ISL6752AAZA [INTERSIL]

ZVS Full-Bridge Current-Mode PWM with Adjustable Synchronous Rectifier Control; 可调的同步整流控制ZVS全桥电流模式PWM
ISL6752AAZA
型号: ISL6752AAZA
厂家: Intersil    Intersil
描述:

ZVS Full-Bridge Current-Mode PWM with Adjustable Synchronous Rectifier Control
可调的同步整流控制ZVS全桥电流模式PWM

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中文:  中文翻译
下载:  下载PDF数据表文档文件
ISL6752  
®
Data Sheet  
March 10, 2005  
FN9181.1  
ZVS Full-Bridge Current-Mode PWM with  
Adjustable Synchronous Rectifier Control  
Features  
• Adjustable Resonant Delay for ZVS Operation  
The ISL6752 is a high-performance, low-pin-count  
alternative zero-voltage switching (ZVS) full-bridge PWM  
controller. Like Intersil’s ISL6551, it achieves ZVS operation  
by driving the upper bridge FETs at a fixed 50% duty cycle  
while the lower bridge FETs are trailing-edge modulated with  
adjustable resonant switching delays. Compared to the more  
familiar phase-shifted control method, this algorithm offers  
equivalent efficiency and improved overcurrent and light-  
load performance with less complexity in a lower pin count  
package.  
• Synchronous Rectifier Control Outputs with Adjustable  
Delay/Advance  
• Current-Mode Control  
• 3% Current Limit Threshold  
• Adjustable Deadtime Control  
• 175µA Startup Current  
• Supply UVLO  
• Adjustable Oscillator Frequency Up to 2MHz  
• Internal Over Temperature Protection  
• Buffered Oscillator Sawtooth Output  
• Fast Current Sense to Output Delay  
• Adjustable Cycle-by-Cycle Peak Current Limit  
• 70ns Leading Edge Blanking  
• Multi-Pulse Suppression  
The ISL6752 features complemented PWM outputs for  
synchronous rectifier (SR) control. The complemented  
outputs may be dynamically advanced or delayed relative to  
the PWM outputs using an external control voltage.  
This advanced BiCMOS design features precision deadtime  
and resonant delay control, and an oscillator adjustable to  
2MHz operating frequency. Additionally, Multi-Pulse  
Suppression ensures alternating output pulses at low duty  
cycles where pulse skipping may occur.  
• Pb-Free (RoHS Compliant)  
Ordering Information  
• ELV, WEEE, and RoHS Compliant  
TEMP. RANGE  
(°C)  
PKG.  
PART NUMBER  
PACKAGE  
16 Ld QSOP  
(Pb-free)  
DWG. #  
Applications  
ISL6752AAZA  
(Note)  
-40 to 105  
M16.15A  
• ZVS Full-Bridge Converters  
Telecom and Datacom Power  
• Wireless Base Station Power  
• File Server Power  
Add -T suffix to part number for tape and reel packaging.  
NOTE: Intersil Pb-free products employ special Pb-free material  
sets; molding compounds/die attach materials and 100% matte tin  
plate termination finish, which are RoHS compliant and compatible  
with both SnPb and Pb-free soldering operations. Intersil Pb-free  
products are MSL classified at Pb-free peak reflow temperatures that  
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.  
• Industrial Power Systems  
Pinout  
ISL6752 (QSOP)  
TOP VIEW  
VADJ  
VREF  
VERR  
CTBUF  
RTD  
1
2
3
4
5
6
7
8
16 VDD  
15 OUTLL  
14 OUTLR  
13 OUTUL  
12 OUTUR  
11 OUTLLN  
10 OUTLRN  
RESDEL  
CT  
9
GND  
CS  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1
1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc.  
Copyright Intersil Americas Inc. 2005. All Rights Reserved  
All other trademarks mentioned are the property of their respective owners.  
Functional Block Diagram  
VDD  
VDD  
OUTUL  
OUTUR  
50%  
VREF  
UVLO  
PWM  
DELAY/  
ADVANCE  
TIMING  
STEERING  
LOGIC  
OVER-  
OUTLL  
OUTLR  
CONTROL  
TEMPERATURE  
PROTECTION  
PWM  
OUTLLN  
OUTLRN  
GND  
VREF  
RESDEL  
VADJ  
OSCILLATOR  
CT  
+
-
CS  
1.00V  
RTD  
70ns  
LEADING  
EDGE  
OVERCURRENT  
COMPARATOR  
BLANKING  
CTBUF  
80mV  
+
-
0.33  
PWM  
COMPARATOR  
VREF  
1mA  
VERR  
Typical Application - High Voltage Input Primary Side Control ZVS Full-Bridge Converter  
VIN+  
CR2  
CR3  
T3  
Q2  
Q5A  
Q5B  
R10  
R11  
Q8A  
Q8B  
Q1  
C9  
C8  
+
T1  
C1  
R12  
C12  
400 VDC  
+ Vout  
L1  
Q12  
C10  
Q10A  
Q10B  
Q9A  
Q9B  
C7  
C15  
+
R1  
Q13  
R13  
RETURN  
C13  
Q3  
Q7A  
Q6A  
Q6B  
Q7B  
Q4  
VIN-  
R18  
R17  
R19  
R16  
T2  
VADJ  
VDD  
CR1  
VREF  
OUTLL  
R8  
VERR  
CTBUF  
RTD  
OUTLR  
OUTUL  
OUTUR  
OUTLLN  
OUTLRN  
GND  
R23  
C14  
EL7212  
U5  
EL7212  
U4  
C5  
T4  
R2  
R20  
CR4  
RESDEL  
CT  
R3  
CS  
R7  
C11  
R4  
U1  
R15  
R24  
Q11  
R23  
R24  
Q14  
U3  
VDD  
U2  
C4  
R14  
C3  
C17  
C2  
C16  
R22  
VR1  
R21  
C6  
R5  
R6  
Typical Application - High Voltage Input Secondary Side Control ZVS Full-Bridge Converter  
VIN+  
T3  
1:1:1  
Q1  
Q2  
Q6  
Q5  
CR2  
T1  
R13  
CR3  
R12  
Np:Ns:Ns=9:2:2  
Ns  
R15  
C12  
Np  
+ Vout  
L1  
Q16  
C10  
Ns  
Q10A  
Q10B  
Q9A  
Q9B  
C14  
C13  
+
+
400 VDC  
C1  
R14  
C11  
Q15  
T4  
1:1:1  
Q4  
Q3  
CR5  
CR4  
Q8A  
Q8B  
R10  
Q7A  
Q7B  
RETURN  
R11  
C8  
C9  
C7  
Q11A  
Q11B  
Q12A  
Q12B  
Q13A  
Q13B  
VIN-  
VREF  
R7  
T2  
VADJ  
VDD  
CR1  
R17  
VREF  
OUTLL  
R8  
VERR  
CTBUF  
RTD  
OUTLR  
OUTUL  
OUTUR  
OUTLLN  
OUTLRN  
GND  
Q14A  
Q14B  
C17  
C16  
R9  
RESDEL  
CT  
Q17  
CS  
R1  
R6  
U1  
R16  
C15  
R18  
SECONDARY  
BIAS SUPPLY  
R20  
VREF  
U3  
-
R22  
+
R4  
C2  
R5  
R21  
R19  
C6  
C3  
C4  
C5  
R2  
R3  
C18  
ISL6752  
Absolute Maximum Ratings  
Thermal Information  
Thermal Resistance Junction to Ambient (Typical)  
