IS31AP2145-CLS2-TR [ISSI]

Audio Amplifier, 2W, 1 Channel(s), 1 Func, PBGA9, 1.42 X 1.42 MM, LEAD FREE, WCSP-9;
IS31AP2145-CLS2-TR
型号: IS31AP2145-CLS2-TR
厂家: INTEGRATED SILICON SOLUTION, INC    INTEGRATED SILICON SOLUTION, INC
描述:

Audio Amplifier, 2W, 1 Channel(s), 1 Func, PBGA9, 1.42 X 1.42 MM, LEAD FREE, WCSP-9

放大器 商用集成电路
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IS31AP2145  
2W@4.2V MONO CLIP-LESS & FILTER-LESS  
CLASS-D AUDIO POWER AMPLIFIER  
SEPTEMBER 2011  
GENERAL DESCRIPTION  
FEATURES  
The IS31AP2145 is a 2W@4.2V mono, clip-less,  
filter-less, high efficiency Class-D audio power  
amplifier with automatic gain control.  
Filter-less Class-D architecture  
AGC enable/disable function via PCC wire  
serial interface  
2W/Ch into 4at 4.2V (10% THD+N)  
Power supply range: 3.3V to 4.5V  
Selectable attack and release times  
Minimum external components  
High efficiency: 90%  
The IS31AP2145 integrates AGC (Automatic Gain  
Control) function to automatically prevent distortion of  
the audio signal by which we can enhance audio  
quality and also protect speaker from damage at high  
power levels. The AGC function and its attack  
time/release time are selectable via the CTRL pin. The  
IS31AP2145 also provides thermal and over current  
protection functions.  
Click-and-pop suppression  
Low shutdown current: 0.1μA  
Fast wake-up time: 46ms  
In addition to these features, 90% high efficiency,  
improved RF-rectification immunity, a fast start-up time  
and small package size make IS31AP2145 ideal  
choice for cellular handsets, PDAs and other portable  
applications.  
Short-circuit and thermal protection  
Space-Saving 1.42mm × 1.42mm WCSP  
APPLICATIONS  
Wireless or cellular handsets and PDAs  
Portable navigation devices  
Portable DVD player  
Notebook PC  
IS31AP2145 is available in a 1.42mm × 1.42mm 9-ball  
WCSP package.  
Educational toys  
USB speakers  
Portable gaming  
TYPICAL APPLICATION CIRCUIT  
Vbat  
VDD  
C
IN  
RI  
RI  
IN-  
1µF  
0.1µF  
33nF  
Differential  
Input  
PWM  
H- Bridge  
VO+  
CIN  
IN+  
VO-  
33nF  
CTRL  
VREF  
GND  
Control  
Logic  
MCU  
AGC  
Bias  
Internal  
Oscillator  
1µF  
300k  
Figure 1 Typical Application Schematic with Differential Input  
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any  
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are  
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the  
product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not  
authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc. – www.issi.com  
1
Rev. A, 08/22/2011  
IS31AP2145  
Vbat  
0.1µF  
VDD  
C
IN  
RI  
RI  
IN-  
1µF  
33nF  
Singer-Ended  
Input  
PWM  
H- Bridge  
VO+  
VO-  
C
IN  
IN+  
33nF  
CTRL  
VREF  
GND  
Control  
Logic  
MCU  
AGC  
Bias  
Internal  
Oscillator  
1µF  
300k  
Figure 2 Typical Application Schematic with Single-Ended Input  
Integrated Silicon Solution, Inc. – www.issi.com  
2
Rev. A, 08/22/2011  
IS31AP2145  
PIN CONFIGURATION  
Package  
Pin Configuration (Top view)  
WCSP-9  
PIN DESCRIPTION  
No.  
Pin  
I/O  
Description  
A1  
IN+  
I
-
Positive differential input  
Power supply  
A2  
A3  
VDD  
VO+  
O
-
Positive BTL output  
B1,B3  
B2  
GND  
VREF  
IN–  
High-current ground  
I
Internally connected to VDD pin.  
