DD
QFN Thermal Pad Considerations
signals need to be AC coupled to the inputs of the device.
The value of the AC coupling capacitor depends on the low
frequency range required for the application. A capacitor of
0.22µF will pass a signal as low as 7.2Hz. The formula
The QFN package features an exposed thermal pad on its
underside. This pad lowers the package’s thermal resistance
by providing a direct heat conduction path from the die to the
PCB. Connect the exposed thermal pad to GND by using a
FN6458.2
October 17, 2007
8
ISL54000, ISL54001, ISL54002
large copper pad and multiple vias to the GND plane. The
vias should be plugged and tented with plating and solder
mask to ensure good thermal conductivity.
Proper supply bypassing is necessary for high power supply
rejection and low noise performance. A filter network
consisting of a 10µF capacitor in parallel with a 0.1µF
capacitor is recommended at the voltage regulator that is
providing the power to the ISL54000, ISL54001, and
ISL54002 IC.
Best thermal performance is achieved with the largest
practical copper ground plane area.
PCB Layout Considersations and Power
Supply Bypassing
To maintain the highest load dissipation and widest output
voltage swing the power supply PCB traces and the traces
that connect the output of the drivers to the speaker loads
should be made as wide as possible to minimize losses due
to parasitic trace resistance.
Local bypass capacitors of 0.1µF should be put at each V
pin of the ISL54000, ISL54001, ISL54002 devices. They
should be located as close as possible to the pin, keeping
the length of leads and traces as short as possible.
DD
A 1µF capacitor from the REF pin (pin 10) to GND is needed
for optimum PSRR and internal bias voltage stability.
Typical Performance Curves T = +25°C, Unless Otherwise Specified.
A
1.0
0.9
0.8
1.0
0.9
0.8
0.7
0.6
V
= 5V
V
= 3.6V
DD
BTL
L
DD
BTL
R
P
= 8Ω
= 800mW
0.7
0.6
R
= 8Ω
= 200mW
L
O
P
O
0.5
0.4
0.5
0.4
0.3
0.2
0.3
0.2
0.1
0.1
20
50
100 200
500 1k
2k
5k
10k 20k
20
50
100 200
500 1k
2k
5k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 1. THD+N vs FREQUENCY
FIGURE 2. THD+N vs FREQUENCY
10.0
5.00
10.0
5.00
V
= 3.6V
V
= 5V
DD
BTL
= 8Ω
DD
BTL
= 8Ω
R
L
R
L
f = 1kHz
2.00
1.00
0.50
2.00
1.00
0.50
f = 1kHz
0.20
0.10
0.05
0.20
0.10
0.05
0.02
0.01
0.02
0.01
10m
20m
40m
OUTPUT POWER (W)
FIGURE 4. THD+N vs OUTPUT POWER
70m 100m
200m
600m
10m
20m
50m
100m 200m
500m
1
OUTPUT POWER (W)
FIGURE 3. THD+N vs OUTPUT POWER
FN6458.2
October 17, 2007
9
ISL54000, ISL54001, ISL54002
Typical Performance Curves T = +25°C, Unless Otherwise Specified. (Continued)
A
-40
-45
-50
-80
-85
V
P
= 5V
DD
= 800mW
O
-90
-55
-95
-60
-100
-105
-110
-115
-120
-125
-130
-135
-140
-145
-150
-155
-160
-65
-70
R
TO L
CH
CH
-75
-80
-85
-90
L
TO R
CH
CH
-95
V
P
= 5V
= 800mW
-100
-105
-110
-115
-120
DD
O
20
50 100 200
500 1k
2k
5k 10k 20k
20
50
100 200
500 1k
2k
5k
10k 20k
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 5. CROSSTALK vs FREQUENCY
FIGURE 6. OFFISOLATION vs FREQUENCY
-20
-22
-24
-26
-28
-30
-32
-34
-36
-38
-40
-42
-44
-46
-48
-50
-52
-54
-56
-58
-60
-62
-64
-66
-68
-70
700
600
500
400
300
200
100
0
V
= 5V
V
= 5V
DD
BTL
= 8Ω
DD
BTL
R
L
V
= 200mV
P-P
RIPPLE
10
20
50 100 200
500 1k
2k
5k 10k 20k
0
250
500
(mW)
750
1000
FREQUENCY (Hz)
P
OUT
FIGURE 7. PSRR vs FREQUENCY
FIGURE 8. POWER DISSIPATION vs OUTPUT POWER
Die Characteristics
400
350
300
250
200
150
100
50
V
= 3.6V
DD
BTL
= 8
SUBSTRATE POTENTIAL (POWERED UP):
R
Ω
L
GND
PROCESS:
Submicron CMOS
0
0
100
200
P
300
(mW)
400
500
OUT
FIGURE 9. POWER DISSIPATION vs OUTPUT POWER
FN6458.2
October 17, 2007
10
ISL54000, ISL54001, ISL54002
Thin Quad Flat No-Lead Plastic Package
(TQFN)
Thin Micro Lead FramePlastic Package
(TMLFP)
L20.4x4A
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I)
MILLIMETERS
SYMBOL
MIN
NOMINAL
MAX
0.80
0.05
0.80
NOTES
A
A1
A2
A3
b
0.70
0.75
-
-
-
0.02
-
0.55
9
0.20 REF
9
0.18
1.95
1.95
0.25
0.30
2.25
2.25
5, 8
D
4.00 BSC
-
D1
D2
E
3.75 BSC
9
2.10
7, 8
4.00 BSC
-
E1
E2
e
3.75 BSC
9
2.10
7, 8
0.50 BSC
-
k
0.20
0.35
-
0.60
20
5
-
-
L
0.75
8
N
2
Nd
Ne
P
3
5
3
-
-
-
0.60
12
9
θ
-
9
Rev. 0 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensionsare provided toassistwith PCBLandPattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6458.2
October 17, 2007
11
相关型号：
ISL54004IR
0.17W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC20, 4 X 4 MM, PLASTIC, MO-220WGGD-1, TQFN-20
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