16 Lead QSOP (Note 1). . . . . . . . . . . . . . . . . . . . . .  
Maximum Junction Temperature . . . . . . . . . . . . . . . .-55°C to 150°C  
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C  
(QSOP- Lead Tips Only)  
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . GND - 0.3V to +20.0V  
θ
(°C/W)  
95  
JA  
OUTxxx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to VDD  
Signal Pins. . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to V  
+ 0.3V  
REF  
VREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 6.0V  
Peak GATE Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1A  
ESD Classification  
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3000V  
Charged Device Model (Per EOS/ESD DS5.3, 4/14/93) . . .1000V  
Operating Conditions  
Temperature Range  
ISL6752AAxx . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 105°C  
Supply Voltage Range (Typical). . . . . . . . . . . . . . . . . . . . . 9-16 VDC  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTES:  
1. θ is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.  
JA  
2. All voltages are with respect to GND.  
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application  
schematic. 9V < VDD< 20V, RTD = 10.0k, CT = 470pF, T = -40°C to 105°C (Note 3), Typical values are at  
A
T
= 25°C  
A
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
SUPPLY VOLTAGE  
Supply Voltage  
-
-
20  
400  
15.5  
9.00  
7.50  
-
V
µA  
mA  
V
Start-Up Current, I  
DD  
V
= 5.0V  
-
-
175  
11.0  
8.75  
7.00  
1.75  
DD  
Operating Current, I  
R
, C = 0  
DD  
LOAD OUT  
UVLO START Threshold  
UVLO STOP Threshold  
Hysteresis  
8.00  
6.50  
-
V
V
REFERENCE VOLTAGE  
Overall Accuracy  
I
= 0-10mA  
4.850  
-
5.000  
5.150  
V
VREF  
Long Term Stability  
Operational Current (source)  
Operational Current (sink)  
Current Limit  
T
= 125°C, 1000 hours (Note 4)  
3
-
-
mV  
mA  
mA  
mA  
A
-10  
5
-
-
-
VREF = 4.85V  
-15  
-
-100  
CURRENT SENSE  
Current Limit Threshold  
CS to OUT Delay  
VERR = VREF  
Excl. LEB (Note 4)  
(Note 4)  
0.97  
1.00  
35  
70  
-
1.03  
50  
V
ns  
ns  
ns  
-
50  
-
Leading Edge Blanking (LEB) Duration  
CS to OUT Delay + LEB  
100  
130  
20  
T
= 25°C  
A
CS Sink Current Device Impedance  
Input Bias Current  
V
V
= 1.1V  
= 0.3V  
-
-
CS  
CS  
-6.00  
65  
-
-2.00  
95  
µA  
mV  
CS to PWM Comparator Input Offset  
PULSE WIDTH MODULATOR  
VERR Pull-Up Current Source  
VERR VOH  
T
= 25°C  
80  
A
VERR = 2.50V  
= 0mA  
0.80  
4.20  
1.00  
-
1.30  
-
mA  
V
I
LOAD  
FN9181.1  
5
March 10, 2005  
ISL6752  
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application  
schematic. 9V < VDD< 20V, RTD = 10.0k, CT = 470pF, T = -40°C to 105°C (Note 3), Typical values are at  
A
T
= 25°C (Continued)  
A
PARAMETER  
Minimum Duty Cycle  
TEST CONDITIONS  
VERR < 0.6V  
MIN  
TYP  
-
MAX  
0
UNITS  
%
-
Maximum Duty Cycle (per half-cycle)  
VERR = 4.20V, V = 0V (Note 5)  
CS  
-
-
94  
97  
99  
-
-
%
RTD = 2.00k, CT = 220pF  
RTD = 2.00k, CT = 470pF  
-
%
-
-
%
Zero Duty Cycle VERR Voltage  
VERR to PWM Comparator Input Offset  
VERR to PWM Comparator Input Gain  
Common Mode (CM) Input Range  
OSCILLATOR  
0.85  
0.7  
0.31  
0
1.20  
0.9  
0.35  
4.45  
V
T
= 25°C  
0.8  
0.33  
-
V
A
V/V  
V
(Note 4)  
(Note 4)  
Frequency Accuracy, Overall  
165  
-10  
-
183  
201  
10  
kHz  
%
Frequency Variation with VDD  
Temperature Stability  
T
= 25°C, (F  
- - F  
)/F  
0.3  
4.5  
1.5  
-200  
20  
1.7  
%
A
20V 10V 10V  
VDD = 10V, |F - F |/F  
-
-
%
-40°C 0°C 0°C  
|F  
0°C  
- F  
|/F  
(Note 4)  
-
-
%
105°C 25°C  
= 25°C  
Charge Current  
T
-193  
19  
-207  
23  
µA  
µA/µA  
V
A
Discharge Current Gain  
CT Valley Voltage  
CT Peak Voltage  
CT Pk-Pk Voltage  
RTD Voltage  
Static Threshold  
Static Threshold  
Static Value  
0.75  
2.75  
1.92  
1.97  
0
0.80  
2.80  
2.00  
2.00  
-
0.88  
2.88  
2.05  
2.03  
2.00  
2.05  
0.44  
0.10  
V
V
V
RESDEL Voltage Range  
V
CTBUF Gain (V  
/V  
CTBUFp-p CTp-p  
)
V
V
= 0.8V, 2.6V  
= 0.8V  
1.95  
0.34  
-
2.0  
0.40  
-
V/V  
V
CT  
CT  
CTBUF Offset from GND  
CTBUF VOH  
V(I  
CT  
= 0mA, I  
= -2mA),  
V
LOAD  
= 2.6V  