Negative differential input  
C1  
I
Shutdown and AGC control terminal  
(Single wire interface)  
CTRL  
VO-  
C2  
C3  
I
O
Negative BTL output  
ORDERING INFORMATION  
Industrial Range: -40°C to +85°C  
Order Part No.  
Package  
WCSP-9, Lead-free  
QTY/Reel  
IS31AP2145-CLS2-TR  
3000  
Integrated Silicon Solution, Inc. – www.issi.com  
3
Rev. A, 08/22/2011  
IS31AP2145  
ABSOLUTE MAXIMUM RATINGS (NOTE 1)  
Supply voltage, VDD  
-0.3V ~ +4.5V  
Voltage at any input pin  
-0.3 V ~ VDD +0.3V  
-40°C ~ +150°C  
-65°C ~ +150°C  
260°C  
Junction temperature, TJMAX  
Storage temperature range, Tstg  
Lead temperature 1.6mm (1/16 inch) from case for 10s  
Thermal resistance θJA (WCSP)  
90°C/W (Note 2)  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Min.  
Max.  
Unit  
Supply voltage, VDD  
3.3  
1.4  
0
4.5  
VDD  
0.4  
V
V
High-level input voltage, VIH  
Low-level input voltage, VIL  
Operating free-air temperature, TA  
CTRL  
CTRL  
V
-40  
+85  
°C  
ELECTRICAL CHARACTERISTICS  
Gain = 18dB, TA = -40°C ~ +85°C, unless otherwise noted. Typical value are TA = +25°C, Gain = 18dB.  
Symbol Parameter  
Condition  
Min.  
Typ.  
Max. Unit  
Output offset voltage  
(measured differentially)  
| VOS |  
IQ  
VI = 0V, VDD = 3.3V ~ 4.5V  
1
25  
mV  
mA  
μA  
VDD = 4.5V, no load  
VDD = 3.3V, no load  
VCTRL = 0.4V,  
3.0  
2.4  
Quiescent current  
ISD  
Shutdown current  
0.1  
1
VDD = 3.3V ~ 4.5V  
fsw  
Switching frequency  
VDD = 3.3V ~ 4.5V  
300  
300  
18  
kHz  
kΩ  
RCTRL Pull low resistor of CTRL pin  
Gain  
VDD = 3.3V ~ 4.5V  
CTRL  
dB  
Low status of CTRL pin setting  
TCTRL_LO  
time  
1
70  
70  
μs  
High status of CTRL pin  
setting time  
TCTRL_HI  
1
μs  
μs  
μs  
TOFF  
TLAT  
Power down mod setting time  
200  
200  
AGC1, AGC2 , AGC OFF  
mode setting time  
Integrated Silicon Solution, Inc. – www.issi.com  
4
Rev. A, 08/22/2011  
IS31AP2145  
Electrical Characteristics  
Gain = 18dB, AGC function off, TA = -40°C ~ +85°C, unless otherwise (Note 3).  
Typical value are TA = +25°C, Gain = 18dB.  
Symbol Parameter  
Condition  
Min.  
Typ.  
Max.  
