LSBI2042 [LIGITEK]
ROUND TYPE LED LAMPS; ROUND型LED灯
| 型号： | LSBI2042 |
| 厂家： | 
LIGITEK ELECTRONICS CO., LTD. |
| 描述： | ROUND TYPE LED LAMPS |
| 文件： | 总5页 (文件大小：100K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
LSBI2042
DATA SHEET
DOC. NO : QW0905-LSBI2042
A
REV.
:
DATE
: 28 - Feb- 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page
PART NO. LSBI2042
1/4
Package Dimensions
3.0
4.2
4.0
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
-
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
60°
0
100% 75% 50% 25%
25% 50% 75%100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
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PART NO. LSBI2042
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Absolute Maximum Ratings at Ta=25 ℃
Ratings
SBI
Symbol
Parameter
UNIT
IF
IFP
30
Forward Current
Peak Forward Current
Duty 1/10@10KHz
mA
mA
70
mW
μA
Power Dissipation
120
PD
Ir
Reverse Current @5V
Electrostatic Discharge
Operating Temperature
Storage Temperature
50
ESD
Topr
Tstg
500
V
-20 ~ +80
-30 ~ +100
℃
℃
Max 260℃for 5 sec Max
Soldering Temperature
Tsol
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
Viewing
Peak
wave
length
λPnm
Dominant
wave
Luminous
intensity
@20mA(mcd)
Spectral
halfwidth
△λnm
voltage
angle
2θ1/2
(deg)
COLOR
@20mA(V)
length
PART NO MATERIAL
LSBI2042 InGaN/SiC
λDnm
Typ.
Typ.
65
Emitted
Blue
Lens
Max. Min.
4.7 38
White Diffused 430
65
3.8
44
465
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
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PART NO. LSBI2042
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Typical Electro-Optical Characteristics Curve
SBI CHIP
Fig.2 Relative Intensity vs. Wavelength
Fig.1 Forward current vs. Forward Voltage
30
25
20
15
10
5
1.0
0.5
0
0
4
5
1
2
3
680
380 430 480 530 580 630
Forward Voltage(V)
Wavelength (nm)
Fig.3 Relative Intensity vs. Forward Current
125
Fig.4 Relative Intensity vs. Lead Temperature
10
100
75
50
25
0
1
0
20 25 30
45
0
15
35 40
10
5
0
25
50
75
100
Lead Temperature (℃)
Forward Current (mA DC)
Fig.5 Forward Current vs. Ambient Temperature
40
30
20
10
0
25
50
75
100
0
Ambient Temperature (℃)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
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PART NO. LSBI2042
4/4
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Operating Life Test
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hous.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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