LOAD  
V
CTBUF VOL  
V(I  
CT  
= 2mA, I  
= 0mA),  
-
-
0.10  
V
LOAD  
LOAD  
V
= 0.8V  
OUTPUT  
High Level Output Voltage (VOH)  
Low Level Output Voltage (VOL)  
Rise Time  
I
I
= -10mA, VDD - VOH  
= 10mA, VOL - GND  
-
0.5  
1.0  
1.0  
V
V
OUT  
OUT  
-
0.5  
C
= 220pF, VDD = 15V (Note 4)  
= 220pF, VDD = 15V (Note 4)  
-
110  
200  
150  
1.25  
3
ns  
ns  
V
OUT  
OUT  
Fall Time  
C
-
90  
-
UVLO Output Voltage Clamp  
VDD = 7V, I  
LOAD  
= 1mA (Note 6)  
-
-
Output Delay/Advance Range  
V
= 2.50V (Note 4)  
< 2.425V  
-
ns  
ns  
ns  
V
ADJ  
OUTLLN/OUTLRN relative to OUTLL/OUTLR  
V
-40  
40  
-
-300  
300  
5.000  
2.425  
ADJ  
V
> 2.575V  
-
ADJ  
Delay/Advance Control Voltage Range  
OUTLxN Delayed  
OUTLxN Advanced  
2.575  
0
-
OUTLLN/OUTLRN relative to OUTLL/OUTLR  
-
V
FN9181.1  
6
March 10, 2005  
ISL6752  
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application  
schematic. 9V < VDD< 20V, RTD = 10.0k, CT = 470pF, T = -40°C to 105°C (Note 3), Typical values are at  
A
T
= 25°C (Continued)  
A
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
VADJ Delay Time  
T
= 25°C (OUTLx Delayed)  
VADJ = 0  
A
280  
92  
300  
105  
70  
320  
118  
80  
ns  
ns  
ns  
ns  
ns  
VADJ = 0.5V  
VADJ = 1.0V  
VADJ = 1.5V  
VADJ = 2.0V  
61  
48  
55  
65  
41  
50  
58  
T
= 25°C (OUTLxN Delayed)  
VADJ = VREF  
A
280  
86  
300  
100  
68  
320  
114  
77  
ns  
ns  
ns  
ns  
ns  
VADJ = VREF - 0.5V  
VADJ = VREF - 1.0V  
VADJ = VREF - 1.5V  
VADJ = VREF - 2.0V  
59  
47  
55  
62  
41  
48  
55  
THERMAL PROTECTION  
Thermal Shutdown  
(Note 4)  
(Note 4)  
(Note 4)  
130  
115  
-
140  
125  
15  
150  
135  
-
°C  
°C  
°C  
Thermal Shutdown Clear  
Hysteresis, Internal Protection  
NOTES:  
3. Specifications at -40°Cand 105°C are guaranteed by 25°C test with margin limits.  
4. Guaranteed by design, not 100% tested in production.  
5. This is the maximum duty cycle achievable using the specified values of RTD and CT. Larger or smaller maximum duty cycles may be obtained  
using other values for these components. See Equations 1 - 3.  
6. Adjust VDD below the UVLO stop threshold prior to setting at 7V.  
Typical Performance Curves  
25  
24  
23  
22  
21  
20  
19  
18  
1.02  
1.01  
1
0.99  
0.98  
-40 -25 -10  
5
20  
35  
50 65  
80 95 110  
0
200  
400  
600  
800  
1000  
TEMPERATURE (°C)  
RTD CURRENT (µA)  
FIGURE 1. REFERENCE VOLTAGE vs TEMPERATURE  
FIGURE 2. CT DISCHARGE CURRENT GAIN vs RTD CURRENT  
FN9181.1  
7
March 10, 2005  
ISL6752  
Typical Performance Curves (Continued)  
3
1-10  
4
CT =  
1-10  
1000pF  
680pF  
470pF  
330pF  
220pF  
3
1-10  
100pF  
100  
10  
100  
10  
RTD =  
10k  
50kΩ  
100kΩ  
0
10 20 30 40 50 60 70 80 90 100  
RTD (k)  
0.1  
1
10  
CT (nF)  
FIGURE 3. DEADTIME (DT) vs CAPACITANCE  
FIGURE 4. CAPACITANCE vs FREQUENCY  
OUTUL and OUTUR - These outputs control the upper  
Pin Descriptions  
bridge FETs and operate at a fixed 50% duty cycle in  
VDD - VDD is the power connection for the IC. To optimize  
noise immunity, bypass VDD to GND with a ceramic  
capacitor as close to the VDD and GND pins as possible.  
alternate sequence. OUTUL controls the upper left FET and  
OUTUR controls the upper right FET. The left and right  
designation may be switched as long as they are switched in  
conjunction with the lower FET outputs, OUTLL and OUTLR.  
VDD is monitored for supply voltage undervoltage lock-out  
(UVLO). The start and stop thresholds track each other  
resulting in relatively constant hysteresis.  
RESDEL - Sets the resonant delay period between the  
toggle of the upper FETs and the turn on of either of the  
lower FETs. The voltage applied to RESDEL determines  
when the upper FETs switch relative to a lower FET turning  
on. Varying the control voltage from 0 to 2.00V increases the  
resonant delay duration from 0 to 100% of the deadtime. The  
control voltage divided by 2 represents the percent of the  
deadtime equal to the resonant delay. In practice the  
maximum resonant delay must be set lower than 2.00V to  
ensure that the lower FETs, at maximum duty cycle, are OFF  
prior to the switching of the upper FETs.  
