LFD4K5-66-XX-S5-PF [LIGITEK]
FOUR DIGIT LED DISPLAY (0.39 Inch); 四位LED显示( 0.39英寸)型号: | LFD4K5-66-XX-S5-PF |
厂家: | LIGITEK ELECTRONICS CO., LTD. |
描述: | FOUR DIGIT LED DISPLAY (0.39 Inch) |
文件: | 总9页 (文件大小:153K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
FOUR DIGIT LED DISPLAY (0.39 Inch)
Pb
Lead-Free Parts
LFD4K5/66-XX/S5-PF
DATA SHEET
DOC. NO : QW0905-LFD4K5/66-XX/S5-PF
REV.
: A
DATE
: 29 - Jul. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LFD4K5/66-XX/S5-PF
Package Dimensions
LFD4K5/66-XX/S5-PF
CUSTOMER P/N
LAPLING
BIN GRADING
ORDER DATE
7.0(0.276")
40.18(1.582")
L1
DIG.1
DIG.2
DIG.3
DIG.4
L3
10.0
(0.39")
12.8
(0.504")
6.5±0.3
L2
1.2
90°±5°
13.0MIN
Ø0.51TYP
2.54*13=33.02
A
F
B
G
E
C
DP
D
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LFD4K5/66-XX/S5-PF
Internal Circuit Diagram
LFD4K56-XX/S5-PF
LFD4K66-XX/S5-PF
14
13
12
11
10
9
8
14
13
12
11
10
9
8
A
B
C
D
E
F
DIG.1
A
B
C
D
E
F
DIG.1
5
5
G
G
A
B
C
D
E
F
DIG.2
A
B
C
D
E
F
DIG.2
4
4
G
G
A
B
C
D
E
F
DIG.3
A
B
C
D
E
F
DIG.3
2
2
G
G
A
B
C
D
E
F
DIG.4
A
B
C
D
E
F
DIG.4
1
1
G
G
L1
L2
L1
L2
3
3
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LFD4K5/66-XX/S5-PF
Electrical Connection
PIN NO.1
1
LFD4K56-XX/S5-PF
PIN NO.1
1
LFD4K66-XX/S5-PF
Common Cathode Dig.4
Common Anode Dig.4
Common Anode Dig.3
Anode L1,L2
Common Cathode Dig.3
Cathode L1,L2
2
3
2
3
Common Cathode Dig.2
Common Anode Dig.2
Common Anode Dig.1
4
4
Common Cathode Dig.1
NO CONNECT
5
5
NO CONNECT
6
6
NO CONNECT
Anode G
7
7
NO CONNECT
Cathode G
8
8
Anode F
Cathode F
9
9
Anode E
Anode D
Cathode E
Cathode D
10
11
12
13
10
11
12
13
Anode C
Cathode C
Anode B,L2
Anode A,L1
Cathode B,L2
Cathode A,L1
14
14
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/8
PART NO. LFD4K5/66-XX/S5-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
HR
Symbol
Parameter
UNIT
Forward Current Per Chip
30
IF
mA
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
100
IFP
Power Dissipation Per Chip
mW
PD
100
10
μA
Reverse Current Per Any Chip
Operating Temperature
Ir
Topr
Tstg
-25 ~ +85
-25 ~ +85
℃
℃
Storage Temperature
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃
Part Selection And Application Information(Ratings at 25℃)
Electrical
common
cathode
or anode
CHIP
λP △λ
Vf(v)
Typ.
Iv(mcd)
Typ.
Max. Min.
IV-M
2:1
PART NO
(nm)
(nm)
Material Emitted
Min.
Common
Cathode
LFD4K56-XX/S5-PF
LFD4K66-XX/S5-PF
660
20
1.5 1.8
5.0 8.5
GaAlAs Red
2.4
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/8
PART NO. LFD4K5/66-XX/S5-PF
Test Condition For Each Parameter
Symbol
Unit
volt
Test Condition
Parameter
Forward Voltage Per Chip
Vf
If=20mA
If=10mA
If=20mA
If=20mA
Vr=5V
Luminous Intensity Per Chip
Peak Wavelength
Iv
mcd
nm
λP
△λ
Ir
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
nm
μA
IV-M
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
6/8
PART NO. LFD4K5/66-XX/S5-PF
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
1000
2.5
2.0
1.5
100
10
1.0
0.5
1.0
0.1
0
1.0
2.0
3.0
4.0
5.0
1.0
10
100
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
1.2
1.1
1.0
0.9
0.8
0
-40
-20
-0
20
40
60
80
100
-40
-20
-0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
600
650
700
750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD4K5/66-XX/S5-PF
Page 7/8
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One Time)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(°C)
260°C3sec Max
260°
5°/sec
max
120°
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LFD4K5/66-XX/S5-PF
Page 8/8
Reliability Test:
Reference
Standard
Description
Test Item
Test Condition
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105 ℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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