KO3403 [KEXIN]

P-Channel Enhancement Mode Field Effect Transistor; P沟道增强型场效应晶体管
KO3403
型号: KO3403
厂家: GUANGDONG KEXIN INDUSTRIAL CO.,LTD    GUANGDONG KEXIN INDUSTRIAL CO.,LTD
描述:

P-Channel Enhancement Mode Field Effect Transistor
P沟道增强型场效应晶体管

晶体 晶体管 场效应晶体管
文件: 总2页 (文件大小:56K)
中文:  中文翻译
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SMD Type  
Transistors  
P-Channel Enhancement Mode Field Effect Transistor  
KO3403  
SOT-23  
Unit: mm  
+0.1  
2.9  
-0.1  
+0.1  
0.4  
-0.1  
3
Features  
VDS (V) = -30V  
ID =-2.6 A (VGS=-10V)  
1
2
RDS(ON)  
RDS(ON)  
RDS(ON)  
130 m (VGS = -10V)  
+0.1  
0.95  
-0.1  
+0.05  
0.1  
-0.01  
+0.1  
1.9  
-0.1  
180 m (VGS = -4.5V)  
260m (VGS = -2.5V)  
1. Gate  
2. Source  
3. Drain  
Absolute Maximum Ratings Ta = 25  
Parameter  
Drain-Source Voltage  
Symbol  
VDS  
Rating  
-30  
Unit  
V
V
Gate-Source Voltage  
VGS  
12  
-2.6  
Continuous Drain TA=25  
ID  
A
-2.2  
Current *1  
TA=70  
Pulsed Drain Current *2  
Power Dissipation *1 TA=25  
TA=70  
IDM  
PD  
-20  
1.4  
W
1
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
*1The value of R èJA is measured with the device mounted on 1in 2 FR-4 board with 2oz.  
Copper, in a still air environment with TA =25  
*2 Repetitive rating, pulse width limited by junction temperature.  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient*1  
Maximum Junction-to-Ambient *1  
Maximum Junction-to-Lead *2  
Symbol  
Typ  
70  
Max  
90  
Unit  
/W  
t
10s  
RèJA  
Steady-State  
Steady-State  
100  
63  
125  
80  
/W  
RèJL  
/W  
*1The value of R èJA is measured with the device mounted on 1in 2 FR-4 board with 2oz.  
Copper, in a still air environment with TA =25  
*2 . The R èJA is the sum of the thermal impedence from junction to lead R èJL and lead to ambient.  
1
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SMD Type  
Transistors  
KO3403  
Electrical Characteristics Ta = 25  
Parameter  
Symbol  
BVDSS  
Testconditons  
Min  
-30  
Typ  
Max  
Unit  
V
Drain-Source Breakdown Voltage  
ID=-250 A, VGS=0V  
VDS=-24V, VGS=0V  
-1  
-5  
Zero Gate Voltage Drain Current  
IDSS  
A
VDS=-24V, VGS=0V ,TJ=55  
VDS=0V, VGS= 12V  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
IGSS  
VGS(th)  
ID(ON)  
nA  
V
100  
-1.4  
-0.6  
-10  
-1  
VDS=VGS ID=-250  
A
VGS=-4.5V, VDS=-5V  
VGS=-10V, ID=-2.6A  
VGS=-10V, ID=-2.6A  
VGS=-4.5V, ID=-2A  
VGS=-2.5V, ID=-1A  
VDS=5V, ID=-2.5A  
IS=-1A,VGS=0V  
A
102  
154  
128  
187  
4.5  
130  
200  
180  
260  
m
TJ=125  
Static Drain-Source On-Resistance  
RDS(ON)  
m
m
S
Forward Transconductance  
Diode Forward Voltage  
Maximum Body-Diode Continuous Current  
Reverse Transfer Capacitance  
Gate resistance  
gFS  
VSD  
IS  
3
-0.85  
-1  
-2  
V
A
Ciss  
Coss  
Crss  
Rg  
400  
55  
500  
pF  
pF  
pF  
VGS=0V, VDS=-15V, f=1MHz  
VGS=0V, VDS=0V, f=1MHz  
VGS=-4.5V, VDS=-15V, ID=-2.5A  
Input Capacitance  
42  
Output Capacitance  
12  
16  
Total Gate Charge  
Qg  
4.4  
0.8  
1.32  
5.3  
4.4  
31.5  
8
5.3  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Gate Source Charge  
Qgs  
Qgd  
tD(on)  
tr  
Gate Drain Charge  
Turn-On Rise Time  
8
Turn-Off DelayTime  
9
VGS=-10V, VDS=-15V, RL=6 ,RGEN=3  
Turn-Off Fall Time  
tD(off)  
tf  
45  
16  
19  
12  
Turn-On DelayTime  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
trr  
15.8  
8
IF=-2.5A, dI/dt=100A/  
IF=-2.5A, dI/dt=100A/  
s
s
Qrr  
Marking  
Marking  
A3  
2
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