GND - Signal and power ground connections for this device.  
Due to high peak currents and high frequency operation, a  
low impedance layout is necessary. Ground planes and  
short traces are highly recommended.  
VREF - The 5.00V reference voltage output having 3%  
tolerance over line, load and operating temperature. Bypass  
to GND with a 0.1µF to 2.2µF low ESR capacitor.  
CT - The oscillator timing capacitor is connected between  
this pin and GND. It is charged through an internal 200 µA  
current source and discharged with a user adjustable current  
source controlled by RTD.  
OUTLL and OUTLR - These outputs control the lower  
bridge FETs, are pulse width modulated, and operate in  
alternate sequence. OUTLL controls the lower left FET and  
OUTLR controls the lower right FET. The left and right  
designation may be switched as long as they are switched in  
conjunction with the upper FET outputs, OUTUL and  
OUTUR.  
RTD - This is the oscillator timing capacitor discharge  
current control pin. The current flowing in a resistor  
connected between this pin and GND determines the  
magnitude of the current that discharges CT. The CT  
discharge current is nominally 20x the resistor current. The  
PWM deadtime is determined by the timing capacitor  
discharge duration. The voltage at RTD is nominally 2.00V.  
OUTLLN and OUTLRN - These outputs are the  
complements of the PWM (lower) bridge FETs. OUTLLN is  
the complement of OUTLL and OUTLRN is the complement  
of OUTLR. These outputs are suitable for control of  
synchronous rectifiers. The phase relationship between  
each output and its complement is controlled by the voltage  
applied to VADJ.  
CS - This is the input to the overcurrent comparator. The  
overcurrent comparator threshold is set at 1.00 V nominal.  
The CS pin is shorted to GND at the termination of either  
PWM output.  
Depending on the current sensing source impedance, a  
series input resistor may be required due to the delay  
between the internal clock and the external power switch.  
This delay may result in CS being discharged prior to the  
power switching device being turned off.  
VADJ - A 0 - 5V control voltage applied to this input sets the  
relative delay or advance between OUTLL/OUTLR and  
OUTLLN/OUTLRN. The phase relationship between  
OUTUL/OUTUR and OUTLL/OUTLR is maintained  
regardless of the phase adjustment between OUTLL/OUTLR  
and OUTLLN/OUTLRN.  
FN9181.1  
8
March 10, 2005  
ISL6752  
Voltages below 2.425V result in OUTLLN/OUTLRN being  
advanced relative to OUTLL/OUTLR. Voltages above  
2.575V result in OUTLLN/OUTLRN being delayed relative to  
OUTLL/OUTLR. A voltage of 2.50 V ±75mV results in zero  
phase difference. A weak internal 50% divider from VREF  
results in no phase delay if this input is left floating.  
determined by CT and a fixed 200µA internal current source.  
The discharge duration is determined by RTD and CT.  
3
T
T
11.5 10 CT  
S
(EQ. 1)  
(EQ. 2)  
C
D
9  
≈ (0.06 RTD CT) + 50 10  
S
The range of phase delay/advance is either zero or 40 to  
300ns with the phase differential increasing as the voltage  
deviation from 2.5V increases. The relationship between the  
control voltage and phase differential is non-linear. The gain  
(t/V) is low for control voltages near 2.5V and rapidly  
increases as the voltage approaches the extremes of the  
control range. This behavior provides the user increased  
accuracy when selecting a shorter delay/advance duration.  
1
SW  
T
= T + T = ------------  
S
(EQ. 3)  
SW  
C
D
F
where T and T are the charge and discharge times,  
C
D
respectively, CT is the timing capacitor in Farads, RTD is the  
discharge programming resistance in ohms, T is the  
SW  
is the oscillator frequency. One  
oscillator period, and F  
SW  
VERR - The control voltage input to the inverting input of the  
PWM comparator. The output of an external error amplifier  
(EA) is applied to this input, either directly or through an  
opto-coupler, for closed loop regulation. VERR has a  
nominal 1mA pull-up current source.  
output switching cycle requires two oscillator cycles. The  
actual times will be slightly longer than calculated due to  
internal propagation delays of approximately 10ns/transition.  
This delay adds directly to the switching duration, but also  
causes overshoot of the timing capacitor peak and valley  
voltage thresholds, effectively increasing the peak-to-peak  
voltage on the timing capacitor. Additionally, if very small  
discharge currents are used, there will be increased error  
due to the input impedance at the CT pin. The maximum  
recommended current through RTD is 1mA, which produces  
a CT discharge current of 20mA.  
CTBUF - CTBUF is the buffered output of the sawtooth  
oscillator waveform present on CT and is capable of  
sourcing 2mA. It is offset from ground by 0.40V and has a  
nominal valley-to-peak gain of 2. It may be used for slope  
compensation.  
Functional Description  
Features  
The maximum duty cycle, D, and percent deadtime, DT, can  
be calculated from:  
The ISL6752 PWM is an excellent choice for low cost ZVS  
full-bridge applications requiring adjustable synchronous  
rectifier drive. With its many protection and control features,  
a highly flexible design with minimal external components is  
possible. Among its many features are a very accurate  
overcurrent limit threshold, thermal protection, a buffered  
sawtooth oscillator output suitable for slope compensation,  
synchronous rectifier outputs with variable delay/advance  
timing, and adjustable frequency.  
T
C
(EQ. 4)  
D = ------------  
T
SW  
DT = 1 D  
(EQ. 5)  
Implementing Soft-Start  
The ISL6752 does not have a soft-start feature. Soft-start  
can be implemented externally using the components shown  
below. The RC network governs the rate of rise of the  
transistor’s base which clamps the voltage at VERR.  
If synchronous rectification is not required, please consider  
the ISL6753 controller.  
Oscillator  
The ISL6752 has an oscillator with a programmable  
frequency range to 2MHz, which can be programmed with a  
resistor and capacitor.  