Unit  
VDD = 4.2V  
VDD = 3.6V  
1.2  
0.85  
2.0  
THD+N = 10%  
f = 1kHz, RL = 8Ω  
W
V
DD = 4.2V  
THD+N = 10%  
f = 1kHz, RL = 4Ω  
W
W
W
VDD = 3.6V  
VDD = 4.2V  
VDD = 3.6V  
VDD = 4.2V  
VDD = 3.6V  
1.5  
PO  
Output power  
0.95  
0.71  
1.7  
THD+N = 1%  
f = 1kHz, RL = 8Ω  
THD+N = 1%  
f = 1kHz, RL = 4Ω  
1.2  
VDD = 4.2V, PO = 0.6W, RL = 8, f = 1kHz  
VDD = 4.2V, PO = 1.0W, RL = 4, f = 1kHz  
0.18  
0.20  
Total harmonic  
distortion plus noise  
THD+N  
VN  
%
VDD = 4.2V, f = 20Hz ~ 20kHz, inputs  
Output voltage noise  
60  
μVrms  
AC-grounded with CI = 1μF A-Weighting  
Wake-up time from  
shutdown  
TWU  
SNR  
VDD = 3.6V  
46  
93  
ms  
dB  
dB  
Signal-to-noise ratio  
PO = 1.0W, RL = 8, VDD = 4.2V  
Power supply rejection VDD = 3.6V ~ 4.5V, f = 1kHz  
ratio Input grounded  
PSRR  
-72  
Notes:  
1. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only,  
and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is  
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. For WCSP 9 package, thermal resistance θJA depends largely on the heat-sinking area. When the area is 50mm2 , θJA is 195°C/W. When  
the area is 500mm2 , θJA is 135°C/W. While large copper plating area of power ground is used, θJA can decrease to 90°C/W.  
3. Guaranteed by design.  
Integrated Silicon Solution, Inc. – www.issi.com  
5
Rev. A, 08/22/2011  
IS31AP2145  
TYPICAL PERFORMANCE CHARACTERISTICS  
20  
10  
5
Vcc=4.2V
Vcc = 4.2V  
10  
R
L
RL  
Po= 600mW  
f = 1kHz  
2
1
5
2
1
0.5  
0.2  
0.1  
0.5  
0.05  
0.2  
0.1  
0.02  
0.01  
20  
50 10 0 20 0 50 0 1k 2k  
5k  
20k  
10m 20m  
50m 10 0m 20 0m 50 0m  
1
2
Figure 4 THD+N vs. Frequency  
Figure 3 THD+N vs. Output Power  
10  
5
20  
10  
Vcc = 3.6V  
Vcc = 3.6V  
R
L
RL  
Po= 400mW  
f = 1kHz  
2
1
5
2
1
0.5  
0.2  
0.1  
0.5  
0.05  
0.2  
0.1  
0.02  
0 01  
10m  
20m  
50m 10 0m 20 0m  
50 0m  
1
20  
50 10 0 20 0 50 0 1k 2k  
5k  
20k  
Figure 6 THD+N vs. Frequency  
Figure 5 THD+N vs. Output Power  
20  
10  
Vcc = 4.2V  
R
L
f = 1kHz  
5
2
1
0.5  
0.2  
0.1  
10m 20m  
50m 10 0m  
50 0m  
1
2 3  
Figure 8 THD+N vs. Frequency  
Figure 7 THD+N vs. Output Power  
Integrated Silicon Solution, Inc. – www.issi.com  
6
Rev. A, 08/22/2011  
IS31AP2145  
20  
Vcc = 3.6V  
Vcc = 3.6V  
10  
5
R
L
R
L
f = 1kHz  
Po= 800mW  
2
1
0.5  
0.2  
0.1  
10m 20m  
50m 10 0m 20 0m 50 0m  
1
2
Figure 9 THD+N vs. Output Power  
Figure 10 THD+N vs. Frequency  
VCC=4.2V  
VCC=4.2V  
Figure 11 Efficiency vs. Output Power  
Figure 12 PSRR vs. Frequency  
R
L
THD+N=10%  
R
L
THD+N=1%  
R
L
THD+N=10%  
R
L
THD+N=1%  
Figure 13 Output Power vs. Supply Voltage  
Integrated Silicon Solution, Inc. – www.issi.com  
7
Rev. A, 08/22/2011  
IS31AP2145  
APPLICATION INFORMATION  
Digital Amplifier  
AGC (Automatic Gain Control) Control Function  
This is the function to control the output in order to  
obtain a maximum output level without distortion when  
an excessive input is applied which would otherwise  
cause clipping at the differential signal output. That is,  
with the AGC function, IS31AP2145 lowers the gain of  
the digital amplifier to an appropriate value so as not to  
cause clipping at the differential signal output.  
