IXSN52N60AU1 [IXYS]
IGBT with Diode Combi Pack - Short Circuit SOA Capability; IGBT与二极管Combi机包 - 短路SOA能力型号: | IXSN52N60AU1 |
厂家: | IXYS CORPORATION |
描述: | IGBT with Diode Combi Pack - Short Circuit SOA Capability |
文件: | 总5页 (文件大小:150K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IGBT with Diode
IXSN 52N60AU1 VCES
= 600 V
= 80 A
IC25
CombiPack
VCE(sat) = 3 V
3
Short Circuit SOA Capability
2
4
1
Symbol
TestConditions
MaximumRatings
miniBLOC, SOT-227 B
1
VCES
VCGR
TJ = 25°C to 150°C
600
600
V
A
2
TJ = 25°C to 150°C; RGE = 1 MW
VGES
VGEM
Continuous
Transient
±20
±30
V
V
4
IC25
IC90
ICM
TC = 25°C
80
40
A
A
A
3
TC = 90°C
1 = Emitter ,
3 = Collector
4 = Emitter
TC = 25°C, 1 ms
160
2 = Gate,
SSOA
(RBSOA)
VGE= 15 V, TVJ = 125°C, RG = 22 W
Clamped inductive load, L = 30 mH
ICM = 80
@ 0.8 VCES
A
Either Emitter terminal can be used as
Main or Kelvin Emitter
Features
• Internationalstandardpackage
miniBLOC
• Aluminium-nitrideisolation
- highpowerdissipation
• Isolation voltage 3000 V~
• Low VCE(sat)
- forminimumon-stateconduction
losses
tSC
(SCSOA)
VGE= 15 V, VCE = 360 V, TJ = 125°C
RG = 22 W, non repetitive
10
ms
W
PC
TC = 25°C
250
VISOL
50/60 Hz
IISOL £ 1 mA
t = 1 min
t = 1 s
2500
3000
V~
V~
TJ
-55 ... +150
150
°C
°C
°C
TJM
Tstg
• Fast RecoveryEpitaxial Diode
- short trr and IRM
-55 ... +150
• Low collector-to-case capacitance
(< 50 pF)
Md
Mountingtorque
Terminalconnectiontorque(M4)
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
- reducesd RFI
• Low package inductance (< 10 nH)
- easy to drive and to protect
Weight
30
g
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Applications
• AC motor speed control
• DC servo and robot drives
• DC choppers
• Uninterruptiblepowersupplies(UPS)
• Switch-modeandresonant-mode
powersupplies
BVCES
VGE(th)
IC = 3 mA, VGE = 0 V
IC = 4 mA, VCE = VGE
600
4
V
V
8
ICES
VCE = 0.8 • VCES
VGE = 0 V
TJ = 25°C
TJ = 125°C
750 mA
15 mA
Advantages
• Space savings
IGES
VCE = 0 V, VGE = ±20 V
±100 nA
• Easy to mount with 2 screws
• High power density
VCE(sat)
IC = IC90, VGE = 15 V
3
V
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
92814H(5/97)
1 - 5
IXSN52N60AU1
Symbol
gfs
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
miniBLOC, SOT-227 B
IC = IC90; VCE = 10 V,
20
23
S
Pulse test, t £ 300 ms, duty cycle d £ 2 %
Cies
Coes
Cres
4500
400
90
pF
pF
pF
VCE = 25 V, VGE = 0 V, f = 1 MHz
Qg
190
45
250 nC
60 nC
M4 screws (4x) supplied
Qge
Qgc
IC = IC90, VGE = 15 V, VCE = 0.5 VCES
Dim.
Millimeter
Min. Max.
31.50 31.88 1.240 1.255
Inches
Min.
Max.