The switching period is the sum of the timing capacitor  
charge and discharge durations. The charge duration is  
FN9181.1  
9
March 10, 2005  
ISL6752  
accomplished by summing an external ramp with the current  
1
2
3
4
5
6
7
8
feedback signal or by subtracting the external ramp from the  
voltage feedback error signal. Adding the external ramp to  
the current feedback signal is the more popular method.  
VREF  
VERR  
R
From the small signal current-mode model [1] it can be  
shown that the naturally-sampled modulator gain, Fm,  
without slope compensation, is  
ISL6752  
1
C
Fm = -------------------  
(EQ. 7)  
SnTsw  
where Sn is the slope of the sawtooth signal and Tsw is the  
duration of the half-cycle. When an external ramp is added,  
the modulator gain becomes  
FIGURE 5. IMPLEMENTING SOFT-START  
1
1
(EQ. 8)  
Fm = -------------------------------------- = ---------------------------  
(Sn + Se)Tsw m SnTsw  
c
The values of R and C should be selected to control the rate  
of rise of VERR to the desired soft-start duration. The soft-  
start duration may be calculated from Equation. 6.  
where Se is slope of the external ramp and  
Se  
m
= 1 + -------  
(EQ. 9)  
c
Sn  
V
V  
be  
SS  
(EQ. 6)  
t = –RC ln 1 -------------------------------------------  
S
0.001R  
VREF + -------------------  
The criteria for determining the correct amount of external  
ramp can be determined by appropriately setting the  
damping factor of the double-pole located at half the  
oscillator frequency. The double-pole will be critically  
damped if the Q-factor is set to 1, and over-damped for  
Q > 1, and under-damped for Q < 1. An under-damped  
condition can result in current loop instability.  
β
where V is the soft-start clamp voltage, V is the base-  
SS be  
emitter voltage drop of the transistor, and β is the DC gain of  
the transistor. If β is sufficiently large, that term may be  
ignored. The schottky diode discharges the soft-start  
capacitor so that the circuit may be reset quickly.  
1
(EQ. 10)  
Q = -------------------------------------------------  
π(m (1 D) 0.5)  
Gate Drive  
c
The ISL6752 outputs are capable of sourcing and sinking  
10mA (at rated VOH, VOL) and are intended to be used in  
conjunction with integrated FET drivers or discrete bipolar  
totem pole drivers. The typical on resistance of the outputs is  
50.  
where D is the percent of on time during a half cycle. Setting  
Q = 1 and solving for Se yields  
1
1
  
(EQ. 11)  
-------------  
S
= S  
-- + 0.5  
1  
e
n
  
1 D  
π
Overcurrent Operation  
Since S and S are the on time slopes of the current ramp  
n
e
The cycle-by-cycle peak current control results in pulse-by-  
pulse duty cycle reduction when the current feedback signal  
exceeds 1.0V. When the peak current exceeds the  
threshold, the active output pulse is immediately terminated.  
This results in a well controlled decrease in output voltage as  
the load current increases beyond the current limit threshold.  
The ISL6752 will operate continuously in an overcurrent  
condition.  
and the external ramp, respectively, they can be multiplied  
by T to obtain the voltage change that occurs during T  
.
ON ON  
1
1
  
-------------  
V
= V  
-- + 0.5  
1  
(EQ. 12)  
e
n
  
1 D  
π
where V is the change in the current feedback signal during  
n
the on time and V is the voltage that must be added by the  
e
external ramp.  
The propagation delay from CS exceeding the current limit  
threshold to the termination of the output pulse is increased  
by the leading edge blanking (LEB) interval. The effective  
delay is the sum of the two delays and is nominally 105ns.  
V can be solved for in terms of input voltage, current  
n
transducer components, and output inductance yielding  
T
V R  
N
N
P
SW  
N
CS  
O
S
1
----------------------------------------- -------  
V
=
-- + D 0.5  
V
(EQ. 13)  
e
L  
π
CT  
O
Slope Compensation  
Peak current-mode control requires slope compensation to  
improve noise immunity, particularly at lighter loads, and to  
prevent current loop instability, particularly for duty cycles  
greater than 50%. Slope compensation may be  
where R  
is the current sense burden resistor, N is the  
CT  
CS  
current transformer turns ratio, L is the output inductance,  
O
V
is the output voltage, and N and N are the secondary  
S P  
O
and primary turns, respectively.  
FN9181.1  
10  
March 10, 2005  
ISL6752  
The inductor current, when reflected through the isolation  
transformer and the current sense transformer to obtain the  
current feedback signal at the sense resistor yields  
peak amplitude of CT (0.4 - 4.4 V). A typical application  
sums this signal with the current sense feedback and applies  
the result to the CS pin as shown in Figure 6.  
N
N
R  
N  
D T  
N
N
  
  
  
S
CS  
SW  
S
------------------------  
--------------------  
-------  
(EQ. 14)  
V
=
I
+
V
V  
O
V
CS  
O
IN  
2L  
1
P
CT  
O
P
2
3
4
5
6
7
8
ISL6752  
where V  
is the voltage across the current sense resistor  
CS  
and I is the output current at current limit.  
O
CTBUF  
Since the peak current limit threshold is 1.00V, the total  
current feedback signal plus the external ramp voltage must  
sum to this value.  
R9  
V
+ V  
= 1  
CS  
(EQ. 15)  
CS  
e
R6  
RCS  
C4  
Substituting Equations 13 and 14 into Equation 15 and  
solving for R yields  
CS  
N  
N
1
P
CT  
----------------------- ------------------------------------------------------  
R
=
(EQ. 16)  
CS  
N
V
S
O
1
D
-------  
I
+
T
-- + ---  
SW  
   
π
O
L
2
O
FIGURE 6. ADDING SLOPE COMPENSATION  
For simplicity, idealized components have been used for this  
discussion, but the effect of magnetizing inductance must be  
considered when determining the amount of external ramp  
to add. Magnetizing inductance provides a degree of slope  
compensation to the current feedback signal and reduces  
the amount of external ramp required. The magnetizing  
inductance adds primary current in excess of what is  
reflected from the inductor current in the secondary.  