IS31AP2145 has digital amplifiers with analog input,  
PWM pulse output, and maximum output of 2W  
(RL=4). Distortion of PWM pulse output and noise of  
the signal is reduced.  
In addition, IS31AP2145 has been designed so that  
high-efficiency can be maintained within an average  
power range that is used for mobile terminal.  
No Distortion  
IS2145  
+Peak amplitude  
Non-Clip Digital Amplifier  
Power-supply  
voltage is the  
maximum  
Input  
Signal  
Output  
Signal  
Amplification  
The output clip is detected, and  
so as not to distort the output,  
the amplifier gain is adjusted.  
-Peak amplitude  
Power-supply voltage decrease  
No Distortion  
IS2145  
+Peak amplitude  
Non-Clip Digital Amplifier  
Power-supply  
voltage  
decrease  
Input  
Signal  
Output  
Signal  
Amplification  
To avoid the influence of  
power supply declining, and so  
as not to distort the output, the  
amplifier gain is adjusted.  
-Peak amplitude  
Figure 14 Operation Outline of Clip-less Function  
Integrated Silicon Solution, Inc. – www.issi.com  
8
Rev. A, 08/22/2011  
IS31AP2145  
The attack time and the release time of AGC control  
have two levels (refer to Table 1). They are selected  
with the CTRL terminal (refer to Table 2 and Figure  
18). The attack time is a time interval that gain falls  
from 18dB to 10dB with a big signal input enough. And  
the Release Time is a time from target attenuation to  
no AGC attenuation.  
PCC Wire Serial Interface  
By using PCC wire (Pulse Count Control) serial  
interface to the CTRL terminal, the following can be  
set: AGC1, AGC2, AGC OFF, and power-down mode.  
The interface records rising edges of the CTRL pin and  
decodes them into 3 different states. The 3 mode  
settings available are indicated in Table 2.  
The PCC wire serial interface has flexible timing. The  
pulse data can be clocked-in at speeds between  
15kHz and 1MHz. After the pulse data is submitted,  
CTRL has to be held high for the time TLAT to have  
the latched pulse data to be effective.  
Before programming the subsequent function mode,  
the CTRL needs to be held low for TOFF.  
When entering the Power-down mode, the CTRL  
needs to be held low for TOFF.  
Table 1 Attack Time and Release Time  
AGC mode  
Attack Time  
Release Time  
AGC1  
(Recommended)  
45ms  
10ms  
2.6s  
1.2s  
AGC2  
Assuming no restriction from power supply, the audio  
output signal would be as in Figure 15.  
PCC Wire Serial Interface Timing  
When CTRL is held low for an amount of time greater  
than TOFF, the IS31AP2145 enters into shutdown  
mode and draws less than 1µA from VCC. The internal  
data register is reset to zero during shutdown.  
Figure 15 Assuming no Restriction from Power Supply, the  
Audio Output Signal  
Regularly, the output is distorted because of the  
restriction from power supply, as shown in Figure 16.  
Figure 16 AGC Function OFF  
With the AGC function of IS31AP2145, the optimum  
output power can be obtained along with the minimal  
distortion. The Figure 17 shows the outcome of AGC  
function.  