88
120 nC
A
B
7.80
8.20 0.307 0.323
Inductive load, TJ = 25°C
td(on)
tri
td(off)
tfi
70
220
200
200
3.5
ns
ns
C
D
4.09
4.09
4.29 0.161 0.169
4.29 0.161 0.169
IC = IC90, VGE = 15 V, L = 100 mH,
VCE = 0.8 VCES, RG = 2.7 W
E
F
4.09
4.29 0.161 0.169
14.91 15.11 0.587 0.595
ns
G
H
30.12 30.30 1.186 1.193
38.00 38.23 1.496 1.505
Remarks: Switching times may increase
for VCE (Clamp) > 0.8 • VCES, higher TJ or
increased RG
ns
J
11.68 12.22 0.460 0.481
K
8.92
9.60 0.351 0.378
Eoff
mJ
L
0.76
0.84 0.030 0.033
M
12.60 12.85 0.496 0.506
25.15 25.42 0.990 1.001
td(on)
tri
70
220
4.7
450
340
6
ns
ns
Inductive load, TJ = 125°C
IC = IC90, VGE = 15 V, L = 100 mH
VCE = 0.8 VCES, RG = 2.7 W
N
O
1.98
2.13 0.078 0.084
P
Q
4.95
5.97 0.195 0.235
26.54 26.90 1.045 1.059
Eon
td(off)
tfi
mJ
R
S
3.94
4.72
4.42 0.155 0.174
4.85 0.186 0.191
ns
Remarks: Switching times may increase
for VCE (Clamp) > 0.8 • VCES, higher TJ or
increased RG
T
U
24.59 25.07 0.968 0.987
-0.05 0.1 -0.002 0.004
600 ns
mJ
Eoff
RthJC
RthCK
0.50 K/W
K/W
0.05
Reverse Diode (FRED)
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
Symbol
VF
TestConditions
IF = IC90, VGE = 0 V,
1.8
V
Pulse test, t £ 300 ms, duty cycle d £ 2 %
IRM
trr
IF = IC90, VGE = 0 V, -diF/dt = 480 A/ms
VR = 360 V
IF = 1 A; -di/dt = 200 A/ms; VR = 30 V TJ = 25°C
19
175
35
A
ns
50 ns
TJ = 125°C
RthJC
0.80 K/W
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
© 2000 IXYS All rights reserved
2 - 5
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715
5,381,025
IXSN52N60AU1
Fig.1 Saturation Characteristics
Fig.2 Output Characterstics
80
70
60
50
40
30
20
10
0
200
180
160
140
120
100
80
13V
TJ = 25°C
VGE = 15V
TJ = 25°C
VGE = 15V
11V
13V
11V
7V
60
9V
7V
40
9V
20
0
0
1
2
3
4
5
0
2
4
6
8
10 12 14 16 18 20
VCE - Volts
VCE - Volts
Fig.3 Collector-Emitter Voltage
vs. Gate-Emitter Voltage
Fig.4 Temperature Dependence
of Output Saturation Voltage
10
9
8
7
6
5
4
3
2
1
0
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
TJ = 25°C
VGE=15V
IC = 80A
IC = 80A
IC = 40A
IC = 20A
IC = 40A
I
C = 20A
8
9
10
11
12
13
14
15
-50 -25
0
25 50 75 100 125 150
TJ - Degrees C
VGE - Volts
Fig.5 Input Admittance
Fig.6 Temperature Dependence of
Breakdown and Threshold Voltage
80
70
60
50
40
30
20
10
0
1.3
1.2
1.1
1.0
0.9
0.8
0.7
VCE = 10V
BVCES
IC = 3mA
TJ = 25°C
TJ = 125°C
VGE8th)
TJ = - 40°C
IC = 4mA
4
5
6
7
8
9
10 11 12 13
-50 -25
0
25 50 75 100 125 150
TJ - Degrees C
VGE - Volts
© 2000 IXYS All rights reserved
3 - 5
IXSN52N60AU1
Fig.7 Turn-Off Energy per Pulse and
Fall Time on Collector Current
Fig.8 Dependence of Turn-Off Energy
Per Pulse and Fall Time on RG
1000
750
500
250
0
12
9
1000
800
600
400
200
0
10
TJ = 125°C
C = 52A
TJ = 125°C
I
Eoff
RG = 10
8
6
4
2
0
Eoff
6
tfi
tfi
3
0
0
10 20 30 40 50 60 70 80
0
10
20
30
40
50
IC - Amperes
RG - Ohms
Fig.9 Gate Charge Characteristic Curve
Fig.10 Turn-Off Safe Operating Area
15
12
9
1000
100
10
I
C = 52A
V
CE = 480V
TJ = 125°C
RG = 2.7
dV/dt < 6V/ns
6
1
3
0.1
0.01
0
0
100 200 300 400 500 600 700
VCE - Volts
0
50
100
150
200
250
Qg - nCoulombs
Fig.11 Transient Thermal Impedance
1
0.1
Diode
IGBT
Single Pulse
0.01
0.001
0.00001
0.0001
0.001
0.01
Time - Seconds
0.1
1
10
© 2000 IXYS All rights reserved
4 - 5
IXSN52N60AU1
Fig. 12 Forward current
versus voltage drop.
Fig. 13 Recovery charge versus -diF/dt.
Fig. 14 Peak reverse current versus
-diF/dt.
Fig. 15. Dynamic parameters versus
junctiontemperature.
Fig. 16 Recovery time versus -diF/dt.
Fig. 17 Peak forward voltage vs. diF/dt.
Fig. 18 Transient thermal impedance junction to case.
© 2000 IXYS All rights reserved
5 - 5
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