Assuming the designer has selected values for the RC filter  
placed on the CS pin, the value of R9 required to add the  
appropriate external ramp can be found by superposition.  
(D(V  
0.4) + 0.4) ⋅ R6  
R6 + R9  
CTBUF  
(EQ. 20)  
V
V  
= ------------------------------------------------------------------------------  
CS  
V
e
Rearranging to solve for R9 yields  
V
DT  
(D(V  
0.4) V + V  
+ 0.4) ⋅ R6  
CS  
IN  
SW  
(EQ. 17)  
CTBUF  
e
I = -------------------------------  
A
R9 = ------------------------------------------------------------------------------------------------------------------  
V  
P
L
V
m
e
CS  
(EQ. 21)  
where V is the input voltage that corresponds to the duty  
IN  
The value of R  
CS  
determined in Equation 16 must be  
cycle D and L is the primary magnetizing inductance. The  
m
rescaled so that the current sense signal presented at the  
CS pin is that predicted by Equation 14. The divider created  
by R6 and R9 makes this necessary.  
effect of the magnetizing current at the current sense  
resistor, R , is  
CS  
I R  
P
CS  
(EQ. 18)  
R6 + R9  
V  
= -------------------------  
V
CS  
----------------------  
(EQ. 22)  
R′  
=
R  
N
CS  
CS  
CT  
R9  
Example:  
If V  
CS  
is greater than or equal to V , then no additional  
e
slope compensation is needed and R  
becomes  
CS  
V
V
L
= 280V  
= 12V  
IN  
N
CT  
R
= -------------------------------------------------------------------------------------------------------------------------------------  
CS  
O
N
DT  
2L  
N
N
V
DT  
  
S
SW  
S
IN  
SW  
-------  
----------------  
-------  
I  
+
V  
V  
+ -------------------------------  
  
O
IN  
O
= 2.0µH  
N
O
L
  
P
O
P
m
(EQ. 19)  
Np/Ns = 20  
Lm = 2mH  
If V is less than Ve, then Equation 16 is still valid for the  
CS  
value of R , but the amount of slope compensation added  
CS  
I
= 55A  
O
by the external ramp must be reduced by V  
.
CS  
Oscillator Frequency, Fsw = 400kHz  
Duty Cycle, D = 85.7%  
Adding slope compensation may be accomplished in the  
ISL6752 using the CTBUF signal. CTBUF is an amplified  
representation of the sawtooth signal that appears on the CT  
pin. It is offset from ground by 0.4V and is 2x the peak-to-  
N
= 50  
CT  
R6 = 499Ω  
FN9181.1  
11  
March 10, 2005  
ISL6752  
Solve for the current sense resistor, R , using Equation 16.  
CS  
and Equation 21 becomes:  
(2D V + V ) ⋅ R6  
R
= 15.1.  
CS  
e
CS  
(EQ. 24)  
R9 = ------------------------------------------------------------  
V
V  
e
CS  
Determine the amount of voltage, V , that must be added to  
e
the current feedback signal using Equation 13.  
The buffer transistor used to create the external ramp from  
CT should have a sufficiently high gain (>200) so as to  
minimize the required base current. Whatever base current  
is required reduces the charging current into CT and will  
reduce the oscillator frequency.  
Ve = 153mV  
Next, determine the effect of the magnetizing current from  
Equation 18.  
V  
CS  
= 91mV  
ZVS Full-Bridge Operation  
Using Equation 21, solve for the summing resistor, R9, from  
CTBUF to CS.  
The ISL6752 is a full-bridge zero-voltage switching (ZVS)  
PWM controller that behaves much like a traditional hard-  
switched topology controller. Rather than drive the diagonal  
bridge switches simultaneously, the upper switches (OUTUL,  
OUTUR) are driven at a fixed 50% duty cycle and the lower  
switches (OUTLL, OUTLR) are pulse width modulated on  
the trailing edge.  
R9 = 30.1kΩ  
Determine the new value of R , R’ , using Equation 22.  
CS CS  
R’  
CS  
= 15.4Ω  
The above discussion determines the minimum external  
ramp that is required. Additional slope compensation may be  
considered for design margin.  
CT  
If the application requires deadtime less than about 500ns,  
the CTBUF signal may not perform adequately for slope  
compensation. CTBUF lags the CT sawtooth waveform by  
300-400ns. This behavior results in a non-zero value of  
CTBUF when the next half-cycle begins when the deadtime  
is short.  
DEADTIME  
PWM  
PWM  
OUTLL  
OUTLR  
OUTUR  
PWM  
PWM  
Under these situations, slope compensation may be added  
by externally buffering the CT signal as shown below.  
RESONANT  
DELAY  
OUTUL  
RESDEL  
WINDOW  
1
2
3
4
5
6
7
8
VREF  
FIGURE 8. BRIDGE DRIVE SIGNAL TIMING  
ISL6752  
To understand how the ZVS method operates one must  
include the parasitic elements of the circuit and examine a  
full switching cycle.  
R9  
CT  
CS  
VIN+  
UL  
UR  
R6  
D1  
VOUT+  
RTN  
LL  
RCS  
C4  
CT  
LL  
LR  
D2  
VIN-  
FIGURE 7. ADDING SLOPE COMPENSATION USING CT  
FIGURE 9. IDEALIZED FULL-BRIDGE  
Using CT to provide slope compensation instead of CTBUF  
requires the same calculations, except that Equations 20  
and 21 require modification. Equation 20 becomes:  
In Figure 9, the power semiconductor switches have been  
replaced by ideal switch elements with parallel diodes and  
capacitance, the output rectifiers are ideal, and the  
transformer leakage inductance has been included as a  
discrete element. The parasitic capacitance has been  
lumped together as switch capacitance, but represents all  
2D R6  
V
V  
= ----------------------  
CS  
V
(EQ. 23)  
e
R6 + R9  
FN9181.1  
March 10, 2005  
12  
ISL6752  
parasitic capacitance in the circuit including winding  
inductance and the parasitic capacitance. The resonant  
transition may be estimated from Equation 25.  
capacitance. Each switch is designated by its position, upper  
left (UL), upper right (UR), lower left (LL), and lower right  
(LR). The beginning of the cycle, shown in Figure 10, is  
arbitrarily set as having switches UL and LR on and UR and  
LL off. The direction of the primary and secondary currents  
π
2
1
-------------------------------------  
τ =  
(EQ. 25)  
2
1
R
-------------- – ---------  
2
L
L C  
L
P
4L  
are indicated by I and I , respectively.  