Figure 18 AGC Function Mode Setting  
Table 2 Mode Settings  
Attack Time  
Release Time  
CTRL Status  
Function  
Figure 17 AGC Function ON  
Connect to VDD  
1 Pulse  
AGC OFF  
AGC1  
2 Pulse  
AGC2  
3 Pulse  
AGC OFF  
Power-down  
Pull Low  
Integrated Silicon Solution, Inc. – www.issi.com  
9
Rev. A, 08/22/2011  
IS31AP2145  
PCB Layout  
When to Use an Output Filter  
As output power increases, interconnect resistance  
(PCB traces and wires) between the amplifiers, load  
and power supply create a voltage drop. The voltage  
loss on the traces between the IS31AP2145 and the  
load results in lower output power and decreased  
efficiency. Higher trace resistance between the supply  
and the IS31AP2145 has the same effect as a poorly  
regulated supply. Increased ripple on the supply line  
also reduces the peak output power. The effects of  
residual trace resistance increases as output current  
increases due to higher output power. To maintain the  
highest output voltage swing and corresponding peak  
output power, the PCB traces that connect the output  
pins to the load and the supply pins to the power  
supply should be as wide and as short as possible to  
minimize trace resistance.  
Design the IS31AP2145 without an output filter if the  
traces from amplifier to speaker are short. Wireless  
handsets and PDAs are good applications for class-D  
without a filter.  
A ferrite bead filter can be used if there is concern  
about EMI effects, or if there are frequency sensitive  
circuits wherein the frequency is greater than 1MHz.  
This is good for circuits that have to pass FCC and CE  
standards. If choosing a ferrite bead, select one with  
high impedance at high frequencies, but very low  
impedance at low frequencies.  
Use an LC output filter if there are low frequency (<  
1MHz) EMI sensitive circuits involved in and/or there  
are long leads from amplifier to speaker.  
The use of power and ground planes will give the best  
THD+N performance. In addition to a reduction in trace  
resistance, the power planes also form a parasitic  
capacitor which aids in filtering the power supply.  
Figure 19 and Figure 20 show typical ferrite bead and  
LC output filters.  
The inductive nature of the transducer load can also  
result in overshoot on one or both edges, clamped by  
the parasitic diodes to GND and VDD in each case.  
From an EMI standpoint, this is an aggressive  
waveform that can radiate or conduct to other  
components in the system and cause interference. It is  
essential to keep the power and output traces short  
and well shielded if possible. Use of ground planes,  
beads, and microstrip layout techniques are all useful  
in preventing unwanted interference.  
Figure 19 Typical Ferrite Chip Bead Filter  
As the distance between the IS31AP2145 and the  
speaker increases, the amount of EMI radiation will  
increase.  
Ferrite chip inductors placed close to the IS31AP2145  
may be needed to reduce EMI radiation. The value of  
the ferrite chip is application dependent.  
Figure 20 Typical LC Output Filter, Cutoff Frequency of  
27 kHz  
Integrated Silicon Solution, Inc. – www.issi.com  
10  
Rev. A, 08/22/2011  
IS31AP2145  
CLASSIFICATION REFLOW PROFILES  
Profile Feature  
Pb-Free Assembly  
Preheat & Soak  
150°C  
200°C  
60-120 seconds  
Temperature min (Tsmin)  
Temperature max (Tsmax)  
Time (Tsmin to Tsmax) (ts)  
Average ramp-up rate (Tsmax to Tp)  
3°C/second max.  
Liquidous temperature (TL)  
Time at liquidous (tL)  
217°C  
60-150 seconds  
Peak package body temperature (Tp)*  
Max 260°C  
Time (tp)** within 5°C of the specified  
classification temperature (Tc)  
Max 30 seconds  
Average ramp-down rate (Tp to Tsmax)  
Time 25°C to peak temperature  
6°C/second max.  
8 minutes max.  
Figure 21 Classification Profile  
Integrated Silicon Solution, Inc. – www.issi.com  
11  
Rev. A, 08/22/2011  
IS31AP2145  
TAPE AND REEL INFORMATION  
Integrated Silicon Solution, Inc. – www.issi.com  
12  
Rev. A, 08/22/2011  
IS31AP2145  
PACKAGING INFORMATION  
WCSP-9  
Note: All dimensions in millimeters unless otherwise stated.  
Integrated Silicon Solution, Inc. – www.issi.com  
13  
Rev. A, 08/22/2011  

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