KT-2117SEL1ZS-VFS [KINGBRIGHT]
SINGLE COLOR LED, HYPER ORANGE, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC PACKAGE-2;
| 型号： | KT-2117SEL1ZS-VFS |
| 厂家： | 
KINGBRIGHT CORPORATION |
| 描述： | SINGLE COLOR LED, HYPER ORANGE, 1.75mm, 2.15 X 1.70 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, CERAMIC PACKAGE-2 光电 |
| 文件： | 总8页 (文件大小：327K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2.15X1.7mm SMD LED WITH CERAMIC
SUBSTRATE
Part Number: KT-2117SEL1ZS-VFS
Hyper Orange
PRELIMINARY SPEC
Features
z Dimension: 2.15mmX 1.7mm X 0.8mm.
z Low thermal resistance.
z Ceramic package with silicone resin.
z Small package with high efficiency.
z Surface mount technology.
z ESD protection.
Typical Applications
Room lighting
Architectural lighting
Decorative/pathway lighting
Front panel backlight
z Package : 2000pcs / reel.
z Moisture sensitivity level : level 2a.
z Soldering methods: IR reflow soldering.
z RoHS compliant.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 1 OF 8
CHECKED: Allen Liu
ERP: 1212000070
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
Top
Tstg
TJ
Value
-40 To +100
-40 To +110
110
Unit
°C
Operating Temperature
Storage Temperature
°C
Junction temperature[1]
DC Forward Current [1]
Peak Forward Current [2]
°C
IF
150
mA
mA
數位簽署者：yal
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日期 2008.11.0314:13:27
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IFM
270
not designed for
reverse operation
Reverse Voltage
VR
Pt
V
Power dissipation
0.51
8000
184
54
W
V
Electrostatic Discharge Threshold (HBM)
Thermal resistance [1] (Junction/ambient)
Rth j-a
Rth j-s
°C/W
°C/W
Thermal resistance [1] (Junction/solder point)
Notes:
1. Results from mounting on PC board FR4,mounted on pc board-metal core PCB is recommend
for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Parameter
Symbol
λ peak
λ dom [1]
Δλ
Value
626
Unit
Wavelength at peak emission IF=140mA
[Typ.]
nm
nm
nm
Dominant Wavelength IF=140mA [Typ.]
618
Spectral Line Half-width IF=140mA [Typ.]
Forward Voltage IF=140mA [Min.]
Forward Voltage IF=140mA [Typ.]
Forward Voltage IF=140mA [Max.]
20
2.4
VF [2]
IR
2.87
3.4
V
not designed for
reverse operation
Reverse Current
μ A
Optical efficiency
18.7
0.11
lm/W
η
opt
Temperature coefficient of λ peak
TC λ peak
TC λ dom
TCV
nm/° C
nm/° C
mV/° C
IF=140mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of λ dom
0.09
-3.6
IF=140mA, -10 ° C≤ T≤100 ° C
[Typ.]
Temperature coefficient of VF
IF=140mA, -10 ° C≤ T≤100 ° C [Typ.]
Notes:
1.Wavelength is measured with a current pulse of 20ms at a tolerance of ±1nm.
2.Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 2 OF 8
CHECKED: Allen Liu
ERP: 1212000070
Selection Guide
Viewing
Luminous Intensity [2] Φv (lm) [3]
Angle [1]
Iv(cd)@ 140mA
@ 140mA
Dice
Lens Type
Part No.
Min.
0.65
Typ.
Typ.
2 θ 1/2
120 °
KT-2117SEL1ZS-VFS Hyper Orange (AlInGaP)
WATER CLEAR
1.1
7.5
Brightness codes
luminous Intensity [2]
Iv(cd) @ 140mA
Φv (lm) [3]
@ 140mA
Code.
Min.
0.65
0.9
Max.
Typ.
5.5
7.5
9.5
11
T
U
V
1.1
1.5
1.8
2.1
1.2
W
1.5
Notes:
1.θ 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2.Luminous intensity is measured by a current pulse of 10ms at a tolerance of ±15%.
3.The typical data of Luminous Flux can only reflect statistical figures, actual parameters of individual product could differ from the typical data.
For the purpose of product enhancement, the typical data is subject to change without prior notice.
Shipment may contain more than one of the light intensity groups.
Orders for single light intensity group are generally not accepted.
Forward Voltage Groups
Forward Voltage
Unit
Min.
2.4
Max.
2.6
V
V
V
2.6
2.8
2.8
3.0
3.0
3.2
3.2
3.4
V
V
Notes:
Forward voltage is measured with a current pulse of 10ms at a tolerance of ±0.1V.
Shipment may contain more than one of the forward voltage groups.
Orders for single forward voltage group are generally not accepted.
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 3 OF 8
CHECKED: Allen Liu
ERP: 1212000070
KT-2117SEL1ZS-VFS
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 4 OF 8
CHECKED: Allen Liu
ERP: 1212000070
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 5 OF 8
CHECKED: Allen Liu
ERP: 1212000070
KT-2117SEL1ZS-VFS
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Heat Generation:
1.Thermal design of the end product is of paramount importance.Please consider the heat generation of the LED when making
the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the
circuit board and density of LED placement on the board ,as well as other components. It is necessary to avoid intense heat gen-
eration and operate within the maximum ratings given in this specification.
2.Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot
of Permissible Forward current vs. Ambient temperature on CHARACTERISTICS in this specification. Please also take meas-
ures to remove heat from the area near the LED to improve the operational characteristics on the LED.
3.The equation ① indicates correlation between Tj and Ta ,and the equation ② indicates correlation between Tj and Ts
Tj = Ta + Rthj-a *W ………
Tj = Ts + Rthj-s *W ………
①
②
Tj = dice junction temperature: °C
Ta = ambient temperature:°C
Ts = solder point temperature:°C
Rthj-a = heat resistance from dice junction temperature to ambient temperature : °C / W
Rthj-s = heat resistance from dice junction temperature to Ts measuring point : °C / W
W = inputting power (IFx VF) : W
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 6 OF 8
CHECKED: Allen Liu
ERP: 1212000070
Tape Specifications (Units : mm)
PACKING & LABEL SPECIFICATIONS
KT-2117SEL1ZS-VFS
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 7 OF 8
CHECKED: Allen Liu
ERP: 1212000070
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might leads to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAI8158
APPROVED: WYNEC
REV NO: V.1
DATE: OCT/31/2008
DRAWN: Y.F.Lu
PAGE: 8 OF 8
CHECKED: Allen Liu
ERP: 1212000070
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