P
S
where τ is the resonant transition time, L is the leakage  
L
VIN+  
inductance, C is the parasitic capacitance, and R is the  
P
UL  
UR  
IS  
D1  
equivalent resistance in series with L and C .  
L
P
VOUT+  
RTN  
LL  
The resonant delay is always less than or equal to the  
deadtime and may be calculated using the following  
equation.  
IP  
LL  
LR  
V
resdel  
D2  
-------------------  
τ
=
DT  
S
(EQ. 26)  
resdel  
2
VIN-  
FIGURE 10. UL - LR POWER TRANSFER CYCLE  
where τ  
resdel  
is the desired resonant delay, V  
voltage between 0 and 2V applied to the RESDEL pin, and  
DT is the deadtime (see Equations 1 - 5).  
is a  
resdel  
The UL - LR power transfer period terminates when switch  
LR turns off as determined by the PWM. The current flowing  
in the primary cannot be interrupted instantaneously, so it  
must find an alternate path. The current flows into the  
parasitic switch capacitance of LR and UR which charges  
the node to VIN and then forward biases the body diode of  
upper switch UR.  
When the upper switches toggle, the primary current that  
was flowing through UL must find an alternate path. It  
charges/discharges the parasitic capacitance of switches UL  
and LL until the body diode of LL is forward biased. If  
RESDEL is set properly, switch LL will be turned on at this  
time.  
VIN+  
VIN+  
UL  
UR  
IS  
UL  
UR  
IS  
D1  
D1  
VOUT+  
RTN  
LL  
VOUT+  
RTN  
LL  
IP  
IP  
LL  
LR  
LL  
LR  
D2  
D2  
VIN-  
VIN-  
FIGURE 11. UL - UR FREE-WHEELING PERIOD  
FIGURE 12. UPPER SWITCH TOGGLE AND RESONANT  
TRANSITION  
The primary leakage inductance, L , maintains the current  
L
The second power transfer period commences when switch  
LL closes. With switches UR and LL on, the primary and  
secondary currents flow as indicated below.  
which now circulates around the path of switch UL, the  
transformer primary, and switch UR. When switch LR opens,  
the output inductor current free-wheels through both output  
diodes, D1 and D2. This condition persists through the  
remainder of the half-cycle.  
VIN+  
UL  
LL  
UR  
LR  
D1  
VOUT+  
RTN  
LL  
During the period when CT discharges, also referred to as  
the deadtime, the upper switches toggle. Switch UL turns off  
and switch UR turns on. The actual timing of the upper  
switch toggle is dependent on RESDEL which sets the  
resonant delay. The voltage applied to RESDEL determines  
how far in advance the toggle occurs prior to a lower switch  
turning on. The ZVS transition occurs after the upper  
switches toggle and before the diagonal lower switch turns  
on. The required resonant delay is 1/4 of the period of the LC  
resonant frequency of the circuit formed by the leakage  
D2  
VIN-  
FIGURE 13. UR - LL POWER TRANSFER CYCLE  
The UR - LL power transfer period terminates when switch  
LL turns off as determined by the PWM. The current flowing  
FN9181.1  
13  
March 10, 2005  
ISL6752  
in the primary must find an alternate path. The current flows  
opposite PWM output, i.e. OUTLL and OUTLRN are paired  
together and OUTLR and OUTLLN are paired together.  
into the parasitic switch capacitance which charges the node  
to VIN and then forward biases the body diode of upper  
switch UL. The primary leakage inductance, L , maintains  
L
the current, which now circulates around the path of switch  
UR, the transformer primary, and switch UL. When switch LL  
opens, the output inductor current free-wheels through both  
output diodes, D1 and D2. This condition persists through  
the remainder of the half-cycle.  
CT  
OUTLL  
OUTLR  
VIN+  
UL  
UR  
IS  
D1  
VOUT+  
RTN  
OUTLLN  
(SR1)  
LL  
IP  
OUTLRN  
(SR2)  
LL  
LR  
D2  
VIN-  
FIGURE 16. BASIC WAVEFORM TIMING  
FIGURE 14. UR - UL FREE-WHEELING PERIOD  
Referring to Figure 16, the SRs alternate between being  
both on during the free-wheeling portion of the cycle  
(OUTLL/LR off), and one or the other being off when OUTLL  
or OUTLR is on. If OUTLL is on, its corresponding SR must  
also be on, indicating that OUTLRN is the correct SR control  
signal. Likewise, if OUTLR is on, its corresponding SR must  
also be on, indicating that OUTLLN is the correct SR control  
signal.  
When the upper switches toggle, the primary current that  
was flowing through UR must find an alternate path. It  
charges/discharges the parasitic capacitance of switches UR  
and LR until the body diode of LR is forward biased. If  
RESDEL is set properly, switch LR will be turned on at this  
time.  
VIN+  
A useful feature of the ISL6752 is the ability to vary the  
phase relationship between the PWM outputs (OUTLL, OUT  
LR) and the their complements (OUTLLN, OUTLRN) by  
±300ns. This feature allows the designer to compensate for  
differences in the propagation times between the PWM FETs  
and the SR FETs. A voltage applied to VADJ controls the  
phase relationship.  
UL  
UR  
IS  
D1  
VOUT+  
RTN  
LL  
IP  
LL  
LR  
D2  
VIN-  
FIGURE 15. UPPER SWITCH TOGGLE AND RESONANT  
TRANSITION  
CT  
The first power transfer period commences when switch LR  
closes and the cycle repeats. The ZVS transition requires  
that the leakage inductance has sufficient energy stored to  
OUTLL  
fully charge the parasitic capacitances. Since the energy  
2
stored is proportional to the square of the current (1/2 L I  
,
L P  
OUTLR  
the ZVS resonant transition is load dependent. If the leakage  
inductance is not able to store sufficient energy for ZVS, a  
discrete inductor may be added in series with the  
transformer primary.  
OUTLLN  
(SR1)  
OUTLRN  
(SR2)  
Synchronous Rectifier Outputs and Control  
The ISL6752 provides double-ended PWM outputs, OUTLL  
and OUTLR, and synchronous rectifier (SR) outputs,  
OUTLLN and OUTLRN. The SR outputs are the  
complements of the PWM outputs. It should be noted that  
the complemented outputs are used in conjunction with the  
FIGURE 17. WAVEFORM TIMING WITH PWM OUTPUTS  
DELAYED, 0V < VADJ < 2.425V  
FN9181.1  
14  
March 10, 2005  
ISL6752  
If the application requires that all outputs be off, then the  
supply voltage, VDD, must be removed from the IC. This  
may be accomplished as shown below.  
CT  
+Vdd  
OUTLL  
ISL6752  
VADJ  
VREF  
VDD  
OUTLR  
OUTLL  
VERR  
CTBUF  
RTD  
OUTLR  
OUTUL  
OUTUR  
OUTLLN  
OUTLRN  
GND  
OUTLLN  
(SR1)  
ON/OFF  
(OPEN = OFF  
GND = ON)  
RESDEL  
CT  
OUTLRN  
(SR2)  
CS  
FIGURE 18. WAVEFORM TIMING WITH SR OUTPUTS  
DELAYED, 2.575V < VADJ < 5.00V  
FIGURE 19. ON/OFF CONTROL USING VDD  
Setting VADJ to VREF/2 results in no delay on any output.  
The no delay voltage has a ±75mV tolerance window.  
Control voltages below the VREF/2 zero delay threshold  
cause the PWM outputs, OUTLL/LR, to be delayed. Control  
voltages greater than the VREF/2 zero delay threshold  
cause the SR outputs, OUTLLN/LRN, to be delayed. It  
should be noted that when the PWM outputs, OUTLL/LR,  
are delayed, the CS to output propagation delay is increased  
by the amount of the added delay.  
Fault Conditions  
A fault condition occurs if VREF or VDD fall below their  
undervoltage lockout (UVLO) thresholds or if the thermal  
protection is triggered. When a fault is detected the outputs  
are disabled low. When the fault condition clears the outputs  
are re-enabled.  
An overcurrent condition is not considered a fault and does  
not result in a shutdown.  
Thermal Protection  
The delay feature is provided to compensate for mismatched  
propagation delays between the PWM and SR outputs as  
may be experienced when one set of signals crosses the  
primary-secondary isolation boundary. If required, individual  
output pulses may be stretched or compressed as required  
using external resistors, capacitors, and diodes.  
Internal die over temperature protection is provided. An  
integrated temperature sensor protects the device should  
the junction temperature exceed 140°C. There is  
approximately 15°C of hysteresis.  
Ground Plane Requirements  
When the PWM outputs are delayed, the 50% upper outputs  
are equally delayed, so the resonant delay setting is  
unaffected.  
Careful layout is essential for satisfactory operation of the  
device. A good ground plane must be employed. VDD and  
VREF should be bypassed directly to GND with good high  
frequency capacitance.  
On/Off Control  
The ISL6753 does not have a separate enable/disable  
control pin. The PWM outputs, OUTLL/OUTLR, may be  
disabled by pulling VERR to ground. Doing so reduces the  
duty cycle to zero, but the upper 50% duty cycle outputs,  
OUTUL/OUTUR, will continue operation. Likewise, the SR  
outputs OUTLLN/OUTLRN will be active high.  
References  
[1] Ridley, R., “A New Continuous-Time Model for Current  
Mode Control”, IEEE Transactions on Power  
Electronics, Vol. 6, No. 2, April 1991.  
FN9181.1  
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March 10, 2005  
ISL6752  
Shrink Small Outline Plastic Packages (SSOP)  
Quarter Size Outline Plastic Packages (QSOP)  
M16.15A  
N
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE  
(0.150” WIDE BODY)  
INDEX  
M
M
B
0.25(0.010)  
H
AREA  
3
E
INCHES  
MILLIMETERS  
GAUGE  
PLANE  
-B-  
SYMBOL  
MIN  
MAX  
MIN  
1.55  
0.102  
1.40  
0.20  
0.191  
4.80  
3.81  
MAX  
1.73  
0.249  
1.55  
0.31  
0.249  
4.98  
3.99  
NOTES  
A
A1  
A2  
B
0.061  
0.004  
0.055  
0.008  
0.0075  
0.189  
0.150  
0.068  
0.0098  
0.061  
0.012  
0.0098  
0.196  
0.157  
-
1
2
-
L
-
0.25  
0.010  
SEATING PLANE  
A
9
-A-  
D
h x 45°  
C
D
E
-
3
-C-  
4
α
A2  
e
A1  
e
0.025 BSC  
0.635 BSC  
-
C
B
H
h
0.230  
0.010  
0.016  
0.244  
0.016  
0.035  
5.84  
0.25  
0.41  
6.20  
0.41  
0.89  
-
0.10(0.004)  
M
M
S
B
0.17(0.007)  
C
A
5
L
6
NOTES:  
N
α
16  
16  
7
1. Symbols are defined in the “MO Series Symbol List” in Section  
0°  
8°  
0°  
8°  
-
2.2 of Publication Number 95.  
Rev. 2 6/04  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
3. Dimension “D” does not include mold flash, protrusions or gate  
burrs. Mold flash, protrusion and gate burrs shall not exceed  
0.15mm (0.006 inch) per side.  
4. Dimension “E” does not include interlead flash or protrusions.  
Interlead flash and protrusions shall not exceed 0.25mm (0.010  
inch) per side.  
5. The chamfer on the body is optional. If it is not present, a visual  
index feature must be located within the crosshatched area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “B” does not include dambar protrusion. Allowable  
dambar protrusion shall be 0.10mm (0.004 inch) total in excess  
of “B” dimension at maximum material condition.  
10. Controlling dimension: INCHES. Converted millimeter dimen-  
sions are not necessarily exact.  
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.  
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see www.intersil.com  
FN9181.1  
16  
March 10, 2005  

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